GB2394365B - Circuit board constructions - Google Patents

Circuit board constructions

Info

Publication number
GB2394365B
GB2394365B GB0224354A GB0224354A GB2394365B GB 2394365 B GB2394365 B GB 2394365B GB 0224354 A GB0224354 A GB 0224354A GB 0224354 A GB0224354 A GB 0224354A GB 2394365 B GB2394365 B GB 2394365B
Authority
GB
United Kingdom
Prior art keywords
circuit board
board constructions
constructions
circuit
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0224354A
Other versions
GB2394365A (en
GB0224354D0 (en
Inventor
Niels-Henrik Lai Hansen
Hans Christian Blomberg
Anders Stensgaard Larsen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Priority to GB0224354A priority Critical patent/GB2394365B/en
Publication of GB0224354D0 publication Critical patent/GB0224354D0/en
Publication of GB2394365A publication Critical patent/GB2394365A/en
Application granted granted Critical
Publication of GB2394365B publication Critical patent/GB2394365B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2045—Protection against vibrations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
GB0224354A 2002-10-19 2002-10-19 Circuit board constructions Expired - Fee Related GB2394365B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0224354A GB2394365B (en) 2002-10-19 2002-10-19 Circuit board constructions

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0224354A GB2394365B (en) 2002-10-19 2002-10-19 Circuit board constructions

Publications (3)

Publication Number Publication Date
GB0224354D0 GB0224354D0 (en) 2002-11-27
GB2394365A GB2394365A (en) 2004-04-21
GB2394365B true GB2394365B (en) 2005-08-17

Family

ID=9946205

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0224354A Expired - Fee Related GB2394365B (en) 2002-10-19 2002-10-19 Circuit board constructions

Country Status (1)

Country Link
GB (1) GB2394365B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007053248A (en) 2005-08-18 2007-03-01 Tdk Corp Flexible substrate, mounting structure, display unit and portable electronic device
EP2044817B1 (en) * 2006-07-21 2014-06-11 OSRAM GmbH Printed circuit board with vibration-generating electronic component
DE102007045148A1 (en) * 2007-09-20 2009-04-09 Continental Automotive Gmbh Electronic component and method for integrating a communication unit
DE102008060487A1 (en) * 2008-12-05 2010-06-10 Sennheiser Electronic Gmbh & Co. Kg Electronic device e.g. microphone, has printed circuit board including sections with electrical and/or electronic unit and electronic and/or electrical unit, where one of sections is partially enclosed by milled edge of circuit board
CN101877938B (en) * 2009-11-26 2012-05-16 深南电路有限公司 Manufacturing method of sheet printed circuit board and sheet printed circuit board
CN108770183B (en) * 2018-05-29 2020-05-05 杭州电子科技大学 Three-axis vibration reduction structure based on FR4 printed circuit board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0654959A1 (en) * 1993-11-23 1995-05-24 E-Systems Inc. Vibration sensitive isolation for printed circuit boards
JP2001148613A (en) * 1999-11-22 2001-05-29 Nippon Dempa Kogyo Co Ltd Circuit board and crystal oscillator using the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0654959A1 (en) * 1993-11-23 1995-05-24 E-Systems Inc. Vibration sensitive isolation for printed circuit boards
JP2001148613A (en) * 1999-11-22 2001-05-29 Nippon Dempa Kogyo Co Ltd Circuit board and crystal oscillator using the same

Also Published As

Publication number Publication date
GB2394365A (en) 2004-04-21
GB0224354D0 (en) 2002-11-27

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20071019