GB2404091B - Circuit board constructions - Google Patents
Circuit board constructionsInfo
- Publication number
- GB2404091B GB2404091B GB0316573A GB0316573A GB2404091B GB 2404091 B GB2404091 B GB 2404091B GB 0316573 A GB0316573 A GB 0316573A GB 0316573 A GB0316573 A GB 0316573A GB 2404091 B GB2404091 B GB 2404091B
- Authority
- GB
- United Kingdom
- Prior art keywords
- circuit board
- board constructions
- constructions
- circuit
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010276 construction Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/02—Fixed inductances of the signal type without magnetic core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10545—Related components mounted on both sides of the PCB
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0316573A GB2404091B (en) | 2003-07-15 | 2003-07-15 | Circuit board constructions |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0316573A GB2404091B (en) | 2003-07-15 | 2003-07-15 | Circuit board constructions |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0316573D0 GB0316573D0 (en) | 2003-08-20 |
GB2404091A GB2404091A (en) | 2005-01-19 |
GB2404091B true GB2404091B (en) | 2005-08-17 |
Family
ID=27763879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0316573A Expired - Fee Related GB2404091B (en) | 2003-07-15 | 2003-07-15 | Circuit board constructions |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2404091B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10908312B2 (en) | 2016-06-24 | 2021-02-02 | Stanley Black & Decker Inc. | Systems and methods for locating a metal object |
US10571423B2 (en) | 2016-06-24 | 2020-02-25 | Stanley Black & Decker Inc. | Systems and methods for locating a stud |
JP2019537258A (en) * | 2016-10-28 | 2019-12-19 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツングRobert Bosch Gmbh | Inductor and method for manufacturing inductor |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04142012A (en) * | 1990-10-02 | 1992-05-15 | Taiyo Yuden Co Ltd | Method for adjusting characteristics of high frequency circuit device |
US5565837A (en) * | 1992-11-06 | 1996-10-15 | Nidec America Corporation | Low profile printed circuit board |
US6175727B1 (en) * | 1998-01-09 | 2001-01-16 | Texas Instruments Israel Ltd. | Suspended printed inductor and LC-type filter constructed therefrom |
EP1286464A1 (en) * | 2001-08-20 | 2003-02-26 | Alps Electric Co., Ltd. | Coupling adjusting structure for double-tuned circuit |
-
2003
- 2003-07-15 GB GB0316573A patent/GB2404091B/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04142012A (en) * | 1990-10-02 | 1992-05-15 | Taiyo Yuden Co Ltd | Method for adjusting characteristics of high frequency circuit device |
US5565837A (en) * | 1992-11-06 | 1996-10-15 | Nidec America Corporation | Low profile printed circuit board |
US6175727B1 (en) * | 1998-01-09 | 2001-01-16 | Texas Instruments Israel Ltd. | Suspended printed inductor and LC-type filter constructed therefrom |
EP1286464A1 (en) * | 2001-08-20 | 2003-02-26 | Alps Electric Co., Ltd. | Coupling adjusting structure for double-tuned circuit |
Also Published As
Publication number | Publication date |
---|---|
GB2404091A (en) | 2005-01-19 |
GB0316573D0 (en) | 2003-08-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20110715 |