SG119300A1 - Circuit board - Google Patents

Circuit board

Info

Publication number
SG119300A1
SG119300A1 SG200504331A SG200504331A SG119300A1 SG 119300 A1 SG119300 A1 SG 119300A1 SG 200504331 A SG200504331 A SG 200504331A SG 200504331 A SG200504331 A SG 200504331A SG 119300 A1 SG119300 A1 SG 119300A1
Authority
SG
Singapore
Prior art keywords
circuit board
board
circuit
Prior art date
Application number
SG200504331A
Inventor
Sunappan Vasudivan
Chee Wai Lu
Boon Keng Lok
Original Assignee
Agency Science Tech & Res
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency Science Tech & Res filed Critical Agency Science Tech & Res
Publication of SG119300A1 publication Critical patent/SG119300A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
SG200504331A 2004-07-09 2005-07-08 Circuit board SG119300A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/888,076 US7359213B2 (en) 2004-07-09 2004-07-09 Circuit board

Publications (1)

Publication Number Publication Date
SG119300A1 true SG119300A1 (en) 2006-02-28

Family

ID=35541136

Family Applications (3)

Application Number Title Priority Date Filing Date
SG200504331A SG119300A1 (en) 2004-07-09 2005-07-08 Circuit board
SG200903843-1A SG153797A1 (en) 2004-07-09 2005-07-08 Circuit board
SG2011059938A SG174088A1 (en) 2004-07-09 2005-07-08 Circuit board

Family Applications After (2)

Application Number Title Priority Date Filing Date
SG200903843-1A SG153797A1 (en) 2004-07-09 2005-07-08 Circuit board
SG2011059938A SG174088A1 (en) 2004-07-09 2005-07-08 Circuit board

Country Status (2)

Country Link
US (2) US7359213B2 (en)
SG (3) SG119300A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050094465A1 (en) * 2003-11-03 2005-05-05 Netlist Inc. Printed circuit board memory module with embedded passive components
US7515434B2 (en) * 2004-12-20 2009-04-07 Nortel Networks Limited Technique for enhancing circuit density and performance
JPWO2006095852A1 (en) * 2005-03-10 2008-08-21 京セラ株式会社 Electronic component module and manufacturing method thereof
US7457132B2 (en) * 2005-10-20 2008-11-25 Sanmina-Sci Corporation Via stub termination structures and methods for making same
TWM335792U (en) * 2007-08-16 2008-07-01 Aflash Technology Co Ltd Device structure of IC
TWI482550B (en) * 2007-11-22 2015-04-21 Ajinomoto Kk Production method of multilayer printed wiring board and multilayer printed wiring board
IT1391557B1 (en) * 2008-09-01 2012-01-11 Ferrarini MULTILAYER PRINTED CIRCUIT PADDED WITH COMPOUNDS GLOBED BETWEEN OVERLAPPING CARDS
KR101620347B1 (en) * 2009-10-14 2016-05-13 삼성전자주식회사 Passive elements embedded semiconductor package
US10561914B2 (en) 2011-01-06 2020-02-18 Mizuno Corporation Baseball or softball bat with modified restitution characteristics
US8745860B2 (en) * 2011-03-11 2014-06-10 Ibiden Co., Ltd. Method for manufacturing printed wiring board
CN203151864U (en) * 2013-03-05 2013-08-21 奥特斯(中国)有限公司 Printed circuit board
TWI611542B (en) * 2016-08-24 2018-01-11 矽品精密工業股份有限公司 Electronic package structure and the manufacture thereof
US10129979B2 (en) 2016-09-23 2018-11-13 Apple Inc. PCB assembly with molded matrix core
US10797039B2 (en) * 2016-12-07 2020-10-06 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming a 3D interposer system-in-package module

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5355283A (en) * 1993-04-14 1994-10-11 Amkor Electronics, Inc. Ball grid array with via interconnection
US6239980B1 (en) * 1998-08-31 2001-05-29 General Electric Company Multimodule interconnect structure and process
US6618267B1 (en) * 1998-09-22 2003-09-09 International Business Machines Corporation Multi-level electronic package and method for making same
SE514426C2 (en) * 1999-06-17 2001-02-19 Ericsson Telefon Ab L M Device for chip mounting in cavity in multilayer PCBs
KR100823767B1 (en) * 1999-09-02 2008-04-21 이비덴 가부시키가이샤 Printed circuit board and method for manufacturing printed circuit board
KR101084525B1 (en) * 1999-09-02 2011-11-18 이비덴 가부시키가이샤 Printed circuit board and method of manufacturing printed circuit board
US6407929B1 (en) 2000-06-29 2002-06-18 Intel Corporation Electronic package having embedded capacitors and method of fabrication therefor
US6577490B2 (en) * 2000-12-12 2003-06-10 Ngk Spark Plug Co., Ltd. Wiring board
TWI293315B (en) * 2000-12-26 2008-02-11 Ngk Spark Plug Co Wiring substrate
JP3926141B2 (en) * 2000-12-27 2007-06-06 日本特殊陶業株式会社 Wiring board
JP3547423B2 (en) 2000-12-27 2004-07-28 松下電器産業株式会社 Component built-in module and manufacturing method thereof
US6512182B2 (en) * 2001-03-12 2003-01-28 Ngk Spark Plug Co., Ltd. Wiring circuit board and method for producing same
KR100573999B1 (en) * 2001-03-23 2006-04-25 가부시끼가이샤 후지꾸라 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof
JP3662219B2 (en) * 2001-12-27 2005-06-22 三菱電機株式会社 Laminated high frequency module
TW546800B (en) 2002-06-27 2003-08-11 Via Tech Inc Integrated moduled board embedded with IC chip and passive device and its manufacturing method
US7218418B2 (en) 2002-07-01 2007-05-15 Xerox Corporation Digital de-screening of documents
JP3664171B2 (en) * 2003-10-27 2005-06-22 セイコーエプソン株式会社 Semiconductor device manufacturing method and semiconductor device manufacturing apparatus

Also Published As

Publication number Publication date
SG174088A1 (en) 2011-09-29
US7748115B2 (en) 2010-07-06
US20060007662A1 (en) 2006-01-12
SG153797A1 (en) 2009-07-29
US20080000676A1 (en) 2008-01-03
US7359213B2 (en) 2008-04-15

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