SG119300A1 - Circuit board - Google Patents
Circuit boardInfo
- Publication number
- SG119300A1 SG119300A1 SG200504331A SG200504331A SG119300A1 SG 119300 A1 SG119300 A1 SG 119300A1 SG 200504331 A SG200504331 A SG 200504331A SG 200504331 A SG200504331 A SG 200504331A SG 119300 A1 SG119300 A1 SG 119300A1
- Authority
- SG
- Singapore
- Prior art keywords
- circuit board
- board
- circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/888,076 US7359213B2 (en) | 2004-07-09 | 2004-07-09 | Circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
SG119300A1 true SG119300A1 (en) | 2006-02-28 |
Family
ID=35541136
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200504331A SG119300A1 (en) | 2004-07-09 | 2005-07-08 | Circuit board |
SG200903843-1A SG153797A1 (en) | 2004-07-09 | 2005-07-08 | Circuit board |
SG2011059938A SG174088A1 (en) | 2004-07-09 | 2005-07-08 | Circuit board |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200903843-1A SG153797A1 (en) | 2004-07-09 | 2005-07-08 | Circuit board |
SG2011059938A SG174088A1 (en) | 2004-07-09 | 2005-07-08 | Circuit board |
Country Status (2)
Country | Link |
---|---|
US (2) | US7359213B2 (en) |
SG (3) | SG119300A1 (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050094465A1 (en) * | 2003-11-03 | 2005-05-05 | Netlist Inc. | Printed circuit board memory module with embedded passive components |
US7515434B2 (en) * | 2004-12-20 | 2009-04-07 | Nortel Networks Limited | Technique for enhancing circuit density and performance |
JPWO2006095852A1 (en) * | 2005-03-10 | 2008-08-21 | 京セラ株式会社 | Electronic component module and manufacturing method thereof |
US7457132B2 (en) * | 2005-10-20 | 2008-11-25 | Sanmina-Sci Corporation | Via stub termination structures and methods for making same |
TWM335792U (en) * | 2007-08-16 | 2008-07-01 | Aflash Technology Co Ltd | Device structure of IC |
TWI482550B (en) * | 2007-11-22 | 2015-04-21 | Ajinomoto Kk | Production method of multilayer printed wiring board and multilayer printed wiring board |
IT1391557B1 (en) * | 2008-09-01 | 2012-01-11 | Ferrarini | MULTILAYER PRINTED CIRCUIT PADDED WITH COMPOUNDS GLOBED BETWEEN OVERLAPPING CARDS |
KR101620347B1 (en) * | 2009-10-14 | 2016-05-13 | 삼성전자주식회사 | Passive elements embedded semiconductor package |
US10561914B2 (en) | 2011-01-06 | 2020-02-18 | Mizuno Corporation | Baseball or softball bat with modified restitution characteristics |
US8745860B2 (en) * | 2011-03-11 | 2014-06-10 | Ibiden Co., Ltd. | Method for manufacturing printed wiring board |
CN203151864U (en) * | 2013-03-05 | 2013-08-21 | 奥特斯(中国)有限公司 | Printed circuit board |
TWI611542B (en) * | 2016-08-24 | 2018-01-11 | 矽品精密工業股份有限公司 | Electronic package structure and the manufacture thereof |
US10129979B2 (en) | 2016-09-23 | 2018-11-13 | Apple Inc. | PCB assembly with molded matrix core |
US10797039B2 (en) * | 2016-12-07 | 2020-10-06 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming a 3D interposer system-in-package module |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5355283A (en) * | 1993-04-14 | 1994-10-11 | Amkor Electronics, Inc. | Ball grid array with via interconnection |
US6239980B1 (en) * | 1998-08-31 | 2001-05-29 | General Electric Company | Multimodule interconnect structure and process |
US6618267B1 (en) * | 1998-09-22 | 2003-09-09 | International Business Machines Corporation | Multi-level electronic package and method for making same |
SE514426C2 (en) * | 1999-06-17 | 2001-02-19 | Ericsson Telefon Ab L M | Device for chip mounting in cavity in multilayer PCBs |
KR100823767B1 (en) * | 1999-09-02 | 2008-04-21 | 이비덴 가부시키가이샤 | Printed circuit board and method for manufacturing printed circuit board |
KR101084525B1 (en) * | 1999-09-02 | 2011-11-18 | 이비덴 가부시키가이샤 | Printed circuit board and method of manufacturing printed circuit board |
US6407929B1 (en) | 2000-06-29 | 2002-06-18 | Intel Corporation | Electronic package having embedded capacitors and method of fabrication therefor |
US6577490B2 (en) * | 2000-12-12 | 2003-06-10 | Ngk Spark Plug Co., Ltd. | Wiring board |
TWI293315B (en) * | 2000-12-26 | 2008-02-11 | Ngk Spark Plug Co | Wiring substrate |
JP3926141B2 (en) * | 2000-12-27 | 2007-06-06 | 日本特殊陶業株式会社 | Wiring board |
JP3547423B2 (en) | 2000-12-27 | 2004-07-28 | 松下電器産業株式会社 | Component built-in module and manufacturing method thereof |
US6512182B2 (en) * | 2001-03-12 | 2003-01-28 | Ngk Spark Plug Co., Ltd. | Wiring circuit board and method for producing same |
KR100573999B1 (en) * | 2001-03-23 | 2006-04-25 | 가부시끼가이샤 후지꾸라 | Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof |
JP3662219B2 (en) * | 2001-12-27 | 2005-06-22 | 三菱電機株式会社 | Laminated high frequency module |
TW546800B (en) | 2002-06-27 | 2003-08-11 | Via Tech Inc | Integrated moduled board embedded with IC chip and passive device and its manufacturing method |
US7218418B2 (en) | 2002-07-01 | 2007-05-15 | Xerox Corporation | Digital de-screening of documents |
JP3664171B2 (en) * | 2003-10-27 | 2005-06-22 | セイコーエプソン株式会社 | Semiconductor device manufacturing method and semiconductor device manufacturing apparatus |
-
2004
- 2004-07-09 US US10/888,076 patent/US7359213B2/en not_active Expired - Fee Related
-
2005
- 2005-07-08 SG SG200504331A patent/SG119300A1/en unknown
- 2005-07-08 SG SG200903843-1A patent/SG153797A1/en unknown
- 2005-07-08 SG SG2011059938A patent/SG174088A1/en unknown
-
2007
- 2007-07-13 US US11/777,988 patent/US7748115B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
SG174088A1 (en) | 2011-09-29 |
US7748115B2 (en) | 2010-07-06 |
US20060007662A1 (en) | 2006-01-12 |
SG153797A1 (en) | 2009-07-29 |
US20080000676A1 (en) | 2008-01-03 |
US7359213B2 (en) | 2008-04-15 |
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