FR2840503B3 - PRINTED CIRCUIT BOARD - Google Patents

PRINTED CIRCUIT BOARD

Info

Publication number
FR2840503B3
FR2840503B3 FR0211315A FR0211315A FR2840503B3 FR 2840503 B3 FR2840503 B3 FR 2840503B3 FR 0211315 A FR0211315 A FR 0211315A FR 0211315 A FR0211315 A FR 0211315A FR 2840503 B3 FR2840503 B3 FR 2840503B3
Authority
FR
France
Prior art keywords
circuit board
printed circuit
printed
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0211315A
Other languages
French (fr)
Other versions
FR2840503A3 (en
Inventor
Marian Baran
Bernd Kaiser
Joerg Romahn
Annette Bolcke
Robert Kalicki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2840503A3 publication Critical patent/FR2840503A3/en
Application granted granted Critical
Publication of FR2840503B3 publication Critical patent/FR2840503B3/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09254—Branched layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
FR0211315A 2002-05-29 2002-09-12 PRINTED CIRCUIT BOARD Expired - Fee Related FR2840503B3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20208478U DE20208478U1 (en) 2002-05-29 2002-05-29 Printed circuit board with mass pad on the back

Publications (2)

Publication Number Publication Date
FR2840503A3 FR2840503A3 (en) 2003-12-05
FR2840503B3 true FR2840503B3 (en) 2004-04-30

Family

ID=7971699

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0211315A Expired - Fee Related FR2840503B3 (en) 2002-05-29 2002-09-12 PRINTED CIRCUIT BOARD

Country Status (5)

Country Link
CN (1) CN2572720Y (en)
DE (1) DE20208478U1 (en)
ES (1) ES1053051Y (en)
FR (1) FR2840503B3 (en)
IT (1) ITMI20030013U1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20314526U1 (en) * 2003-09-12 2003-11-20 Siemens Ag PCB for a radio module
CN102509957B (en) * 2011-10-18 2014-02-19 华为终端有限公司 Universal serial bus (USB) male plug

Also Published As

Publication number Publication date
ES1053051U (en) 2003-03-01
FR2840503A3 (en) 2003-12-05
ITMI20030013U1 (en) 2003-11-30
DE20208478U1 (en) 2002-08-29
CN2572720Y (en) 2003-09-10
ES1053051Y (en) 2003-06-16

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FR2840503B3 (en) PRINTED CIRCUIT BOARD

Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20070531