GB0010730D0 - Printed circuit boards - Google Patents

Printed circuit boards

Info

Publication number
GB0010730D0
GB0010730D0 GBGB0010730.0A GB0010730A GB0010730D0 GB 0010730 D0 GB0010730 D0 GB 0010730D0 GB 0010730 A GB0010730 A GB 0010730A GB 0010730 D0 GB0010730 D0 GB 0010730D0
Authority
GB
United Kingdom
Prior art keywords
printed circuit
circuit boards
boards
printed
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB0010730.0A
Other versions
GB2362037A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KCE ELECTRONICS PLC
Original Assignee
KCE ELECTRONICS PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KCE ELECTRONICS PLC filed Critical KCE ELECTRONICS PLC
Priority to GB0010730A priority Critical patent/GB2362037A/en
Priority to TW089108612A priority patent/TW475343B/en
Publication of GB0010730D0 publication Critical patent/GB0010730D0/en
Priority to PCT/GB2001/001948 priority patent/WO2001084896A1/en
Priority to AU2001252401A priority patent/AU2001252401A1/en
Publication of GB2362037A publication Critical patent/GB2362037A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
GB0010730A 2000-05-03 2000-05-03 Printed circuit board manufacture Withdrawn GB2362037A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB0010730A GB2362037A (en) 2000-05-03 2000-05-03 Printed circuit board manufacture
TW089108612A TW475343B (en) 2000-05-03 2000-05-05 Printed circuit boards
PCT/GB2001/001948 WO2001084896A1 (en) 2000-05-03 2001-05-03 Printed circuit boards
AU2001252401A AU2001252401A1 (en) 2000-05-03 2001-05-03 Printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0010730A GB2362037A (en) 2000-05-03 2000-05-03 Printed circuit board manufacture

Publications (2)

Publication Number Publication Date
GB0010730D0 true GB0010730D0 (en) 2000-06-28
GB2362037A GB2362037A (en) 2001-11-07

Family

ID=9890923

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0010730A Withdrawn GB2362037A (en) 2000-05-03 2000-05-03 Printed circuit board manufacture

Country Status (4)

Country Link
AU (1) AU2001252401A1 (en)
GB (1) GB2362037A (en)
TW (1) TW475343B (en)
WO (1) WO2001084896A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004108791A1 (en) * 2003-06-03 2004-12-16 Matsushita Electric Works, Ltd. Resin composition for printed wiring board, prepreg, and laminate obtained with the same
CN103025065B (en) * 2012-12-11 2015-09-02 胜宏科技（惠州）股份有限公司 A kind of method of circuit board pressing filler
CN104519671B (en) * 2013-09-26 2017-12-22 深圳崇达多层线路板有限公司 Carbon oil pcb board and preparation method thereof
US10405421B2 (en) 2017-12-18 2019-09-03 International Business Machines Corporation Selective dielectric resin application on circuitized core layers
EP3871476A4 (en) * 2018-10-25 2022-08-24 Jabil Inc. Printing of multilayer circuits on graphics
CN113207245B (en) * 2021-04-28 2022-06-07 中国科学院微电子研究所 Method for manufacturing low-warpage printed wiring board

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4180608A (en) * 1977-01-07 1979-12-25 Del Joseph A Process for making multi-layer printed circuit boards, and the article resulting therefrom
DE3113334A1 (en) * 1981-04-02 1982-10-28 Siemens AG, 1000 Berlin und 8000 München Method for producing multilayer printed-circuit boards
GB8630392D0 (en) * 1986-12-19 1987-01-28 Prestwick Circuits Ltd Producing printed circuit boards
JPH08302161A (en) * 1995-05-10 1996-11-19 Hitachi Chem Co Ltd Resin composition and method for chemically etching same
US5806177A (en) * 1995-10-31 1998-09-15 Sumitomo Bakelite Company Limited Process for producing multilayer printed circuit board
JP2830812B2 (en) * 1995-12-27 1998-12-02 日本電気株式会社 Manufacturing method of multilayer printed wiring board
JPH1027966A (en) * 1996-07-10 1998-01-27 Toshiba Chem Corp Manufacture of multi-layer flexible-rigid wiring board
US5837355A (en) * 1996-11-07 1998-11-17 Sumitomo Bakelite Company Limited Multilayer printed circuit board and process for producing and using the same

Also Published As

Publication number Publication date
TW475343B (en) 2002-02-01
GB2362037A (en) 2001-11-07
AU2001252401A1 (en) 2001-11-12
WO2001084896A1 (en) 2001-11-08

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)