HK1048666A1 - Printed circuit boards - Google Patents

Printed circuit boards

Info

Publication number
HK1048666A1
HK1048666A1 HK03100802A HK03100802A HK1048666A1 HK 1048666 A1 HK1048666 A1 HK 1048666A1 HK 03100802 A HK03100802 A HK 03100802A HK 03100802 A HK03100802 A HK 03100802A HK 1048666 A1 HK1048666 A1 HK 1048666A1
Authority
HK
Hong Kong
Prior art keywords
printed circuit
circuit boards
boards
printed
circuit
Prior art date
Application number
HK03100802A
Other versions
HK1048666B (en
Inventor
Masami Matsumura
Yuhta Ogawa
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of HK1048666A1 publication Critical patent/HK1048666A1/en
Publication of HK1048666B publication Critical patent/HK1048666B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
HK03100802.5A 1999-05-06 2003-02-04 Printed circuit boards HK1048666B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP12558599 1999-05-06
PCT/JP2000/002936 WO2000068740A1 (en) 1999-05-06 2000-05-08 Solder resist ink composition

Publications (2)

Publication Number Publication Date
HK1048666A1 true HK1048666A1 (en) 2003-04-11
HK1048666B HK1048666B (en) 2007-12-07

Family

ID=14913828

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03100802.5A HK1048666B (en) 1999-05-06 2003-02-04 Printed circuit boards

Country Status (5)

Country Link
JP (1) JP3924431B2 (en)
CN (2) CN1821876B (en)
HK (1) HK1048666B (en)
TW (1) TW494276B (en)
WO (1) WO2000068740A1 (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002234932A (en) * 2001-02-09 2002-08-23 Nippon Kayaku Co Ltd Epoxy carboxylate compound soluble in alkali aqueous solution photosensitive resin composition using the same and its cured product
JP4713753B2 (en) * 2001-03-29 2011-06-29 太陽ホールディングス株式会社 Photocurable thermosetting resin composition and cured product thereof
EP1410109B1 (en) 2001-07-26 2011-10-26 Basf Se Photosensitive resin composition
SG100761A1 (en) * 2001-09-28 2003-12-26 Nanya Plastics Corp Photosensitive thermosetting resin composition
JP4328645B2 (en) * 2004-02-26 2009-09-09 太陽インキ製造株式会社 Photocurable / thermosetting resin composition and printed wiring board using the same
WO2006004158A1 (en) * 2004-07-07 2006-01-12 Taiyo Ink Mfg. Co., Ltd. Photocurable/thermosetting resin composition, dry film using same, and cured product thereof
JP4559892B2 (en) * 2005-03-28 2010-10-13 太陽インキ製造株式会社 Colored photosensitive resin composition and cured product thereof
KR100787341B1 (en) * 2005-09-06 2007-12-18 다이요 잉키 세이조 가부시키가이샤 A resin composition, cured material therefrom, and printing wiring boards using the same
JP4849860B2 (en) * 2005-10-04 2012-01-11 太陽ホールディングス株式会社 Photocurable / thermosetting resin composition, cured product thereof, and printed wiring board obtained using the same
JP2007256477A (en) * 2006-03-22 2007-10-04 Fujifilm Corp Method for manufacturing optical compensation sheet, polarizing plate including optical compensation sheet manufactured by same manufacturing method, and liquid crystal display device
JP4994922B2 (en) * 2007-04-06 2012-08-08 太陽ホールディングス株式会社 Solder resist composition and cured product thereof
JP5189878B2 (en) * 2008-04-01 2013-04-24 関西ペイント株式会社 Resin composition, resist composition, and resist pattern forming method
CN105517364B (en) * 2014-09-25 2018-10-23 深南电路有限公司 A kind of electroplating gold method for printed circuit board
CN106318019B (en) * 2015-07-06 2020-03-17 南亚塑胶工业股份有限公司 Low dielectric solder resist ink composition for printed circuit board
US10527936B2 (en) 2016-06-17 2020-01-07 Nan Ya Plastics Corporation Low Dk/Df solder resistant composition use for printed circuit board
JP6892668B2 (en) * 2016-10-14 2021-06-23 互応化学工業株式会社 Photosensitive resin composition
CN109970953B (en) * 2017-12-27 2021-04-09 太阳油墨（苏州）有限公司 Curable resin composition, dry film, cured product, and printed wiring board
JP6563158B1 (en) * 2018-02-08 2019-08-21 関西ペイント株式会社 Resist composition and resist film
JP6986476B2 (en) * 2018-03-29 2021-12-22 株式会社タムラ製作所 Photosensitive resin composition
CN110895381A (en) * 2019-11-20 2020-03-20 深圳市容大感光科技股份有限公司 Photosensitive solder resist ink composition, application thereof and circuit board containing same
CN116171292A (en) * 2020-09-18 2023-05-26 柯尼卡美能达株式会社 Curable composition, solder resist ink, and printed circuit board
CN117003933B (en) * 2023-08-14 2024-01-19 江门市金桥新材料有限公司 Soap-free polymeric cationic dispersion and preparation method thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0717737B2 (en) * 1987-11-30 1995-03-01 太陽インキ製造株式会社 Photosensitive thermosetting resin composition and method for forming solder resist pattern
JP3154782B2 (en) * 1992-01-06 2001-04-09 太陽インキ製造株式会社 Resist ink composition and method for forming solder resist film
CN1147868A (en) * 1995-03-13 1997-04-16 互応化学工业株式会社 Photosensitive resin composition, and coating film, resist ink, resist protective film solder protective resist film and substrate of printed circuit
JPH09160239A (en) * 1995-12-05 1997-06-20 Asahi Chem Res Lab Ltd Soldering resist resin composition
JPH10114852A (en) * 1996-10-11 1998-05-06 Nippon Kayaku Co Ltd Resin composition, resist ink composition and cured product thereof
CN1065971C (en) * 1996-12-27 2001-05-16 清华大学 Organic base catalytic non-developing gas-phase photoresist
JPH1114852A (en) * 1997-06-20 1999-01-22 Sharp Corp Photoelectric composite instrument
JPH1165117A (en) * 1997-08-27 1999-03-05 Tamura Kaken Kk Photosensitive resin composition and solder resist ink using that

Also Published As

Publication number Publication date
CN1821876A (en) 2006-08-23
CN1313883C (en) 2007-05-02
WO2000068740A1 (en) 2000-11-16
TW494276B (en) 2002-07-11
HK1048666B (en) 2007-12-07
CN1821876B (en) 2010-10-06
JP3924431B2 (en) 2007-06-06
CN1364247A (en) 2002-08-14

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20110508