AU2001271381A1 - Vialess printed circuit board - Google Patents

Vialess printed circuit board

Info

Publication number
AU2001271381A1
AU2001271381A1 AU2001271381A AU7138101A AU2001271381A1 AU 2001271381 A1 AU2001271381 A1 AU 2001271381A1 AU 2001271381 A AU2001271381 A AU 2001271381A AU 7138101 A AU7138101 A AU 7138101A AU 2001271381 A1 AU2001271381 A1 AU 2001271381A1
Authority
AU
Australia
Prior art keywords
vialess
circuit board
printed circuit
printed
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001271381A
Inventor
Alexander W. Barr
Samuel C. Ramey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robinson Nugent Inc
Original Assignee
Robinson Nugent Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robinson Nugent Inc filed Critical Robinson Nugent Inc
Publication of AU2001271381A1 publication Critical patent/AU2001271381A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
AU2001271381A 2000-06-26 2001-06-22 Vialess printed circuit board Abandoned AU2001271381A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US21419100P 2000-06-26 2000-06-26
US60214191 2000-06-26
PCT/US2001/019948 WO2002001928A1 (en) 2000-06-26 2001-06-22 Vialess printed circuit board

Publications (1)

Publication Number Publication Date
AU2001271381A1 true AU2001271381A1 (en) 2002-01-08

Family

ID=22798132

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001271381A Abandoned AU2001271381A1 (en) 2000-06-26 2001-06-22 Vialess printed circuit board

Country Status (5)

Country Link
US (1) US6479765B2 (en)
EP (1) EP1295517A1 (en)
JP (1) JP2004502296A (en)
AU (1) AU2001271381A1 (en)
WO (1) WO2002001928A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030123238A1 (en) * 2001-12-27 2003-07-03 Chia-Hsing Yu Enhanced PCB and stacked substrate structure
US20040194999A1 (en) * 2003-04-03 2004-10-07 Matsushita Electric Industrial Co., Ltd. Wiring board, method for manufacturing a wiring board and electronic equipment
US7020960B2 (en) * 2003-06-30 2006-04-04 Finisar Corporation Systems and methods for fabricating printed circuit boards
US7388279B2 (en) * 2003-11-12 2008-06-17 Interconnect Portfolio, Llc Tapered dielectric and conductor structures and applications thereof
US7466021B2 (en) * 2003-11-17 2008-12-16 Interconnect Portfolio, Llp Memory packages having stair step interconnection layers
ITUD20040034A1 (en) 2004-02-27 2004-05-27 Eurotech Spa MULTILAYER EXPANSION BOARD FOR ELECTRONIC AND RELATED EQUIPMENT
JP2006073994A (en) * 2004-08-05 2006-03-16 Seiko Epson Corp Connecting substrate, structure, and method, and electronic apparatus
US20060244124A1 (en) * 2005-04-27 2006-11-02 Teradyne, Inc. Reduced cost printed circuit board
JP4669338B2 (en) * 2005-07-22 2011-04-13 富士通コンポーネント株式会社 Printed wiring board and manufacturing method thereof
US7528069B2 (en) 2005-11-07 2009-05-05 Freescale Semiconductor, Inc. Fine pitch interconnect and method of making
JP4790558B2 (en) * 2006-10-02 2011-10-12 日東電工株式会社 Method for manufacturing printed circuit board
US20080203075A1 (en) * 2007-02-27 2008-08-28 Feldhausen Joseph E Portable structural welding system having integrated resources
US9098646B2 (en) * 2007-08-10 2015-08-04 Kyocera Corporation Printed circuit board design system and method
US8764464B2 (en) * 2008-02-29 2014-07-01 Fci Americas Technology Llc Cross talk reduction for high speed electrical connectors
US9277649B2 (en) * 2009-02-26 2016-03-01 Fci Americas Technology Llc Cross talk reduction for high-speed electrical connectors
US20110147069A1 (en) * 2009-12-18 2011-06-23 International Business Machines Corporation Multi-tiered Circuit Board and Method of Manufacture
US8966747B2 (en) * 2011-05-11 2015-03-03 Vlt, Inc. Method of forming an electrical contact
US9082695B2 (en) 2011-06-06 2015-07-14 Avalanche Technology, Inc. Vialess memory structure and method of manufacturing same
TWI489922B (en) * 2013-07-15 2015-06-21 Mpi Corp Multilayer circuit boards
US9980378B1 (en) * 2017-03-10 2018-05-22 Dell Products, Lp Surface mount connector pad
US10658772B1 (en) * 2017-08-15 2020-05-19 Adtran, Inc. Tiered circuit board for interfacing cables and connectors
JP7232006B2 (en) 2018-09-21 2023-03-02 日本航空電子工業株式会社 CONNECTOR, DEVICE INCLUDING CONNECTOR, AND CONNECTOR MANUFACTURING METHOD
WO2023104842A1 (en) 2021-12-08 2023-06-15 Société des Produits Nestlé S.A. Beverage menu creation

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3400210A (en) 1966-04-26 1968-09-03 Automatic Elect Lab Interlayer connection technique for multilayer printed wiring boards
US4935284A (en) * 1988-12-21 1990-06-19 Amp Incorporated Molded circuit board with buried circuit layer
JPH02273484A (en) * 1989-04-12 1990-11-07 Nec Corp Printed wiring board structure
JPH04249082A (en) * 1991-02-01 1992-09-04 Yamaichi Electron Co Ltd Multi-electrode connector
JPH0574526A (en) * 1991-09-13 1993-03-26 Nec Niigata Ltd Printed board, connector, and connecting method thereof
JP3226959B2 (en) * 1992-05-14 2001-11-12 日東電工株式会社 Manufacturing method of multilayer flexible printed circuit board
DE69413679T2 (en) * 1994-07-15 1999-04-29 Berg Electronics Mfg Assembling a shielded connector and a printed circuit board with contacted holes
JP2609825B2 (en) * 1994-10-31 1997-05-14 日本電気株式会社 Method for manufacturing multilayer wiring board
JP2734447B2 (en) * 1995-09-14 1998-03-30 日本電気株式会社 Multilayer printed circuit board
US5774340A (en) * 1996-08-28 1998-06-30 International Business Machines Corporation Planar redistribution structure and printed wiring device

Also Published As

Publication number Publication date
WO2002001928A1 (en) 2002-01-03
US20020017397A1 (en) 2002-02-14
EP1295517A1 (en) 2003-03-26
US6479765B2 (en) 2002-11-12
JP2004502296A (en) 2004-01-22

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