AU2001229588A1 - Printed circuit board assembly - Google Patents

Printed circuit board assembly

Info

Publication number
AU2001229588A1
AU2001229588A1 AU2001229588A AU2958801A AU2001229588A1 AU 2001229588 A1 AU2001229588 A1 AU 2001229588A1 AU 2001229588 A AU2001229588 A AU 2001229588A AU 2958801 A AU2958801 A AU 2958801A AU 2001229588 A1 AU2001229588 A1 AU 2001229588A1
Authority
AU
Australia
Prior art keywords
circuit board
printed circuit
board assembly
assembly
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001229588A
Inventor
Edgar Jhay Gregorios
Roland F. Portman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BiTMICRO Networks Inc
Original Assignee
BiTMICRO Networks Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BiTMICRO Networks Inc filed Critical BiTMICRO Networks Inc
Publication of AU2001229588A1 publication Critical patent/AU2001229588A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1461—Slidable card holders; Card stiffeners; Control or display means therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Combinations Of Printed Boards (AREA)
AU2001229588A 2000-02-15 2001-01-18 Printed circuit board assembly Abandoned AU2001229588A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09504303 2000-02-15
US09/504,303 US6317330B1 (en) 2000-02-15 2000-02-15 Printed circuit board assembly
PCT/US2001/001650 WO2001062056A1 (en) 2000-02-15 2001-01-18 Printed circuit board assembly

Publications (1)

Publication Number Publication Date
AU2001229588A1 true AU2001229588A1 (en) 2001-08-27

Family

ID=24005690

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001229588A Abandoned AU2001229588A1 (en) 2000-02-15 2001-01-18 Printed circuit board assembly

Country Status (7)

Country Link
US (1) US6317330B1 (en)
JP (1) JP4397143B2 (en)
CN (1) CN1241462C (en)
AU (1) AU2001229588A1 (en)
IL (2) IL151278A0 (en)
TW (1) TWI228211B (en)
WO (1) WO2001062056A1 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6842345B2 (en) * 2002-08-29 2005-01-11 Hewlett-Packard Development Company, L.P. Circuit board support assembly
US6906266B2 (en) * 2003-03-03 2005-06-14 International Business Machines Corporation Method and structure for fastening a planar board to a chassis
US7345891B2 (en) * 2003-10-07 2008-03-18 Hewlett-Packard Development Company, L.P. Circuit board assembly
US20110103050A1 (en) * 2006-01-06 2011-05-05 Jeremy Hochman 360 Degree Viewable Light Emitting Apparatus
US7722215B2 (en) * 2006-01-06 2010-05-25 Barco, Inc. 360 degree viewable light emitting apparatus
WO2009114018A1 (en) 2008-03-14 2009-09-17 Hewlett-Packard Development Company, L.P. Blade server for increased processing capacity
US8595572B2 (en) * 2009-04-08 2013-11-26 Google Inc. Data storage device with metadata command
US8566508B2 (en) * 2009-04-08 2013-10-22 Google Inc. RAID configuration in a flash memory data storage device
US8665601B1 (en) 2009-09-04 2014-03-04 Bitmicro Networks, Inc. Solid state drive with improved enclosure assembly
US8560804B2 (en) 2009-09-14 2013-10-15 Bitmicro Networks, Inc. Reducing erase cycles in an electronic storage device that uses at least one erase-limited memory device
US9043669B1 (en) 2012-05-18 2015-05-26 Bitmicro Networks, Inc. Distributed ECC engine for storage media
JP6069237B2 (en) * 2014-02-26 2017-02-01 京セラ株式会社 Electronics
US9433095B2 (en) 2014-09-10 2016-08-30 International Business Machines Corporation Implementing simultaneously connecting of multiple devices in a multi-tiered, multi-directional, enhanced tolerance system with mechanical support structures
US9980381B2 (en) * 2014-12-16 2018-05-22 Motorola Solutions, Inc. Method and apparatus for intrinsically safe circuit board arrangement for portable electronic devices
JP6378265B2 (en) * 2016-08-04 2018-08-22 Ｎｅｃスペーステクノロジー株式会社 PCB connection structure
JP6780422B2 (en) * 2016-09-30 2020-11-04 オムロン株式会社 Electronics
US11929297B2 (en) * 2020-11-09 2024-03-12 Hamilton Sundstrand Corporation Conductive thermal management architecture for electronic devices
CN112866454B (en) * 2021-01-19 2023-05-12 维沃移动通信有限公司 Electronic module and mobile terminal

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5818299Y2 (en) * 1978-04-28 1983-04-13 富士通株式会社 Electronic equipment with built-in printed circuit board unit
DE3586893D1 (en) * 1984-12-28 1993-01-21 Micro Co Ltd STACKING METHOD FOR PRINTED CIRCUITS.
US4695872A (en) * 1986-08-01 1987-09-22 Texas Instruments Incorporated High density micropackage for IC chips
US5107404A (en) * 1989-09-14 1992-04-21 Astec International Ltd. Circuit board assembly for a cellular telephone system or the like
JPH0669668A (en) * 1992-08-13 1994-03-11 Nec Corp System for mounting parts on printed wiring board
JPH0798620A (en) * 1992-11-13 1995-04-11 Seiko Epson Corp Electronic device and computer using it
US5373104A (en) * 1993-07-12 1994-12-13 Delco Electronics Corporation Control module with integral fastening/locking assembly
JP3654448B2 (en) * 1993-10-06 2005-06-02 Ｔｄｋ株式会社 Electrical equipment
US5499164A (en) * 1994-06-22 1996-03-12 Northrop Grumman Corporation High impact digital crash data recorder
US5583749A (en) * 1994-11-30 1996-12-10 Altera Corporation Baseboard and daughtercard apparatus for reconfigurable computing systems
US5644277A (en) * 1995-02-27 1997-07-01 Hughes Aircraft Company Three-wire-line vertical interconnect structure for multilevel substrates
US5856915A (en) * 1997-02-26 1999-01-05 Pacesetter, Inc. Vertically stacked circuit module using a platform having a slot for establishing multi-level connectivity

Also Published As

Publication number Publication date
CN1241462C (en) 2006-02-08
WO2001062056A1 (en) 2001-08-23
CN1423917A (en) 2003-06-11
JP4397143B2 (en) 2010-01-13
IL151278A (en) 2006-10-05
IL151278A0 (en) 2003-04-10
JP2003523619A (en) 2003-08-05
US6317330B1 (en) 2001-11-13
TWI228211B (en) 2005-02-21

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