JPH0669668A - System for mounting parts on printed wiring board - Google Patents

System for mounting parts on printed wiring board

Info

Publication number
JPH0669668A
JPH0669668A JP21586592A JP21586592A JPH0669668A JP H0669668 A JPH0669668 A JP H0669668A JP 21586592 A JP21586592 A JP 21586592A JP 21586592 A JP21586592 A JP 21586592A JP H0669668 A JPH0669668 A JP H0669668A
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
boards
frames
wiring boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21586592A
Other languages
Japanese (ja)
Inventor
Hiroyuki Matsumoto
裕之 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP21586592A priority Critical patent/JPH0669668A/en
Publication of JPH0669668A publication Critical patent/JPH0669668A/en
Pending legal-status Critical Current

Links

Landscapes

  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

PURPOSE:To reduce the size of a device constituted of a plurality of printed wiring boards to nearly the same size of the printed wiring boards and, at the same time, to improve the vibrationproof property of the device. CONSTITUTION:Frames 4 having heights decided by taking the parts mounted on printed wiring boards 1 into account, thicknesses decided by paying attention to radiation, and outer frames of nearly the same sizes as the external sizes of the boards 1 and the boards 1 are alternately pile up and the plurality of boards 1 are respectively put between a top and bottom covers 2 and 3 together with the frames 4, with vibration-proof collars 6 being respectively put between the boards 1, and the covers 2 and 3, boards 2, and frames 4 are fixed to each other with through bolts 5.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は印刷配線板実装方式に関
し、特に小型化および耐振性を要求される電子機器装置
における印刷配線板実装方式に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board mounting method, and more particularly to a printed wiring board mounting method in an electronic device that is required to be compact and resistant to vibration.

【0002】[0002]

【従来の技術】従来のこの種の印刷配線板実装方式の例
を図2および図3に示す。図2に示す方式では、複数の
印刷配線板1はカラー6を介して上からトップカバー1
2、下からボトムカバー13で挟まれ、貫通ボルト5に
より固定される。固定された複数の印刷配線板1は、側
面からねじ7により取付けられるサイドカバー8で囲わ
れる。
2. Description of the Related Art An example of a conventional printed wiring board mounting system of this type is shown in FIGS. In the system shown in FIG. 2, the plurality of printed wiring boards 1 are connected to the top cover 1 from above via the collar 6.
2. It is sandwiched by the bottom cover 13 from below and fixed by the through bolt 5. The plurality of fixed printed wiring boards 1 are surrounded by side covers 8 which are attached from the side by screws 7.

【0003】また、図3に示す方式では、印刷配線板1
は、予め分割されたサイドフレーム9にねじ7によって
取付けられており、印刷配線板1が取付けられた複数の
サイドフレーム9は、カラー6を介して上からトッパカ
バー2、下からボトムカバー3で挟まれ、貫通ボルト5
により固定される。この方式はスライス構造と呼ばれ、
図2に示したサイドカバー8を分割した形でサイドフレ
ーム9とし、サイドフレーム9の中に印刷配線板1を実
装する方式である。
In the system shown in FIG. 3, the printed wiring board 1 is also used.
Is attached to the side frame 9 divided in advance by screws 7, and the plurality of side frames 9 to which the printed wiring board 1 is attached are sandwiched by the topper cover 2 from above and the bottom cover 3 from below via the collar 6. Through bolt 5
Fixed by. This method is called slice structure,
This is a system in which the side cover 8 shown in FIG. 2 is divided into side frames 9 and the printed wiring board 1 is mounted in the side frames 9.

【0004】[0004]

【発明が解決しようとする課題】上述した従来の印刷配
線板実装方式は、基本的には印刷配線板の外側にケース
を設ける構造となっているため、必然的に印刷配線板の
外形に対し装置が大型化となっていた。また印刷配線板
は、ねじまたは貫通ボルトにより点で固定されるだけで
あるため振動に弱く、耐振性の向上をはかるために、制
振作用を目的として発泡材等を用いたポッティングを行
い、部品の固定および印刷配線板の固定を行って対処し
ていたが、近年アウトガス補修性の問題から発泡材等を
用いない印刷配線板実装方式の採用が必要となってい
た。また作業性の面においても、予めねじまたは貫通ボ
ルトで複数の印刷配線板を固定してからケースに組込む
ため、手間がかかるなどの問題点があった。
The conventional printed wiring board mounting method described above basically has a structure in which a case is provided on the outside of the printed wiring board. The device had become larger. The printed wiring board is only fixed at points with screws or through bolts, so it is weak against vibration and potting using foam etc. is performed for the purpose of vibration damping in order to improve vibration resistance. However, in recent years, it has become necessary to adopt a printed wiring board mounting method that does not use a foam material or the like because of the problem of outgas repairability. Further, in terms of workability as well, there is a problem in that it takes time and labor because a plurality of printed wiring boards are fixed in advance with screws or through bolts and then assembled into a case.

【0005】[0005]

【課題を解決するための手段】本発明の印刷配線板実装
方式は、実装すべき複数の印刷配線板と、これらの印刷
配線板に搭載される実装部品を考慮した高さおよび放射
線を考慮した厚さとを持ち且つ前記印刷配線板の外形と
ほぼ同寸法の外枠を持つ複数のフレームとを有し、前記
印刷配線板と前記フレームとを交互に重ね合わせて締結
部材で固定することにより前記印刷配線板を前記フレー
ムの面全体で固定し且つ前記印刷配線板自体も装置のケ
ースの一部とするように構成したものである。
The printed wiring board mounting method of the present invention considers the height and radiation in consideration of a plurality of printed wiring boards to be mounted and mounting components mounted on these printed wiring boards. A plurality of frames having a thickness and an outer frame having substantially the same dimensions as the outer shape of the printed wiring board, and the printed wiring boards and the frames are alternately superposed and fixed by a fastening member. The printed wiring board is fixed on the entire surface of the frame, and the printed wiring board itself is also a part of the case of the apparatus.

【0006】[0006]

【実施例】次に、本発明について図面を参照して説明す
る。図1は本発明の一実施例の印刷配線板実装方式を示
す分解斜視図である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 is an exploded perspective view showing a printed wiring board mounting method according to an embodiment of the present invention.

【0007】本実施例は、複数の印刷配線板1、トップ
カバー2、ボトムカバー3および複数のフレーム4を主
たる構成要素としており、印刷配線板1自体もケースの
一部とする構造である。具体的には、フレーム4は印刷
配線板1に搭載される実装部品を考慮した高さおよび放
射線を考慮した厚さとを持ち且つ印刷配線板1の外形と
ほぼ同寸法の外枠を持っており、この複数のフレーム4
と複数の印刷配線板1とを交互に重ね合わせており、複
数の印刷配線板1は上からトップカバー2、下からボト
ムカバー3で挟まれ、貫通ボルト5で固定される。即
ち、印刷配線板1はフレーム4の面全体で固定されるこ
ととなる。また印刷配線板1が大型になることによっ
て、振動時における中央部の振幅が大きくなる場合は、
制振材としてのカラー6を印刷配線板1の相互間に実装
し、貫通ボルト5で印刷配線板1の間を固定する方式を
とることも可能である。
In this embodiment, a plurality of printed wiring boards 1, a top cover 2, a bottom cover 3 and a plurality of frames 4 are main constituent elements, and the printed wiring board 1 itself is a part of the case. Specifically, the frame 4 has a height considering the mounting components mounted on the printed wiring board 1 and a thickness considering radiation, and has an outer frame having substantially the same size as the outer shape of the printed wiring board 1. , This multiple frames 4
And a plurality of printed wiring boards 1 are alternately superposed, and the plurality of printed wiring boards 1 are sandwiched by a top cover 2 from the top and a bottom cover 3 from the bottom and fixed by through bolts 5. That is, the printed wiring board 1 is fixed on the entire surface of the frame 4. In addition, when the printed wiring board 1 becomes large and the amplitude of the central portion during vibration increases,
It is also possible to adopt a system in which the collar 6 as a damping material is mounted between the printed wiring boards 1 and the printed wiring boards 1 are fixed by the through bolts 5.

【0008】[0008]

【発明の効果】以上説明したように本発明は、印刷配線
板の実装部品を考慮した高さおよび放射線を考慮した厚
さとを持ち、印刷配線板の外形とほぼ同寸法を外枠を持
つフレームと印刷配線板とを交互に重ね合わせることに
より、印刷配線板の外形寸法とほぼ同程度にまで装置の
小型化が可能であるのみでなく、印刷配線板をフレーム
の面全体で固定することにより、耐振性の面でも有効で
ある。その結果、発泡材等による印刷配線板の固定が不
要となり、部品の固定のみをコーティング剤により行え
ば良く、装置組立て時の作業項目削減と合わせて作業面
での能率向上が可能となる効果を有する。
As described above, the present invention has a frame having a height in consideration of mounting parts of a printed wiring board and a thickness in consideration of radiation and having an outer frame having substantially the same size as the outer shape of the printed wiring board. By alternately superposing the printed wiring board and the printed wiring board, not only can the size of the device be reduced to approximately the same as the external dimensions of the printed wiring board, but also by fixing the printed wiring board on the entire surface of the frame. It is also effective in terms of vibration resistance. As a result, it is not necessary to fix the printed wiring board with foam material, etc., and only the parts need to be fixed with the coating agent, which reduces the work items when assembling the device and improves the work efficiency. Have.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例の印刷配線板実装方式を示す
分解斜視図である。
FIG. 1 is an exploded perspective view showing a printed wiring board mounting method according to an embodiment of the present invention.

【図2】従来の印刷配線板実装方式の一例を示す分解斜
視図である。
FIG. 2 is an exploded perspective view showing an example of a conventional printed wiring board mounting method.

【図3】従来の印刷配線板実装方式の他の例を示す分解
斜視図である。
FIG. 3 is an exploded perspective view showing another example of a conventional printed wiring board mounting method.

【符号の説明】[Explanation of symbols]

1 印刷配線板 2,12 トップカバー 3,13 ボトムカバー 4 フレーム 5 貫通ボルト 6 カラー 7 ねじ 8 サイドカバー 9 サイドフレーム 1 Printed wiring board 2, 12 Top cover 3, 13 Bottom cover 4 Frame 5 Through bolt 6 Color 7 Screw 8 Side cover 9 Side frame

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 実装すべき複数の印刷配線板と、これら
の印刷配線板に搭載される実装部品を考慮した高さおよ
び放射線を考慮した厚さとを持ち且つ前記印刷配線板の
外形とほぼ同寸法の外枠を持つ複数のフレームとを有
し、前記印刷配線板と前記フレームとを交互に重ね合わ
せて締結部材で固定することにより前記印刷配線板を前
記フレームの面全体で固定し且つ前記印刷配線板自体も
装置のケースの一部とするように構成したことを特徴と
する印刷配線板実装方式。
1. A plurality of printed wiring boards to be mounted and a height in consideration of mounting components mounted on these printed wiring boards and a thickness in consideration of radiation, and having substantially the same outer shape as that of the printed wiring board. A plurality of frames having an outer frame of a size, and the printed wiring board and the frame are alternately superposed and fixed with a fastening member to fix the printed wiring board on the entire surface of the frame, and A printed wiring board mounting method characterized in that the printed wiring board itself is also configured as part of the case of the device.
【請求項2】 前記印刷配線板の相互間に制振用部材を
設けたことを特徴とする請求項1記載の印刷配線板実装
方式。
2. The printed wiring board mounting method according to claim 1, wherein a vibration damping member is provided between the printed wiring boards.
JP21586592A 1992-08-13 1992-08-13 System for mounting parts on printed wiring board Pending JPH0669668A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21586592A JPH0669668A (en) 1992-08-13 1992-08-13 System for mounting parts on printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21586592A JPH0669668A (en) 1992-08-13 1992-08-13 System for mounting parts on printed wiring board

Publications (1)

Publication Number Publication Date
JPH0669668A true JPH0669668A (en) 1994-03-11

Family

ID=16679556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21586592A Pending JPH0669668A (en) 1992-08-13 1992-08-13 System for mounting parts on printed wiring board

Country Status (1)

Country Link
JP (1) JPH0669668A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003031974A (en) * 2001-07-18 2003-01-31 Fujitsu Ltd Assembling structure for printed board unit
JP2003523619A (en) * 2000-02-15 2003-08-05 ビットマイクロ ネットワークス、インク. Printed circuit board assembly
JP2006287172A (en) * 2005-03-08 2006-10-19 Toshiba Corp Circuit board housing structure and its cabinet packing structure
JP2012089767A (en) * 2010-10-22 2012-05-10 Denso Corp Dew condensation prevention structure of printed circuit board
JP2018022788A (en) * 2016-08-04 2018-02-08 Necスペーステクノロジー株式会社 Printed board connection structure
WO2022064074A1 (en) * 2020-09-28 2022-03-31 Softiron Limited Interposer for printed circuit boards
WO2023037856A1 (en) * 2021-09-10 2023-03-16 株式会社デンソー Electronic device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0453298A (en) * 1990-06-20 1992-02-20 Mitsubishi Electric Corp Board assembling method
JPH0496295A (en) * 1990-08-03 1992-03-27 Mitsubishi Electric Corp Microwave circuit device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0453298A (en) * 1990-06-20 1992-02-20 Mitsubishi Electric Corp Board assembling method
JPH0496295A (en) * 1990-08-03 1992-03-27 Mitsubishi Electric Corp Microwave circuit device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003523619A (en) * 2000-02-15 2003-08-05 ビットマイクロ ネットワークス、インク. Printed circuit board assembly
JP2003031974A (en) * 2001-07-18 2003-01-31 Fujitsu Ltd Assembling structure for printed board unit
JP2006287172A (en) * 2005-03-08 2006-10-19 Toshiba Corp Circuit board housing structure and its cabinet packing structure
JP4602183B2 (en) * 2005-03-08 2010-12-22 株式会社東芝 Circuit board housing structure and casing packaging structure thereof
JP2012089767A (en) * 2010-10-22 2012-05-10 Denso Corp Dew condensation prevention structure of printed circuit board
JP2018022788A (en) * 2016-08-04 2018-02-08 Necスペーステクノロジー株式会社 Printed board connection structure
WO2022064074A1 (en) * 2020-09-28 2022-03-31 Softiron Limited Interposer for printed circuit boards
WO2023037856A1 (en) * 2021-09-10 2023-03-16 株式会社デンソー Electronic device

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Legal Events

Date Code Title Description
A02 Decision of refusal

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Effective date: 19980331