JP4602183B2 - Circuit board housing structure and casing packaging structure thereof - Google Patents

Description

  The present invention relates to a circuit board housing case that is mounted mainly on an aircraft and houses a circuit board on which a heat generating component of an antenna device is mounted, and a housing packing structure for installing the housing on a mounting machine, and in particular, a housing component. TECHNICAL FIELD OF THE INVENTION

  Conventionally, a housing for accommodating a circuit board of an antenna device for an aircraft is manufactured with high rigidity and high strength in accordance with the requirements of vibration resistance and impact resistance, and light weight such as aluminum alloy is required due to the demand for weight reduction. Material is used.

  However, in recent years, the aircraft itself has been required to be reduced in weight, and in order to respond to this, it is essential to reduce the weight of the on-board equipment. Then, there is no limit to weight reduction. In addition, when there are a plurality of housings and they are installed in a limited space, the heat radiation countermeasures may become insufficient due to the stacking, and countermeasures are also demanded.

As an existing technology of this type, in Patent Document 1, when housing a semiconductor element and an insulating substrate on which the semiconductor element is mounted in a case, a resin having high thermal conductivity is injected into the case together with silicone gel. A structure for obtaining a heat dissipation effect and a structure for filling a foamed material and pressing the silicone gel surface with the foamed material are disclosed. However, there is no disclosure regarding the material of the case itself, and there is no disclosure regarding a technique for reducing the overall weight.
Japanese Patent Laid-Open No. 11-177006

  As described above, although the conventional circuit board housing is made of a lightweight alloy, it is difficult to achieve further weight reduction. Moreover, when installing a some housing | casing, it considers heat dissipation and it is also requested | required that it can install in a bundle.

  Therefore, the present invention has been made in view of the above circumstances, and is more lightweight, excellent in vibration resistance and impact resistance, and excellent in heat dissipation of internal heating components, and a plurality of circuit board housing structures. An object of the present invention is to provide a casing packaging structure for sufficiently exerting a heat dissipation effect when arranging the casings together.

  A circuit board housing structure according to the present invention houses a circuit board on which a heat-generating component is mounted, and is a foamed molded product having a frame shape with an open front surface and a back surface, and the circuit on the back surface side. A housing body having a countersink for accommodating the substrate and supporting it at the periphery of the substrate, and a foamed product, each of the front and back lids covering the entire surface of the housing body and the entire back surface; And a coupling means for integrally coupling the housing body, the front surface lid, and the back surface lid.

  In addition, the casing packing structure according to the present invention accommodates a circuit board on which a heat generating component is mounted using a molded foam material, and stacks a plurality of casings having the same shape and having leg portions on the front and back surfaces. A base for placing the plurality of casings side by side, a metal frame for bundling the plurality of casings mounted on the base at the top, the metal frame and the base And a wire connecting mechanism for connecting the two with a wire.

  According to the above-described invention, when the circuit board housing structure that is lighter in weight, excellent in vibration resistance and impact resistance, and excellent in heat dissipation of the internal heat generating component, and a plurality of housings are arranged together, It is possible to provide a housing packaging structure for sufficiently exhibiting the heat dissipation effect.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(First embodiment)
1 to 3 show the structure of a circuit board housing structure according to a first embodiment of the present invention. FIG. 1 is an exploded perspective view seen from the front side of the board, and FIG. 2 is seen from the back side of the board. FIG. 3 shows a cross-sectional view after assembly. In FIGS. 1 to 3, reference numeral 11 denotes a casing main body that accommodates the circuit board 1 on which heat-generating components are mounted. The casing main body 11 is a foamed molded product having a frame shape with the front and back surfaces open. And the counterbore 11a for accommodating the said circuit board 1 and supporting it with the periphery of the said board | substrate 1 is formed in the back surface side. The circuit board 1 is mounted with electronic components including heat-generating components on the front surface side, and the wiring pattern is formed on the back surface side. When the circuit board 1 is accommodated in the housing body 11, the electronic component mounting surface side is set inside the housing. The depth of the counterbore 11a of the housing body 11 is set to be deeper than the thickness of the substrate 1, and the depth on the surface side when the substrate is accommodated is equal to or greater than the maximum height of the mounted component. The counterbore 11a is slightly smaller than the size around the substrate and is easily supported by pushing the substrate 1 using the elasticity of the foam material. In addition, 11b in the figure is a cable lead-in port formed in the side part of the housing body 11.

  A front cover 12 and a back cover 13 are prepared for the housing body 11. Each of these lids 12 and 13 is a molded product made of the same material as the casing main body 11 and has a dimension covering the entire front surface and the entire back surface of the main body. The lids 12 and 13 are formed with leg portions 12a, 12b, 13a and 13b having constant widths at both ends in the longitudinal direction so that they do not adhere to each other when the casings are stacked. ing.

  That is, the front cover 12 and the back cover 13 are integrally coupled to the housing body 11 in a state where the circuit board 1 is accommodated. Although various forms are conceivable as the coupling mechanism, in this embodiment, through holes 11c, 12c, and 13c are formed at a plurality of locations around the casing body 11 and the front and back lids 12 and 13, respectively. The lids 12 and 13 are integrally coupled to the main body 11 by passing the shaft 14a through the circular plate 14b and 14e on both sides of the shaft 14a and screwing with the screws 14d and 14e.

  As a result of the above structure, the following effects are obtained. In other words, while the conventional product was designed to be “stiff” and to suppress internal displacement, ie acceleration (= inertial force) when subjected to vibration or impact, According to this, on the contrary, it is made "soft" using a cushioning material made of foam, which is a high-attenuation material. Can do. In terms of image, it is used as a casing as it is in a packing box. Heat dissipation is handled by forcibly sending wind through the gap between the legs.

(Second Embodiment)
4 to 6 show the structure of the circuit board housing structure according to the second embodiment of the present invention. FIG. 4 is an exploded perspective view as seen from the front side of the board, and FIG. 5 is as seen from the back side of the board. FIG. 6 shows a sectional view after assembly. 4 to 6, the same parts as those in FIGS. 1 to 3 are denoted by the same reference numerals, and different parts will be described in detail here.

  In the embodiment shown in FIGS. 4 to 6, the housing body 11 is formed with a counterbore 11 d serving as a space for housing the aluminum plate 2 on the front surface side. The depth of the counterbore 11d for supporting the aluminum plate 2 is substantially equal to the thickness of the aluminum plate 2 respectively. On the other hand, a window portion 12d for exposing the aluminum plate 2 to the outside is formed in the surface lid 12.

  Here, in the said structure, as shown in FIG. 6, between the circuit board 1 and the aluminum plate 2 becomes an air layer, and heat conductivity is low. Therefore, it is conceivable to pack a heat conductive sheet, but since the height is sufficient to accommodate the parts on the board, it is not a good idea to pack the heat conductive sheet to fill the space. May cause damage to the connection.

  Therefore, in the present embodiment, the heat conducting member 3 is interposed between the aluminum plate 2 and the heat generating component 1. Specifically, aluminum heat conduction fins 3a processed into a flexible shape at least in the height direction are prepared, and a gel-like shape is formed on the inner surface of the aluminum plate 2 at a position facing the heat generating component on the substrate 1. The heat conductive sheet 3b is screwed and the gel heat conductive sheet 3c is sandwiched between the heat generating component and the fin 3a during assembly. Thereby, the heat generated by the heat generating component is conducted to the aluminum plate 2 through the conductive sheet 3c, the fins 3a, and the conductive sheet 3b, and can be radiated from the window 12d of the front cover 12. Further, the fin 3a itself can also provide a heat radiation effect by air cooling in the main body. Since the fin 3a has a flexible structure at least in the height direction, even if there is an impact from the front surface side or the back surface side, the vibration can be absorbed by the fin 3a along with the impact absorption by the foam material. .

  FIG. 7 shows a specific example in which the fin 3a is flexible not only in the height direction but also in the horizontal direction. In this fin structure, a copper plate 31, which is a thin plate excellent in thermal conductivity, is formed in a cross shape, and a pair of upper and lower pieces are curved upward together so that the ends of the pieces are close to each other so as to face each other. The left and right pieces are both curved downward and the end portions of the pieces are brought close to each other so as to face each other, and the adjacent facing portions serve as the joining surfaces of the heat generating component 1 and the aluminum plate 2. According to this structure, since there is a degree of freedom in the X direction and the Y direction in addition to the height direction in the vertical direction, it is possible to realize flexible fins in the vertical and horizontal directions as a whole.

  In the above embodiment, the countersink 11d for fitting and supporting the aluminum plate 2 on the housing body 11 side is formed. However, the countersink for supporting the aluminum plate is formed on the front cover 12. Of course, it may be.

  According to the above structure, the heat generated by the heat generating component is directly conducted to the aluminum plate 2 and radiated to the outside. Therefore, if the outside temperature is low, it is possible to radiate heat regardless of forced air cooling by the blower. is there.

(Third embodiment)
8 to 10 show the structure of the circuit board housing structure according to the third embodiment of the present invention. FIG. 8 is an exploded perspective view as seen from the front side of the board, and FIG. 9 is as seen from the back side of the board. FIG. 10 shows a cross-sectional view after assembly. 8 to 10, the same parts as those in FIGS. 4 to 6 are denoted by the same reference numerals, and different parts will be described in detail here.

  8 to 10, the casing body 11 further accommodates a heat-dissipating aluminum plate 4 outside the countersink 11 a for the circuit board 1 formed on the back side, and at the periphery of the aluminum plate 4. A counterbore 11e for supporting is formed. The depth of the counterbore 11e is approximately equal to the thickness of the aluminum plate 4. On the other hand, the rear cover 13 is formed with a window portion 13d for exposing the aluminum plate 4 to the outside.

  According to the above structure, when integrating the housing body 11, the front cover 12, and the back cover 13, the heat-dissipating aluminum plate 4 having excellent thermal conductivity can be sandwiched between the back surfaces of the main body 11. At this time, since the aluminum plate 4 is exposed to the outside from the window portion 13 d formed on the lid 13, the heat accumulated on the back surface of the substrate can be efficiently radiated by the aluminum plate 4.

  Here, in the said structure, between the back surface of the circuit board 1 and the aluminum plate 4 becomes an air layer, and heat conductivity is low. Therefore, as shown in FIG. 10, a gel-like heat conduction sheet 5 having a thickness sufficient to fill the space is sandwiched between the circuit board 1 and the aluminum plate 4. As a result, the heat generated inside the main body is conducted from the back surface of the substrate to the aluminum plate 4 through the heat conductive sheet 5, so that heat can be efficiently radiated if the outside air temperature is low, particularly without forced air cooling by a blower.

  Also in the above embodiment, the countersink 11d for fitting and supporting the aluminum plate 4 on the housing body 11 side is formed, but the countersink for supporting the aluminum plate is formed on the back cover 13. Of course, it may be.

(Fourth embodiment)
By the way, when the circuit board 1 and the aluminum plate 2 of the second embodiment are fitted into the countersunk portion of the housing body 11, the end surface is relatively acute, and therefore when subjected to long-term vibration, the foam material As a result, the receiving portion on the side of the casing body 11 is shaved, which causes shakiness.

  Therefore, in this embodiment, as shown in FIGS. 11A, 11B, and 11C, L-shaped metal fittings 1a are attached to the four sides (three sides in the figure) of the circuit board 1 by screwing, for example, A groove portion 11f into which the end portion of the L-shaped metal fitting 1a attached to the substrate fits is formed in the receiving portion on the body main body 11 side. Similarly, for the aluminum plate 2, the edges of the four sides are bent in the same direction, and the groove 11g is formed so that the end of the bent portion fits into the receiving portion on the housing body 11 side.

  As a result, the edges of the circuit board 1 and the aluminum plate 2 are L-shaped and come into contact with the inner surface of the housing main body 11 in a plane, thereby preventing the housing main body 11 from being scraped even if it is a foam material. Can do.

  In the third embodiment, the aluminum plate 4 is also bent by bending the edges of the four sides in the same manner as the aluminum plate 2 and forming a groove portion into which the edge portion fits in the receiving portion of the housing body 11. The effect is obtained.

(Fifth embodiment)
FIG. 12 is an exploded perspective view showing the overall structure of the housing packaging structure according to the present invention, and FIGS. 13A, 13B, and 13C are a top view, a right side view, and a left side view. Show. 21, 22, and 23 are cases of any type of circuit board housing structures described in the first to third embodiments (hereinafter simply referred to as cases). The housings 21 to 23 are integrated together by the support frame 25 from above while being placed side by side on the base 24.

  On the four sides of the support frame 25, columns 25a for suspending the wires 26 are provided. On the other hand, the base 24 has a locking mechanism 27 that fixes both ends of the wire 26 suspended from the support columns 25a of the support frame 25 to the base 24 around the mounting positions of the casings 21 to 23. Provided. This tethering mechanism 27 has a structure in which both ends of the wire 26 are connected to support members 27c and 27d fixed to the base 24 side by a wire receiver 27a and a tension spring 27b, respectively, and by adjusting the expansion / contraction strength of the tension spring 27b. The housing holding force by the wire 26 can be adjusted. Further, the suspension caused by the expansion and contraction of the wire 26 can be arbitrarily removed or suspended again.

  In addition, when the number of housings is less than the accommodating number of the support frames 25, a dummy housing molded into a housing shape with a foam material is used. Since this dummy housing is molded only from the foam material, it is extremely lightweight and has only a slight increase in mass. Of course, a support frame or the like may be prepared for each accommodation number.

  According to the structure, a space is formed between the casings 21 to 23 by the respective leg portions, so that a heat dissipation effect by forced air cooling can be expected. And, since each housing case 21 to 23 is a molded product of foam material, it is bundled with a support frame and is pulled and fixed by a wire on the base while taking advantage of the extremely lightweight feature. Simple. Moreover, since it can be installed as it is, it is not necessary to dismantle a large number of cases at the loading site, and the workability is also excellent in this respect.

  In the second embodiment, the case where the fins are flexible in the vertical and horizontal directions as a whole has been described. However, the fin structure is not limited to the shape shown in FIG. The shape shown in FIG.

  The fin shown in FIG. 14 is a flexible and thermally conductive thin plate (copper plate) formed in a strip shape and formed into a mainspring shape, and both end portions serve as joint surfaces between the heat generating component 1 and the aluminum plate 2. Further, the fin shown in FIG. 15 is a flexible and thermally conductive thin plate (copper plate) formed in a strip shape, formed into an S-shape, and both end portions used as joint surfaces between the heat generating component 1 and the aluminum plate 2. Yes.

  It is possible to provide a plurality of heat sinks in order to increase the heat dissipation effect. However, in order to enhance the partial heat dissipation effect, as shown in FIGS. It is good to shape in a letter shape and join each end. According to this structure, it is possible to reduce the weight as compared with increasing the thickness with one heat transfer member, and it is possible to maintain high flexibility.

(effect)
Summarizing the above embodiments, the following effects can be obtained.

  In the past, the housing itself was made “stiff” to suppress internal displacement, that is, acceleration (= inertial force) when subjected to vibration or impact, but in the present invention, conversely, a high damping material is used. It is made "soft" using a cushioning material such as a foam material, and is displaced when subjected to vibration or impact to insulate high frequency components (vibration), thereby protecting the interior. In terms of image, it is used as a casing as it is in a packing box.

  The casing that accommodates the circuit board uses a cushioning material such as polyethylene foam, and a plurality of casings that accommodate the board are arranged side by side and are collectively bound by a wire. For this reason, compared with the conventional aluminum housing | casing, since a material is almost a foam material and a wire, it becomes a very lightweight housing | casing. In addition, since a foam cushioning material is used, the structure can withstand vibration shock.

  For heat dissipation, a forced air cooling method using a blower (first to third embodiments) and a heat conduction method using a gel-like heat conductive sheet or a flexible heat conductive fin (second and third embodiments) The following two methods can be taken.

  Here, in the case of mounting on an aircraft, the heat radiation method is divided between the ground and the high sky. That is, on the ground, since the air is warm and the atmospheric pressure is 1 atm, heat radiation by air, that is, forced air cooling has a high heat radiation effect. On the other hand, in high skies, air pressure is low and air is thin, so heat radiation by air is not very effective. However, on the other hand, since the air is cold and does not require the cooling efficiency as the ground, it is effective to adopt a heat dissipation method by heat conduction without performing forced air cooling with a blower. As described above, one of the features of the present invention is that an appropriate heat dissipation method can be selected between the ground and the high sky.

  By making the heat dissipation method selectable as described above, the blower, which is a heavy object, is treated as a cooling jig during ground tests, and when flying to high altitudes, it is necessary to reduce the weight to the limit. Remove the heavy blower to remove heat by conduction. The point that the blower can be detached as described above is also one of the features of the present invention.

  Note that the present invention is not limited to the above-described embodiments as they are, and can be embodied by variously modifying the constituent elements without departing from the scope of the invention in the implementation stage. Various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the above-described embodiments. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, constituent elements according to different embodiments may be appropriately combined.

The disassembled perspective view seen from the board | substrate surface side of the circuit board accommodation structure which is 1st Embodiment concerning this invention. The exploded perspective view seen from the substrate back side of a 1st embodiment. Sectional drawing after the assembly of 1st Embodiment. The disassembled perspective view seen from the board | substrate surface side of the circuit board accommodation structure which is the 2nd Embodiment concerning this invention. The exploded perspective view seen from the substrate back side of a 2nd embodiment. Sectional drawing after the assembly of 2nd Embodiment. The figure which shows the specific structural example of the flexible heat conductive fin used for 2nd Embodiment. The disassembled perspective view seen from the board | substrate surface side of the circuit board accommodation structure which is the 3rd Embodiment concerning this invention. The exploded perspective view seen from the substrate back side of a 3rd embodiment. Sectional drawing after the assembly of 3rd Embodiment. The figure for demonstrating the process of the circuit board of 4th Embodiment, the aluminum plate for heat dissipation, and the process of a housing body side receiving part. The disassembled perspective view which shows the whole structure of the housing | casing packing structure which concerns on this invention. FIG. 12 is a top view, a right side view, and a left side view of the housing packaging structure shown in FIG. 11. The figure which shows the other specific example (spring-spring type) of the flexible heat conductive fin used for 2nd Embodiment. The figure which shows the other specific example (S-shape) of the flexible heat conductive fin used for 2nd Embodiment. The figure which shows the other specific example (spring-spring type) of the flexible heat conductive fin used for 2nd Embodiment. The figure which shows the other specific example (S-shape) of the flexible heat conductive fin used for 2nd Embodiment.

Explanation of symbols

1 ... Circuit board,
2 ... Aluminum plate for heat dissipation,
3 ... heat conduction member,
3a ... Flexible heat conduction fin,
3b, 3c ... heat conduction sheet,
4 ... Aluminum plate for heat dissipation,
5 ... Thermal conductive sheet,
11 ... the housing body,
11a ... Countersink for substrate support,
11b ... Cable entry port,
11c ... through hole,
11d, 11e ... aluminum plate support countersink,
12 ... surface lid,
12a, 12b ... legs,
12c ... through hole,
12d ... window,
13 ... back cover,
13a, 13b ... legs,
13c ... through hole,
13d ... window,
14a ... shaft,
14b, 14c ... circular flat plate,
14d, 14e ... screw,
21, 22, 23 ... casing,
24 ... the base,
25. Support frame,
25a ... struts,
26 ... Wire,
27. Tightening mechanism,
27a ... Wire receiver,
27b ... tension spring,
27c, 27d ... Supporting tools.

Claims (11)

In the circuit board housing structure for housing the circuit board on which the heat generating component is mounted,
A molded body of a foam material, having a frame shape with open front and back surfaces, a housing body having a countersink for accommodating the circuit board on the back surface side and supporting it at the periphery of the substrate,
Each is a molded product of foam, and the front and back covers covering the entire front and back surfaces of the housing body,
A circuit board housing structure comprising: a coupling means for integrally coupling the housing main body, the front surface lid, and the rear surface lid. 2. An L-shaped metal fitting is attached to each of the four sides of the circuit board, and a groove portion into which an end of the L-shaped metal fitting is fitted is formed in a countersink forming portion of the housing body. The circuit board housing structure according to the description. Sandwiching a first heat conducting plate between the surface lid and the housing body;
Sandwiching a heat conducting member between the first heat conducting plate and the heat generating component on the circuit board;
2. The circuit board housing structure according to claim 1, wherein an opening for exposing the first heat conducting plate is formed in the surface lid. The heat conducting member is obtained by processing a thin plate having heat conductivity into a flexible structure, fixing one surface on the first heat conducting plate via a gel-like first heat conducting sheet, 4. The circuit board housing structure according to claim 3, wherein the surface is coupled to the heat generating component on the circuit board via a gel-like second heat conductive sheet. Sandwiching a second heat conducting plate between the back cover and the housing body;
2. The circuit board housing structure according to claim 1, wherein an opening for exposing the second heat conducting plate is formed in the back cover. The edges of the four sides of the first or second heat conducting plate are each bent in the same direction, and the end of the casing body that contacts the bent end of the first or second heat conducting plate has its end. 6. The circuit board housing structure according to claim 3, wherein a groove portion into which the portion is fitted is formed. 6. The circuit board housing structure according to claim 5, further comprising a gel-like heat conductive sheet interposed between the back surface of the circuit board and the second heat conductive plate. The circuit board housing structure according to claim 1, wherein the front cover and the back cover include legs. The coupling means is characterized in that a plurality of holes penetrating through the casing, the front cover, and the back cover are formed in a coupled state, a shaft is passed through each hole, and a flat plate is screwed onto the shaft on both sides. The circuit board housing structure according to claim 1 . Each heat generating component accommodates a circuit board mounted, for packing a stack of a plurality of housings with either the circuit board housing structure according to claim 1 to 9 having legs on both surfaces with same shape housing A packing structure,
A base for placing the plurality of housings side by side;
A metal frame for bundling a plurality of circuit board housing structures mounted on the base at the top;
A housing packaging structure comprising a wire coupling mechanism for coupling the metal frame and the base with a wire. The case packing structure according to claim 10, wherein the wire connecting mechanism includes a pulling hook for connecting the wire in a pulled state.

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