JPH1098289A - Radiation structure of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable general implementation of radiation by causing a first abutment portion to be abutted against one of an electronic component and a structure, while causing a second abutment portion to be abutted against the other, so as to carry out radiation or heating, and using a radiation component for elastically connecting the first and second abutment portions so as to carry out radiation of the electronic component. SOLUTION: A radiation component 1 has an elastic shape, formed by bending a single metal plate of, for example, stainless steel or phosphor bronze, substantially into a Z-shape. A radiation surface 1a, formed in a flat surface as a first abutment portion and a heating surface 1c formed as a second abutment portion, are made substantially parallel to each other. In addition, the radiation surface 1a and the heating surface 1c have their end portions connected by a thermal conductive portion 1b. That is, the radiation surface 1a is abutted against and fitted with a structure, such as a shield case or a chassis, and the heating surface 1b is abutted against and fitted with a heating portion of an electronic component such as an integrated circuit. Thus, the heat generated in the electronic component is conducted to the structure though the radiation component 1, thus executing the radiation.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiation structure for electronic parts.

[0002]

2. Description of the Related Art Various functional circuits constituting an electronic device are constituted by mounting electronic parts such as an integrated circuit on a printed circuit board as necessary. Further, since these electronic components generate considerable heat during use, heat dissipating means are provided together with the electronic components.

[0003] For example, as disclosed in Japanese Patent Application Laid-Open No. 2-170593, it is known that a heat dissipation structure is formed by processing an inner wall of a shield case and bringing a part of the inner wall into contact with an electronic component. I have. FIG. 9 is a sectional view showing an example of the shield case processing. As shown, an electronic component 51 such as an integrated circuit is mounted on a printed circuit board 50 and further shielded by a shield case 52. And in the shield case 52,
A heat radiating portion 53 is formed at a position corresponding to the electronic component 51,
Electronic component 51 via sheet member 54 having excellent thermal conductivity
It is configured to abut against. Thereby, the electronic component 5
1 is radiated by the shield case 52.

It is also known that a metal plate is sandwiched between a shield case and an electronic component, for example, as disclosed in Japanese Patent Application Laid-Open No. 3-36615. For example, as shown in FIG. 10, an electronic component 61 is mounted on a printed board 60 and further shielded by a shield case 62. One surface of a metal plate 63 made of, for example, aluminum or the like corresponding to the shape of the electronic component 61 is bonded to the electronic component 61 by an adhesive sheet 64, and the other surface is made of silicon grease or the like having excellent heat conductivity. Is made to abut on the inner wall of the shield case 62 via the sheet member 66 formed by the above. Thus, the heat generated in the electronic component 61 is conducted to the shield case 62 via the metal plate 63 and is radiated.

Although not shown in the drawings, it is also considered that a radiator is provided on the substrate without providing the above-described radiator structure, and the radiator radiates the electronic components and the like actually mounted. .

[0006]

However, processing a position corresponding to the electronic component 51 in the shield case 52 shown in FIG. 9 as the heat radiating portion 53 is necessary when radiating heat to a plurality of electronic components 51. Shield case 52
Of the shield case 52 and the electronic component 5
Complete contact of one becomes difficult. The printed circuit board 50
Since the arrangement position of the electronic component 51 above and the positional relationship of the heat radiating section 53 need to correspond, if the circuit configuration changes, the configuration of the shield case 52 also needs to be changed accordingly. In addition, as shown in the figure, the heat radiation surface can be easily applied to a device having a heat radiation surface formed along the inner wall of the shield case 52, such as a surface-mounted electronic component. The heat radiating portion 53 cannot be easily formed on the electronic component so as to be perpendicular to the printed board 50.

Further, as shown in FIG. 10, in a method in which a metal plate 63 is sandwiched between a shield case 62 and an electronic component 61 to conduct heat conduction, a metal having a thickness corresponding to the distance between the electronic component 61 and the shield case 62 is used. A plate 63 is required. Therefore, stress may be applied to the electronic component 61 due to the weight of the metal plate 63, and a crack may be generated in a soldered portion that is a connection portion with the printed circuit board 60. Further, when the printed circuit board 60 is used by arranging it in the vertical direction, the metal plate 63 may be dropped by its own weight. In addition, like the case described with reference to FIG. It is not easy to use 63.

Further, in the examples shown in FIGS. 9 and 10, the stress applied to the shield case is applied to the electronic components as it is, and cracks may occur due to this stress.

[0009]

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and at least one of first and second contact portions contacting an electronic component and a structure. The first contact portion contacts either the electronic component or the structure to release heat or generate heat, and the second contact portion corresponds to the electronic component or the structure. And heat radiation of the electronic component by using a heat radiation component in which the first contact portion and the second contact portion are connected with elasticity. .

According to the present invention, since the heat radiating component is formed separately from the structure such as the shield case, regardless of the configuration of the circuit formed on the substrate and the type and size of the electronic component,
The heat can be radiated for general purpose. Also,
Since the heat radiating portion is formed with elasticity, it can absorb the stress applied to the structure from the outside, so that no load is applied to the electronic component.

[0011]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of an electronic component according to an embodiment of the present invention. FIG. 1 is a perspective view showing a heat radiating component used as a heat radiating structure according to the first embodiment. As shown in FIG. 1, the heat dissipating component 1 is formed by bending a single metal plate of, for example, stainless steel, phosphor bronze or the like into a substantially Z-shape to have elasticity. The heat dissipating surface 1a formed as a plane as the first contact portion and the heat generating surface 1c formed as the second contact surface are substantially parallel to each other. These ends are connected by a heat conducting part 1b. That is, the heat radiation surface 1
a is in contact with a structure such as a shield case or a chassis, and the heat generating surface 1c is in contact with a heat generating portion of an electronic component such as an integrated circuit, so that heat generated by the electronic component is transmitted through the heat radiating component 1. The heat is transmitted to the structure and released.

Next, an example in which heat is dissipated by the heat dissipating component 1 will be described. FIGS. 2A, 2B, and 2C are schematic views showing an example in which a heat radiating component is arranged between an electronic component and a structure, and show a part of a substrate in cross section. As shown in FIG. 2A, an electronic component 30 such as an integrated circuit is mounted on the printed board K, and further, for example, a shield case, a chassis, or the like is provided so as to face the printed board K. Is disposed. Then, as shown, the heat radiating component 1 is arranged between the electronic component 30 and the structure 31. At this time, between the heat radiating surface 1 a and the structure 31 and between the heat generating surface 1 c and the electronic component 30, for example, silicon or the like, which is excellent in heat conductivity while maintaining the flatness of each surface, is formed. By interposing heat conduction members (for example, Denka sheet of Denki Kagaku Kogyo Co., Ltd.) 32, 33, etc., the heat dissipation can be improved.

As described above, since the heat radiating component 1 is configured to have elasticity, the heat radiating surface 1a and the heat generating surface 1a are formed.
c comes into contact with the electronic component 30 and the structure 31 with a predetermined force via the heat conductive sheets 32 and 33, so that the heat generated by the electronic component 30 is radiated by the heat radiating component 1 itself, The heat is transmitted through the heat transfer sheet 32 and the heat absorbing plate 1c, and is radiated from the structure 31 via the heat transfer sheet 33 and the heat dissipation plate 1a via the heat transfer portion 1b.

Further, since the heat dissipating component 1 has elasticity, it can cope with a case where the distance between the electronic component 30 and the structure 31 is slightly different, for example, as shown in FIG. 2B. Thus, it can be used for an electronic component 30b that is taller than the electronic component 30a. That is, it is possible to cope with different types of electronic components 30 with one type of heat radiation component.

Further, as shown in FIG. 2C, the heat radiating component 1 can correspond to a lead component 40. This is a structure 3 consisting of a shield case, for example.
This is achieved by interposing the heat radiating component 1 between the side surface of the lead component 40 disposed near the side wall 1 and the side wall. In this case, in order to prevent the heat radiating component 1 from dropping, for example, a screw hole may be provided in the heat generating surface 1c, and the heat radiating component 1 may be fixed to a screw hole provided in the lead component 40 in advance by a screw N.

As described above, in the present embodiment, it is possible to cope with different types of electronic components and constituent patterns of electronic circuits by using one kind of heat radiating component 1. Further, even when external pressure is applied to the structure 31 or the like in some form, the pressure is absorbed by the elasticity of the heat radiating component 1, so that a load is not directly applied to the electronic component, so that solder cracks and the like are suppressed.

Next, a second embodiment of the present invention will be described. FIG. 3 is a perspective view showing the heat radiation component 2 of the second embodiment. The heat radiating component 2 has a heat generating surface 2c formed, for example, in a direction perpendicular to the heat radiating surface 2a.
And the heat generating surface 2c are connected by a heat conducting portion 2b.
Further, since the heat radiating component 2 is used particularly for the lead component 40 as shown in FIG. 2C, a screw hole 2d is formed in the heat generating surface 2c. This heat dissipation component 2
When heat is dissipated by using, for example, as shown in FIG. 4, the heat dissipating component 2 is fixed to the side surface of the lead component 40 mounted on the printed board K with the screw N.
As a result, the lead component 40 via the heat conductive sheet 32
And the heat generating surface 2c abuts on the heat radiating surface 2a and the structure 31 via the heat conductive sheet 33. That is,
The position where the lead component 40 is mounted is shown in FIG.
As described in the above, even when it is not near the side wall of the structure 31, heat can be dissipated by using the heat dissipating component 2.

Next, a third embodiment of the present invention will be described. FIG. 5 is a perspective view showing the heat dissipation component 3 of the third embodiment. The heat dissipating component 3 is configured so that a hole 3d is provided in the heat dissipating surface 3a and fixed to a structure by screwing or caulking. The heat conducting portion 3b is formed so as to extend obliquely from the heat radiating surface 1a, and a heat absorbing portion 3c is formed at the tip thereof. When this heat radiating component 3 is attached to the structure 31 with, for example, screws N, the structure shown in FIG. 6 is obtained. As shown, the heat dissipating component 3
, Ie, the heat radiating surface 3 a is fixed to the structure 31, and the position of the heat generating surface 3 c, which is the other end, can be displaced by the elasticity of the heat radiating component 3. Therefore,
Electronic components 30a, 3 configured to have different heights
0b can be dealt with. In this case, between the electronic components 30a, 30b and the heat generating surfaces 3c, 3c, as in the case of the present embodiment, the heat conductive sheet 3 is provided.
2, 32 are arranged.

By the way, the shape of the heat radiating component is not limited to the shape shown in the first to third embodiments, and may be, for example, as shown in FIGS. 7 (a), 7 (b), (c), 8 (a), 8 (b). The shape as shown in FIG. Each of the heat dissipation components described below is also formed by bending a metal plate such as stainless steel, phosphor bronze, or the like.

For example, FIG. 7A shows an example in which the heat radiating component 4 is formed in a substantially ring shape, wherein the heat radiating surfaces 4a, 4a and the heat generating surface 4c are formed as flat surfaces, and the heat conducting portions 4b, 4b are formed as curved surfaces. Make up. In FIG. 7B, the heat radiating component 5 is formed in a substantially U-shape, the heat radiating surface 5a and the heat generating surface 5c are formed as flat surfaces, and the heat conducting portion 5b is formed as a curved surface. These heat radiating components 4 and 5 can be used, for example, in the same manner as the heat radiating component 1 described above with reference to FIGS. Further, for example, the heat dissipating component 6 shown in FIG. 7C is configured such that the heat dissipating surface 6a and the heat generating surface 6c are arranged at different positions by giving an angle to the heat conducting portion 6b. Therefore, it can be used when it is necessary to dissipate heat at a position distant from the electronic component due to the mounting position of the electronic component or the like.

For example, in the heat radiating component 7 shown in FIG. 8A, heat conducting portions 7b and 7b are provided in two directions from the heat radiating surface 7a, and accordingly, the heat generating surfaces 7c and 7c are also provided with two.
The surface is provided. Therefore, one electronic component 7 can dissipate heat from two electronic components. Further, the heat dissipating component 8 shown in FIG.
Although the position of the heat radiating surface 8a and the position of the heat generating surface 8c are displaced similarly to the heat radiating component 6 shown in (c), since the two heat conducting portions 8b are provided, this heat conducting portion 8b The heat radiation is improved by the heat radiation of itself. Further, FIG.
Are provided with three heat radiating surfaces 9a and two heat generating surfaces 9c.
B, 9b, and 9b form a substantially W-shaped configuration.
Therefore, as in the case of the heat radiation component 7 shown in FIG.
The two heat dissipation components 9 can dissipate heat from the two electronic components, and can dissipate heat from the three heat dissipation surfaces 9a, 9a, 9a.

In this embodiment, for convenience, the planes constituting the heat radiating components are defined as the heat radiating surface and the heat generating surface. However, when actually used, any surface is arranged on the electronic component side. You may.

[0023]

As described above, according to the present invention, since the heat radiating component is formed separately, even if the arrangement position of the electronic component is changed due to a change in the design of the electronic circuit formed on the substrate, the present invention is not limited thereto. It becomes possible to change the arrangement position of the heat radiating component according to the condition. Further, in the present invention, since the heat dissipating component is disposed with elasticity between the electronic component and the structure that dissipates heat, the shape can be displaced depending on the disposition state.
Various types of electronic components can be used with various types of heat dissipating components. In addition, since it is possible to cope with the case where the shape of the heat dissipating structure changes, the heat dissipating component can be made versatile, and the heat dissipating component can be changed according to the design change of the electronic circuit and the structure. There is no need to newly design, and the manufacturing cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view of a heat radiation component according to a first embodiment of the present invention.

FIG. 2 is a diagram illustrating an example of a case where heat is radiated by the heat radiating component illustrated in FIG. 1;

FIG. 3 is a perspective view of a heat radiation component according to a second embodiment of the present invention.

FIG. 4 is a diagram illustrating an example of a case where heat is radiated by the heat radiating component illustrated in FIG. 3;

FIG. 5 is a perspective view of a heat dissipation component according to a third embodiment of the present invention.

6 is a diagram illustrating an example of a case where heat is dissipated by the heat dissipating component illustrated in FIG. 5;

FIG. 7 is a perspective view showing another shape of the heat dissipation component.

FIG. 8 is a perspective view showing another shape of the heat dissipation component.

FIG. 9 is a diagram illustrating a conventional heat dissipation structure.

FIG. 10 is a diagram illustrating a conventional heat dissipation structure.

[Explanation of symbols]

1,2,3,4,5,6,7,8,9 Heat radiating components, 1
a, 2a, 3a, 4a, 5a, 6a, 7a, 8a, 9a
Heat radiation surface, 1b, 2b, 3b, 4b, 5b, 6b, 7
b, 8b, 9b heat conducting parts, 1c, 2c, 3c, 4c,
5c, 6c, 7c, 8c, 9c Heating part, K substrate, 3
0, 40 electronic components, 31 structures,

Claims (2)

[Claims] At least a first contact portion of a first contact portion and a second contact portion contacting an electronic component and a structure is planar, and the first contact portion is an electronic component or a structure. The second contact portion contacts the other of the electronic components or the structure to release heat or generate heat while contacting one of the objects, and the first contact portion A heat dissipating component, wherein the heat dissipating component and the second contact portion are connected with elasticity. 2. The heat conducting member according to claim 1, wherein a heat conducting member is arranged between the first contact portion and / or the second contact portion and the electronic component or structure. Heat dissipation structure for electronic components.