JP5387738B2 - Electrical component unit - Google Patents

Description

  The present invention relates to an electrical component unit that accommodates electrical components including capacitors.

  An electrolytic capacitor is used in an electrical component unit in which an inverter smoothing circuit or the like is incorporated (see, for example, Patent Documents 1 to 3).

  Such an electrolytic capacitor is known to have a reduced lifetime as the temperature increases.

Japanese Utility Model Publication No. 5-77930 JP-A-6-104143 JP 2005-102464 A

  In the electrical component unit described above, the electrolytic capacitor is one of the electrical components having the shortest lifetime, and the lifetime of the electrolytic capacitor is often the lifetime of the electrical component unit. Therefore, there is a demand for further extending the life of electrolytic capacitors.

  Therefore, it is preferable to suppress the temperature rise of the capacitor in the electrical component unit.

  In particular, there is room for improvement regarding the technology for suppressing the temperature rise of the capacitor mounted on the substrate.

  Accordingly, an object of the present invention is to provide an electrical component unit that can suppress an increase in the temperature of a capacitor.

A first aspect (1H) of an electrical component unit according to the present invention includes a capacitor (11), a board (19) for mounting the capacitor, and a case (20) for housing the board. has a recess (22) on the inner surface, said capacitor, Ru is disposed in close contact with the recess.

And, the said recess (22) is a substantially arcuate cross section of the recess, the outer peripheral curved surface of the condenser (11) having a substantially cylindrical shape, you close contact with the recess. The capacitor is disposed so as to pass through the notch or the through hole of the substrate and be in close contact with the recess.

A second aspect of the electrical component unit according to the present invention is the first aspect, wherein the concave portion (22) is a substantially semi-cylindrical concave portion of the capacitor (11) having a substantially cylindrical shape. An outer peripheral curved surface is closely attached to the concave portion.

A third aspect of the electrical component unit according to the present invention is any one of the first to second aspects, wherein the concave portion is provided in a protruding portion that protrudes from the substrate placement surface of the case. It is characterized by.

A fourth aspect of the electrical component unit according to the present invention is any one of the first to third aspects, further comprising a heat dissipating member (30) in contact with the outer surface of the case. .

A fifth aspect of the electrical component unit according to the present invention is any one of the first to fourth aspects, wherein the capacitor is in close contact with the recess through an insulating material.

  According to the 1st aspect of the electrical equipment unit concerning this invention, since a capacitor | condenser is closely_contact | adhered and arrange | positioned at the recessed part of case inner surface, it can obtain high heat dissipation efficiency. Therefore, it is possible to suppress the temperature rise of the capacitor.

Since the outer peripheral curved surface of the capacitor having a substantially cylindrical shape is in close contact with the recess having a substantially arc-shaped cross section, a high heat dissipation effect can be obtained. Then, the capacitor can come into contact with a recess existing on the opposite side of the mounting surface of the substrate.

According to the second aspect of the electrical component unit according to the present invention, the outer peripheral curved surface of the capacitor having a substantially cylindrical shape is in close contact with the substantially semi-cylindrical concave portion, so that a high heat dissipation effect can be obtained.

According to the third aspect of the electrical component unit according to the present invention, it is sufficient that the protruding portion has a thickness for mounting the substantially cylindrical capacitor, and the protruding portion on the board arrangement surface of the case It is possible to make the other parts relatively thin.

According to the 4th aspect of the electrical equipment unit concerning this invention, since the heat | fever generate | occur | produced with the capacitor | condenser is transmitted to a thermal radiation member via a case, high thermal radiation efficiency can be obtained.

According to the 5th aspect of the electrical equipment unit concerning this invention, high thermal radiation efficiency can be obtained, implement | achieving electrical insulation.

It is sectional drawing which shows the electrical component unit which concerns on 1st Embodiment. FIG. 2 is a partially enlarged view of FIG. 1. It is a top view which shows the state which the L-shaped member contact | adhered to the capacitor | condenser. It is sectional drawing which shows the electrical component unit which concerns on 2nd Embodiment. It is a perspective view which shows a heat-transfer member. It is sectional drawing which shows the electrical component unit which concerns on 3rd Embodiment. It is a disassembled sectional view which shows the electrical component unit which concerns on 4th embodiment. It is sectional drawing of the electrical equipment unit which concerns on 4th embodiment. It is a side view of the electrical equipment unit which concerns on 4th embodiment. It is a side view which shows the electrical component unit which concerns on 5th Embodiment. It is a top view which shows the heat-transfer member which concerns on 5th Embodiment. It is a disassembled sectional view which shows the electrical component unit which concerns on 6th embodiment. It is sectional drawing of the electrical equipment unit which concerns on 6th embodiment. It is sectional drawing of the electrical equipment unit which concerns on 7th embodiment. It is a disassembled sectional view which shows the electrical component unit which concerns on 8th embodiment. It is sectional drawing of the electrical equipment unit which concerns on 8th embodiment. It is a side view of the electrical equipment unit which concerns on 8th embodiment. It is sectional drawing of the electrical equipment unit which concerns on a modification. It is sectional drawing of the electrical equipment unit which concerns on another modification. It is sectional drawing of the electrical equipment unit which concerns on another modification. It is sectional drawing of the electrical equipment unit which concerns on another modification.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<1. First Embodiment>
FIG. 1 is a cross-sectional view showing an electrical component unit 1 (also referred to as 1A) according to the first embodiment, and FIG. 2 is a partially enlarged view of FIG.

  As shown in FIG. 1, an electrical component unit 1A includes an electrical component 10 such as a capacitor (here, an electrolytic capacitor) 11, a heat transfer member 15 (also referred to as 15A), a substrate 19 on which the electrical component 10 is mounted, A case 20 (also referred to as 20 </ b> A) that accommodates the product 10 and the substrate 19 and a heat radiating member 30 are provided.

  The electrical component 10 includes a substantially cylindrical capacitor 11 and may include various electronic components 12 other than the capacitor. These electrical components 10 are fixed to the substrate 19 by soldering or the like. The substrate 19 is fixed to the case 20A at a predetermined position inside the case 20A. Specifically, the substrate 19 is fixed in a state of being slightly lifted (separated) from the bottom surface of the case 20A, for example, by arranging spacers (not shown) at the four corners thereof. Since the bottom surface of the case 20A is also a surface on which the substrate 19 is disposed, it is also referred to as a “substrate disposition surface” or “arrangement surface”.

  The case 20A is a box mainly formed of resin, and is molded in a state of being integrated with the heat transfer member 15A, as will be described later. Further, the heat dissipating member 30 is disposed on the outer surface of the case 20A so as to be in contact with the case 20A in substantially the entire area of the bottom surface of the case 20A. The heat radiating member 30 is formed of a material having high thermal conductivity such as aluminum, copper, or iron.

  The heat transfer member 15 </ b> A plays a role of transferring heat generated in the capacitor 11 to the case 20 </ b> A and the heat dissipation member 30. The heat transfer member 15A is formed of a material having high thermal conductivity such as aluminum, copper, or iron.

  Here, the heat transfer member 15 </ b> A includes four L-shaped members LA (see FIGS. 2 and 3). 3 is a diagram (top view) of the state in which four L-shaped members LA are in close contact with the outer peripheral side surface of the capacitor 11 as viewed from above. As shown in FIG. 3, the four L-shaped members LA are arranged at substantially equal intervals along the outer periphery of the capacitor 11.

  Each L-shaped member LA of the heat transfer member 15A has a vertical portion 18A (see FIG. 2) and a horizontal portion 16A formed by being bent substantially perpendicular to the vertical portion 18A. . The heat transfer member 15A is integrally formed with a resin case 20A. Specifically, the horizontal portion 16A and a part (lower portion) of the vertical portion 18A are embedded in the case 20A, and the remaining portion (upper portion) of the vertical portion 18A is vertically upward from the inner surface SA of the case 20A. It is molded in a state protruding toward the inside of the case 20A. Further, here, the heat transfer member 15A penetrates the bottom surface portion of the case 20A from the inside to the outside (bottom surface side) of the case 20A, and the horizontal portion 16A extends to the outside of the case 20A (radiation member 30 side). The case where it is molded integrally with the case 20A in the reached state (exposed state) is illustrated.

  The substrate 19 has four through holes HL1 (see FIGS. 2 and 3) corresponding to the respective L-shaped members LA at predetermined positions, respectively, and a total of four vertical portions 18A are respectively corresponding through. It is fixed to the case 20A in a state of passing through the hole HL1. Therefore, in a state where the substrate 19 is fixed to the case 20A, the upper portion of the vertical portion 18A of the heat transfer member 15A passes through the through hole HL1 provided in the substrate 19 and protrudes above the substrate 19. . Then, the protruding portion above the substrate (the upper portion of the vertical portion 18A) is in close contact with the outer peripheral side surface of the capacitor disposed on the substrate 19.

  As described above, a part of the heat transfer member 15A (here, the vertical part 18A) is in close contact with the outer peripheral side surface of the condenser 11, and the other part (here, the horizontal part 16A, etc.) is connected to the case 20A. The Therefore, since the heat generated in the capacitor 11 is directly transmitted to the case 20A via the heat transfer member 15A, higher heat dissipation efficiency can be obtained as compared with the conventional air-cooling type. As a result, the temperature rise of the capacitor 11 can be suppressed.

  Moreover, since the horizontal portion 16A of the heat transfer member 15A reaches the outside of the case 20A, higher heat dissipation efficiency can be obtained.

  Further, the vertical portions 18A of the four L-shaped members LA are configured to generate an urging force toward the central axis side of the substantially cylindrical capacitor 11 by the elastic force. Therefore, the four L-shaped members LA are stably held on the outer peripheral side surface of the capacitor 11 by the urging force, and are in a state of being stably in close contact with the capacitor 11. Further, as shown in the top view of FIG. 3, the upper portion of the vertical portion 18 </ b> A draws an arc curve having the same curvature as that of the outer peripheral side surface of the capacitor 11 (that is, along the curved surface of the outer peripheral side surface of the capacitor 11). And so on). According to this, the adhesion between the heat transfer member 15A and the capacitor 11 can be further improved. In addition, by holding the capacitor 11 stably, it is possible to prevent lead breakage (of the capacitor 11) due to vibration during transportation.

  Further, the heat transfer member 15A is connected to a heat radiating member 30 provided outside the case 20A. Since the heat generated in the capacitor 11 is transmitted to the heat dissipation member 30 via the heat transfer member 15A, higher heat dissipation efficiency can be obtained. Specifically, the heat transfer member 15A is connected to the heat dissipation member 30 provided outside the case 20A via an insulating material (for example, insulating paper) 17. The connection between the heat transfer member 15A and the heat radiating member 30 is not required to interrupt the heat transfer between the two, and the above-mentioned interposition (for solving the problem) It may correspond to the “first insulating material” in the means, and may have an aspect in which the insulating material 17 or the like is present. The insulating material 17 may be any material having thermal conductivity, but is more preferably a material having relatively high thermal conductivity (high thermal conductivity material). As the insulating material 17, for example, it is preferable to employ a high thermal conductive resin.

  As described above, according to the electrical component unit 1A, a high heat dissipation effect by the heat transfer member 15A or the like can be obtained, and therefore, the temperature rise of the capacitor 11 is suppressed as compared with the conventional air-cooled type. Therefore, the life of the capacitor 11 can be extended. Further, by using a capacitor 11 having a low temperature grade, it is possible to reduce the cost.

  In addition, in this 1st Embodiment, in order to ensure the insulation between the heat radiating member 30 and the heat transfer member 15A, the case where the insulating material 17 is provided between the heat transfer member 15A and the heat radiating member 30 is illustrated. However, when insulation is not necessary, the heat transfer member 15A may be directly connected to the heat dissipation member 30 without providing the insulating material 17.

<2. Second Embodiment>
The second embodiment is a modification of the first embodiment, and the following description will focus on differences from the first embodiment.

  FIG. 4 is a cross-sectional view showing an electrical component unit 1 (also referred to as 1B) according to the second embodiment.

  In the second embodiment, the shape and arrangement of the heat transfer member are different from those of the first embodiment. Specifically, a heat transfer member 15B is provided instead of the heat transfer member 15A.

  As shown in the perspective view of FIG. 5, the heat transfer member 15B has a horizontal portion 16B and a vertical portion 18B, and in addition, a curved portion 13B and a connecting portion that connects the curved portion 13B to the vertical portion 18B. 14B. The heat transfer member 15B is configured such that the horizontal portion 16B, the vertical portion 18B, the connection portion 14B, and the bending portion 13B are integrated.

  The curved portion 13B is processed by bending a thin plate-like member so as to have a substantially cylindrical shape having the same diameter as the outer peripheral side surface of the capacitor 11, and has a shape in which a part of the ring is opened in a top view. ing. The curved portion 13B has a curved surface curved with the same curvature as the outer peripheral side surface of the capacitor 11, and corresponds to a central angle of a predetermined angle (preferably an angle of 180 degrees or more (for example, 270 degrees)) when viewed from above. It has an arc portion. When the capacitor 11 is inserted in the direction of the arrow AR from the opening portion side with the opening portion of the bending portion 13B slightly expanded, and the opening portion returns to the original state, the outer peripheral curved surface of the capacitor 11 is in close contact with the bending portion 13B. In this state, the capacitor 11 is held. Further, the bending portion 13B is configured to generate an urging force that surrounds the outer peripheral curved surface of the substantially cylindrical capacitor 11 by its elastic force, and the capacitor 11 is stably held by the urging force. Is done.

  The heat transfer member 15B is integrally formed with a resin case 20 (also referred to as 20B). Specifically, the vertical portion 18B and the horizontal portion 16B of the heat transfer member 15B are embedded in the side wall portion of the case 20B, and the connection portion 14B projects in the horizontal direction from the side wall portion of the case 20B, and the connection portion 14B. The bending portion 13B is connected to the tip of the.

  In the electrical component unit 1B according to the second embodiment, the heat transfer member 15B is in close contact with the outer peripheral side surface of the capacitor 11 at a certain part (here, the curved part 13B) and the other part (here, the horizontal part 16B). Etc.) is connected to the case 20B. Therefore, since the heat generated in the capacitor 11 is directly transmitted to the case 20B via the heat transfer member 15B, high heat dissipation efficiency can be obtained. Further, since the horizontal portion 16B of the heat transfer member 15B reaches the outer side (here, the bottom surface side) of the case 20B, higher heat radiation efficiency can be obtained.

  The heat transfer member 15B is connected to the heat dissipation member 30 provided outside the case 20B (more specifically, via the insulating material 17). Since the heat generated in the capacitor 11 is transmitted to the heat dissipation member 30 via the heat transfer member 15B, higher heat dissipation efficiency can be obtained.

<3. Third Embodiment>
In the first embodiment, a separate insulating material (for example, insulating paper) 17 is provided between the heat transfer member 15A and the heat dissipation member 30 in order to ensure insulation between the heat dissipation member 30 and the heat transfer member 15A. Although the case where it provides is illustrated, it is not limited to this.

  The third embodiment is a modification of the first embodiment, and the following description will focus on the differences from the first embodiment.

  FIG. 6 is an enlarged cross-sectional view of the vicinity of the capacitor 11 of the electrical component unit 1 (also referred to as 1C) according to the third embodiment.

  The case 20 (also referred to as 20C) of the electrical component unit 1C is formed of an insulating material (resin or the like). In addition, the heat transfer member 15 (also referred to as 15C) of the electrical component unit 1C is disposed between the inner surface SA and the outer surface SB of the case 20C from the inside of the case 20C on one end side (specifically, the portion 16C). It is integrally formed with the case 20C so as to be embedded in the case 20C up to the predetermined position P1.

  According to this, since the heat transfer member 15C is connected to the case 20C, a higher heat dissipation effect can be obtained as compared with the conventional air-cooled type. Moreover, since the remaining part RP from the predetermined position P1 to the outer surface SB in the case 20 exhibits an insulating function, it is not necessary to provide an additional insulating member.

<4. Fourth Embodiment>
FIG. 7 is an exploded sectional view showing an electrical component unit 1 (also referred to as 1D) according to the fourth embodiment. 8 is a cross-sectional view (specifically, a vertical cross-sectional view of the electrical component unit 1D viewed from the front side) as seen from the same direction as FIG. 7, and FIG. 9 is a side view of the interior of the electrical component unit 1D. It is the side view (partial sectional view) seen from the direction.

  In the fourth embodiment, a case where the substantially cylindrical capacitors 11 are arranged in a posture in which the axial direction thereof is substantially parallel to the bottom surface of the case (in short, in a laid state) is exemplified. Below, it demonstrates centering on difference with the electrical component unit 1A.

  As shown in FIGS. 7 to 9, the electrical component unit 1 </ b> D includes an electrical component 10 (see FIG. 1) such as a capacitor 11, a substrate 19 on which the electrical component 10 is mounted, and a heat transfer member 51 that is in close contact with the capacitor 11. A case 20 (also referred to as 20D) for housing the electrical component 10 and the substrate 19 and a heat dissipation member 30 are provided. Heat generated in the capacitor 11 mounted on the substrate 19 is released to the outside through the heat transfer member 51, the case 20 </ b> D, and the heat dissipation member 30.

  The heat transfer member 51 has a substantially rectangular parallelepiped base portion 55 and, as shown in FIG. 8, a protruding portion 53 that protrudes outward leftward and rightward on both the left and right sides of the upper side. Further, on the upper surface side of the base portion 55, a recess 52 having a substantially arc-shaped cross section (more specifically, a substantially semi-cylindrical shape) is provided. The number of recesses 52 is determined according to the number of capacitors 11 to be arranged. Here, in order to arrange the two capacitors 11, two recesses 52 are provided.

  Each recess 52 is formed in conformity with the outer shape of the capacitor 11, and each of the substantially cylindrical capacitors 11 has a posture in which the axial direction is substantially horizontal (in a state of being laid down) It arrange | positions closely to each recessed part 52. More specifically, one side (lower side) of the outer peripheral curved surface of the capacitor 11 having a substantially cylindrical shape is disposed so as to be in close contact with the substantially semi-cylindrical recess 52. Thus, since the capacitor | condenser 11 directly contacts the recessed part 52, high heat dissipation efficiency can be obtained. Here, the adhesion between the capacitor 11 and the recess 52 is enhanced by bonding the capacitor 11 to the recess 52 with an adhesive.

  Each of the substantially semi-cylindrical recesses 52 has a length in the axial direction that is equal to or greater than (equivalent to here) the axial length of the substantially cylindrical capacitor 11 (see FIG. 9). Since the capacitor 11 is in contact with the recess 52 over the entire length of the capacitor 11 in the axial direction, high heat dissipation efficiency can be obtained.

  Further, the lead wire 41 of the capacitor 11 is fixed by soldering to a predetermined position of the substrate 19, and the lead wire 41 is electrically connected to a predetermined wiring on the substrate 19. Note that the lead wire 41 is bent at an appropriate position in order to place the capacitor 11 in a lying state.

  The substrate 19 is provided with a substantially rectangular through hole HL2 having the same size as the base portion 55 in a top view, and the base portion 55 of the heat transfer member 51 penetrates the substrate 19 through the through hole HL2. The bottom surface of the base portion 55 is disposed in contact with the bottom surface (inner bottom surface) of the case 20D.

  On the bottom surface of the case 20 </ b> D, a substantially prismatic protruding portion 23 protruding upward from the bottom surface of the case 20 </ b> D is provided at a position corresponding to the protruding portion 53 of the heat transfer member 51. Each protruding portion 23 is provided with a female screw portion (not shown), and the bolt 26 is screwed into the female screw portion with the projecting portion 53 and the substrate 19 sandwiched therebetween, whereby the heat transfer member 51 and the substrate. 19 is fixed to the case 20D.

  The capacitor 11 is disposed so as to pass through the through hole HL2 from the mounting surface side (upper surface side) of the substrate 19 to the other surface side (back surface side) (see FIG. 8 and the like). Therefore, the capacitor 11 can come into contact with the recess 52 that also exists on the opposite side (that is, the lower surface side) of the mounting surface of the substrate 19.

  Further, the capacitor 11 passes through the through hole HL <b> 2 and is disposed across both the one surface side (upper surface side) and the other surface side (lower surface side) of the substrate 19. According to this, the restriction of the position of the substrate 19 in the height direction is reduced, and the position of the substrate 19 in the height direction can be set relatively low. That is, the size of the electrical component unit 1 in the height direction can be suppressed and a compact configuration can be achieved.

  Further, the case 20D described above is formed of the same material over substantially the whole. Here, the case 20D is formed of a highly thermally conductive resin, but is not limited thereto, and various materials can be used. As a material for the case 20D, it is preferable to use a high thermal conductivity material (for example, a high thermal conductivity resin, aluminum, iron, or the like). However, the present invention is not limited to this, and the case 20D only needs to have thermal conductivity, and may be formed of a general resin that does not have high thermal conductivity (that is, relatively low thermal conductivity).

  As described above, the capacitor 11 is disposed in close contact with the recess 52 of the heat transfer member 51, and the bottom surface of the base portion 55 of the heat transfer member 51 is connected to the case 20D. Therefore, the heat from the capacitor 11 is directly transmitted to the heat transfer member 51 including the concave portion 52, further transmitted to the case 20D that contacts the heat transfer member 51, and toward the outside of the electrical component unit 1D. Released. Therefore, high heat dissipation efficiency can be obtained.

  Further, in the electrical component unit 1D, the heat radiating member 30 is disposed so as to contact the outer surface of the case 20D. Therefore, higher heat dissipation efficiency can be obtained by transferring heat from the case 20D to the heat dissipation member 30.

<5. Fifth Embodiment>
The fifth embodiment is a modification of the fourth embodiment. Hereinafter, the fifth embodiment will be described with reference to FIGS. 10 and 11 with a focus on differences from the fourth embodiment. FIG. 10 is a side view (partially sectional view) of the interior of the electrical component unit 1E viewed from the same direction as FIG. 9, and FIG. 11 is a top view showing the heat transfer member 51 (also referred to as 51B). .

  In the fifth embodiment, a hole HL3 for passing the lead wire 41 is provided in the heat transfer member 51B. As shown in FIGS. 10 and 11, the heat transfer member 51 includes a projecting portion 54 on the back side (right side in FIG. 10) in FIG. 8 in addition to the left and right projecting portions 53 (see FIG. 8) in FIG. 8. Is provided. The overhang portion 54 has a total of four through holes HL3. Each through-hole HL3 is provided at a position corresponding to each arrangement position of the lead wire 41 on the substrate 19, and the two lead wires 41 (four lead wires 41 in total) of each capacitor 11 are connected to each through-hole. It penetrates the overhanging portion 54 in the hole HL3. Since the through hole HL3 functions as a hole for positioning the lead wire 41 as described below, good workability can be obtained in the assembly process.

  Here, the assembly process (part) of the electrical component unit 1E will be described.

  First, the capacitor 11 bends the lead wire 41 at an appropriate position to pass through the through hole HL3 of the heat transfer member 51 and is laid in the recess 52 of the heat transfer member 51. Adhered to 51 and fixed.

  Next, the base portion 55 of the heat transfer member 51 is passed through the through hole HL2 (see FIG. 7) of the substrate 19 on which the various electrical components 10 are mounted, and the lead wire 41 that extends downward through the through hole HL3. Is further penetrated through a through hole (not shown) provided at a predetermined position on the substrate 19. In this state, the lead wire 41 is fixed to the substrate 19 by soldering.

  Thereafter, the three integrated parts (the capacitor 11, the heat transfer member 51, and the substrate 19) are attached to the case 20 (also referred to as 20E). Specifically, the base portion 55 of the heat transfer member 51 is brought into contact with a predetermined position on the bottom surface of the case 20 </ b> E, and the bolt 26 is inserted into the female screw of the projecting portion 23 with the projecting portion 53 and the substrate 19 being sandwiched. The capacitor 11, the heat transfer member 51, and the substrate 19 are fixed to the case 20E. Further, the heat radiating member 30 is bonded to the bottom surface of the case 20E.

  The electrical component unit 1E is manufactured as described above.

  In the process as described above, when the capacitor 11 is attached to the heat transfer member 51, the through hole HL3 functions as a hole for positioning the lead wire 41. Therefore, when the heat transfer member 51 on which the capacitor 11 is already mounted is attached to the substrate 19, the lead wire 41 of the capacitor 11 can be easily disposed at a predetermined position on the substrate 19. Therefore, the attachment work can be performed with good workability.

  Note that the above assembly process is an example, and various modifications can be made. For example, the work of adhering and fixing the capacitor 11 to the recess 52 may be performed after the heat transfer member 51 is combined with the substrate 19 or after the heat transfer member 51 is attached to the case 20E. The capacitor 11 may be fixed to the substrate 19 after the heat transfer member 51 is attached to the case 20E.

<6. Sixth Embodiment>
The sixth embodiment is a modification of the fourth embodiment. Hereinafter, the sixth embodiment will be described with reference to FIG. 12 and FIG. 13 with a focus on differences from the fourth embodiment. FIG. 12 is an exploded cross-sectional view showing an electrical component unit 1 (also referred to as 1F) according to the sixth embodiment, and FIG. 13 is a cross-sectional view of the electrical component unit 1F viewed from the same direction as FIG.

  Also in this electrical component unit 1 </ b> F, one side (lower side) of the outer peripheral curved surface of the capacitor 11 having a substantially cylindrical shape is disposed so as to be in close contact with the substantially semi-cylindrical recess 52.

  The other side (upper side) of the outer peripheral curved surface of the capacitor 11 is covered with a pressing member 56 having a substantially semi-cylindrical concave portion 57. The number of recesses 57 is determined according to the number of capacitors 11 to be disposed on the pressing member 56. Here, in order to arrange the two capacitors 11, two concave portions 57 are provided.

  The pressing member 56 is manufactured by, for example, pressing a sheet metal, but is not limited thereto, and may be formed of other various materials (for example, resin). In addition, in the case where the pressing member 56 has electrical conductivity (conductivity), etc., when insulation between the pressing member 56 and the capacitor 11 is required, an insulating material (for example, between the pressing member 56 and the capacitor 11) Insulating paper) may be interposed.

  Further, the pressing member 56, the heat transfer member 51, and the substrate 19 are fixed to the case 20F by two bolts 26. Specifically, the two bolts 26 are screwed into the female screw portion of the projecting portion 23 in a state where the pressing member 56 (specifically, the horizontal portions on the left and right sides), the overhang portion 53 and the substrate 19 are sandwiched. Such a fixed state is realized.

  As a result, the capacitor 11 is sandwiched between the concave portion 57 of the pressing member 56 and the concave portion 52 of the heat transfer member 51 and stably held, and the adhesion between the capacitor 11 and the concave portion 52 is improved. According to this, when the capacitor 11 is not fixed to the recess 52 of the heat transfer member 51 with an adhesive, a cooling grease or a heat conductive sheet is sandwiched between the capacitor 11 and the heat transfer member 51. In this case, the adhesion between the capacitor 11 and the recess 52 can be improved. In addition, by holding the capacitor 11 stably, it is possible to prevent lead breakage (of the capacitor 11) due to vibration during transportation.

<7. Seventh Embodiment>
The seventh embodiment is a modification of the fourth embodiment. Hereinafter, the seventh embodiment will be described with reference to FIG. 14 focusing on differences from the fourth embodiment. FIG. 14 is a cross-sectional view of the electrical component unit 1 (also referred to as 1G) viewed from the front side. In this embodiment, a case where a single capacitor 11 is mounted is illustrated.

  Also in the electrical component unit 1G, a part of the heat transfer member 51 (specifically, the recess 52) is in close contact with the capacitor 11, and the other part of the heat transfer member 51 (contact surface FC) is the case. 20 is connected. Therefore, high heat dissipation efficiency can be obtained.

  Further, in the electrical component unit 1G, the heat transfer member 51 reaches the outside of the case 20 (in other words, exposed to the outside of the case 20). And the heat radiating member 30 is provided so that the heat-transfer member 51 may be contact | connected. According to such a configuration, the heat transfer member 51 is directly connected to the heat radiating member 30, so that particularly high heat transfer efficiency can be obtained.

  In addition, although the case where the thermal radiation member 30 is provided only in the part corresponding to the heat-transfer member 51 is illustrated here, it is not limited to this. For example, you may make it arrange | position the thermal radiation member 30 over substantially the whole region of case 20 bottom surface similarly to other embodiment etc.

<8. Eighth Embodiment>
In 4th Embodiment-7th Embodiment, although the case where the heat-transfer member 51 was provided separately from case 20 was illustrated, it is not limited to this. For example, the case 20 itself may function as a heat transfer member. Below, 8th Embodiment which concerns on such a modification is described, referring FIGS. 15-17. FIG. 15 is an exploded cross-sectional view showing an electrical component unit 1 (also referred to as 1H) according to the eighth embodiment. 16 is a cross-sectional view (specifically, a vertical cross-sectional view of the electrical component unit 1H viewed from the front side) as seen from the same direction as FIG. 15, and FIG. 17 is a side view of the interior of the electrical component unit 1H. It is the side view (partial sectional view) seen from the direction.

  As shown in FIGS. 15 to 17, the case 20 (also referred to as 20 </ b> H) of the electrical component unit 1 </ b> H has a protruding portion 21 that is substantially rectangular in a top view and protrudes upward at a predetermined position in the bottom surface. ing. The protruding portion 21 and the like function as a heat transfer portion, and the heat generated in the capacitor 11 is released to the outside through the protruding portion 21 and the heat radiating member 30.

  The case 20H is formed of the same material over substantially the entire case. Here, the case 20H is made of a highly thermally conductive resin, but is not limited to this, and various materials can be used. Case 20H should just have thermal conductivity, and may be formed with common resin which does not have high thermal conductivity (namely, comparatively low thermal conductivity). However, in order to improve the thermal conductivity, it is preferable to use a high thermal conductivity material (for example, a high thermal conductivity resin, aluminum, iron, or the like) as the material of the case 20H.

  The case 20H has a recess 22 on its inner surface. Specifically, as shown in FIG. 15 and the like, the protruding portion 21 of the case 20H has a concave portion 22 having a substantially arc-shaped cross section (more specifically, a substantially semi-cylindrical shape) on the upper surface side. The number of recesses 22 is determined according to the number of capacitors 11 to be arranged. Here, in order to arrange a single capacitor 11, a single recess 52 is provided.

  As described above, the recess 22 for closely attaching the capacitor 11 is provided in the protruding portion 21 protruding from the board placement surface of the case 20H. In this case, the protrusion 21 having the semi-cylindrical recess 22 only needs to have a thickness (a predetermined value larger than the radius of the capacitor 11) for placing the substantially cylindrical capacitor 11, and the case 20H. The portion other than the protruding portion 21 on the substrate placement surface may be relatively thin. In other words, it is not necessary to increase the thickness of the board arrangement surface according to the diameter of the capacitor 11 over the entire board arrangement surface of the case 20H.

  The substrate 19 (also referred to as 19H) is provided with a through hole HL4 (see FIG. 15). The capacitor 11 present on the mounting surface side (upper surface side) of the substrate 19H passes through the through hole HL4, reaches the back surface side (lower surface side) of the substrate 19H, and is opposite to the mounting surface of the substrate 19 (that is, the lower surface). It is arranged in contact with the recess 22 that also exists on the side).

  Further, the capacitor 11 passes through the through hole HL4 and is disposed across both the one surface side (upper surface side) and the other surface side (lower surface side) of the substrate 19. According to this, the restriction of the position of the substrate 19 in the height direction is reduced, and the position of the substrate 19 in the height direction can be set relatively low. That is, the size of the electrical component unit 1 in the height direction can be suppressed and a compact configuration can be achieved.

  The concave portion 22 of the case 20H is formed in accordance with the outer shape of the capacitor 11 similarly to the concave portion 52 of the fourth embodiment, and the substantially cylindrical capacitor 11 has a posture in which its axial direction is substantially horizontal (simple In other words, the outer peripheral curved surface is placed in close contact with the recess 22 in a state of being laid down. In this way, since the capacitor 11 is in direct contact with the case 20H, high heat dissipation efficiency can be obtained. Here, the adhesion between the capacitor 11 and the recess 22 is enhanced by bonding the capacitor 11 to the recess 22 with an adhesive.

  Moreover, the protrusion part 21 of case 20H has the part formed in step shape in both right and left shoulder parts. Specifically, the protrusion 21 has a placement surface 24a and a vertical surface 24b. In other words, the protruding portion 21 is also expressed as having a protruding portion 27 that particularly protrudes on the upper surface thereof.

  The through hole HL4 of the substrate 19H is a substantially rectangular hole having a size including the convex portion 27 when viewed from above, and the substrate 19H has the placement surface 24a in a state where the convex portion 27 penetrates the through hole HL4. Placed on top. Further, the mounting surface 24a is provided with a female screw part (not shown), and the board 19 is fixed to the case 20H by screwing the bolt 26 into the female screw part with the board 19 interposed therebetween. .

  At this time, the mounting surface 24a has a function of defining the position of the substrate 19H in the vertical direction of FIG. 16 (in short, the height position of the substrate 19H), and the vertical surface 24b of the convex portion 27 is 16 has a function of defining the position of the substrate 19H in the left-right direction of FIG. Therefore, the convex part 27 of the projecting part 21 penetrates the through hole HL4 of the substrate 19H, and the substrate 19H is mounted at a position defined by the mounting surface 24a and the vertical surface 24b. The assembling work for arranging the protrusions 21 on the protrusions 21 can be easily performed.

  Moreover, since it is not necessary to provide a heat transfer member separately as compared with the fourth embodiment, the number of components is reduced, and the assembling work is further facilitated.

<9. Other>
Although the embodiments of the present invention have been described above, the present invention is not limited to the contents described above.

  For example, in the eighth embodiment, the case where the capacitor 11 is fixed to the concave portion 22 of the projecting portion 21 with an adhesive is illustrated, but the present invention is not limited to this, and as shown in FIG. 56 may be used to fix the capacitor 11.

  Moreover, in the said 8th Embodiment etc., although the case where the board | substrate 19 was fixed to the case 20 with the volt | bolt 26 was illustrated, it is not limited to this. For example, as shown in FIG. 19, the substrate 19 may be fixed using a claw portion 28 provided on the protruding portion 21. Or as shown in FIG. 20, you may make it fix the board | substrate 19 with the adhesive agent GL with respect to the mounting surface 24a.

  Moreover, you may make it form the part corresponded to the protrusion part 21 of the said 8th Embodiment with a material different from the case 20. FIG. Specifically, as shown in FIG. 21, for example, a portion corresponding to the protruding portion 21 is formed of an aluminum heat transfer member 51C, and the case 20 formed mainly of resin and the heat transfer member 51C May be integrally molded. In this case, the substrate 19 and the capacitor 11 mounted on the substrate 19 may be assembled to the integrally molded component. According to this, since it is not necessary to form the entire case 20 with the same material, it is possible to appropriately use a high heat transfer material for a portion (here, the heat transfer member 51C) that preferably has high heat transfer. It is.

  In the fourth to eighth embodiments, the heat transfer member 51 or the protruding portion 21 is disposed across both the one surface side (upper surface side) and the other surface side (lower surface side) of the substrate 19. Although illustrated, it is not limited to this. For example, the heat transfer member or the protruding portion may exist only on the lower side of the substrate 19.

  Further, in the fourth to eighth embodiments and the like, the capacitor 11 is illustrated as being disposed across both the one surface side (upper surface side) and the other surface side (lower surface side) of the substrate 19. However, the present invention is not limited to this. For example, the capacitor 11 may be arranged so as to exist only on the lower side of the substrate 19.

  Moreover, in the said 1st Embodiment etc., although the case where the heat-transfer member 15 contacts the capacitor | condenser 11 directly and adheres is illustrated, it is not limited to this. For example, the capacitor 11 and the heat transfer member 15 may be brought into close contact with a second insulating material (for example, insulating paper) interposed between the capacitor 11 and the heat transfer member 15. That is, the connection between the heat transfer member 15 and the capacitor 11 is not required to block the heat transfer between the two, and the above-described interposition is present between the two. It may be. In other words, it is sufficient that the two are thermally connected. The second insulating material is not particularly limited as long as it has thermal conductivity, but more preferably has a relatively high thermal conductivity (high thermal conductivity material). As the second insulating material, for example, it is preferable to employ a high thermal conductive resin. The same applies to the case where the heat transfer member 51 and the capacitor 11 are in close contact with each other, with the second insulating material interposed between the heat transfer member 51 and the capacitor 11. You may make it closely_contact | adhere.

  Further, in each of the above embodiments, fins or the like may be arranged in a part of the case 20 and / or the heat dissipation member 30 to increase the surface area and further improve the heat dissipation performance.

  Moreover, in each said embodiment, although the case where the heat radiating member 30 is provided is illustrated, it is not limited to this, You may make it not provide the heat radiating member 30. FIG. However, providing the heat radiating member 30 can further improve the heat radiating efficiency as compared with the case where the heat radiating member 30 is not provided.

  When the heat radiating member 30 is not provided, it is particularly preferable to expose the heat transfer member 51 to the outside of the case 20 as in the electrical component unit 1G (FIG. 14).

  Moreover, in each said embodiment, although the case where the through-hole was provided in the board | substrate 19 was illustrated, it is not limited to this. For example, a cutout portion may be provided in the peripheral edge portion of the substrate, and at least one of the heat transfer member 51, the protruding portion 21, the capacitor 11, and the like may be penetrated.

  Each idea described above may be applied to an open type electrical component unit, or may be applied to a type (sealed type) electrical component unit in which the internal space is sealed. In particular, in a sealed electrical component unit, there is a strong demand for suppression of the temperature rise because the temperature rise due to sealing tends to be significant. By applying the above idea to such a sealed electrical component unit, it is possible to suitably suppress the temperature rise.

1, 1A-1H Electrical component unit 10 Electrical component 11 Capacitor 12 Electronic component 15, 15A-15C, 51, 51B, 51C Heat transfer member 17 Insulating material 19 Substrate 20, 20A-20H Case 22, 52, 57 Recessed member 30 Heat dissipation member HL1 to HL4 Through-hole LA L-shaped member RP Remaining SA Inner surface SB Outer surface

Claims (5)

An electrical component unit (1H),
A capacitor (11);
A substrate (19) on which the capacitor is mounted;
A case (20) for housing the substrate;
With
The case has a recess (22) on the inner surface;
The capacitor is disposed in close contact with the recess ,
The recess (22) is a recess having a substantially arc-shaped cross section,
The outer peripheral curved surface of the capacitor (11) having a substantially cylindrical shape is in close contact with the recess,
The capacitor passes through the notched portion or the through hole of the substrate, it is disposed so as to be in close contact with the recess electric component unit, characterized in Rukoto. The electrical component unit according to claim 1,
It said recess (22) has a substantially semi-cylindrical recess,
The electrical component unit, wherein an outer peripheral curved surface of the capacitor (11) having a substantially cylindrical shape is in close contact with the concave portion. In the electrical component unit according to claim 1 or 2 ,
Electrical component unit said recess (22), characterized that you have provided projection projecting from the substrate arrangement surface of the case. In the electrical component unit according to any one of claims 1 to 3,
A heat dissipating member (30) in contact with the outer surface of the case;
Further comprising electric component unit, characterized in Rukoto a. In the electrical component unit according to any one of claims 1 to 4,
Electrical component unit said capacitor, characterized that you close contact with the recess via an insulating material.

Images