WO2017098899A1

WO2017098899A1 - Electrical junction box

Info

Publication number: WO2017098899A1
Application number: PCT/JP2016/084404
Authority: WO
Inventors: 北　幸功
Original assignee: 株式会社オートネットワーク技術研究所; 住友電装株式会社; 住友電気工業株式会社
Priority date: 2015-12-11
Filing date: 2016-11-21
Publication date: 2017-06-15

Abstract

This electrical junction box 10 is provided with: a circuit structure 11 wherein a coil assembly 20 having a main body part 46 is mounted on a mounting surface 12A of a circuit board 12 that has the mounting surface 12A; a case 60 which internally contains the circuit structure 11; and a heat sink 50 which is arranged on a surface of the circuit board 12, said surface being on the reverse side of the mounting surface 12A. The case 60 has a top plate part 61 which covers the circuit structure 11 from the mounting surface 12A side, while being in contact with the main body part 46 of the coil assembly 20 in a heat transferring manner.

Description

Electrical junction box

The technology disclosed in this specification relates to an electrical junction box.

2. Description of the Related Art Conventionally, an electrical connection box is known in which a circuit structure in which an electronic component is mounted on a conductive path of a circuit board is accommodated in a case (see Patent Document 1). Since the electronic component generates heat when energized, a heat radiating plate is attached to the circuit component. The heat generated by the electronic component is dissipated by the heat radiating plate.

JP 2003-87934 A

Recently, with the miniaturization of electronic parts, the heat generation density of the electrical junction box tends to increase. For this reason, there exists a possibility that heat | fever diffusion may not be enough only with a heat sink.

The technology disclosed in the present specification has been completed based on the above circumstances, and is intended to improve the heat dissipation of the electrical junction box.

The technology disclosed in this specification includes a circuit configuration body in which an electronic component having a main body is mounted on the mounting surface of a circuit board having a mounting surface, a case that accommodates the circuit configuration body therein, A heat sink provided on a surface opposite to the mounting surface of the circuit board, wherein the case covers the circuit board from the mounting surface side, and the electronic Either or both of the frame portions that contact the component are included, and the top plate portion is in thermal contact with the main body portion of the electronic component.

According to the technology disclosed in this specification, a part of the heat generated in the electronic component when energized is transmitted to the top plate portion that is in thermal contact with the electronic component. And it is dissipated from the top plate part to the outside of the electric junction box. As described above, according to the present embodiment, the heat generated in the electronic component is dissipated from the case to the outside of the electrical junction box, so that the electrical junction box is compared with the case where the electrical junction box has only the heat sink. The heat dissipation can be improved.

The following embodiments are preferred as embodiments of the technology disclosed in this specification.

The electronic component is a coil assembly, and it is preferable that the opposing surface of the main body of the coil assembly that faces the mounting surface of the circuit board is separated from the mounting surface.

According to the above configuration, the heat dissipation performance of the heat sink may be exceeded when the amount of heat generated by the electronic components arranged in the electrical junction box is large. In such a case, heat may be transferred from the heat sink to the electronic component. In the present embodiment, since the coil assembly is disposed at a position where the main body part is separated from the circuit board, the influence of heat received from the heat sink via the circuit board can be reduced. On the other hand, since the top plate portion of the case is in heat transfer contact with the upper surface of the main body portion, heat generated from the coil assembly is transmitted to the case and can be radiated from the case side. Thereby, it can be set as the electrical junction box excellent in heat dissipation.

It is preferable that the top plate portion is provided with a contact convex portion that protrudes toward the main body portion and contacts the main body portion.

According to said structure, since heat can be transmitted from a coil assembly to a contact convex part and a case (top plate part) by making a contact convex part contact a main-body part, the heat dissipation of an electrical junction box Can be further improved.

The coil assembly includes a coil in which a flat wire is wound in an edgewise manner, and both ends of the flat wire are extended in a direction along the circuit board from the main body portion and bent in a crank shape, and the tip ends thereof. The connecting part is connected to a conductive path provided on the circuit board, and the connecting part is preferably arranged on the circuit board side from the surface including the opposing surface in the main body part.

According to said structure, since the connection part is distribute | arranged to the circuit board side rather than the surface containing an opposing surface among main body parts, a main body is reliably connected by connecting a connection part to the conductive path of a circuit board. The part can be separated from the mounting surface of the circuit board.

The case is preferably made of metal.

According to the above configuration, it is possible to provide an electrical junction box with more excellent heat dissipation than a configuration in which the case is made of, for example, a synthetic resin.

It is preferable that the frame portion and the top plate portion are in contact.

According to the above configuration, the heat generated in the electronic component when energized is transmitted to the frame portion and further transmitted from the frame portion to the top plate portion. The heat transferred to the top plate is dissipated to the outside of the electrical junction box. Thereby, since the heat generated in the electronic component can be efficiently dissipated to the outside of the electrical junction box, the heat dissipation of the electrical junction box can be improved.

The top plate portion projects toward the electronic component and has a fitting convex portion that fits into the fitting concave portion provided in the frame portion, and the surface of the fitting concave portion opposite to the fitting convex portion. Is preferably in contact with the electronic component.

According to the above configuration, the heat generated in the electronic component when energized is transmitted from the electronic component to the fitting recess of the frame portion. Since the fitting convex part of the top plate part is fitted in this fitting concave part, the heat quickly moves from the fitting concave part to the fitting convex part. Furthermore, the heat transmitted from the fitting convex part to the top plate part is dissipated to the outside of the electrical junction box. Thereby, the heat dissipation of an electrical junction box can further be improved.

The top plate portion has a plurality of fitting convex portions, the frame portion has a plurality of fitting concave portions, and other electronic components different from the electronic components are mounted on the mounting surface of the circuit board. The electronic component is preferably disposed between the plurality of fitting convex portions and the plurality of fitting concave portions.

According to the above configuration, the heat generated in the other electronic components is transmitted to the plurality of fitting convex portions and the plurality of fitting concave portions. The heat transmitted to the plurality of fitting projections and the plurality of fitting depressions is dissipated from the case to the outside of the electrical junction box. Thereby, the heat dissipation of an electrical junction box can further be improved.

According to the technology disclosed in this specification, an electrical junction box having excellent heat dissipation can be obtained.

Sectional drawing which shows the electrical-connection box which concerns on Embodiment 1. Exploded perspective view of choke coil Perspective view of coil assembly Sectional drawing which shows the electrical-connection box concerning Embodiment 2.

<Embodiment 1>
A first embodiment will be described with reference to FIGS. The electrical junction box 10 of the present embodiment is disposed between a power source such as a battery and in-vehicle electrical components such as a lamp and a motor, and performs energization and disconnection of power supplied from the power source to the in-vehicle electrical components. To do. In the following description, the upper side in FIG. 1 is the front side or the upper side, and the lower side is the back side or the lower side.

(Electric junction box 10)
As shown in FIG. 1, the electrical junction box 10 includes a circuit component 11 in which a small component 15 and a coil assembly 20 (an example of an electronic component) are mounted on a circuit board 12, and a back surface ( The heat sink 50 distribute | arranged to the lower surface in FIG. 1, and the case 60 which accommodates the circuit structure 11 inside is provided.

(Circuit structure 11)
The circuit structure 11 includes a circuit board 12. The circuit board 12 is formed by arranging and bonding a plurality of bus bars 13 in a predetermined pattern on the back surface of a printed wiring board in which a conductive circuit (not shown) is formed on the surface of an insulating board by a printed wiring technique. A small component 15 and a coil assembly 20 are mounted at predetermined positions on the circuit board 12. The small component 15 is a transistor, a capacitor, or the like.

In the following, a surface (surface on the front side) on which the small component 15 and the coil assembly 20 are mounted in the circuit board 12 is referred to as a mounting surface 12A.

(Coil assembly 20)
The coil assembly 20 accommodates a magnetic core 22 and a coil 30 (corresponding to an edgewise coil) formed by winding a winding in a coil case 40 and is filled with a potting material 45 (see FIG. 3). ). In the following description, the upper side in FIGS. 2 and 3 is the upper side, the lower side is the lower side, the left front is the front, and the right back is the rear.

The magnetic core 22 is a so-called PQ-type core, and is formed by combining a pair of first core 22A and second core 22B having the same shape as shown in FIG. The first core 22 A and the second core 22 B are a pair of substantially plate-like portions that extend in parallel along the axial direction of the wound portion 23 with the cylindrical wound portion 23 interposed therebetween. Leg portion 24 and a plate-like connecting portion 25 formed by connecting one end of the wound portion 23 and the pair of leg portions 24 to each other. The wound portion 23 and the leg portion 24 have the same height with respect to the connecting portion 25. Further, of the side edges of the connecting portion 25, a pair of side edges that are not connected to the leg portion 24 are notched obliquely from both ends of the leg portion 24 toward the wound portion 23.

The coil 30 of this embodiment is an edgewise coil formed by winding a rectangular wire in an edgewise shape and in an annular shape. As shown in FIG. 2, the coil 30 is wound from the upper end and the lower end of the wound portion 31 that forms a tubular shape as a whole, and both ends of the flat wire are directed in the same direction (forward) and to each other. It extends in parallel and is bent in a crank shape downward.

Hereinafter, in FIG. 2, an end portion extending from the upper side of the winding portion 31 is referred to as a first end portion 32A, and an end portion extending from the lower side is referred to as a second end portion 32B. Further, a portion of the first end portion 32A that extends forward from the winding portion 31 is a first extending portion 33A, and a portion that extends downward and continues to the first extending portion 33A is a first step. A tip end portion that extends to the front in continuation with the portion 34A and the first step portion 34A is referred to as a first connection portion 35A. Similarly, a portion of the second end portion 32B that extends forward from the winding portion 31 is connected to the second extension portion 33B, and a portion that extends downward is connected to the second extension portion 33B. A tip end portion that extends forward and continues to the stepped portion 34B and the second stepped portion 34B is referred to as a second connecting portion 35B.

The first connection part 35A and the second connection part 35B are arranged in parallel with the first extension part 33A and the second extension part 33B. Further, the first connection portion 35 A and the second connection portion 35 B are arranged at the same height (equal to each other), and are arranged below the lower end edge of the winding portion 31.

In addition, the connection holes 36A and 36B for penetrating the connecting bolts 48 are formed in the first connection part 35A and the second connection part 35B.

The coil 30 is disposed around the wound portion 23 of the pair of first core 22 A and second core 22 B, thereby forming the choke coil 21 together with the magnetic core 22. The choke coil 21 is accommodated in the coil case 40 as shown in FIG.

The coil case 40 is made of a synthetic resin material, and is made of a box whose one side (front face) is opened by an opening 41 as shown in FIG. More specifically, the coil case 40 includes an upper wall 42 and a bottom wall 43 along the top and bottom surfaces of the choke coil 21, a pair of side walls 44 along the left and right side surfaces (leg portions 24) of the choke coil 21, and the choke coil 21. And a rear wall along the back surface.

As shown in FIG. 2, the choke coil 21 is accommodated in the coil case 40 in a direction in which the pair of first end portion 32 A and second end portion 32 B protrudes outward from the opening 41. The coil case 40 is filled with a potting material 45 in a state where the choke coil 21 is accommodated. In addition, as the potting material 45, an epoxy resin etc. can be used, for example.

In this state, both ends (first end 32A, second end 32B) of the rectangular wire of the coil 30 are extended to the outside of the coil case 40. Further, the extended portions of the first end portion 32A and the second end portion 32B from the coil case 40 (the first extension portion 33A and the second extension portion 33B) are prevented from moving on the base end side by the potting material 45. It is firmly fixed to.

Further, the first connection portion 35A and the second connection portion 35B are arranged on the lower side than the lower surface 43A of the bottom wall 43 of the coil case 40. The bottom surface 43 A of the bottom wall 43 is a facing surface that faces the mounting surface 12 A of the circuit board 12.

In the coil assembly 20 described above, a portion in which the coil case 40, the choke coil 21 accommodated in the coil case 40, and the potting material 45 filled in the coil case 40 are integrated is a main body. It will be called part 46.

The coil assembly 20 described above is conductively connected to a predetermined position on the circuit board 12 as shown in FIG.

(Heat sink 50)
A heat sink 50 is provided on the lower surface side of the circuit board 12 (the back surface side of the bus bar 13). The heat sink 50 is a flat plate-like heat radiating member made of a metal material having excellent thermal conductivity such as aluminum or aluminum alloy, and has a function of radiating heat generated in the circuit board 12.

An insulating sheet for insulation between the heat sink 50 and the circuit board 12 (bus bar 13) is overlaid on the upper surface of the heat sink 50 (not shown). The insulating sheet has adhesiveness that can be fixed to the bus bar 13 and the heat sink 50.

Also, a bolt hole (not shown) that can be screwed with a bolt 48 described later is provided at a predetermined position of the heat sink 50.

(Case 60)
The circuit board 12 superimposed on the heat sink 50 via an insulating sheet is accommodated in the case 60 (see FIG. 1). The case 60 is formed by punching and bending a galvanized steel plate (made of metal), for example, to cover the circuit component 11 from the mounting surface 12A side, and downward from the edge of the top plate 61. It is formed in the substantially rectangular parallelepiped box shape provided with the four side walls 62 extended.

Of the top plate portion 61, the region corresponding to the main body portion 46 of the coil assembly 20 in a state where the case 60 accommodates the circuit structure 11 projects toward the main body portion 46 and the upper wall 42 of the main body portion 46. A contact convex portion 63 that contacts the upper surface 42A is provided. In the present embodiment, a pair of coil assemblies 20 are mounted on the circuit board 12, and a pair of contact convex portions 63 are also provided so as to correspond to the coil assemblies 20.

(Method for manufacturing electrical junction box 10)
Next, the manufacturing method of the electrical junction box 10 of this embodiment is demonstrated. First, a plurality of bus bars 13 are arranged and bonded in a predetermined pattern on the back surface side of a printed circuit board on which a conductive circuit (not shown) is printed on the mounting surface 12A (front surface) side by a printed wiring technique.

Next, the small small component 15 excluding the coil assembly 20 is placed at a predetermined position on the mounting surface 12A of the circuit board 12, and connected by soldering.

Next, the circuit board 12 on which the small small parts 15 are mounted is fixed to a predetermined position on the upper surface of the heat sink 50 with an adhesive insulating sheet (not shown). Finally, the coil assembly 20 is disposed at a predetermined position on the circuit board 12, and the bolts 48 are inserted into the connection holes 36A and 36B of the first connection part 35A and the second connection part 35B to be fastened to the bolt holes of the heat sink 50. By connecting (screwing), the bus bar 13 is electrically connected.

Here, both ends (first end portion 32A, second end portion 32B) of the rectangular wire of the coil 30 are led out from the coil case 40 (main body portion 46) in the direction along the circuit board 12 and bent into a crank shape. The tip portions (the first connection portion 35A and the second connection portion 35B) protrude below the circuit board 12 side from the lower surface 43A of the bottom wall 43 of the coil case 40 (the lower surface of the main body portion 46). Therefore, the main body 46 is disposed at a position above the circuit board 12.

Here, the distant position refers to a distance at which the main body portion 46 is not easily affected by heat from the heat sink 50 via the circuit board 12, and in this embodiment, below the main body portion 46 (main body A small small component 15 is arranged between the portion 46 and the circuit board 12).

Next, the case 60 is attached so as to cover the integrated circuit structure 11 and the heat sink 50, and relatively fixed by fixing means (not shown).

In this state, the contact convex portion 63 provided on the top plate portion 61 of the case 60 is brought into contact with the upper surface of the main body portion 46 of the coil assembly 20 (the upper surface 42A of the upper wall 42 of the coil case 40). . In this way, the electrical junction box 10 is completed.

(Operation and effect of the embodiment)
Then, the effect | action and effect of this embodiment are demonstrated. In the present embodiment, a circuit component 11 in which the coil assembly 20 having the main body 46 is mounted on the mounting surface 12A of the circuit board 12 having the mounting surface 12A, and a case 60 that houses the circuit component 11 therein, An electrical junction box 10 having a heat sink 50 provided on the surface opposite to the mounting surface 12A of the circuit board 12, and the case 60 covers the circuit component 11 from the mounting surface 12A side, The top plate portion 61 is in thermal contact with the main body portion 46 of the assembly 20.

According to the present embodiment, a part of the heat generated in the coil assembly 20 during energization is transmitted to the top plate portion 61 that is in thermal contact with the coil assembly 20. Then, it is dissipated from the top plate portion 61 to the outside of the electrical junction box 10. As described above, according to the present embodiment, the heat generated in the coil assembly 20 is dissipated from the case 60 to the outside of the electrical junction box 10, so that the electrical junction box 10 has only the heat sink 50. In comparison, the heat dissipation of the electrical junction box 10 can be improved.

Further, according to the present embodiment, the electronic component is the coil assembly 20, and the lower surface 43 A facing the mounting surface 12 A of the circuit board 12 in the main body 46 of the coil assembly 20 is separated from the mounting surface 12 A. Yes.

When the amount of heat generated by the coil assembly 20 disposed in the electrical junction box 10 is large, the heat dissipation performance of the heat sink 50 may be exceeded. In such a case, heat may be transferred from the heat sink 50 to the coil assembly 20. In the present embodiment, since the coil assembly 20 is disposed at a position where the main body 46 is separated from the circuit board 12, the influence of heat received from the heat sink 50 via the circuit board 12 can be reduced. On the other hand, since the top plate portion 61 (contact convex portion 63) of the case 60 is in heat transfer contact with the upper surface of the main body portion 46 (the upper surface 42A of the upper wall 42), heat generated from the coil assembly 20 is obtained. Is transmitted to the case 60 and can be radiated from the case 60 side.

That is, even when the temperature of the heat sink 50 is increased by another small component 15 such as an FET, the heat is suppressed from being transmitted to the coil assembly 20, while the heat generated from the coil assembly 20 itself. Is radiated by the case 60 (top plate portion 61), and heat generated in the circuit component 11 can be efficiently radiated by both the heat sink 50 and the case 60. Therefore, it can be set as the electrical junction box 10 excellent in heat dissipation.

Further, according to the present embodiment, the top plate portion 61 is provided with the contact convex portion 63. Heat can be transferred from the coil assembly 20 to the contact projection 63 and the case 60 (top plate portion 61) by bringing the contact projection 63 into contact with the main body portion 46, so that heat dissipation of the electrical junction box is achieved. Can be further improved.

In addition, since the case 60 (top plate portion 61) is made of metal, the electrical junction box 10 can be made more excellent in heat dissipation than a configuration in which the case 60 is made of, for example, a synthetic resin.

<Embodiment 2>
Next, the electrical junction box 70 according to the second embodiment will be described with reference to FIG. The electrical connection box 70 includes a metal heat sink 71, a metal case 72 that covers the upper surface of the heat sink 71, and a circuit structure 73 that is accommodated in the case 72.

A plurality of fins 74 protrude downward from the lower surface of the heat sink 71. A circuit board 75 is disposed on the upper surface of the heat sink 71 via an insulating layer (not shown).

A semiconductor element 76 (an example of an electronic component) and a capacitor 77 (an example of another electronic component) are mounted on the upper surface (mounting surface) of the circuit board 75. Specifically, a connection portion (not shown) of the semiconductor element 76 and a connection portion (not shown) of the capacitor 77 are connected to a conductive path (not shown) formed on the circuit board 75 by a known method such as soldering. It is connected by the method.

In the case 72, a synthetic resin frame 78 is provided. The frame part 78 surrounds the circuit board 75. The frame part 78 includes a bridge part 79 that extends over the circuit board 75.

At least a part of the frame part 78 is sandwiched between the case 72 and the heat sink 71. Thereby, the frame part 78 is connected to the case 72 in a heat transfer manner and is also connected to the heat sink 71 in a heat transfer manner.

The case 72 includes a top plate portion 80 that covers the upper side of the circuit board 75. The top plate 80 covers the semiconductor element 76 and the capacitor 77 from above (from the mounting surface side).

The top plate 80 is formed with a plurality (two in FIG. 4) of fitting protrusions 81 that hang downward from a position corresponding to the semiconductor element 76 side by side in the horizontal direction in FIG. The fitting projections 81 are fitted from above into a plurality (two in FIG. 4) of fitting recesses 82 formed in the bridge portion 79 of the frame portion 78. Thereby, the frame part 78 and the top-plate part 80 are connected thermally.

The lower surface of the fitting recess 82 is in contact with the upper surface of the semiconductor element 76 from above. The lower surface of the fitting recess 82 and the upper surface of the semiconductor element 76 may be in direct contact, or indirectly in contact with each other via a known heat transfer sheet, adhesive, or adhesive. Also good.

The capacitor 77 is arranged between the two fitting convex portions 81 and the fitting concave portion 82 arranged in the left-right direction in FIG. The capacitor 77 is arranged away from the fitting recess 82 of the frame portion 78. In addition, the capacitor 77 is also spaced apart from the bridge portion 79 of the frame portion 78.

Since the configuration other than the above is substantially the same as that of the first embodiment, the same members are denoted by the same reference numerals, and redundant description is omitted.

(Operation and effect of the embodiment)
Then, the effect | action and effect of this embodiment are demonstrated. According to the present embodiment, the electrical junction box 70 further includes the frame portion 78 that contacts the semiconductor element 76 in the case 72, and the frame portion 78 and the top plate portion 80 are in contact with each other.

With the above configuration, the heat generated in the semiconductor element 76 during energization is transmitted to the frame portion 78 and further transmitted from the frame portion 78 to the top plate portion 80. The heat transmitted to the top plate 80 is dissipated to the outside of the electrical junction box 70. Thereby, since the heat generated in the semiconductor element 76 can be efficiently dissipated to the outside of the electrical junction box 70, the heat dissipation of the electrical junction box 70 can be improved.

Further, according to the present embodiment, the top plate portion 80 has the fitting convex portion 81 that protrudes toward the semiconductor element 76 and fits with the fitting concave portion 82 provided in the frame portion 78. Of the mating recess 82, the surface on the opposite side of the fitting projection 81 is in contact with the semiconductor element 76.

The heat generated in the semiconductor element 76 during energization is transferred from the semiconductor element 76 to the fitting recess 82 of the frame portion 78. Since the fitting convex portion 81 of the top plate portion 80 is fitted to the fitting concave portion 82, the heat quickly moves from the fitting concave portion 82 to the fitting convex portion 81. The heat transmitted from the fitting convex portion 81 to the top plate portion 80 is dissipated to the outside of the electrical connection box 70. Thereby, the heat dissipation of the electrical junction box 70 can further be improved.

Further, according to the present embodiment, the top plate portion 80 has a plurality of fitting convex portions 81, the frame portion 78 has a plurality of fitting concave portions 82, and an electronic component and a mounting surface of the circuit board 75 are provided. Different capacitors 77 are mounted, and the capacitor 77 is disposed between the plurality of fitting convex portions 81 and the plurality of fitting concave portions 82.

According to the above configuration, the heat generated in the capacitor 77 is transmitted to the plurality of fitting convex portions 81 and the plurality of fitting concave portions 82. The heat transmitted to the plurality of fitting convex portions 81 and the plurality of fitting concave portions 82 is dissipated from the case 72 to the outside of the electrical junction box 70. Thereby, the heat dissipation of the electrical junction box 70 can further be improved.

<Other embodiments>
The technology disclosed in the present specification is not limited to the embodiments described with reference to the above description and drawings, and includes, for example, the following various aspects.

(1) In the first embodiment, the contact convex portion 63 is provided on the top plate portion 61. However, the contact convex portion 63 is not necessarily provided.

(2) Further, in the first embodiment, when the contact convex portion 63 is provided, the metal plate material is bent and formed in a convex shape, but the convex portion may be provided on the flat plate. Moreover, it is good also as a structure which makes several contact convex parts contact the one coil assembly.

(3) Although the case 60 is made of metal in the first embodiment, it may be made of synthetic resin. Alternatively, the case may be composed of separate members of the cover part and the frame, only the cover part may be made of metal, and the frame may be made of synthetic resin.

(4) The coil assembly 20 is not limited to the first embodiment, and may have other forms. For example, the connection portion may be directly derived from the lower surface of the main body portion. In short, when the coil assembly is mounted on the circuit board, the main body portion is hardly affected by heat from the heat sink. What is necessary is just to be set as the structure distribute | arranged to the distant position.

(5) In the first embodiment, the coil assembly 20 is connected to the circuit board 12 by bolt fastening, but may be connected by solder.

(6) In the first embodiment, the body 46 of the coil assembly 20 is bolted to the circuit board 12 by fastening both ends 32A and 32B (

connections

35A and 35B) of the coil 30 led out from the body 46. The main body 46 can be supported and supported at a position distant from the mounting surface 12A. However, other means such as a separate support for supporting the main body 46 are provided. It is good also as a structure arrange | positioned and distribute | arranged to the position away from 12 A of mounting surfaces.

(7) In the first embodiment, an example in which an edgewise coil is used as the coil 30 has been shown, but another type of coil may be used.

(8) In the first embodiment, the both

end portions

32A and 32B of the coil 30 are configured to extend from the winding portion 31 in the same direction. However, they may not necessarily be in the same direction, for example, extend in the intersecting direction. Or it is good also as a structure extended toward the other side.

(9) In the first embodiment, an example in which a PQ type core is used as the magnetic core 22 has been shown. However, the magnetic core uses other types of cores such as an EI core, an EE core, an EER core, and an EPC core. Also good.

(10) In the first embodiment, the circuit board 12 and the heat sink 50 are relatively fixed by the insulating sheet having adhesiveness. For example, the circuit board 12 and the heat sink 50 are bonded by an insulating adhesive or fixed by screwing. It is good.

DESCRIPTION OF SYMBOLS 10,70: Electrical junction box 11,73: Circuit structure 12, 75: Circuit board 12A: Mounting surface 13: Bus bar (conductive circuit)
20: Coil assembly (electronic component)
30: Coil 31: Winding portion 32A: First end portion 32B: Second end portion 35A: First connection portion 35B: Second connection portion 40: Coil case 42: Upper wall 42A: Upper surface (on the side opposite to the facing surface) surface)
43: Bottom wall 43A: Lower surface (opposing surface)
46: main body 48: bolt 50, 71: heat sink 60, 72: case 61, 80: top plate 63: contact convex portion 75A: upper surface (mounting surface)
76: Semiconductor element (electronic component)
77: Capacitor (other electronic components)
78: Frame part 81: Fitting convex part 82: Fitting concave part

Claims

A circuit structure in which an electronic component having a main body is mounted on the mounting surface of the circuit board having a mounting surface;
A case for housing the circuit structure therein;
An electrical junction box having a heat sink provided on the surface side opposite to the mounting surface of the circuit board,
The case has either one or both of a top plate portion that covers the circuit structure from the mounting surface side, and a frame portion that contacts the electronic component,
The top plate is an electrical junction box that is in thermal contact with the main body of the electronic component.
The electronic component is a coil assembly;
2. The electrical junction box according to claim 1, wherein a facing surface of the main body portion of the coil assembly that faces the mounting surface of the circuit board is separated from the mounting surface.
3. The electrical junction box according to claim 2, wherein the top plate portion is provided with a contact convex portion that protrudes toward the main body portion and contacts the main body portion.
The coil assembly includes a coil in which a flat wire is wound in an edgewise manner, and both ends of the flat wire are extended from the main body in a direction along the circuit board and bent in a crank shape. , The tip is a connection portion connected to a conductive path provided on the circuit board,
The electrical connection box according to claim 2, wherein the connection portion is disposed closer to the circuit board than a surface including the facing surface in the main body portion.
The electrical junction box according to any one of claims 1 to 4, wherein the case is made of metal.
The electrical junction box according to any one of claims 1 to 5, wherein the frame portion and the top plate portion are in contact with each other.
The top plate portion has a fitting convex portion that protrudes toward the electronic component and fits with a fitting concave portion provided in the frame portion,
The electrical junction box according to claim 6, wherein a surface of the fitting concave portion opposite to the fitting convex portion is in contact with the electronic component.
The top plate portion has a plurality of the fitting convex portions, and the frame portion has a plurality of the fitting concave portions,
Other electronic components different from the electronic components are mounted on the mounting surface of the circuit board,
The electrical connection box according to claim 7, wherein the other electronic component is disposed between the plurality of fitting convex portions and the plurality of fitting concave portions.