JP6349807B2 - Electronics - Google Patents

Description

  The present invention relates to an electronic device such as a power supply device.

For example, a switching power supply device is used as the power supply device, and electronic components such as a transformer, a coil, and an aluminum electrolytic capacitor are provided inside the switching power supply device. Among these electronic components, for example, transformers, coils, semiconductor elements, and the like are heat generating components, and a metal housing may be used to dissipate heat generated by these components to the outside.
However, when a metal casing is used, there is a problem that it is difficult to reduce the size of the power supply device because it is necessary to secure an insulation distance between the casing and the electrical component.

On the other hand, for example, as shown in Patent Document 1, a configuration using a resin-made casing as a casing of a power supply device is disclosed. By using such a casing made of resin, insulation from an electrical component is disclosed. Therefore, it is possible to reduce the size from the viewpoint of insulation.
Moreover, since the housing can be mass-produced by resin molding, the cost can be reduced.

JP 2000-208968 A

However, since the amount of heat generated increases in response to the demand for higher capacity in recent years, when the case is formed of a resin having a lower thermal conductivity than metal, the case is in direct contact with the heat-generating component. Although heat is radiated from the body part, heat is not transmitted to the periphery of the body part, so there is a problem that the heat radiation area is small and it is difficult to sufficiently radiate heat.
In addition, when trying to reduce the size of the power supply device, heat is likely to be trapped and it is difficult to dissipate heat.

  An object of the present invention is to provide an electronic device that has good heat dissipation and can be miniaturized.

  An electronic device according to a first aspect of the present invention includes a housing, a heat generating component, a heat radiating member, and a heat transfer member. The housing is made of resin. The heat generating component is housed in the housing. The heat dissipating member is disposed along the outer surface of the housing, has a higher thermal conductivity than the resin forming the housing, and has a plate shape. The heat transfer member has a first surface and a second surface that face each other. The heat transfer member contacts the heat dissipation member directly or indirectly through the housing on the first surface, and contacts the heat-generating component on the second surface. . The heat dissipating member has a shape that covers at least the contact surface between the heat transfer member and the heat generating component.

  Here, the heat generating component is a component that generates heat by being electrically driven. When an aluminum electrolytic capacitor is used for the electronic device, it may be a component that generates a larger amount of heat than the aluminum electrolytic capacitor. In addition, among the components used in the electronic device, components included in the upper half when viewed in descending order of the calorific value may be used. One of a transformer, a semiconductor component, and a coil is included. Further, the heat transfer member is a member having a higher thermal conductivity than a gas inside the housing such as air. As a result, heat can be efficiently radiated to the housing rather than providing a space without arranging a heat transfer member. Indirect contact means that another member is interposed between two members, and these two members are not in direct contact with each other, but either member is in direct contact with the other member. State. The other member may be a member in which a plurality of members are continuously connected in direct contact. The other member is a member having a higher thermal conductivity than the gas inside the housing such as air.

By forming the housing with resin in this way, it is not necessary to secure an insulation distance from the electronic component, so that it is possible to reduce the size, and a plate-like heat dissipation member is disposed along the outer surface of the housing As a result, the heat spreads to a wider area than the heat radiating member as compared with the case of only the resin casing, and good heat dissipation can be obtained.
Further, since the housing is formed of resin, cost reduction can be achieved.

An electronic device according to a second aspect is the electronic device according to the first aspect, wherein the housing has a vent hole through which gas flows in or out.
Thereby, the heat generation component can be further radiated by the air flowing through the inside of the housing through the vent hole.
An electronic device according to a third invention is the electronic device according to the first or second invention, wherein the heat transfer member is in contact with the housing, and the heat dissipation member is a heat transfer member sandwiching the housing. It is arranged on the opposite side.
Thereby, the heat generated by the heat-generating component can be transmitted to the heat radiating member through the housing, and heat can be radiated.

An electronic device according to a fourth invention is the electronic device according to the first or second invention, wherein the housing has a through hole, and the heat transfer member is in direct contact with the heat dissipation member via the through hole. doing.
Thereby, the heat generated by the heat generating component can be directly transmitted to the heat radiating member, and heat can be radiated.

An electronic device according to a fifth invention is the electronic device according to the first or second invention, comprising a sheet-like member disposed between the heat transfer member and the housing in contact with the heat transfer member. Yes. The sheet-like member is disposed on the opposite side of the heat dissipation member with the housing interposed therebetween. The surface of the sheet-like member on the housing side has high slidability with respect to the inner surface of the housing. The sheet-like member includes paper and a resin sheet. It may have insulating properties. It is preferable that it is solid and has a strength that does not break even when housed in the housing while being in contact with the inner surface of the housing.
Thereby, the heat generated by the heat generating component can be transmitted to the heat radiating member via the sheet-like member and the housing, and heat can be radiated.

An electronic device according to a sixth aspect is the electronic device according to the second aspect, wherein the housing has a first surface and a second surface facing each other. The ventilation hole is provided in each of the first surface and the second surface.
Thereby, heat dissipation of the electronic component can be performed by the flow of air passing through the vent hole on the first surface and the vent hole on the second surface.

An electronic device according to a seventh aspect is the electronic device according to the sixth aspect, wherein the housing has a third surface and a fourth surface that face each other. The third surface and the fourth surface are disposed along a direction perpendicular to the first surface and the second surface. The heat dissipation member is disposed on at least one of the third surface and the fourth surface.
Since the heat dissipating member is arranged on the surface that does not have the vent hole in this way, it is possible to form the heat dissipating member with as large an area as possible according to the surface without considering closing the vent hole, The heat dissipation efficiency can be further improved. Note that the description of “vertical” in this specification does not indicate a strict meaning.

An electronic device according to an eighth aspect of the invention is the electronic device according to the sixth aspect of the invention, in which all the substrates arranged in the housing including the substrate on which the heat generating component is arranged have the first surface and Arranged along the direction perpendicular to the second surface,
By disposing the substrate in this way, it is possible to reduce as much as possible the obstruction of the air flow that passes through the air holes on the first surface and the air holes on the second surface, and heat can be radiated efficiently.

An electronic device according to a ninth aspect of the invention is the electronic device according to the sixth aspect of the invention, further comprising an attachment portion for attaching the housing to the support rail. The housing has a fifth surface arranged along a direction perpendicular to the first surface and the second surface. The attachment portion is disposed on the fifth surface. In a state where the housing is attached to the support rail, the first surface and the second surface are disposed along a direction in which the opposing surfaces are perpendicular to the longitudinal direction of the support rail.
Thereby, a plurality of electronic devices can be attached to the support rail without blocking the vent holes on the first surface and the second surface.

An electronic device according to a tenth invention is the electronic device according to the second invention, wherein the casing is formed by fastening, fitting or adhering at least two members, and faces each other. It has a third surface and a fourth surface. The heat dissipation member is disposed on at least one of the third surface and the fourth surface. The third surface and the fourth surface are provided on separate members.
Accordingly, the heat transfer member is disposed on the heat generating component placed inside one of the third surface and the fourth surface, and the other of the third surface and the fourth surface is placed on the heat transfer member. Since the electronic device can be manufactured so as to be covered, the heat transfer member can be easily arranged between the heat generating component and the housing.

An electronic device according to an eleventh aspect of the invention is the electronic device according to the fifth aspect of the invention, wherein the casing is disposed so as to close the opening surface and a box-shaped member having an opening surface opening toward the outside. And a lid-like member.
Thus, even if the casing is formed of a box-shaped member and a lid-shaped member, the heat-generating component is box-shaped with the heat-transfer member placed by placing the sheet-shaped member in contact with the heat-transfer member. Since it can slide and insert in a member, it becomes easier to manufacture an electronic device.

An electronic device according to a twelfth aspect of the invention is the electronic device according to the first or second aspect of the invention, in which the heat dissipation member is bonded to the housing with a double-sided tape.
Thereby, a heat radiating member can be easily affixed on a housing | casing.

An electronic device according to a thirteenth aspect of the present invention is the electronic device according to the first or second aspect of the present invention, in which the heat dissipation member is integrally formed with the casing.
Accordingly, it is not necessary to perform bonding, fastening, or the like for attaching the heat dissipating member to the housing, and manufacturing is facilitated.

An electronic device according to a fourteenth aspect is the electronic device according to the first or second aspect, wherein the heat transfer member has elasticity and is in close contact with the heat generating component.
Thereby, the heat of the heat generating component can be more reliably transmitted to the heat radiating member directly or via the housing.

  According to the electronic device of the present invention, heat dissipation is good and downsizing can be achieved.

The perspective view which shows the power supply device in Embodiment 1 which concerns on this invention. The perspective view which shows the power supply device of FIG. The disassembled perspective view which shows the power supply device of FIG. (A), (b), (c), (d), (e) Front view, right side view, left side view, top view, bottom view, cross-sectional view of the case body of the power supply device of FIG. The perspective view which shows the power supply circuit unit of the power supply device of FIG. The side view for demonstrating the internal structure of the power supply device of FIG. The perspective view which shows the power circuit unit and heat-transfer member of the power supply device of FIG. (A) A cross-sectional view taken along the line AA in FIG. 6, (b) an enlarged view of a portion C in FIG. 8 (a). The perspective view for demonstrating the manufacturing method of the power supply device of FIG. (A), (b) The perspective view which shows the power supply device in Embodiment 2 which concerns on this invention. (A) Sectional drawing of the power supply device of FIG. 9, (b) The C section enlarged view of Fig.11 (a). The perspective view for demonstrating the manufacturing method of the power supply device of FIG. (A), (b) The perspective view which shows the power supply device in Embodiment 3 which concerns on this invention. (A) Sectional drawing of the power supply device of FIG. 13, (b) The C section enlarged view of Fig.14 (a). FIG. 14 is a perspective view for explaining a method for manufacturing the power supply device of FIG. 13. The side view which shows the power supply device of the modification of embodiment which concerns on this invention. (A) A cross-sectional view taken along the line HH in FIG. 16, and (b) an enlarged view of a portion k in FIG. (A) Cross section taken along the line II in FIG. 16, (b) Enlarged view of portion J in FIG. 18 (a). (A) (b) The elements on larger scale which show the power supply device of the modification of embodiment which concerns on this invention. The disassembled perspective view which shows the power supply device of the modification of embodiment which concerns on this invention. (A) The figure which shows the slide sheet of the power supply device of the modification of Embodiment 2 which concerns on this invention, (b) The figure which shows the power supply circuit unit of the power supply device of the modification of Embodiment 2 which concerns on this invention, (c) The figure which shows the state in which the power supply circuit unit shown in FIG.21 (b) was covered with the slide sheet | seat shown to Fig.21 (a). The perspective view which shows the power supply device of the modification of embodiment which concerns on this invention. The left view of the power supply device of FIG. (A) Arrow cross-sectional view between JJ in FIG. 23, (b) Arrow cross-sectional view between KK in FIG. (A), (b) The perspective view of the power supply device of the modification of embodiment which concerns on this invention.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings as appropriate. In the following description, for example, in order to avoid the description from being unnecessarily redundant and to facilitate understanding by those skilled in the art, for example, a detailed description of known matters and a redundant description of substantially the same configuration are omitted. There is a case.
The applicant provides the following description and drawings in order for those skilled in the art to fully understand the contents of the present invention, and these disclosures limit the subject matter described in the claims. Not intended.

(Embodiment 1)
<1. Configuration>
FIG. 1 is a perspective view of the power supply device 100 according to the first embodiment viewed from the front side. FIG. 2 is a perspective view of the power supply device 100 according to the first embodiment viewed from the back side. FIG. 3 is an exploded perspective view of the power supply device 100 according to the first embodiment.

The power supply apparatus 100 according to the first embodiment is a switching power supply apparatus, and can convert a commercial power supply input into high-frequency power using a semiconductor switching action to obtain a predetermined direct current.
As shown in FIG. 1, FIG. 2, and FIG. 3, the power supply device 100 according to the first embodiment is housed in the case 1, the heat radiating plate 2 disposed outside both side surfaces of the case 1, and the case 1. The power supply circuit unit 3 and the heat dissipating gel sheet 4 disposed on predetermined parts of the power supply circuit unit 3 are provided. In FIG. 1, the support rail 9 to which the power supply device 100 according to the first embodiment is attached is indicated by a dotted line.

(1-1. Case 1)
As shown in FIG. 3, the case 1 includes a case main body 10 and a case front portion 11.
4 (a), 4 (b), 4 (c), 4 (d), and 4 (e) are respectively a front view, a right side view, a left side view, and a top view of the case body 10. FIG. Moreover, FIG.4 (f) is sectional drawing shown by the arrow between AA of FIG.4 (c).

  As shown in FIGS. 3 and 4A to 4F, the case body 10 has a box shape having an opening on the front side, and includes a right side surface 12, a left side surface 13, an upper surface 14, a bottom surface 15, and A back surface 16 is provided. In the present specification, up / down / left / right and front / rear are defined with reference to the power supply device 100 attached to the support rail 9. The left-right direction indicates the left-right direction when the case front portion 11 is viewed from the front. Further, the front side is the case front portion 11 side, and the rear side is the back surface 16 side.

(1-1-1. Case body 10)
(1-1-1-1. Right side surface 12)
As shown in FIG. 4B, the right side surface 12 is formed with fitting holes 12a and 12b into which claws 11a and 11b (described later) of the case front portion 11 are fitted. The fitting holes 12a and 12b are formed at two positions on the right side 12 on the front end 12f side.

(1-1-1-2. Left side 13)
As shown in FIG. 4C, fitting holes 13 a and 13 b are formed in the left side surface 13 so that claws 11 c and 11 d (described later) of the case front portion 11 are fitted. The fitting holes 13a and 13b are formed at two places on the left side 13 on the front end 13f side. As shown in FIGS. 4 (c) and 4 (d), the left side surface 13 is formed with an opening 13 c that penetrates the inside and the outside of the case body 10. The opening 13 c is provided near the upper end of the left side surface 13 and is formed at a position facing the transformer 34 provided in the power supply circuit unit 3.

(1-1-1-3. Upper surface 14)
As shown in FIG. 4D, the upper surface 14 is formed with a fitting hole 14a into which a claw portion 11e (described later) of the case front portion 11 is fitted. The fitting hole 14 a is formed on the front end 14 f side of the upper surface 14. Further, as shown in FIGS. 1, 3 and 4D, a vent hole 141 for releasing heat generated in the power supply circuit unit 3 to the outside is formed in the upper surface 14. The ventilation hole 141 has a substantially hexagonal ventilation hole 141a and a linear ventilation hole 141b. If the end on the right side 12 of the upper surface 14 is the right end 14c, the end on the left side 13 side of the upper surface 14 is the left end 14d, and the end on the back 16 side of the upper surface 14 is the rear end 14e, the vent hole 141b is the right end 14c. Two are provided along the right end 14c and the left end 14d at positions closer to the left end 14d. Further, a plurality of vent holes 141a are provided between the vent holes 141b formed along the right end 14c and the left end 14d so as to form a honeycomb structure in the front-rear direction (front end 14f to rear end 14e). .

(1-1-1-4. Bottom 15)
As shown in FIG. 4E, the bottom surface 15 is formed with a fitting hole 15a into which a claw portion 11f (described later) of the case front portion 11 is fitted. The fitting hole 15 a is formed on the front end 15 f side of the bottom surface 15. Further, as shown in FIGS. 1, 3, and 4 (e), a vent hole 151 for releasing heat generated in the power supply circuit unit 3 to the outside is formed in the bottom surface 15. The vent 151 has a substantially hexagonal vent 151a and a linear vent 151b. If the end of the bottom surface 15 on the right side 12 side is the right end 15c, the end of the bottom surface 15 on the left side 13 side is the left end 15d, and the end of the bottom surface 15 on the back 16 side is the rear end 15e, the vent hole 151b is the right end 15c. Two are provided along the right end 15c and the left end 15d at positions closer to the left end 15d. A plurality of vent holes 151a are provided between the vent holes 151b formed along the right end 15c and the left end 15d so as to form a honeycomb structure in the front-rear direction (front end 15f to rear end 15e). .

(1-1-1-5. Back 16)
As shown in FIG. 2, the back surface 16 is provided with an attachment portion 160 for attachment to the support rail 9. The attachment portion 160 is formed in a concave shape in the left-right direction at a substantially central portion in the up-down direction. More specifically, the back surface 16 has a top surface 16a, a substantially central surface 16b, and a bottom surface 16c in the vertical direction. The surface 16b is located in front of the lower end of the surface 16a and the upper end of the surface 16c. A locking portion 16d formed so as to protrude downward is formed at the lower end of the surface 16a. Further, a recessed portion 16e formed so as to be recessed upward is formed in the step portion between the surface 16a and the surface 16b.

On the other hand, a locking portion 16f formed in the upward direction is provided at the center upper end portion in the left-right direction of the surface 16c, and an inclined surface 16g is formed on the front surface of the locking portion 16f. Yes. The inclined surface 16g is inclined so that the position on the surface thereof is positioned forward as it goes upward. Further, the locking portion 16f has elasticity so as to bend in the front-rear direction.
The upper end portion 9a (see FIG. 1) of the support rail 9 is fitted in the recess 16e, and the lower end portion 9b (see FIG. 1) is fitted over the inclined surface 16g of the locking portion 16f, so that the upper end portion 9a is locked. The lower end portion 9b is locked by the locking portion 16f. As a result, the power supply device 100 is supported by the support rail 9. The support rail 9 is formed to be long in the left-right direction, and the left-right direction in FIG. 1 is an example of the longitudinal direction of the support rail 9.

(1-1-2. Case Front 11)
As shown in FIG. 3, the case front portion 11 is formed in a lid shape that closes the opening 17 of the case main body 10, and fits with the case main body 10. As shown in FIGS. 1 to 3, the case front portion 11 has a front surface 110, a right surface 112, a left surface 113, an upper surface 114, and a lower surface 115. In a state where the case front part 11 is fitted to the case body 10, the right surface 112, the left surface 113, the upper surface 114, and the lower surface 115 of the case front part 11 are respectively connected to the right side surface 12, the left side surface 13, and the upper surface 14 of the case body 10. And the bottom surface 15 and the end surfaces are adjacent to each other.

  The case front part 11 is formed with projecting parts 11g and 11h projecting rearward from the edge 11k on the left side 13 side of the rear end thereof, and in the fitting holes 13a and 13b of the left side 13 at the tip thereof. Claw portions 11c and 11d to be fitted are provided. The claw portions 11c and 11d have inclined surfaces 111c and 111d on the outside, and are formed so that the width in the left-right direction becomes narrower toward the rear.

  As shown in FIGS. 1 and 2, the case front portion 11 is formed with a protruding portion (not shown) protruding rearward from the edge 11j on the right side surface 12 side of the rear end. Claw portions 11a and 11b that fit into the fitting holes 12a and 12b of the surface 12 are provided (see FIG. 2). In addition, the shape of the protrusion part in which the nail | claw parts 11a and 11b are provided is the same shape as the protrusion parts 11g and 11h shown in FIG.

  As shown in FIG. 3, the case front portion 11 is formed with a plate-like protrusion 11 i that protrudes rearward from the edge 11 m on the upper surface 14 side of the rear end, and the plate-like protrusion 11 i A claw portion 11e that fits in the fitting hole 14a of the upper surface 14 is provided on the outer surface. The claw portion 11e has an inclined surface 111e on the outer side, and is formed so that the thickness in the vertical direction decreases toward the rear.

Further, as shown in FIG. 2, the case front portion 11 is formed with a plate-like protruding portion (not shown) protruding rearward from the edge 11 n on the bottom surface 15 side at the rear end. A claw portion 11f that fits into the fitting hole 15a is provided. In addition, the shape of the protrusion part in which the nail | claw part 11f is provided is the same shape as the protrusion part 11i shown in FIG.
Further, as shown in FIG. 3, the first wiring connection portion 39 a of the power supply circuit unit 3 is disposed in the vicinity of the upper end inside the case front portion 11. A through hole 11o for tightening or loosening the screw 390 of the first arrangement connecting portion 39a is provided in the front surface 110 of the case front portion 11. Further, a through hole 11p for inserting a wiring is provided in the upper surface 114.
Similarly, in the vicinity of the lower end inside the case front portion 11, the second wiring connection portion 39 b of the power circuit unit 3 is arranged. A through hole 11q for tightening or loosening the screw 390 of the second wiring connection portion 39b is provided in the front surface 110 of the case front portion 11. Furthermore, a through hole 11r (see FIG. 3) for inserting a wiring is provided on the lower surface 115 (see FIG. 2).

(1-2. Heat sink 2)
In this embodiment, the heat sink 2 is a plate-like member formed of aluminum. The heat radiating plate 2 includes an outer surface 12s of the right side surface 12 of the case body 10 (see FIG. 4B, see FIG. 8B described later) and an outer surface 13s of the left side surface 13 (see FIG. 4C, described later). 8b) are attached with an adhesive, and the heat sink on the right side surface 12 side is 2a, and the heat sink on the left side surface 13 side is 2b.

The heat radiating plate 2 a is formed to have substantially the same outer shape as the right side surface 12 so as to cover the entire right side surface 12 of the case body 10. Moreover, the heat sink 2b is formed in the substantially same external shape as the left side surface 13 so that the whole left side surface 13 of the case main body 10 may be covered also including the opening part 13c.
Further, the heat sink 2a is formed with notches 21 and 22 so as not to block the fitting holes 12a and 12b formed on the right side surface 12, and the heat sink 2b is also formed on the left side surface 13. Cutouts 21 and 22 are formed so as not to block the fitting holes 13a and 13b.
Moreover, as an adhesive agent which attaches heat sink 2a, 2b to the right side surface 12 and the left side surface 13, a double-sided tape etc. are mentioned, However, The one where heat conductivity is higher than the case main body 10 after adhesion hardening is preferable.

(1-3. Power supply circuit unit 3)
FIG. 5 is a perspective view of the power supply circuit unit 3 of the power supply apparatus 100 according to the first embodiment. FIG. 6 is a side view showing the internal configuration of the power supply apparatus 100 according to the first embodiment. In FIG. 6, the internal configuration is indicated by a dotted line.
As shown in FIGS. 5 and 6, the power supply circuit unit 3 is housed in the case 1 and has a first substrate 31a and a second substrate 31b.

(1-3-1. First substrate 31a)
The first substrate 31 a is disposed so as to cover the entire inner side of the right side surface 12 along a direction parallel to the right side surface 12 of the case body 10. As shown in FIG. 8A, which will be described later, the first substrate 31a is slid and inserted into groove-like support portions 14m and 15m formed in the vicinity of the right side surface 12 inside each of the upper surface 14 and the lower surface 15. Is supported. In addition, the description of "parallel" in this specification does not show a strict meaning.

On the first substrate 31a, a switching element 32, a heat sink 33a, a transformer 34, an aluminum electrolytic capacitor 35, a rectifier diode 30, a heat sink 33b, a bridge diode 36, an aluminum electrolytic capacitor 37, a coil 38, and the like are arranged as main components. ing. These components are arranged on the surface 31as on the left side surface 13 side of the first substrate 31a.
Note that the back surface opposite to the front surface 31as of the first substrate 31a is shown in FIG. 7 as 31ab. The front surface 31as of the first substrate 31a faces the left side surface 13, and the back surface 31ab faces the right side surface 12.

  The switching element 32 is a MOSFET (metal-oxide-semiconductor field-effect transistor) or the like, and is disposed on the back surface 16 side of the first substrate 31a. The heat sink 33a is plate-shaped and dissipates heat generated by the switching element 32. The heat sink 33 a is disposed along a direction in which the plate-like surface 33 as is perpendicular to the first substrate 31 a and perpendicular to the upper surface 14 and the bottom surface 15 of the case body 10.

  The transformer 34 and the aluminum electrolytic capacitor 35 are disposed on the opening 17 side (front side) of the heat sink 33a of the first substrate 31a. A transformer 34 is disposed on the upper surface 14 side, and an aluminum electrolytic capacitor 35 is disposed on the bottom surface 15 side of the transformer 34. As shown in FIGS. 5 and 8A, the aluminum electrolytic capacitor 35 has a cylindrical shape and includes a side surface 35a, an end surface 35b, and an end surface 35c. A lead wire (not shown) is provided on the end surface 35b on the upper surface 14 side, and is electrically connected to the first substrate 31a. In the present embodiment, the aluminum electrolytic capacitor 35 has an end surface 35 b and an end surface 35 c arranged along a direction parallel to the top surface 14 and the bottom surface 15. In addition, it can be said that the end surfaces 35b and 35c of the aluminum electrolytic capacitor 35 are arranged along the direction perpendicular to the first substrate 31a. Furthermore, the aluminum electrolytic capacitor 35 has a part of the side surface 35a of the first substrate 31a. It can be said that they are arranged so as to face each other.

  The heat sink 33 b is provided to dissipate heat from the rectifier diode 30. The heat sink 33 b has a shape obtained by bending a plate-like member into an L shape, and is disposed on the opening 17 side of the transformer 34. The heat sink 33b is disposed along a direction in which the plate-like surface 33bs is perpendicular to the first substrate 31a and perpendicular to the upper surface 14 and the bottom surface 15 of the case body 10.

A bridge diode 36 is disposed below the heat sink 33b. The bridge diode 36 has a plate shape, and a surface 36 a (see FIG. 6) is arranged along a direction perpendicular to the upper surface 14 and the bottom surface 15 of the case body 10.
Three aluminum electrolytic capacitors 37 are arranged in the vertical direction (opposite direction of the top surface 14 and the bottom surface 15). As shown in FIGS. 5 and 6, the aluminum electrolytic capacitor 37 has a cylindrical shape, and has a side surface 37a and two opposing end surfaces (only one end surface 37c is shown). The end surface 37c faces the left side surface 13 and is provided along a direction parallel to the first substrate 31a. An end face (not shown) is provided along the direction parallel to the first substrate 31a toward the right side face 12 side. A lead wire is provided on an end surface (not shown) facing the right side surface 12 and is electrically connected to the first substrate 31a.
A coil 38 is disposed on the bottom surface 15 side of these aluminum electrolytic capacitors 37.

(1-3-2. Second substrate 31b)
The second substrate 31b is disposed in front of the three aluminum electrolytic capacitors 37 and the coil 38 (not shown in FIG. 5 but shown in FIG. 6). As shown in FIG. It arrange | positions so that the opening 17 may be obstruct | occluded substantially. In addition, the second substrate 31 b is disposed on the front side of the first substrate 31 a along a direction perpendicular to the first substrate 31 a and perpendicular to the upper surface 14 and the bottom surface 15 of the case body 10.

The second substrate 31b is mainly provided with a first wiring connection portion 39a and a second wiring connection portion 39b. The first wiring connection portion 39a and the second wiring connection portion 39b are provided on the front surface 110 side surface of the second substrate 31b. When the case body 10 and the case front portion 11 are combined, the case front portion 11 is combined. Placed inside. The first wiring connection portion 39a and the second wiring connection portion 39b are each divided so that a plurality of wirings can be connected.
Screws 390 for fixing the wiring for each section are inserted into the first wiring connecting portion 39a from the front surface 110 side, and wiring for fixing the wiring fixed with the screws 390 is inserted into the upper surface 114 side. A portion 391 is provided. The second wiring connection portion 39b has the same structure as the first wiring connection portion 39a, but the wiring insertion portion 391 is provided on the lower surface 115 side.

(1-4. Heat dissipation gel sheet 4)
FIG. 7 is a diagram illustrating a state in which the case 1 of the power supply device 100 according to the first embodiment is removed. FIG. 8A is a cross-sectional view taken along the line BB in FIG. 6, and FIG. 8B is an enlarged view of a portion C in FIG. 8A.

The heat radiating gel sheet 4 of Embodiment 1 has insulating properties, heat transfer properties, elasticity, and adhesiveness.
As shown in FIG. 7, in the power supply device 100 according to the first embodiment, the heat radiating gel sheet 4 is disposed in close contact with the surface of the transformer 34 that generates a large amount of heat. This surface is the left side surface 13 side, and is illustrated as a surface 34a in FIG. As shown in FIGS. 8A and 8B, the heat radiating gel sheet 4 is in direct contact with the heat radiating plate 2 b through the opening 13 c formed in the left side surface 13.

Specifically, the heat dissipation gel sheet 4 has a substantially rectangular parallelepiped shape, and has a first surface 4a and a second surface 4b facing each other. The heat dissipation gel sheet 4 has a first surface 4a in contact with the surface 34a of the transformer 34 and a second surface 4b in contact with the heat dissipation plate 2b.
With such a configuration, heat generated in the transformer 34 is transmitted to the heat radiating plate 2b via the heat radiating gel sheet 4, spreads in the surface direction of the heat radiating plate 2b, and is radiated to the outside.

  Since the heat sinks 2a and 2b are attached to the right side surface 12 and the left side surface 13 with an adhesive, heat dissipation between the outer surface 12s of the right side surface 12 and the heat sink 2a and between the outer surface 13s of the left side surface 13 and heat dissipation. Although an adhesive layer is actually formed between the plates 2b, they are omitted in FIGS. 8 (a) and 8 (b). Similarly, the adhesive layer is omitted in the following drawings.

<2. Method for Manufacturing Power Supply Device 100>
FIG. 9 is an exploded view for explaining a method of manufacturing the power supply device 100 according to the first embodiment.
First, the power supply circuit unit 3 shown in FIG. 5 is inserted into the case body 10 by sliding.
Next, the heat radiating gel sheet 4 is placed on the surface 34a of the transformer 34 from the opening 13c (see arrow T). This state is the state shown in FIG. Here, since the heat radiating gel sheet 4 also has adhesiveness, when it is pressed against the surface 34a of the transformer 34, it is in close contact with the surface 34a and hardly falls.

And the heat sink 2a is attached to the right side surface 12 by bonding, and the heat sink 2b is attached to the left side surface 13 by bonding.
Next, the case front part 11 is attached so as to close the opening 17 of the case body 10. The case body 10 and the case front part 11 are connected by fitting the respective claw parts 11a, 11b, 11c, 11d, and 11e of the case front part 11 into the fitting holes 12a, 12b, 13a, 13b, 14a, and 15a, respectively. Case 1 is formed. The claw portion 11c will be described in detail as an example. When the case front portion 11 is attached to the case main body 10, the inclined surface 111c of the claw portion 11c comes into contact with the front end 13f of the left side surface 13. When the case front portion 11 is further pushed toward the case main body 10, the inclined surface 111 c slides with respect to the front end 13 f, the projecting portion 11 g bends inward, and the claw portion 11 c enters the left side surface 13. Then, by further pushing the case front part 11 toward the case main body 10, the claw part 11c is fitted into the fitting hole 13a. The same applies to the other claw portions 11a, 11b, 11d, 11e, and 11f. Note that either the attachment of the case front portion 11 to the case body 10 or the attachment of the heat sinks 2a, 2b may be performed first.
As described above, the heat dissipating gel sheet 4 is formed by forming the opening 13c as a through hole in the case body 10 and inserting the power supply circuit unit 3 into the case main body 10 and then disposing the heat dissipating gel sheet 4 through the opening 13c. Can be directly brought into contact with the heat sink 2b.

<3. Main features>
As described above, the power supply device 100 (an example of an electronic device) according to the first embodiment includes a case 1 (an example of a housing), a transformer 34 (an example of a heat generating component), and a heat sink as illustrated in FIG. 2b (an example of a heat dissipation member) and a heat dissipation gel sheet 4 (an example of a heat transfer member). Case 1 is formed of resin. The transformer 34 is housed in the case 1. The heat radiating plate 2b is disposed along the outer surface 13s (an example of the outer surface) of the left side surface 13 of the case 1, and has a plate-like shape having higher thermal conductivity than the resin forming the case 1 (specifically, the case main body 10). It is a member.

As shown in FIG. 8B, the heat transfer member has a first surface 4a and a second surface 4b facing each other, and in direct contact with the heat sink 2b on the second surface 4b, the first surface 4a. In contact with the transformer 34. The heat radiating plate 2b has a shape that covers at least the heat radiating gel sheet 4 and the first surface 4a (an example of a contact surface) and the surface 34a (an example of a contact surface) of the transformer 34.
That is, in the first embodiment, the case body 10 has an opening 13c (an example of a through hole), and the heat radiating gel sheet 4 is in direct contact with the heat radiating plate 2b through the opening 13c.

  By forming the case 1 with resin in this way, it is not necessary to secure an insulation distance between the electronic components such as the transformer 34, the aluminum electrolytic capacitors 35 and 37, and the coil 38 and the case 1, thereby reducing the size. Is possible. Further, by disposing the heat radiation plates 2a and 2b along the left side surface 13 and the outer surfaces 12s and 13s of the right side surface 12, which are the outer surfaces of the case 1, good heat dissipation can be obtained.

Further, since the housing is formed of resin, cost reduction can be achieved.
In the present embodiment, the first substrate 31a and the second substrate 31b are arranged perpendicular to the upper surface 14 on which the vent hole 141 is formed and the bottom surface 15 on which the vent hole 151 is formed. By disposing the substrate in this way, the flow of air from the vent hole 151 to the vent hole 141 is not blocked, so that cooling can be performed efficiently. Further, since the right side surface 12 and the left side surface 13 are not formed with vent holes, the heat radiation plates 2a and 2b can be made as large as possible without blocking the vent holes, and heat can be efficiently radiated. .

(Embodiment 2)
The power supply device 200 according to the second embodiment of the present invention will be described below. The basic configuration of the power supply device 200 of the second embodiment is the same as that of the power supply device 100 of the first embodiment. However, unlike the first embodiment, no opening is formed on the left side surface, and the power supply device 200 is manufactured. Puts the slide sheet 5 on the heat radiating gel sheet 4 and inserts the power supply circuit unit 3 into the case. Therefore, the difference between the second embodiment and the first embodiment will be mainly described. Note that the same reference numerals in the second embodiment denote the same components as those in the first embodiment.

<1. Configuration>
FIG. 10A is a perspective view showing a state in which the heat radiating plate 2b of the power supply apparatus 200 of Embodiment 2 is removed. As shown in FIG. 10A, the case body 210 of the case 201 of the power supply apparatus 200 of the second embodiment differs from the left side surface 13 of the first embodiment in that the left side surface 13 ′ where the opening 13c is not formed is formed. Have. The configuration of the case 201 other than this point is the same as that of the case 1 of the first embodiment. The power supply device 200 according to the second embodiment has the same appearance as the power supply device 100 shown in FIG. 1 in a state where the heat radiation plates 2a and 2b are attached to the case 201.

  FIG. 10B is a perspective view for explaining the inside of the power supply apparatus 200 according to the second embodiment. The heat radiating plate 2b is not shown, and the case main body 210 is shown by a dotted line. FIG. 11A is a front cross-sectional view of the power supply device 200 of the second embodiment, and is a view cut through a plane parallel to the front surface 110 through the transformer 34 and the aluminum electrolytic capacitor 35. Moreover, the cross-sectional view shown in FIG. 11A is an arrow cross-sectional view of the power supply apparatus 200 of the second embodiment at the same position as between the CCs shown in FIG. FIG.11 (b) is the D section enlarged view of Fig.11 (a).

  As shown in FIGS. 10 (b), 11 (a), and 11 (b), in the power supply device 200 of the second embodiment, from the inside toward the outside, the transformer 34, the heat radiating gel sheet 4, the slide sheet 5, The left side surface 13 'and the heat radiating plate 2b are arranged in this order. That is, the heat radiating gel sheet 4 is in contact with the surface 34a of the transformer 34 at the first surface 4a, and is in contact with the slide sheet 5 at the second surface 4b opposite to the first surface 4a. The slide sheet 5 is in contact with the left side surface 13.

Here, the slide sheet 5 is formed of resin or the like, and preferably has a higher slidability with respect to the inner surface of the main body case 201, particularly the inner surface 13 i ′ of the left side surface 13 ′, and at least the second surface of the heat radiating gel sheet 4. It is preferable that it is higher than the sliding property with respect to the inner surface 13i 'of 4b.
With the configuration as described above, the heat generated in the transformer 34 is transmitted to the heat radiating plate 2b via the heat radiating gel sheet 4, the slide sheet 5, and the left side surface 13 '. Is released.

<2. Method for Manufacturing Power Supply Device 200>
FIG. 12 is an exploded view for explaining a method of manufacturing the power supply device 200 of the first embodiment.
As shown by an arrow E in FIG. 12, the slide sheet 5 is disposed on the heat radiating gel sheet 4 disposed on the surface 34 a of the transformer 34 of the power supply circuit unit 3. Since the heat dissipating gel sheet 4 has adhesiveness, when the slide sheet 5 is pressed against the heat dissipating gel sheet 4, the slide sheet 5 comes into close contact with the heat dissipating gel sheet 4 and is not easily separated.

Next, the power supply circuit unit 3 in a state where the slide sheet 5 and the heat dissipation gel sheet 4 are arranged is inserted into the case body 210 while being slid (see arrow F).
Next, the case front portion 11 is fitted and attached to the case main body 210.
Then, the heat radiating plates 2a and 2b are bonded to the outer surface 12s of the right side 12 and the outer surface 13s 'of the left side 13' of the case body 210, respectively.
As described above, the power supply device 200 of this embodiment can be manufactured.

<3. Main features>
As described above, in the power supply device 200 (an example of an electronic device) according to the second embodiment, the heat radiating gel sheet 4 (an example of a heat transfer member) is disposed on the second surface 4b via the case 201 and the slide sheet 5. 2b (an example of a heat radiating member) is in contact with the transformer 34 on the first surface 4a. The slide sheet 5 is disposed between the heat radiating gel sheet 4 and the case 201 in contact with the heat radiating gel sheet 4. Further, the slide sheet 5 is disposed on the opposite side of the heat radiating plate 2b across the case 201, and the surface 5a (see FIG. 10B and FIG. 11B) of the slide sheet 5 on the case 201 side is The slidability with respect to the inner surface of the case 201 (specifically, the inner surface 13i ′ of the left side surface 13 ′ (see FIG. 11B)) is high.

  As shown in FIGS. 11A and 11B, the heat radiating gel sheet 4 is in contact with the heat radiating plate 2b via the case 201 and the slide sheet 5 on the second surface 4b. The two surfaces 4b are in contact with the slide sheet 5, the slide sheet 5 is in contact with the left side surface 13 'of the case 301, and the left side surface 13' is in contact with the heat radiating plate 2b. Thereby, the heat from the transformer 34 is transmitted to the heat radiating plate 2 b through the heat radiating gel sheet 4, the slide sheet 5, and the case 301.

As described above, since the heat radiating gel sheet 4 has adhesiveness, when the heat radiating gel sheet 4 is disposed without the slide sheet 5 and the power circuit unit 3 is inserted into the case main body 210, the heat radiating gel sheet 4 is disposed. Is in close contact with the inner surface of the case body 210 and is difficult to slide.
Therefore, in the second embodiment, the slide sheet 5 is disposed on the second surface 4b side of the heat radiating gel sheet 4 so that the heat radiating gel sheet 4 is disposed in the transformer 34 of the power supply circuit unit 3 and inserted into the case main body 210. Therefore, the power supply device 200 can be easily manufactured.

(Embodiment 3)
The power supply device 300 according to the third embodiment of the present invention will be described below. The basic configuration of the power supply device 300 of the third embodiment is the same as that of the first and second embodiments. However, unlike the second embodiment, the slide sheet 5 is not disposed and the case main body is formed of two members. Has been. Therefore, the difference between the third embodiment and the second embodiment will be mainly described. Note that the same reference numerals in the third embodiment denote the same components as those in the first and second embodiments.

<1. Configuration>
FIG. 13A is a perspective view of the power supply apparatus 300 according to the third embodiment, and shows a state where the heat sink 2b is removed. FIG. 13B is a perspective view for explaining the inside of the power supply device 300 according to the third embodiment. The heat radiating plate 2b is not shown, and the case main body 210 is shown by a dotted line. FIG. 14A is a front cross-sectional view of the power supply device 300 according to the third embodiment, and is a cross-sectional view parallel to the front surface 110 that passes through the transformer 34 and the aluminum electrolytic capacitor 35. 14A can also be said to be an arrow cross-sectional view of the power supply device 300 of the third embodiment at the same position as that between the CCs shown in FIG. FIG.14 (b) is the D section enlarged view of Fig.14 (a). FIG. 15 is an exploded view for explaining a method of manufacturing the power supply device 300 according to the third embodiment.

As shown in FIGS. 13A and 15, the case main body 310 of the case 301 of the third embodiment includes two members, a first member 310 a including the right side surface 12 and a second member 310 b including the left side surface 13 ′. It is formed by joining the members. In other words, it can be said that the case main body 310 of the third embodiment is obtained by dividing the case main body 210 of the second embodiment into two.
The case body 310 is cut along a plane parallel to the left side surface 13 ′ and the right side surface 12. As shown in FIG. 15, this plane is a plane that passes between the ventilation hole 141 b on the left side surface 13 ′ side and the plurality of hexagonal ventilation holes 141 a. A joining portion S obtained by joining the cut surfaces is shown in FIGS. 13 (a) and 14 (a). The power supply device 300 according to the third embodiment has the same appearance as the power supply device 100 shown in FIG. 1 except for the joining portion S in a state where the heat radiation plates 2a and 2b are attached to the case 201.

<2. Method for Manufacturing Power Supply Device 300>
As shown in FIG. 15, the power supply circuit unit 3 is accommodated in the second member 310 b in a state where the heat radiating gel sheet 4 is disposed on the transformer 34. Thereafter, the first member 310a is joined to the second member 310b with an adhesive or the like, and the case body 310 is formed.
Subsequently, the case front portion 11 is attached to the case main body 310. Thereafter, the heat radiating plates 2a and 2b are bonded and fixed to the right side surface 12 and the left side surface 13 ', respectively.
As described above, the power supply device 300 of this embodiment can be manufactured.

<3. Main features>
As described above, in the power supply device 300 (an example of an electronic device) according to the third embodiment, as illustrated in FIG. 14, the heat radiating gel sheet 4 (an example of a heat transfer member) is interposed on the second surface 4 b via the case 301. The radiator plate 2b (an example of a radiator member) is in contact with the transformer 34 on the first surface 4a.

  The heat dissipating gel sheet 4 is in contact with the heat dissipating plate 2b through the case 301 on the second surface 4b and in contact with the transformer 34 on the first surface 4a, as shown in FIG. The two surfaces 4b are in contact with the left side surface 13 'of the case 301, and the left side surface 13' is in contact with the heat sink 2b. Thereby, the heat from the transformer 34 is transmitted to the heat radiating plate 2 b through the heat radiating gel sheet 4 and the case 301.

The case 301 is formed by adhering the case front portion 11, the first member 310a, and the second member 310b, and has a left side surface 13 'and a right side surface 12 that face each other. The left side surface 13 'and the right side surface 12 are provided on the first member 310a and the second member 310b, which are separate members, and the heat sink 2b is disposed on the left side surface 13'.
As a result, as shown in FIG. 15, the heat dissipation gel sheet 4 is disposed on the transformer 34 placed on the right side surface 12, and the power supply device 300 is manufactured by disposing the left side surface 13 ′ over the heat dissipation gel sheet 4. Therefore, the heat radiating gel sheet 4 can be easily disposed between the transformer 34 and the case 301 in a state where they are in contact with each other.

<Other embodiments>
(A)
In the first to third embodiments, the heat radiating plates 2a and 2b are attached to the right side surface 12 and the left side surfaces 13 and 13 'by adhesion using a double-sided tape or the like. Also good.

(A1)
FIG. 16 is a left side view showing a case 401 of a power supply device 400 according to a modification of the second embodiment. FIG. 17A is a cross-sectional view taken along the line HH in FIG. FIG. 17B is an enlarged view of a portion J in FIG. 18A is a cross-sectional view taken along the line II in FIG. 16, and FIG. 18B is an enlarged view of a portion k in FIG. 18A.

  As shown in FIGS. 16 and 17A, a lower support portion 413a formed in an L shape in front view is provided at the lower end of the left side surface 13 'of the case body 410 of the case 401. It has been. Specifically, the lower support portion 413a includes a lower first support portion 413b that protrudes perpendicularly from the lower end of the left side surface 13 'to the left side surface 13', as shown in FIG. The first support portion 413b has a lower second support portion 413c formed in parallel with the left side surface 13 'from the front end and upward. A groove-like portion 413d is formed surrounded by the left side surface 13 ', the lower first support portion 413b, and the lower second support portion 413c. The lower end 201b of the heat radiating plate 2b is fitted into the groove-shaped portion 413d.

  As described above, the lower end side of the heat radiating plate 2b is supported, but the upper end side is supported by the push rivet 7 as shown in FIG. That is, the heat sink 2b and the left side surface 13 ′ are provided with through holes at two locations on the upper end side, that is, the front surface 110 side and the rear surface 16 side. 18A and 18B, the push rivet 7 is disposed through the through hole 203b of the heat radiating plate 2b and the through hole 413e of the left side surface 13 ′.

  That is, when attaching the heat radiating plate 2b to the left side surface 13 ', after the lower end 201b of the heat radiating plate 2b is inserted into the groove-like portion 413d, the push rivet 7 is passed through the through hole 203b of the heat radiating plate 2b and the left side surface 13'. The heat sink 2b can be attached to the left side surface 13 'by being inserted into the hole 413e. As shown in FIGS. 17A and 18A, the heat radiating plate 2a is fixed to the right side surface 12 by adhesion, but may have the same configuration as the left side surface 13 ′. The fixing of the heat radiating plate 2b by the push rivet 7 corresponds to an example of fixing by fitting. The fixing of the heat sink 2b by the lower support portion 413a also corresponds to an example of fixing by fitting.

(A2)
In the above (A1), the lower side of the heat sink 2b is supported by the lower support portion 413a, but the lower support portion 413a may not be provided, and the lower side of the heat sink 2b is also left by the push rivet. It may be fixed to the surface 13.
(A3)
In the above (A1), the upper side of the heat radiating plate 2b is fixed to the left side surface 13 'by the push rivet 7, but is not limited to the push rivet 7. For example, as shown in FIGS. 19A and 19B, an upper support portion 423a may be formed at the upper end of the left side surface 13 ′. The upper support portion 423a includes an upper first support portion 423b that protrudes perpendicularly from the upper end of the left side surface 13 'to the left side surface 13', and a lower side parallel to the left side surface 13 'from the tip of the upper first support portion 423b. And an upper second support portion 423c formed toward the top. Further, an inclined surface 423d is formed on the outer side of the lower end of the upper second support portion 423c so that the width becomes narrower as it goes downward.

  When the lower end 201b of the heat radiating plate 2b is inserted into the groove-like portion 413d shown in FIGS. 17A and 17B, when the heat radiating plate 2b is to be attached to the left side surface 13 ′, the upper end 202b of the heat radiating plate 2b. Comes into contact with the inclined surface 423d. When the heat sink 2b is further pushed toward the left side surface 13 ', the upper second support portion 423c bends inward, and the upper end 202b of the heat sink 2b is placed on the left side with the upper second support portion 423c as shown in FIG. Fit between the surfaces 13. The heat sink 2b may be attached to the left side surface 13 ′ as described above.

(B)
In the said embodiment, although aluminum is used as a material of the heat sink 2, it is not restricted to this, Furthermore, it may be not only a metal but resin. In short, the heat radiating plate 2 having higher thermal conductivity than the resin material of the case body 10 may be used.
(C)
In the second embodiment, the slide sheet 5 made of resin is used. However, it is not limited to resin as long as it is an insulator. The slide sheet may be formed of, for example, other materials such as glass, paper, etc., and the sliding property of the surface 5a on the left side surface 13 ′ side of the slide sheet 5 with respect to the inner surface 13i ′ of the left side surface 13 ′. It should be high.

  Furthermore, the slidability of the surface 5a on the left side 13 'side of the slide sheet 5 with respect to the inner surface 13i' of the left side 13 'is determined by the inner surface 13i of the left side 13' of the second surface 4b of the heat radiating gel sheet 4. If it is at least higher than the slidability with respect to ′, it is more preferable to attach the slide sheet 5 because it is easier to insert the power supply circuit unit 3 into the case body 210 than to a state where it is not attached.

(D)
In the said Embodiment 1-3, although the thermal radiation gel sheet 4 is arrange | positioned only at the transformer 34, it may not be restricted to the transformer 34, and may be arrange | positioned at the other electronic components which generate heat. In the power supply device of the said embodiment, you may arrange | position the thermal radiation gel sheet 4 on the left side surface 13 and 13 'side of the coil 38, for example. Thus, when arrange | positioning a heat-transfer member with respect to a some electronic component, either of Embodiment 1-3 can be applied separately with respect to each electronic component. In other words, the configuration of the same embodiment may not be applied to a plurality of electronic components. For example, the configuration of any of the first to third embodiments is applied to some electronic components, and the others The configuration of the embodiment may be applied to other electronic components.

  For example, when the heat radiating gel sheet 4 is arranged on both the transformer 34 and the coil 38 and each heat generation is radiated from the heat radiating plate 2b, the configuration of the first embodiment is applied to the transformer 34, and Thus, the configuration of the second embodiment can be applied. That is, the heat radiating gel sheet 4 on the transformer 34 is in direct contact with the heat radiating plate 2b through the opening 13c formed on the left side surface 13, and the heat radiating gel sheet 4 on the coil 38 is placed on the slide sheet 5 disposed thereon. The power supply device may be configured to be in thermal contact with the heat radiating plate 2b through the left side surface 13.

(E)
As shown in FIG. 20, the case main body 10 described in the first embodiment may be formed of two members as in the third embodiment. In this case, for an electronic component that generates a large amount of heat and needs to be in direct contact with the heat radiating plate 2b, the heat radiating gel sheet 4 disposed on the electronic component is directly brought into contact with the heat radiating plate 2b. The heat dissipating gel sheet 4 arranged on the case can be configured to contact the case main body 10.

Specifically, the case main body 310 ′ shown in FIG. 20 is formed of a first member 310 a ′ and a second member 310 b, and an opening 13 c is formed on the left side surface 13. The first member 310a 'has the same configuration as the first member 310a except that the opening 13c is formed.
For example, the heat radiating gel sheet 4 disposed in the transformer 34 is in contact with the heat radiating plate 2b through the opening 13c as in the first embodiment. On the other hand, the heat-dissipating gel sheet 4 disposed in the coil 38 contacts the inner surface of the left side surface 13 as in the third embodiment. Since the case main body 310 ′ shown in FIG. 20 is divided into a first member 310a ′ and a second member 310b ′, the case main body 310 ′ is not interposed through the slide sheet 5 even when the heat radiating gel sheet 4 is arranged. The power supply circuit unit 3 can be arranged in

(F)
In the second embodiment, as shown in FIG. 10, the slide sheet 5 having a size covering at least the heat radiating gel sheet 4 is used. However, not only the heat radiating gel sheet 4 but also other power supply circuit unit 3 portions are covered. A slide sheet may be used. FIG. 21A is a perspective view showing such a slide sheet 500. FIG. 21B is a perspective view schematically showing the power supply circuit unit 3. FIG. 21C is a diagram illustrating a state where the power supply circuit unit 3 is covered with the slide sheet 5.

  A slide sheet 500 shown in FIG. 21A has a front surface portion 501, a right side surface portion 502, a left side surface portion 503, and a back surface portion 504. The right side surface portion 502 is formed so as to cover the entire side disposed on the right side surface 12 of the power supply circuit unit 3. The other front surface portion 501, left side surface portion 503, and back surface portion 504 cover the front surface 110 side, left side surface 13 'side, and back surface 16 side of the power supply circuit unit 3. Further, the back surface portion 504 of the slide sheet 500 is formed with an insertion claw 504a formed toward the front surface portion 501 as shown in FIG. 21A, and a heat sink 33a shown in FIG. It inserts in insertion hole 33a1 'formed in'. By inserting the insertion claw 504a into the insertion hole 33a1 ′ in this way, it becomes easy to maintain the state where the power supply circuit unit 3 is covered with the slide sheet 500. Thus, the power supply circuit unit 3 is inserted into the case main body 210 shown in FIG. 12 while being covered with the slide sheet 500. Note that the shape is not limited to the shape as shown in FIG. 21A, and for example, the entire left side surface 13 ′ side of the power supply circuit unit 3 may be covered.

(G)
In Embodiment 1 described above, the heat dissipation gel sheet 4 that is an example of a heat transfer member is disposed in direct contact with a transformer 34 that is an example of a heat generating component, and the heat dissipation gel sheet 4 is in direct contact with the heat dissipation plate 2b. As described above, the heat generating component is not limited to the transformer 34, and the heat transfer member is not limited to the heat radiating gel sheet 4a.

For example, a configuration in which a heat sink 33b (an example of a heat transfer member) for radiating heat from the rectifier diode 30 (an example of a heat generating component and a semiconductor component) is in direct contact with the heat radiating plate 2b may be employed. This configuration corresponds to an example in which the heat generating component is in contact with the heat sink indirectly through the heat transfer member.
FIG. 22 is a perspective view of the power supply device 600 having such a configuration. FIG. 23 is a left side view showing the internal configuration of power supply device 600 of FIG. 24A is a cross-sectional view taken along the line JJ in FIG. 23, and FIG. 24B is a cross-sectional view taken along the line KK in FIG.

  The power supply device 600 of FIG. 22 differs from the power supply device 300 shown in FIG. 13 in that an opening 13g for allowing the heat sink 33b to directly contact the heat radiating plate 2b is formed in the left side surface 613. As shown in FIGS. 22, 24 (a), and 24 (b), the heat sink 33 b has a shape in which a plate-like member is bent in an L shape, and is shown in FIGS. 24 (a) and 24 (b). As shown, the first portion 33ba disposed along the direction perpendicular to the first substrate 31a and the tip of the first portion 33ba (the end on the left side 613 side) along the direction parallel to the first substrate 31a. The second portion 33bc is formed. The second portion 33bc is in direct contact with the first heat radiating portion 24 of the heat radiating plate 2b.

  In this power supply device 600, since it is necessary to insert the heat sink 33b into the opening 13g, the case main body 610 of the case 601 is connected to the first member 610a like the power supply device 300 shown in FIGS. The second member 310b is joined. The first member 610a has the same configuration as the first member 310a shown in FIGS. 13 to 15 except for the opening 13g.

Further, when the heat sink 33b directly contacts the heat radiating plate 2b as described above, it is necessary that the heat sink 33b and the rectifier diode 30 are insulated or the rectifier diode 30 itself is insulated.
In the power supply device 600, the heat sink 33b is in direct contact with the heat radiating plate 2b. However, the heat radiating gel sheet 4 may be disposed between the heat sink 33b and the heat radiating plate 2b in direct contact with each other. .

Moreover, the opening part 13g is not formed in the left side surface 613, but the heat sink 33b may contact the heat sink 2b indirectly via the heat dissipation gel sheet 4 and the left side surface 613.
Further, the heat sink 33b may be in direct contact with the left side surface 613 without the heat dissipation gel sheet 4 interposed therebetween.
In addition, the heat sink 33a may be used as an example of a heat transfer member similarly to the heat sink 33b and may be in direct contact with the heat radiating plate 2b directly or through a case.
In addition, when the electronic component itself is insulated, an opening may be formed in the case so that the electronic component is brought into direct contact with the heat sink 2b. Such a configuration corresponds to an example in which the heat generating component is in direct contact with the heat sink 2b.

(H)
In the third embodiment, the case body 310 has two members (a first member 310a and a second member 310b) in order to make it easier to store the power supply circuit unit 3 in the case body 310 without arranging the slide sheet 5. However, a box-shaped case body 210 may be used as in the second embodiment. However, in this case, since it becomes difficult to insert the power supply circuit unit 3 into the case main body 210 due to the adhesiveness of the heat radiating gel sheet 4, it takes a little time for manufacturing. Moreover, when using the box-shaped case main body 210 in this way, it is preferable to use a heat-dissipating gel sheet 4 having a weak adhesive property because the power supply circuit unit 3 can be easily inserted.

(I)
In the third embodiment, it has been described that the case body 10 is formed by bonding the first member 310a and the second member 310b. However, the present invention is not limited to this, and as shown in FIG. Etc., the first member 310a and the second member 310b may be joined.
(J)
Moreover, when attaching the heat sinks 2a and 2b to the right side surface 12 and the left side surface 13, not only the bonding described in the above embodiment and the fitting described in the above (A1) to (A4) but also screws and nuts are used. The heat sinks 2a and 2b may be attached to the right side surface 12 and the left side surface 13 by fastening. FIG. 25B shows a state in which the heat radiating plates 2 a and 2 b are attached to the right side surface 12 and the left side surface 13 using screws 51 in the power supply device shown in FIG. 1.

(K)
Further, the heat radiating plates 2a and 2b may be integrally formed with the case main bodies 210 and 310. In addition, in the case of Embodiment 1, since it is necessary to insert the thermal radiation gel sheet 4 from the opening part 13c of the left side surface 13, only the thermal radiation plate 2a can be integrally molded with the case main body 10. FIG.
(L)
Although the power supply device as an example of the electronic device has been described in the above embodiment, the power supply device is not limited to the power supply device, and the above-described structure can be applied to an electronic device having a heat generating component.

  According to the electronic device of the present invention, heat dissipation is good, and there is an effect that the size can be reduced, which is useful as a power supply device or the like.

1 Case (example of housing)
2, 2a, 2b Heat dissipation plate (an example of heat dissipation member)
3 Power supply circuit unit 4 Heat dissipation gel sheet (an example of heat transfer member)
4a 1st surface 4b 2nd surface 5 Slide sheet (an example of a sheet-like member)
5a surface 7 push rivet 9 support rail 9a upper end portion 9b lower end portion 10 case main body (example of box-shaped member)
10a '1st member 10b' 2nd member 11 Case front part (an example of a lid-shaped member)
11a, 11b, 11c, 11d, 11e, 11f Claw portion 11g, 11i Protruding portion 11j Edge on right side 11k Edge on left side 11m Edge on top side 11n Edge on bottom 11o, 11p, 11q, 11r Through hole 12 Right side (example of third or fourth side)
12a, 12b Fitting hole 12f Front end 12s Outer surface 13, 13 'Left side surface (example of third surface or fourth surface)
13a, 13b Fitting hole 13c Opening (an example of a through hole)
13f front end 13s, 13s' outer surface (an example of outer surface)
13i 'inner surface (example of inner surface)
14 Upper surface (an example of the first surface or the second surface)
14a fitting hole 14c right end 14d left end 14e rear end 14f front end 14m support portion 15 bottom surface (an example of the first surface or the second surface)
15a fitting hole 15c right end 15d left end 15e rear end 15f front end 15m support part 16 back surface (an example of the fifth surface)
16a Upper end surface 16b Substantially central surface 16c Lower end side surface 16d Locking portion 16e Recessed portion 16f Locking portion 16g Inclined surface 17 Opening 21, 22 Notch 31a First substrate 31b Second substrate 32 Switching element 33a, 33b Heat sink 33as, 33bs Surface 34 Transformer (an example of a heat generating component)
34a surface 35 aluminum electrolytic capacitor 36 bridge diode 36a surface 37 aluminum electrolytic capacitor 38 coil 39a first wiring connection portion 39b second wiring connection portion 50 screw 110 front surface 111c, 111e inclined surface 112 right surface 113 left surface 114 upper surface 115 lower surface 141, 141a, 141b Ventilation holes 151, 151a, 151b Ventilation holes 160 Mounting portion 201 Case 201b Lower end 202b Upper end 203b 'Through hole 210 Case body (an example of a box-shaped member)
301 Case 310, 310 'Case main body (an example of a box-shaped member)
310a First member 310b Second member 390 Screw 391 Wiring insertion portion 401 Case 410 Case main body (an example of a box-shaped member)
413a Lower support portion 413b Lower first support portion 413c Lower second support portion 413d Groove-shaped portion 413e Through hole 423a Upper support portion 423b Upper first support portion 423c Upper second support portion 423d Inclined surface

Claims (12)

A box-shaped member having an opening surface opened toward the outside, a lid-shaped member arranged so as to close the opening surface, and a housing formed of resin;
A heat generating component housed in the housing;
A plate-like heat radiating member that is disposed along the outer surface of the housing and has a higher thermal conductivity than the resin that forms the housing;
Has a first surface and a second surface facing each other, wherein the first surface, in indirect contact via the heat radiating member and the front Kikatamitai, in the second surface, heat transfer in contact with the heat generating component A thermal member;
Between the heat transfer member and the housing, a sheet-like member disposed in contact with the heat transfer member;
With
The heat dissipation member is at least, Ri shape der to cover the contact surface of the heat generating component and the heat transfer member,
The sheet-like member is disposed on the opposite side of the heat radiating member across the housing,
The surface on the housing side of the sheet-like member is highly slidable with respect to the inner surface of the housing.
Electronics. The housing has a vent hole through which gas flows in or out.
The electronic device according to claim 1. The housing has a first surface and a second surface facing each other,
The vent hole is provided in each of the first surface and the second surface.
The electronic device according to claim 2. The housing has a third surface and a fourth surface facing each other,
The third surface and the fourth surface are disposed along a direction perpendicular to the first surface and the second surface,
The heat dissipation member is disposed on at least one of the third surface and the fourth surface.
The electronic device according to claim 3 . All the substrates arranged in the housing, including the substrate on which the heat generating component is arranged, are arranged along a direction perpendicular to the first surface and the second surface.
The electronic device according to claim 3 . A mounting portion for mounting the housing to a support rail;
The housing has a fifth surface arranged along a direction perpendicular to the first surface and the second surface;
The mounting portion is disposed on the fifth surface;
In a state in which the housing is attached to the support rail, the first surface and the second surface are disposed along a direction in which the opposing surfaces are perpendicular to the longitudinal direction of the support rail.
The electronic device according to claim 3 . The casing is formed by fastening, fitting or adhering at least two or more members, and has a third surface and a fourth surface facing each other.
The heat dissipation member is disposed on at least one of the third surface and the fourth surface,
The third surface and the fourth surface are provided on separate members,
The electronic device according to claim 1 . The release heat member is bonded to the housing by a double-sided tape,
The electronic device according to claim 1 or 2. The heat dissipation member is integrally formed with the housing.
The electronic device according to claim 1 or 2. The heat transfer member has elasticity and is in close contact with the heat generating component.
The electronic device according to claim 1 or 2.   The sheet-like member is perpendicular to the first surface and the second surface of the housing and surrounds all the substrates disposed in the housing including the substrate on which the heat generating component is disposed. Arranged so that,
The electronic device according to claim 3.   The sheet-like member has an insertion claw protruding from the periphery thereof,
  Either the board or the component arranged on the board is formed with an insertion hole into which the insertion claw is inserted.
The electronic device according to claim 11.

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