CN104918457A - Electronic equipment - Google Patents

Abstract

The present invention provides electronic equipment for good heat dispersion and realization of miniaturization. The electronic equipment provided by the invention has housing (1) formed by resin; a transformer (34) housed in the housing; a heating panel (2b) configured along the left side surface (13) of the housing (1), which is a tabular member having a thermal conductivity higher than the thermal conductivity the housing (1); and a heat dissipation film (4) having a first surface (4a) and a second surface (4b) relative to each other, contacted to the heating panel (2b) on the second surface (4b) and contacted to the transformer (34) on the first surface (4a). The heating panel (2b) is in a shape of covering a contact surface covering the heat dissipation film (4) and the transformer (34), namely the first surface (4a) and the surface (34a) thereof.

Description

Electronic equipment

Technical field

The present invention relates to the electronic equipment of a kind of supply unit etc.

Background technology

As supply unit, such as, use switching power unit, be provided with the electronic units such as transformer, coil, aluminium electrolytic capacitor in the inside of this switching power unit.In these electronic units, such as transformer, coil, semiconductor element etc. are heat generating components, sometimes in order to externally be discharged by the heat sent by these parts, and use metal framework.

But, when using metal framework, due to the insulation distance between framework and electric component must be guaranteed, be difficult to so exist the problem making supply unit miniaturization.

On the other hand, such as, as Patent Document 1, disclose the structure using resinous framework as the framework of supply unit, by using so resinous framework, owing to not needing to consider the insulating properties between electric component, so from the viewpoint of insulating properties, can miniaturization be realized.

In addition, due to a large amount of production framework can be carried out, so also can reduce costs by resin forming.

Patent documentation 1:JP JP 2000-208968 publication

But, due to the demand to reply high capacity in recent years, then caloric value will increase, so when using the low resin of the thermal conductivity of thermal conductivity ratio metal to form framework, although can dispel the heat from the frame that heat generating components directly contacts, but owing to not conducting heat towards periphery, so area of dissipation is little, there is the problem being difficult to fully heat radiation.

In addition, to realize the miniaturization of supply unit, then thermal capacitance is easily gathered, and becomes and is more difficult to heat radiation.

Summary of the invention

Problem of the present invention is provide a kind of thermal diffusivity good and can realize miniaturized electronic equipment.

The electronic equipment of the first invention has: framework, heat generating components, radiating component, heat transfer member.Framework is formed by resin.Heat generating components is contained in framework.Radiating component configures along the outside of framework, and the thermal conductivity that thermal conductivity ratio forms the resin of framework is high, and is tabular.Heat transfer member comprises first surface respect to one another and second, at first surface and radiating component directly or indirectly contact via framework, contacts with heat generating components at second.Radiating component is the shape of the contact-making surface at least covering heat transfer member and heat generating components.

At this, heat generating components is the parts generated heat by electric drive.When using aluminium electrolytic capacitor in this electronic equipment, heat generating components can be the parts that caloric value is larger than the caloric value of this aluminium electrolytic capacitor.In addition, in the parts used in this electronic equipment, when according to the sequential observation of caloric value from many to few, heat generating components can be included in the parts in the first half.Comprise any one in transformer, semiconductor device and coil.In addition, heat transfer member is that heat generation rate is in the high component of the thermal conductivity of the gas of framework inside than air etc.Thereby, it is possible to do not configure heat transfer member and compared with installation space, dispel the heat to framework expeditiously.In addition, contact refers to indirectly, gets involved other components between 2 components, although these 2 components directly do not contact mutually, and the state that any one component all directly contacts mutually with these other components.Other components also directly can contact and the component be formed by connecting for multiple component successively.Other components are that thermal conductivity ratio air etc. is in the high component of the thermal conductivity of the gas of framework inside.

Like this, by forming framework by resin, do not need the insulation distance guaranteed between electronic unit, therefore, it is possible to realize miniaturized, by the radiating component of the outer surface configuration tabular along framework, compared with only having the situation of resin framework, heat is diffused into broadness around from radiating component, can obtain good thermal diffusivity.

In addition, owing to forming framework by resin, so can cost degradation be realized.

The electronic equipment of the second invention is on the basis of the electronic equipment of the first invention, and framework has the air vent hole flowing into for gas or flow out.

Thus, utilize the air circulated in framework by air vent hole, the heat radiation of heat generating components can be carried out further.

The electronic equipment of the 3rd invention is on the basis of the electronic equipment of the first or second invention, and heat transfer member contacts with framework; Radiating component is configured in the side contrary with heat transfer member side across framework.

Thereby, it is possible to the heat distributed by heat generating components dispels the heat to radiating component conduction via framework.

The electronic equipment of the 4th invention is on the basis of the electronic equipment of the first or second invention, and framework has through hole; Heat transfer member directly contacts with radiating component via through hole.

Thereby, it is possible to the heat distributed by heat generating components dispels the heat directly to radiating component conduction.

The electronic equipment of the 5th invention, on the electronic equipment of the first or second invention, has the flat member contacted with heat transfer member between heat transfer member with framework.Flat member is configured in the side contrary with radiating component side across framework.The face of the framework side of flat member is high relative to the sliding of the inner surface of framework.Flat member comprises paper, resin sheet etc.Also insulating properties can be had.Even if be preferably solid and have that contact with the inner surface of framework and to be contained in framework also can not the intensity of degree of breakage.

Thereby, it is possible to the heat distributed by heat generating components dispels the heat to radiating component conduction via flat member and framework.

The electronic equipment of the 6th invention is on the basis of the electronic equipment of the second invention, and framework has first surface respect to one another and second.Air vent hole is arranged at first surface and second respectively.

Thereby, it is possible to utilize the air flowing by the air vent hole of first surface and the air vent hole of second, to performing heat radiation of electric component.

The electronic equipment of the 7th invention is on the basis of the electronic equipment of the 6th invention, and framework has the 3rd and fourth face respect to one another.3rd and fourth face configure along the direction vertical with first surface and second.Radiating component is configured at least one face in the 3rd and fourth face.

Like this, owing to configuring radiating component on the face not having air vent hole, so the problem blocking air vent hole need not be considered, can mate with face, form radiating component with area large as far as possible, radiating efficiency can be improved further.In addition the record of " vertically " does not represent the meaning of exact vertical, in this manual.

The electronic equipment of the 8th invention is on the basis of the electronic equipment of the 6th invention, and the surface being configured at all substrates in framework comprising the substrate being configured with heat generating components is vertical with first surface and second.

By such placement substrate, the flowing of the air hindered by the air vent hole of first surface and the air vent hole of second can be reduced as far as possible, can dispel the heat expeditiously.

The electronic equipment of the 9th invention is on the basis of the electronic equipment of the 6th invention, and this electronic equipment also has the installation portion for framework being arranged on supporting track: framework has the 5th that configures along the direction vertical with first surface and second.Installation portion is configured at the 5th.Framework be arranged under the state on supporting track, the relative direction of first surface and second is vertical with the length direction of supporting track.

Thereby, it is possible to multiple electronic equipment to be installed on air vent hole supporting track not blocking first surface and second.

The electronic equipment of the tenth invention on the basis of the electronic equipment of the second invention, framework be by being fastenedly connected the component of more than at least 2, chimeric or bonding and formed, and there is the 3rd and fourth face respect to one another; Radiating component is configured at least one face in the 3rd and fourth face; 3rd is arranged on different components from fourth face.

Thus, the heat generating components of inner side being configured at a face in the 3rd and fourth face is configured with heat transfer member, another face in 3rd and fourth face is covered on heat transfer member and manufactures electronic equipment, so easily configure heat transfer member between heat generating components and framework.

The electronic equipment of the 11 invention is on the basis of the electronic equipment of the 5th invention, and framework comprises: box like component, has opening towards the outside and the opening surface formed; Cap-like structure, is configured to block opening surface.

Like this, even if framework is formed by box like component and cap-like structure, by contact configuration flat member on heat transfer member, insert in box like component, so easily electronic equipment can be manufactured owing to heat generating components can be slided under the state being placed with heat transfer member.

The electronic equipment of the 12 invention is on the basis of the electronic equipment of the first or second invention, and radiating component is pasted onto in framework by two-sided tape.

Thereby, it is possible to easily radiating component is pasted onto in framework.

The electronic equipment of the 13 invention on the basis of the electronic equipment of the first or second invention, radiating component and framework integrally formed.

Thus, do not need to carry out for radiating component is arranged in framework bonding, be fastenedly connected, manufacture and become easy.

The electronic equipment of the 14 invention is on the basis of the electronic equipment of the first or second invention, and heat transfer member has elasticity, and is close on heat generating components.

Thereby, it is possible to the heat of heat generating components positively directly or via framework is conducted to radiating component.

Electronic equipment of the present invention, thermal diffusivity is good, and can realize miniaturization.

Accompanying drawing explanation

Fig. 1 is the stereogram of the supply unit illustrated in embodiments of the present invention 1.

Fig. 2 is the stereogram of the supply unit that Fig. 1 is shown.

Fig. 3 is the three-dimensional exploded view of the supply unit that Fig. 1 is shown.

Fig. 4 A, Fig. 4 B, Fig. 4 C, Fig. 4 D, Fig. 4 E, Fig. 4 F are respectively front view, right view, left view, vertical view, upward view, the cutaway view of the housing main body of the supply unit of Fig. 1.

Fig. 5 is the stereogram of the power circuit unit of the supply unit that Fig. 1 is shown.

Fig. 6 is the end view of the internal structure of supply unit for illustration of Fig. 1.

Fig. 7 is the power circuit unit of the supply unit that Fig. 1 is shown and the stereogram of heat transfer member.

Fig. 8 A be Fig. 6 BB between to looking cutaway view, Fig. 8 B is the C portion enlarged drawing of Fig. 8 A.

Fig. 9 is the stereogram of the manufacture method of supply unit for illustration of Fig. 1.

Figure 10 A, Figure 10 B are the stereogram of the supply unit illustrated in embodiments of the present invention 2.

Figure 11 A is the cutaway view of the supply unit of Fig. 9, and Figure 11 B is the D portion enlarged drawing of Figure 11 A.

Figure 12 is the stereogram of the manufacture method of supply unit for illustration of Figure 10.

Figure 13 A, Figure 13 B are the stereogram of the supply unit illustrated in embodiments of the present invention 3.

Figure 14 A is the cutaway view of supply unit of Figure 13 A, Figure 13 B, and Figure 14 B is the C portion enlarged drawing of Figure 14 A.

Figure 15 is the stereogram of the manufacture method of supply unit for illustration of Figure 13 A, Figure 13 B.

Figure 16 is the end view of the supply unit of the variation that embodiments of the present invention are shown.

Figure 17 A be Figure 16 HH between to looking cutaway view, Figure 17 B is the J portion enlarged drawing of Figure 17 A.

Figure 18 A be Figure 16 II between to looking cutaway view, Figure 18 B is the J portion enlarged drawing of Figure 18 A.

Figure 19 A, Figure 19 B are the enlarged partial sectional view of the supply unit of the variation that embodiments of the present invention are shown.

Figure 20 is the three-dimensional exploded view of the supply unit of the variation that embodiments of the present invention are shown.

Figure 21 A is the figure of the slide plate of the supply unit of the variation that embodiments of the present invention 2 are shown, Figure 21 B is that the figure of the power circuit unit of the supply unit of the variation that embodiments of the present invention 2 are shown, Figure 21 C is for illustrating the figure of the state by the power circuit unit shown in the slide plate coverage diagram 21B shown in Figure 21 A.

Figure 22 is the stereogram of the supply unit of the variation that embodiments of the present invention are shown.

Figure 23 is the left view of the supply unit of Figure 22.

Figure 24 A be Figure 23 JJ between to looking cutaway view, Figure 24 B be Figure 23 KK between to looking cutaway view.

Figure 25 A, Figure 25 B are the stereogram of the supply unit of the variation of embodiments of the present invention.

Wherein, description of reference numerals is as follows:

1 shell (example of framework)

2,2a, 2b heating panel (example of radiating component)

3 power circuit unit

4 heat radiations film (example of heat transfer member)

4a first surface

4b second

5 slide plates (example of flat member)

5a face

7 pushing-type rivets

9 supporting tracks

9a upper part

9b end portion

10 housing main bodies (example of box like component)

10a ' first component

10b ' second component

11 housing front (example of cap-like structure)

11a, 11b, 11c, 11d, 11e, 11f claw

11g ~ 11i protuberance

The edge of 11j right flank side

The edge of 11k left surface side

The edge of 11m top surface side

The edge of 11n bottom surface side

11o, 11p, 11q, 11r through hole

A 12 right flanks example of fourth face (the 3rd or)

12a, 12b embedded hole

12f front end

12s outer surface

13, a 13 ' left surface example of fourth face (the 3rd or)

13a, 13b embedded hole

13c peristome (example of through hole)

13f front end

13s, 13s ' outer surface (example of outside)

13i ' inner surface (example of inner surface)

A 14 end faces example of second (first surface or)

14a embedded hole

14c right-hand member

14d left end

14e rear end

14f front end

14m support portion

A 15 bottom surfaces example of second (first surface or)

15a embedded hole

15c right-hand member

15d left end

15e rear end

15f front end

15m support portion

16 back sides (example of the 5th)

The face of 16a upper end side

The face of 16b substantial middle

The face of 16c lower end side

16d fastener

16e recess

16f fastener

16g inclined plane

17 openings

21,22 breach

31a first substrate

31b second substrate

32 switch elements

33a, 33b radiator

33as, 33bs surface

34 transformers (example of heat generating components)

34a surface

35 aluminium electrolytic capacitors

36 bridge diodes

36a surface

37 aluminium electrolytic capacitors

38 coils

39a first distribution connecting portion

39b second distribution connecting portion

50 screws

Before 110

111c, 111e inclined plane

112 right sides

113 left sides

114 end faces

115 bottom surfaces

141,141a, 141b air vent hole

151,151a, 151b air vent hole

160 installation portions

201 shells

201b lower end

202b upper end

203b ' through hole

210 housing main bodies (example of box like component)

301 shells

310,310 ' housing main body (example of box like component)

310a first component

310b second component

390 screws

391 distribution insertion sections

401 shells

410 housing main bodies (example of box like component)

Support portion on the downside of 413a

First support portion on the downside of 413b

Second support portion on the downside of 413c

413d channel-shaped portion

413e through hole

Support portion on the upside of 423a

First support portion on the upside of 423b

Second support portion on the upside of 423c

423d inclined plane

Embodiment

Below, with reference to accompanying drawing, an embodiment of the invention are suitably described.In the following description, becoming unnecessarily tediously long in order to avoid illustrating, and making one of ordinary skill in the art will readily recognize that such as, sometimes omit the detailed description of known item or the repeat specification to the identical structure of essence.

In addition, applicant fully understands content of the present invention to make those skilled in the art, provides the following description and accompanying drawing, and is not the protection range wanting the content disclosed by these to limit the application.

(execution mode 1)

< 1. structure >

Fig. 1 is the stereogram observed from the face side of the supply unit 100 of present embodiment 1.Fig. 2 is the stereogram observed from the rear side of the supply unit 100 of present embodiment 1.Fig. 3 is the three-dimensional exploded view of the supply unit 100 of present embodiment 1.

The supply unit 100 of present embodiment 1 is switching power unit, and the on-off action of semiconductor can be utilized inputted source power supply to be converted to High frequency power to obtain the direct current specified.

As shown in Figure 1, Figure 2 and shown in Fig. 3, the supply unit 100 of present embodiment 1 has: shell 1, be configured at the outside of two sides of shell 1 heating panel 2, be contained in shell 1 power circuit unit 3, be configured at power circuit unit 3 regulation parts on heat radiation film 4.In addition, the supporting track 9 of the supply unit 100 for being provided with present embodiment 1 is shown in broken lines in FIG.

(1-1. shell 1)

As shown in Figure 3, shell 1 has housing main body 10 and housing front 11.

Fig. 4 A, Fig. 4 B, Fig. 4 C, Fig. 4 D and Fig. 4 E are respectively the front view of housing main body 10, right view, left view, vertical view and upward view.In addition, Fig. 4 F be Fig. 4 C AA between to looking cutaway view.

As shown in Fig. 3 and Fig. 4 A ~ Fig. 4 F, housing main body 10 is the box-shaped in front face side with opening, and has: right flank 12, left surface 13, end face 14, bottom surface 15 and the back side 16.In addition, in this manual, using being in the supply unit 100 of the state be arranged on supporting track 9 as benchmark, specify up and down and front and back.Left and right directions represents from left and right directions front observation housing front 11.In addition, front represents housing front 11 side, and rear represents side, the back side 16.

(1-1-1. housing main body 10)

(1-1-1-1. right flank 12)

As shown in Figure 4 B, right flank 12 is formed with embedded hole 12a, the 12b of claw 11a, 11b (aftermentioned) for chimeric coat front portion 11.This embedded hole 12a, 12b are formed at 2 positions up and down of the 12f side, front end of right flank 12.

(1-1-1-2. left surface 13)

As shown in Figure 4 C, left surface 13 is formed with embedded hole 13a, the 13b of claw 11c, 11d (aftermentioned) for chimeric coat front portion 11.This embedded hole 13a, 13b are formed at 2 positions up and down of the 13f side, front end of left surface 13.As shown in Fig. 4 C and Fig. 4 F, left surface 13 is formed with the peristome 13c of the inner side and outer side of through housing main body 10.This peristome 13c near the upper end of left surface 13, and is formed in the position relative with the transformer 34 be located on power circuit unit 3.

(1-1-1-3. end face 14)

As shown in Figure 4 D, end face 14 is formed with the embedded hole 14a of the claw 11e (aftermentioned) for chimeric coat front portion 11.This embedded hole 14a is formed at the 14f side, front end of end face 14.In addition, as shown in Fig. 1, Fig. 3 and Fig. 4 D, end face 14 is formed with the air vent hole 141 of the thermal release for producing on power circuit unit 3 to outside.Air vent hole 141 comprises the air vent hole 141b of roughly hexagonal air vent hole 141a and wire.If the end of right flank 12 side of end face 14 is set to right-hand member 14c, the end of left surface 13 side of end face 14 is set to left end 14d, the end of the side, the back side 16 of end face 14 is set to rear end 14e, then air vent hole 141b is near right-hand member 14c with on the position of left end 14d, respectively arranges 2 along right-hand member 14c and left end 14d.In addition, air vent hole 141a, between the air vent hole 141b formed along right-hand member 14c and left end 14d, fore-and-aft direction (from front end 14f to rear end 14e) is provided with multiple in the mode forming honeycomb.

(1-1-1-4. bottom surface 15)

As shown in Figure 4 E, the embedded hole 15a of the claw 11f (aftermentioned) for chimeric coat front portion 11 is formed on a lower surface 15.This embedded hole 15a is formed at the 15f side, front end of bottom surface 15.In addition, as shown in Figure 1, Figure 2 and shown in Fig. 4 E, be formed with the air vent hole 151 of the thermal release for producing on power circuit unit 3 to outside on a lower surface 15.Air vent hole 151 comprises the air vent hole 151b of roughly hexagonal air vent hole 151a and wire.If the end of right flank 12 side of bottom surface 15 is set to right-hand member 15c, the end of left surface 13 side of bottom surface 15 is set to left end 15d, the end of the side, the back side 16 of bottom surface 15 is set to rear end 15e, then air vent hole 151b is near right-hand member 15c with on the position of left end 15d, respectively arranges 2 along right-hand member 15c and left end 15d.In addition, air vent hole 151a, between the air vent hole 151b formed along right-hand member 15c and left end 15d, is provided with multiple at fore-and-aft direction (from front end 15f to rear end 15e) in the mode forming honeycomb.

(the 1-1-1-5. back side 16)

As shown in Figure 2,16 installation portion 160 for being arranged on supporting track 9 is provided with overleaf.This installation portion 160 is concavely formed at substantial middle part in the vertical direction along left and right directions.If be described in detail, then the back side 16 has face 16a, the face 16b of substantial middle, the face 16c of lower end side of upper end side in the vertical direction.Face 16b is positioned at the front side of the lower end of face 16a and the upper end of face 16c.Be formed in the lower end of face 16a and give prominence to downwards and the fastener 16d of formation.In addition, the stepped portion of face 16a and face 16b is formed caves in upward and the recess 16e formed.

On the other hand, on the central upper part of the left and right directions of surperficial 16c, be provided with the fastener 16f formed upward, the surface on the top of this fastener 16f is formed with inclined plane 16g.The mode that inclined plane 16g is then located front with the position on its surface close to top tilts.In addition, fastener 16f has elasticity to bend in the longitudinal direction.

By the upper part 9a (with reference to Fig. 1) of supporting track 9 is embedded in recess 16e, and inclined plane 16g end portion 9b (with reference to Fig. 1) being crossed fastener 16f embeds, upper part 9a engaged part 16d blocks thus, and end portion 9b engaged part 16f blocks.Thus, supply unit 100 is supported by supporting track 9.In addition, it is longer that supporting track 9 is formed as left and right, and the left and right directions in Fig. 1 is an example of the length direction of supporting track 9.

(1-1-2. housing front 11)

As shown in Figure 3, housing front 11 is formed as the lid opening 17 of housing main body 10 can blocked, and with housing main body 10 tabling.As shown in FIG. 1 to 3, housing front 11 comprises: above 110, the right side 112, the left side 113, end face 114 and bottom surface 115.Under the state being embedded on housing main body 10 by housing front 11, the right side 112 of housing front 11, the left side 113, end face 114 and bottom surface 115 are adjacent with end face each other with the right flank 12 of housing main body 10, left surface 13, end face 14 and bottom surface 15 respectively.

Housing front 11 is formed protuberance 11g, 11h of rearward giving prominence to from the edge 11k of left surface 13 side of its rear end, the top of protuberance 11g, 11h is respectively equipped with claw 11c, the 11d for being embedded in embedded hole 13a, 13b of left surface 13.This claw 11c, 11d have inclined plane 111c, 111d in outside, and are formed as more rearward, and the width of left and right directions becomes narrower.

In addition, as shown in Figure 1 and Figure 2, housing front 11 is formed the protuberance (not shown) rearward given prominence to from the edge 11j of right flank 12 side of its rear end, and on the top of each protuberance, is respectively equipped with claw 11a, the 11b (with reference to Fig. 2) for being embedded in embedded hole 12a, 12b of right flank 12.In addition, the shape being provided with the protuberance of claw 11a, 11b is the shape identical with protuberance 11g, 11h as shown in Figure 3

As shown in Figure 3, housing front 11 is formed the protuberance 11i of the tabular of rearward giving prominence to from the edge 11m of end face 14 side of its rear end, on the surface in the outside of the protuberance 11i of this tabular, be provided with the claw 11e for being embedded in the embedded hole 14a of end face 14.This claw 11e has inclined plane 111e in outside, and is formed as more rearward, and the thickness of above-below direction becomes less.

In addition, as shown in Figure 2, housing front 11 is formed the protuberance (not shown) of the tabular of rearward giving prominence to from the edge 11n of the side, bottom surface 15 of its rear end, the surface in the outside of the protuberance of this tabular is provided with the claw 11f (with reference to Fig. 2) for being embedded in the embedded hole 15a of bottom surface 15.In addition, the shape being provided with the protuberance of claw 11f is the shape identical with protuberance 11i as shown in Figure 3.

In addition, as shown in Figure 3, near the upper end of the inner side of housing front 11, the first distribution connecting portion 39a of power circuit unit 3 is configured with.110 are located at before housing front 11 for the through hole 11o tightened by the screw 390 of this first distribution connecting portion 39a or unclamp.Further, the through hole 11p for inserting distribution is located at end face 114.

Similarly, at the lower end of the inner side of housing front 11, be configured with the second distribution connecting portion 39b of power circuit unit 3.110 are located at before housing front 11 for the through hole 11q tightened by the screw 390 of this second distribution connecting portion 39b or unclamp.Further, the through hole 11r (with reference to Fig. 3) for inserting distribution is located at bottom surface 115 (with reference to Fig. 2).

(1-2. heating panel 2)

In the present embodiment, heating panel 2 is the component of the tabular formed by aluminium.Heating panel 2 is pasted on the outer surface 12s of the right flank 12 of housing main body 10 respectively (with reference to Fig. 4 B by bonding agent, with reference to Fig. 8 B described later) and the outer surface 13s of left surface 13 (with reference to Fig. 4 C, with reference to Fig. 8 B described later), the heating panel of right flank 12 side is 2a, and the heating panel of left surface 13 side is 2b.

Heating panel 2a is formed as the profile roughly the same with right flank 12, and the whole right flank 12 of covering shell main body 10.In addition, heating panel 2b is formed as the profile roughly the same with left surface 13, and covers the whole left surface 13 comprising the housing main body 10 of peristome 13c.

In addition, heating panel 2a is formed with breach 21,22, not block embedded hole 12a, 12b of being formed at right flank 12; Heating panel 2b is also formed with breach 21,22, not block embedded hole 13a, 13b of being formed on left surface 13.

In addition, as bonding agent heating panel 2a, 2b being installed on right flank 12 and left surface 13, can two-sided tape etc. be enumerated, but the bonding agent that preferably thermal conductivity ratio housing main body 10 is higher after bonding solidification.

(1-3. power circuit unit 3)

Fig. 5 is the stereogram of the power circuit unit 3 of the supply unit 100 of present embodiment 1.Fig. 6 is the end view of the internal structure of the supply unit 100 that present embodiment 1 is shown.Be shown in broken lines inner structure in figure 6.

As shown in figs.5 and 6, power circuit unit 3 is contained in shell 1, and has first substrate 31a and second substrate 31b.

(1-3-1. first substrate 31a)

First substrate 31a is to cover the mode of the whole inner side of right flank 12, and the direction parallel along the right flank 12 with housing main body 10 configures.As shown in Fig. 8 A described later, first substrate 31a slides support portion 14m, 15m of inserting channel-shaped and being supported, and support portion 14m, 15m are formed near the right flank 12 of the respective inner side of end face 14 and bottom surface 15 respectively.In addition, the record of " parallel " in this specification does not represent the meaning of perfect parallelism.

On first substrate 31a, there are switch element 32, radiator 33a, transformer 34, aluminium electrolytic capacitor 35, rectifier diode 30, radiator 33b, bridge diode (bridge diode) 36, aluminium electrolytic capacitor 37 and coil 38 etc. as main component configuration.These component configuration are in the surperficial 31as of left surface 13 side of first substrate 31a.In addition, by first substrate 31a be set to 31ab with the reverse side of surperficial 31as opposite side and shown in Figure 7.The surperficial 31as of first substrate 31a is relative with left surface 13, and reverse side 31ab is relative with right flank 12.

Switch element 32 is MOSFET (metal-oxide-semiconductor field-effect transistor: metal oxide semiconductor field effect tube) etc., is configured at the side, the back side 16 of first substrate 31a.Radiator 33a is tabular, for the heat that release-push element 32 sends.The surperficial 33as of the tabular of radiator 33a is vertical with first substrate 31a and vertical with the end face 14 of housing main body 10 and bottom surface 15.

Transformer 34 and aluminium electrolytic capacitor 35 are configured at opening 17 side (front side) of the radiator 33a of first substrate 31a.Transformer 34 is configured at end face 14 side, is configured with aluminium electrolytic capacitor 35 in the side, bottom surface 15 of transformer 34.Aluminium electrolytic capacitor 35 is cylindric, has side 35a, end face 35b and end face 35c.End face 35b is provided with not shown lead-in wire, and is electrically connected with first substrate 31a.In the present embodiment, the end face 35b of aluminium electrolytic capacitor 35 is parallel with end face 14 and bottom surface 15 with end face 35c.In addition, alternatively, end face 35b, 35c and the first substrate 31a of aluminium electrolytic capacitor 35 are perpendicular, can also say it is that a part and the first substrate 31a of the side 35a of aluminium electrolytic capacitor 35 are oppositely disposed.

Radiator 33b is arranged to dispel the heat to rectifier diode 30.Radiator 33b is the shape parts of tabular being bent to L-shaped, and is configured at opening 17 side of transformer 34.In addition, the surperficial 33bs of the tabular of radiator 33b is vertical with first substrate 31a and vertical with the end face 14 of housing main body 10 and bottom surface 15.

Bridge diode 36 is configured at the downside of radiator 33b.This bridge diode 36 is tabular, and end face 14 and the bottom surface 15 of its surperficial 36a (with reference to Fig. 6) and housing main body 10 are vertical.

Aluminium electrolytic capacitor 37 has been arranged 3 on above-below direction (relative direction of end face 14 and bottom surface 15).As shown in figs.5 and 6, aluminium electrolytic capacitor 37 is cylindric, comprises side 37a and relative 2 end faces (only illustrating an end face 37c).End face 37c is towards left surface 13 side, and parallel with first substrate 31a.Not shown end face is towards right flank 12 side, and parallel with first substrate 31a.In addition, the not shown end face towards right flank 12 side is provided with lead-in wire, and is electrically connected with first substrate 31a.

Coil 38 is configured with in the side, bottom surface 15 of these aluminium electrolytic capacitors 37.

(1-3-2. second substrate 31b)

Second substrate 31b is configured to than 3 aluminium electrolytic capacitors 37 and the forward side (having diagram in Fig. 5 and Fig. 6) of coil 38, and, as shown in Figure 3, be configured to the opening 17 almost blocking housing main body 10.In addition, second substrate 31b, in the front side of first substrate 31a, configures along direction that can be vertical with first substrate 31a and vertical with the end face 14 of housing main body 10 and bottom surface 15.

On second substrate 31b, be mainly provided with the first distribution connecting portion 39a and the second distribution connecting portion 39b.First distribution connecting portion 39a and the second distribution connecting portion 39b is located on the surface of 110 sides before second substrate 31b, if housing main body 10 and housing front 11 combine, is then configured in housing front 11.First distribution connecting portion 39a and the second distribution connecting portion 39b is distinguished in the mode that can connect many distributions respectively.

On the first distribution connecting portion 39a, be used for the screw 390 of permanent wiring for each zoning from 110 sides insertions above, be provided with the distribution insertion section 391 for the fixing distribution of insertion screw 390 in end face 114 side.Second distribution connecting portion 39b is the structure same with the first distribution connecting portion 39a, and side, bottom surface 115 is located in distribution insertion section 391.

(1-4. dispel the heat film 4)

Fig. 7 is the figure of the state of the dismounting shell 1 of the supply unit 100 that present embodiment 1 is shown.Fig. 8 A be Fig. 6 BB between to looking cutaway view, Fig. 8 B is the C portion enlarged drawing of Fig. 8 A.

The heat radiation film 4 of present embodiment 1 has insulating properties, conductivity of heat, elasticity and cementability.

As shown in Figure 7, in the supply unit 100 of present embodiment 1, be close on the surface of the many transformer 34 of caloric value and be configured with heat radiation film 4.This surface is positioned at left surface 13 side, is illustrated as surperficial 34a in Figure 5.As shown in Figure 8A and 8B, this heat radiation film 4 directly contacts with heating panel 2b via the peristome 13c being formed at left surface 13.

In detail, heat radiation film 4 is roughly rectangular shape, and has first surface 4a and second 4b respect to one another.The heat radiation first surface 4a of film 4 contacts with the surperficial 34a of transformer 34, and its second 4b contacts with heating panel 2b.

Structure thus, the heat that transformer 34 distributes conducts to heating panel 2b via heat radiation film 4, the direction, face of heating panel 2b is spread, and externally discharges.

In addition, because heating panel 2a, 2b are pasted on right flank 12 and left surface 13 by adhesives, so between the outer surface 12s and heating panel 2a of right flank 12 and between the outer surface 13s and heating panel 2b of left surface 13, in substance form adhesive linkage, but omit in Fig. 8 A and Fig. 8 B.Adhesive linkage is omitted similarly in following figure.

The manufacture method > of < 2. supply unit 100

Fig. 9 is the exploded view of the manufacture method of supply unit 100 for illustration of present embodiment 1.

First, slide the power circuit unit 3 shown in Fig. 5 insertion housing main body 10.

Then, from peristome 13c, heat radiation film 4 is placed on (reference arrow T) the surperficial 34a of transformer 34.This state is the state shown in Fig. 3.Herein, because heat radiation film 4 has cementability, so pass through by heat radiation film 4 by being pressed on the surperficial 34a of transformer 34, thus heat radiation film 4 is close on surperficial 34a and is difficult to come off.

Then, by bonding, heating panel 2a is installed on right flank 12, by bonding, heating panel 2b is installed on left surface 13.

Then, to block the mode mounting casing front portion 11 of the opening 17 of housing main body 10.By making each claw 11a, 11b, 11c, 11d, 11e, 11f of housing front 11 be embedded in embedded hole 12a, 12b, 13a, 13b, 14a, 15a respectively, housing main body 10 and housing front 11 being linked together, forming shell 1.If be described in detail for claw 11c, then when housing front 11 being arranged on housing main body 10, the inclined plane 111c of claw 11c abuts with the front end 13f of left surface 13.If towards housing main body 10 pressing housing front 11 further, then inclined plane 111c slides relative to front end 13f, and protuberance 11g bends to the inside, and claw 11c enters the inner side of left surface 13.Then, by being compressed into towards housing main body 10 by housing front 11 further, claw 11c embeds embedded hole 13a.Other claw 11a, 11b, 11d, 11e, 11f are too.In addition, housing front 11, relative to the installation of housing main body 10 and heating panel 2a, 2b installation relative to housing main body 10, first carries out that whichever will do.

As previously discussed, forming peristome 13c as through hole at housing main body 10, after power circuit unit 3 is inserted housing main body 10, by configuring heat radiation film 4 via peristome 13c, heat radiation film 4 can be made directly to contact with heating panel 2b.

The feature > that < 3. is main

As previously discussed, as shown in Figure 3, the supply unit 100 (example of electronic equipment) of present embodiment 1 has shell 1 (example of framework), transformer 34 (example of heat generating components), heating panel 2b (example of radiating component), heat radiation film 4 (example of heat transfer member).Shell 1 is formed by resin.Transformer 34 is contained in shell 1.Heating panel 2b configures along the outer surface 13s (example of outer surface) of the left surface 13 of shell 1, the component of the tabular that the thermal conductivity for the resin of thermal conductivity ratio formation shell 1 (in detail, being housing main body 10) is higher.

As shown in Figure 8 B, heat transfer member has first surface 4a and second 4b respect to one another, and directly contact with heating panel 2b at second 4b, first surface 4a contacts with transformer 34.Heating panel 2b at least covers heat radiation film 4 and the first surface 4a (example of contact-making surface) of transformer 34 and the shape of surperficial 34a (example of contact-making surface).

That is, in present embodiment 1, housing main body 10 has peristome 13c (example of through hole); Heat radiation film 4 directly contacts with heating panel 2b via peristome 13c.

Like this, by forming shell 1 with resin, due to do not need transformer 34, aluminium electrolytic capacitor 35,37, guarantee insulation distance, so can miniaturization be realized between the electronic unit of coil 38 etc. and shell 1.In addition, by configuring heating panel 2b, 2a along the outer surface of shell 1 and outer surface 13s, 12s of left surface 13 and right flank 12, good thermal diffusivity can be obtained.

In addition, owing to using resin to form framework, so can cost degradation be realized.

In the present embodiment, first substrate 31a and second substrate 31b is configured to and is formed with the end face 14 of air vent hole 141 and to be formed with the bottom surface 15 of air vent hole 151 vertical.By substrate as so configured, owing to not blocking wind from air vent hole 151 to the flowing of air vent hole 141, so can cool efficiently.In addition, owing to not forming air vent hole on right flank 12 and left surface 13, so the area of heating panel 2a, 2b can be set to when not blocking air vent hole as far as possible large, can dispel the heat expeditiously.

(execution mode 2)

Below, the supply unit 200 of embodiments of the present invention 2 is described.The supply unit 200 of present embodiment 2 is identical with the basic structure of the supply unit 100 of execution mode 1, but with the difference of execution mode 1 be, left surface does not form peristome, on heat radiation film 4, loads slide plate 5 during fabrication, power circuit unit 3 is inserted in shell.Therefore, the difference of present embodiment 2 relative to execution mode 1 is described as emphasis.In addition, in present embodiment 2, identical Reference numeral is put on to the structure same with execution mode 1.

< 1. structure >

Figure 10 A is the stereogram of the state of the dismounting heating panel 2b of the supply unit 200 that present embodiment 2 is shown.As shown in Figure 10 A, different from the left surface 13 of execution mode 1, the housing main body 210 of the shell 201 of the supply unit 200 of present embodiment 2 has the left surface 13 ' not forming peristome 13c.Except this point, the structure of shell 201 is same with the shell 1 of execution mode 1.In addition, under the state that the supply unit 200 of present embodiment 2 is installed on shell 201 at heating panel 2a, 2b, the supply unit 100 shown in its outward appearance with Fig. 1 is same.

Figure 10 B is the stereogram of the inside of supply unit 200 for illustration of present embodiment 2, heating panel 2b is not shown, illustrate with dashed lines housing main body 210.Figure 11 A is the front sectional view of the supply unit 200 of present embodiment 2, for by transformer 34 and aluminium electrolytic capacitor 35 and with the figure of 110 parallel plane cuttings above.In addition, the supply unit 200 that is present embodiment 2 of the cutaway view shown in Figure 11 A on the position identical with between the BB shown in Fig. 6 to looking cutaway view.Figure 11 B is the D portion enlarged drawing of Figure 11 A.

As shown in Figure 10 B, Figure 11 A and Figure 11 B, in the supply unit 200 of present embodiment 2, be configured with transformer 34, heat radiation film 4, slide plate 5, left surface 13 ' and heating panel 2b successively from Inside To Outside.That is, the film 4 that dispels the heat contacts with the surperficial 34a of transformer 34 at its first surface 4a, contacts with slide plate 5 at relative with first surface 4a second 4b.Slide plate 5 contacts with left surface 13 '.

Herein, slide plate 5 is formed by resin etc., preferably high relative to the sliding of the inner surface 13i ' of the inner surface of main body cover 210, particularly left surface 13 ' slide plate, preferably at least higher relative to the sliding of inner surface 13i ' than second 4b of heat radiation film 4 slide plate.

By said structure, the heat that transformer 34 produces conducts to heating panel 2b via heat radiation film 4, slide plate 5, left surface 13 ', heating panel 2b conducts further on direction, face, externally discharges.

The manufacture method > of < 2. supply unit 200

Figure 12 is the exploded view of the manufacture method of supply unit 200 for illustration of present embodiment 2.

As shown in the arrow E of Figure 12, the heat radiation film 4 on the surperficial 34a of transformer 34 being configured at power circuit unit 3 is configured with slide plate 5.Because heat radiation film 4 has cementability, thus by by slide plate 5 by being pressed on thermal paste sheet 4, slide plate 5 can become to be close to heat radiation film 4 and to be difficult to the state that is separated.

Then, by be in be configured with slide plate 5 and heat radiation film 4 state under power circuit unit 3 slide and insert in housing main body 210 (reference arrow F).

Then, install chimeric with housing main body 210 for housing front 11.

Then, heating panel 2a, 2b are adhered to respectively the outer surface 12s of right flank 12 and the outer surface 13s ' of left surface 13 ' of housing main body 210.

As previously discussed, the supply unit 200 of present embodiment can be manufactured.

The feature > that < 3. is main

As previously discussed, in the supply unit 200 (example of electronic equipment) of present embodiment 2, heat radiation film 4 (example of heat transfer member) contacts with heating panel 2b (example of radiating component) via shell 201 and slide plate 5 at second 4b, contacts with transformer 34 at first surface 4a.Slide plate 5 is configured between heat radiation film 4 and shell 201, and contacts with heat radiation film 4.In addition, slide plate 5 is configured at the opposition side of heating panel 2b across shell 201, the face 5a (with reference to Figure 10 B and Figure 11 B) of outer shell 201 side of slide plate 5 is high relative to the sliding of the inner surface (in detail, being the inner surface 13i ' (with reference to Figure 11 B) of left surface 13 ') of shell 201.

Heat radiation film 4 to contact with heating panel 2b via shell 201 and slide plate 5 at second 4b and refers to, as shown in Figure 11 A, Figure 11 B, second 4b of heat radiation film 4 contacts with slide plate 5, and slide plate 5 contacts with the left surface 13 ' of shell 201, the structure that left surface 13 ' contacts with heating panel 2b.Thus, the heat sent from transformer 34 conducts to heating panel 2b via heat radiation film 4, slide plate 5 and shell 201.

As mentioned above, because heat radiation film 4 has cementability, if do not configure slide plate 5 and only configure heat radiation film 4 and just insert in housing main body 210 by power circuit unit 3, then the inner surface of dispel the heat film 4 and housing main body 210 is close to, and is difficult to slide.

Therefore, in present embodiment 2, by second 4b side configuration slide plate 5 at heat radiation film 4, thus under the state being configured with heat radiation film 4 on the transformer 34 of power circuit unit 3, power circuit unit 3 can be inserted housing main body 210, so can easily manufacture supply unit 200.

(execution mode 3)

Below, the supply unit 300 of embodiments of the present invention 3 is described.The supply unit 300 of present embodiment 3 is identical with the basic structure of execution mode 1 and 2, be do not configure slide plate 5, and housing main body is formed by 2 components with the difference of execution mode 2.Therefore, the difference of present embodiment 3 relative to execution mode 2 is described as emphasis.In addition, in this example 3, identical Reference numeral is put on to execution mode 1,2 same structures.

< 1. structure >

Figure 13 A is the stereogram of the supply unit 300 of present embodiment 3, and the state of removing heating panel 2b is shown.Figure 13 B is the stereogram of the inside of supply unit 300 for illustration of present embodiment 3, heating panel 2b is not shown, and illustrate with dashed lines housing main body 310.In addition, Figure 14 A is the front sectional view of the supply unit 300 of present embodiment 3, for by transformer 34 and aluminium electrolytic capacitor 35 and with the figure after 110 parallel section cuttings above.In addition, Figure 14 A be alternatively the supply unit 300 of present embodiment 3 on the position identical with between the BB shown in Fig. 6 to looking cutaway view.Figure 14 B is the G portion enlarged drawing of Figure 14 A.Figure 15 is the exploded view of the manufacture method of supply unit 300 for illustration of present embodiment 3.

As shown in Figure 13 A and Figure 15, the housing main body 310 of the shell 301 of present embodiment 3 is that the first component 310a by comprising right flank 12 engages with these 2 components of second component 310b comprising left surface 13 ' and formed.In other words, the outer cover body 310 of present embodiment 3 housing main body 210 of execution mode 2 is divided into the housing main body of 2.

Housing main body 310 is cut off by the plane parallel with left surface 13 ' and right flank 12.As shown in figure 15, this plane is by the plane between the air vent hole 141b of left surface 13 ' side and multiple hexagonal air vent hole 141a.By the junction surface S that is engaged with each other between section shown in Figure 13 A and Figure 14 A.In addition, the supply unit 300 of present embodiment 3 is under the state being installed on shell 301 by heating panel 2a, 2b, and its outward appearance is except the S of junction surface, identical with the supply unit 100 shown in Fig. 1.

The manufacture method > of < 2. supply unit 300

As shown in figure 15, under the state that heat radiation film 4 is configured on transformer 34, power circuit unit 3 is contained in second component 310b.Afterwards, the first component 310a is bonded on second component 310b by bonding agent etc., forms housing main body 310 thus.

Next, housing front 11 is installed on housing main body 310.

Afterwards, heating panel 2a, 2b is bonded and fixed to right flank 12 and left surface 13 ' respectively.As previously discussed, the supply unit 300 of present embodiment can be manufactured.

The feature > that < 3. is main

As previously discussed, as shown in figure 14, in the supply unit 300 (example of electronic equipment) of present embodiment 3, heat radiation film 4 (example of heat transfer member) contacts with heating panel 2b (example of radiating component) via shell 301 at second 4b, contacts with transformer 34 at first surface 4a.

Heat radiation film 4 contacts with heating panel 2b via shell 301 at second 4b, to contact with transformer 34 at first surface 4a and refer to, as shown in figure 14, second 4b of heat radiation film 4 contacts with the left surface 13 ' of shell 301, the structure that left surface 13 ' contacts with heating panel 2b.Thus, the heat from transformer 34 conducts to heating panel 2b via heat radiation film 4 and shell 301.

In addition, shell 301 by by bonding for housing front 11, first component 310a and second component 310b and formed, and has left surface 13 ' respect to one another and right flank 12.Left surface 13 ' and right flank 12 are located on different components i.e. the first component 310a, second component 310b, and heating panel 2b is configured at left surface 13 '.

Thus, as shown in figure 15, due to heat radiation film 4 can be configured on the transformer 34 be configured on right flank 12, and left surface 13 ' is covered on heat radiation film 4, manufacture supply unit 300, so can between transformer 34 and shell 301, under the state contacted respectively with transformer 34 and shell 301, easily configure the film 4 that dispels the heat.

Other execution modes of < >

(A)

In above-mentioned execution mode 1 ~ 3, using two-sided tape etc. to be installed on right flank 12 and left surface 13,13 ' by bonding by heating panel 2a, 2b, but be not limited to bonding, can also install by being fitted together to.

(A1)

Figure 16 is the left view of the shell 401 of the supply unit 400 of the variation that above-mentioned execution mode 2 is shown.Figure 17 A is that the HH of Figure 16 is to looking cutaway view.Figure 17 B is the J portion enlarged drawing of Figure 17 A.Figure 18 A be Figure 16 II between to looking cutaway view, Figure 18 B is the J portion enlarged drawing of Figure 18 A.

As shown in Figure 16 and Figure 17 A, in the lower end of the left surface 13 ' of the housing main body 410 of this shell 401, be provided with toward the outer side and look lower the support portion, downside 413 in L-shaped main.In detail, as seen in this fig. 17b, support portion, downside 413a has the downside first support portion 413b outstanding perpendicular to left surface 13 ' from the lower end of left surface 13 ' and is parallel to left surface 13 ' from the top of downside first support sector 413b and the downside second support portion 413c formed upward.Surrounded by this left surface 13 ', downside first support portion 413b and downside second support portion 413c and form channel-shaped portion 413d.The lower end 201b of chimeric heating panel 2b in this channel-shaped portion 413d.

As previously discussed, the lower end side of heating panel 2b is supported, and as shown in figure 16, the upper end side of heating panel 2b is supported by pushing-type rivet (push rivet) 7.That is, on heating panel 2b and left surface 13 ', side and 2 positions of 110 sides and side, the back side 16 are provided with through hole above thereon.Then, as shown in Figure 18 A and Figure 18 B, configure pushing-type rivet 7 through the through hole 203b of heating panel 2b and the through hole 413e of left surface 13 '.

Namely, when heating panel 2b is installed on left surface 13 ', after the lower end 201b of heating panel 2b is inserted channel-shaped portion 413d, by pushing-type rivet 7 being inserted the through hole 203b of heating panel 2b and the through hole 413e of left surface 13 ', heating panel 2b can be installed on left surface 13 '.In addition, as shown in Figure 17 A and Figure 18 A, although heating panel 2a is by being adhesively fixed on right flank 12, also the structure same with left surface 13 ' can be set to.In addition, be fixed by pushing-type rivet 7 couples of heating panel 2b, correspond to the pass the chimeric example be fixed.In addition, by support portion, downside 413a, heating panel 2b is fixed, corresponds to the pass the chimeric example be fixed.

(A2)

In addition, in above-mentioned (A1), although the downside of heating panel 2b is supported by support portion, downside 413a, downside support portion 413a also can not be set, left surface 13 ' also can also be fixed on by pushing-type rivet in the downside of heating panel 2b.

(A3)

In addition, in above-mentioned (A1), although left surface 13 ' is fixed on by pushing-type rivet 7 in the upside of heating panel 2b, be not limited to pushing-type rivet 7.Such as, shown in Figure 19 A, Figure 19 B, upside support portion 423a can be formed with in the upper end of left surface 13 '.On the upside of this, support portion 423a has the upside first support portion 423b outstanding perpendicular to left surface 13 ' from the upper end of left surface 13 ' and is parallel to left surface 13 ' from the top of upside first support portion 423b and the upside second support portion 423c formed downward.In addition, upside second support portion 423c with more then width become narrower mode, be formed with inclined plane 423d in the outside of its lower end.

After the lower end 201b of heating panel 2b is inserted the channel-shaped portion 413d shown in Figure 17 A and Figure 17 B, when heating panel 2b being installed on left surface 13 ', the upper end 202b of heating panel 2b and inclined plane 423d is abutted against.And then if be pressed into towards left surface 13 ' by heating panel 2b, then upside the second support portion 423c bends to the inside, as shown in Figure 19 B, the upper end 202b of heating panel 2b embeds between upside the second support portion 423c and left surface 13 '.Also heating panel 2b can be installed on left surface 13 ' as described above.

(B)

In the above-described embodiment, as the materials'use aluminium of heating panel 2, but can be not limited thereto, metal can also be not limited to for resin etc.In a word, as long as use the heating panel 2 that the thermal conductivity of the resin material of thermal conductivity ratio housing main body 10 is high.

(C)

In above-mentioned execution mode 2, as slide plate 5, use the slide plate formed by resin, but as long as insulant, be not limited to resin.Slide plate also can be formed by the such as other materials such as glass, paper, as long as the face 5a of the side, side 13 ' that keeps left of slide plate 5 is high relative to the sliding of the inner surface 13i ' of left surface 13 '.

Say further, the face 5a of the side, side 13 ' that keeps left of slide plate 5 is relative to the sliding of the inner surface 13i ' of left surface 13 ', as long as at least high relative to the sliding of the inner surface 13i ' of left surface 13 ' than second 4b of heat radiation film 4, owing to being pasted with, slide plate 5 is easier compared with the state of not pasting inserts housing main body 210 by power circuit unit 3, so be more preferably.

(D)

In above-mentioned execution mode 1 ~ 3, on transformer 34, be only configured with heat radiation film 4, but be not limited to transformer 34, heat radiation film 4 can also be configured on the electronic unit of other heating.In the supply unit of above-mentioned execution mode, also can such as at left surface 13, the 13 ' side of coil 38 configuration heat radiation film 4.Like this, when to multiple electronic unit configuration heat transfer member, can to any one in each electronic unit respectively application implementation mode 1 ~ 3.That is, also can not apply the structure of identical execution mode to multiple electronic unit, such as, to the structure of any one in a part of electronic unit application implementation mode 1 ~ 3, and the structure of execution mode in addition can be applied to other electronic unit.

Such as, transformer 34 and coil 38 are all configured with heat radiation film 4, and when the heat distributed separately is undertaken dispelling the heat by heating panel 2b, can to the structure of transformer 34 application implementation mode 1, to the structure of coil 38 application implementation mode 2.Namely, also can be the supply unit of following structure: the heat radiation film 4 on transformer 34 directly contacts with heating panel 2b via the peristome 13c being formed at left surface 13, and heat radiation film 4 on coil 38 be via the slide plate 5 configured thereon and left surface 13 and heating panel 2b thermo-contact.

(E)

In addition, as shown in figure 20, the housing main body 10 illustrated in execution mode 1 also can be formed by 2 components as Embodiment 3.In this case, large and need the electronic unit that directly contacts with heating panel 2b for caloric value, the heat radiation film 4 configured thereon is directly contacted with heating panel 2b, for heat generating components in addition, the heat radiation film 4 configured can be made thereon to contact with housing main body 10.

When using Figure 20 to specifically describe, the housing main body 310 ' shown in Figure 20 is formed by the first component 310a ' and second component 310b, and left surface 13 is formed peristome 13c.This first component 310a ', except being formed with peristome 13c, is the structure same with the first component 310a.

Such as, the heat radiation film 4 be configured on transformer 34 similarly contacts with heating panel 2b via peristome 13c with execution mode 1.On the other hand, the heat radiation film 4 be configured on coil 38 similarly contacts with the inner surface of left surface 13 with execution mode 3.Because the housing main body 310 ' shown in Figure 20 is divided into the first component 310a ' and second component 310b ', even if so when being configured with heat radiation film 4, also can not via slide plate 5 at the interior configuration power circuit unit 3 of housing main body 310 '.

(F)

In above-mentioned execution mode 2, as shown in Figure 10, employ the slide plate 5 that size at least covers heat radiation film 4, but also can use the slide plate of other parts not only covering heat radiation film 4 but also cover power circuit unit 3.Figure 21 A is the stereogram showing such slide plate 500.Figure 21 B is the stereogram schematically showing power circuit unit 3.Figure 21 C is the figure that the state being covered power circuit unit 3 by slide plate 500 is shown.

Slide plate 500 shown in Figure 21 A has front face 501, right side face 502, left side face 503 and back part 504.Right side face 502 is formed as the entirety of right flank 12 side covering power circuit unit 3.Other front face 501, left side face 503 and back part 504 cover a part for 110 sides before power circuit unit 3, left surface 13 ' side, side, the back side 16.In addition, as illustrated in fig. 21, the back part 504 of slide plate 500 is formed with the insertion pawl 504a formed towards front face 501 side, and inserts the patchhole 33a1 ' being formed at the radiator 33a ' shown in Figure 21 B.Like this, insert in patchhole 33a1 ' by pawl 504a will be inserted, be easy to the state that maintenance slide plate 500 covers power circuit unit 3.Like this, slide power circuit unit 3 outer cover body 210 of insertion shown in Figure 12 under the state covered by slide plate 500.In addition, be not limited to the shape as Figure 21 A, such as, also can cover the entirety of the left surface 13 ' side of power circuit unit 3.

(G)

In above-mentioned execution mode 1, following structure is illustrated, namely, the transformer 34 of an example as heat generating components is configured with in the mode directly contacted the heat radiation film 4 of an example as heat transfer member, heat radiation film 4 directly contacts with heating panel 2b, but heat generating components is not limited to transformer 34, heat transfer member is also not limited to the film 4 that dispels the heat.

Such as, the structure that the radiator 33b (example of heat transfer member) for dispelling the heat to rectifier diode 30 (example of heat generating components and semiconductor device) directly contacts with heating panel 2b can also be adopted.This structure corresponds to the example that heat generating components contacts with heating panel indirectly via heat transfer member.

Figure 22 is the stereogram of the supply unit 600 of such structure.Figure 23 is the left view of the internal structure of the supply unit 600 that Figure 22 is shown.Figure 24 A be Figure 23 JJ between to looking cutaway view, Figure 24 B be Figure 23 KK between to looking cutaway view.

The supply unit 600 of Figure 22 is compared with the supply unit 300 shown in Figure 13, and difference is, is formed at left surface 613 for the peristome 13g making radiator 33b directly contact with heating panel 2b.As shown in Figure 22, Figure 24 A and Figure 24 B, radiator 33b is shape tabular component being bent into L-shaped, as shown in Figure 24 A, Figure 24 B, there is the Part II 33bc that the Part I 33ba that configures along the direction vertical with the 1st substrate 31a is formed along the direction parallel with first substrate 31a with the top (end of left surface 613 side) from Part I 33ba.And this Part II 33bc directly contacts with first radiating part 24 of heating panel 2b.

In addition, in this supply unit 600, because needs are by radiator 33b insertion opening portion 13g, so the housing main body 610 of shell 601 is as the supply unit 300 shown in Figure 13 ~ Figure 15, is engaged with second component 310b by the first component 610a and form.The first component 310a of first component 610a and Figure 13 ~ Figure 15 compares, and the structure except peristome 13g is identical.

In addition, like this, when radiator 33b directly contacts with heating panel 2b, need to make to insulate between radiator 33b and rectifier diode 30, or rectifier diode 30 itself is insulated.

In addition, in supply unit 600, although radiator 33b directly contacts with heating panel 2b, also heat radiation film 4 can be configured between radiator 33b and heating panel 2b, and directly contact with heating panel 2b with radiator 33b respectively.

In addition, can not also form peristome 13g on left surface 613, radiator 33b contacts with heating panel 2b indirectly via heat radiation film 4 and left surface 613.

Further, radiator 33b directly can not also contact with left surface 613 via thermal paste sheet 4.

In addition, radiator 33a also can use by an example as heat transfer member in the same manner as above-mentioned radiator 33b, and directly or via shell indirectly contacts with heating panel 2b.

In addition, when electronic unit itself is insulated, also can form peristome on shell and electronic unit is directly contacted with heating panel 2b.Such structure corresponds to the example that heat generating components directly contacts with heating panel 2b.

(H)

In addition, in above-mentioned execution mode 3, even if also can easily power circuit unit 3 be contained in housing main body 310 to not configure slide plate 5, and housing main body 310 is divided into 2 components (the first component 310a and second component 310b), but also can use the housing main body 210 of box-shaped as Embodiment 2.Wherein, in this case, owing to causing being difficult to power circuit unit 3 to insert housing main body 210 because of the cementability of the film 4 that dispels the heat, so need during fabrication to spend the regular hour.In addition, like this, when using housing main body 210 of box-shaped, in order to easily insert power circuit unit 3, the material preferably using cementability weak is as heat radiation film 4.

(I)

In addition, in above-mentioned execution mode 3, describe and form housing main body 10 by being bonded together by the first component 310a and second component 310b, but be not limited to this, as shown in fig. 25 a, such as screw 50 etc. also can be used to engage the first component 310a and second component 310b.

(J)

In addition, when heating panel 2a, 2b are installed on right flank 12 and left surface 13, being not limited to bonding and being fitted together in the middle description of above-mentioned (A1) ~ (A4) described in the above-described embodiment, also by using being fastenedly connected of screw and nut, heating panel 2a, 2b can being installed on right flank 12, left surface 13.Illustrate in Figure 25 B and used screw 51 that heating panel 2a, 2b are installed on the state of right flank 12 and left surface 13 in the supply unit shown in Fig. 1.

(K)

And then, heating panel 2a, 2b and housing main body 210,310 integrally formed can also be made.In addition, when execution mode 1, owing to needing to insert heat radiation film 4 from the peristome 13c of left surface 13, thus can only make heating panel 2a and housing main body 10 integrally formed.

(L)

In the above-described embodiment, the supply unit of an example as electronic equipment is illustrated, but is not limited in supply unit, for the electronic equipment with heat generating components, the structure of above-mentioned explanation can both be adopted.

It is good and can realize miniaturized effect that electronic equipment of the present invention has thermal diffusivity, can be used as supply unit etc.

Claims (14)

1. an electronic equipment, is characterized in that,

Have:

Framework, is formed by resin,

Heat generating components, is contained in described framework,

The radiating component of tabular, the outer surface along described framework configures, and the thermal conductivity that thermal conductivity ratio forms the resin of described framework is high,

Heat transfer member, has first surface respect to one another and second, directly contacts or indirectly contacts with described radiating component via described framework at described second, contact at described first surface with described heat generating components at described second with described radiating component;

Described radiating component is the shape of the contact-making surface at least covering described heat transfer member and described heat generating components.

2. electronic equipment as claimed in claim 1, is characterized in that,

Described framework has the air vent hole flowing into for gas or flow out.

3. electronic equipment as claimed in claim 1 or 2, is characterized in that,

Described heat transfer member contacts with described framework,

Described radiating component is configured in the side contrary with described heat transfer member side across described framework.

4. electronic equipment as claimed in claim 1 or 2, is characterized in that,

Described framework has through hole,

Described heat transfer member directly contacts with described radiating component via described through hole.

5. electronic equipment as claimed in claim 1 or 2, is characterized in that,

Between described heat transfer member and described framework, there is the flat member contacted with described heat transfer member,

Described flat member is configured in the side contrary with described radiating component side across described framework,

The face of the described framework side of described flat member is high relative to the sliding of the inner surface of described framework.

6. electronic equipment as claimed in claim 2, is characterized in that,

Described framework has first surface respect to one another and second,

Described air vent hole is arranged at described first surface and described second respectively.

7. electronic equipment as claimed in claim 6, is characterized in that,

Described framework has the 3rd and fourth face respect to one another,

Described 3rd and described fourth face configure along with described first surface and described second vertical direction,

Described radiating component is configured at least one face in described 3rd and described fourth face.

8. electronic equipment as claimed in claim 6, is characterized in that,

Comprise the substrate being configured with described heat generating components be configured in the surface of all substrates in described framework and the described first surface of described framework and described second vertical.

9. electronic equipment as claimed in claim 6, is characterized in that,

This electronic equipment also has the installation portion for described framework being arranged on supporting track,

Described framework has the 5th along configuring with the described first surface of described framework and described second vertical direction,

Described installation portion is configured on described 5th,

Under the state that described framework is arranged on described supporting track, the described first surface of described framework and described second relative direction vertical with the length direction of described supporting track.

10. electronic equipment as claimed in claim 3, is characterized in that,

Described framework be by being fastenedly connected the component of more than at least 2, chimeric or bonding and formed, and there is the 3rd and fourth face respect to one another,

Described radiating component is configured at least one in described 3rd and described fourth face,

Described 3rd and described fourth face are arranged on different components.

11. electronic equipments as claimed in claim 5, is characterized in that,

Described framework has:

Box like component, has opening towards the outside and the opening surface formed;

Cap-like structure, is configured to block described opening surface.

12. electronic equipments as claimed in claim 1 or 2, is characterized in that,

Described radiating component is pasted onto in described framework by two-sided tape.

13. electronic equipments as claimed in claim 1 or 2, is characterized in that,

Described radiating component and described framework integrally formed.

14. electronic equipments as claimed in claim 1 or 2, is characterized in that,

Described heat transfer member has elasticity, and is close on described heat generating components.