JP6295746B2 - Electronics - Google Patents

Description

  The present invention relates to an electronic device such as a power supply device.

For example, a switching power supply device is used as the power supply device, and electronic components such as a transformer, a coil, and an aluminum electrolytic capacitor are provided inside the switching power supply device. Among these electronic components, for example, transformers and coils are heat generating components that generate a large amount of heat, and a metal casing may be used to radiate heat generated by these components to the outside.
However, when a metal casing is used, there is a problem that it is difficult to reduce the size of the power supply device because it is necessary to secure an insulation distance between the casing and the electrical component.

On the other hand, for example, as shown in Patent Document 1, a configuration using a resin-made casing as a casing of a power supply device is disclosed. By using such a casing made of resin, insulation from an electrical component is disclosed. Therefore, it is possible to reduce the size from the viewpoint of insulation.
Moreover, since the housing can be mass-produced by resin molding, the cost can be reduced.

JP 2000-208968 A

However, the conventional configuration has the following problems.
That is, when trying to reduce the size, heat tends to be trapped in the apparatus, and therefore, there is a problem that it is difficult to sufficiently dissipate heat when the casing is formed of a resin having a lower thermal conductivity than metal. Furthermore, if it is going to respond to the request | requirement of high capacity | capacitance in recent years, since the emitted-heat amount will increase, it will become more difficult for heat dissipation.

Also, among the electronic components provided in the power supply device, the life of aluminum electrolytic capacitors, especially when the temperature rises too much, is shortened. Therefore, when trying to increase the capacity and reduce the size, an appropriate power supply device equivalent to the conventional one is used. There is a risk that it will not be possible to ensure the service life.
An object of the present invention is to provide an electronic device that can be miniaturized and has good heat dissipation and can ensure an appropriate life.

  The electronic device according to the first invention includes a housing, an aluminum electrolytic capacitor, a heat generating component, and a heat radiating member. The housing is made of resin. The aluminum electrolytic capacitor is disposed in the housing. The heat generating component is disposed in the casing and generates a larger amount of heat than the aluminum electrolytic capacitor. The heat dissipating member is disposed on the outer surface of the housing, has a higher thermal conductivity than the resin forming the housing, and has a plate shape. The heat radiating member is formed with a first heat radiating portion that radiates heat from the heat generating component and a second heat radiating portion that radiates heat from the aluminum electrolytic capacitor and is thermally separated from the first heat radiating portion.

Here, the heat generating component is a component that generates heat by being electrically driven. In addition, among the components used in the electronic device, components included in the upper half when viewed in descending order of the calorific value may be used. One of a transformer, a semiconductor component, and a coil is included.
Since the housing is formed of resin in this way, it is not necessary to secure an insulation distance from the heat generating component, so that the size can be reduced.

In addition, by disposing the heat sink along the outer surface of the housing, the heat generated by the heat generating component spreads in the surface direction of the heat dissipation member and is released from the entire heat dissipation member to the outside, so good heat dissipation Can be obtained.
In addition, since the first heat radiating portion and the second heat radiating portion are thermally separated, no heat transfer is performed from the first heat radiating portion to which the heat generated by the heat-generating component is transmitted to the aluminum electrolytic capacitor, and further the aluminum electrolytic capacitor. Since this heat is radiated from the second heat radiating portion, it is possible to suppress the life of the aluminum electrolytic capacitor from being shortened, and to realize the life of the electronic device equivalent to or longer than that of the conventional one. Here, the fact that the first heat radiating portion and the second heat radiating portion are connected to such an extent that the mechanical strength of the heat radiating plate is maintained is included in the thermal separation.
For this reason, it is possible to provide electric air that can be miniaturized and has good heat dissipation and can ensure an appropriate life.

An electronic device according to a second invention is the electronic device according to the first invention, wherein the heat dissipating member covers at least the aluminum electrolytic capacitor and the heat generating component with a single member, and the heat dissipating member includes a heat dissipating member. A slit is formed so as to surround at least a portion other than the side away from the heat generating component of the aluminum electrolytic capacitor as viewed from a direction perpendicular to the member. The first heat radiating portion and the second heat radiating portion are separated by a slit.
By forming the slits in this way, it is possible to form a first heat radiating portion that radiates heat generated by the heat generating component and a second heat radiating portion that radiates heat generated by the aluminum electrolytic capacitor in one heat radiating member.

An electronic device according to a third aspect is the electronic device according to the first aspect, wherein the slit is formed in the heat dissipation member in a groove shape.
Thereby, a 1st thermal radiation part and a 2nd thermal radiation part can be formed easily by press work etc.

An electronic device according to a fourth aspect is the electronic device according to the first aspect, wherein the housing has a first surface and a second surface. The heat dissipation member is disposed on each of the first surface and the second surface. The first heat radiating portion is a heat radiating member disposed on the first surface, and the second heat radiating portion is a heat radiating member disposed on the second surface.
As a result, heat dissipating members are arranged on separate surfaces of the housing, one is used as a heat dissipating member that dissipates heat from the aluminum electrolytic capacitor, and the other heat dissipating member dissipates heat from the heat-generating component that generates more heat than the aluminum electrolytic capacitor. It can be.

An electronic device according to a fifth aspect of the present invention is the electronic device according to the fourth aspect of the present invention, provided with an aluminum electrolytic capacitor and a heat generating component, and provided with a substrate disposed in the housing. The first surface is disposed to face the second surface along a direction parallel to the second surface. The substrate is disposed between the first surface and the second surface along a direction parallel to the first surface and the second surface. The aluminum electrolytic capacitor and the heat generating component are provided on the surface on the first surface side of the substrate.
As a result, heat radiation from the aluminum electrolytic capacitor and the heat-generating component is performed separately from one surface and the other surface across the substrate.

  An electronic device according to a sixth invention is the electronic device according to the fifth invention, wherein the substrate has a through hole, and is in direct contact with the aluminum electrolytic capacitor through the through hole. A heat transfer member is further provided. The heat transfer member is in contact with the second heat radiating portion directly or indirectly through the housing.

  Here, the heat transfer member is a member having a higher thermal conductivity than the gas inside the housing such as air. As a result, heat can be efficiently radiated to the housing rather than providing a space without arranging a heat transfer member. Indirect contact means that another member is interposed between two members, and these two members are not in direct contact with each other, but either member is in direct contact with the other member. State. The other member may be a member in which a plurality of members are continuously connected in direct contact. The other member is a member having a higher thermal conductivity than the gas inside the housing such as air.

Thus, the aluminum electrolytic capacitor can be radiated from the heat radiating member disposed on the side opposite to the side on which the aluminum electrolytic capacitor is disposed with the substrate interposed therebetween.
An electronic device according to a seventh aspect of the invention is the electronic device according to the fifth aspect of the invention, wherein a heat transfer member that is in direct contact with the terminal of the aluminum electrolytic capacitor and disposed on the second surface side of the substrate is provided. In addition. The heat transfer member is in contact with the second heat radiating portion directly or indirectly through the housing.
Thus, the aluminum electrolytic capacitor can be radiated from the heat radiating member disposed on the side opposite to the side on which the aluminum electrolytic capacitor is disposed with the substrate interposed therebetween.

An electronic device according to an eighth aspect is the electronic device according to the first aspect, wherein the heat resistance temperature of the aluminum electrolytic capacitor is lower than that of the heat generating component.
Thus, the life of the aluminum electrolytic capacitor can be appropriately ensured by separating the heat dissipating part that dissipates the heat of the heat-generating component having a higher heat resistance temperature than that of the aluminum electrolytic capacitor and the heat dissipating part of the aluminum electrolytic capacitor.

An electronic device according to a ninth aspect is the electronic device according to the first aspect, wherein the heat generating component is a transformer or a semiconductor component.
By dissipating heat from the transformer and semiconductor components that generate a large amount of heat to a heat dissipating part that is separate from the aluminum electrolytic capacitor, heat generated by the transformer and semiconductor parts is prevented from being transmitted to the aluminum electrolytic capacitor via the heat dissipating part. Therefore, it is possible to suppress the temperature of the aluminum electrolytic capacitor from rising too much.

An electronic device according to a tenth aspect of the invention is the electronic device according to the first aspect of the invention, wherein the heat generating component is disposed via at least one of the heat transfer member disposed in direct contact with the housing and the heat generating component. It is in contact with the first heat radiating portion indirectly or directly.
Thereby, a heat-emitting component can contact a 1st thermal radiation part directly or indirectly.
An electronic device according to an eleventh aspect of the invention is the electronic device according to the first aspect of the invention, in which the aluminum electrolytic capacitor is interposed via at least one of a heat transfer member disposed in direct contact with the casing and the heat generating component. Indirectly or directly in contact with the second heat dissipating part.
Thereby, the aluminum electrolytic capacitor can contact the 2nd thermal radiation part directly or indirectly.

An electronic device according to a twelfth invention is the electronic device according to the first invention, and includes a first heat transfer member and a second heat transfer member. The first heat transfer member is disposed between the heat generating component and the housing, directly contacts the heat generating component, and directly or indirectly contacts the housing. The second heat transfer member is disposed between the aluminum electrolytic capacitor and the casing, and is in direct contact with the aluminum electrolytic capacitor and directly or indirectly in contact with the casing. The case covers both the heat generating component and the aluminum electrolytic capacitor. The first heat radiation part covers the first heat transfer member over the housing. The second heat radiating portion covers the second heat transfer member over the housing. The first heat radiating portion and the second heat radiating portion are separated or thermally separated.
As a result, heat is not transferred from the first heat radiating part to which the heat generated by the heat generating component is transmitted to the aluminum electrolytic capacitor, and the heat of the aluminum electrolytic capacitor is further radiated from the second heat radiating part. The shortening can be suppressed, and the life of the electronic device equal to or longer than that of the conventional device can be realized.

An electronic apparatus according to a thirteenth aspect is the electronic apparatus according to the first aspect, wherein the first heat radiating portion and the second heat radiating portion are separately disposed on one surface of the housing.
Thereby, the heat generated by the heat generating component can be dissipated from one surface, and the heat generated by the aluminum electrolytic capacitor can be dissipated.

An electronic device according to a fourteenth aspect is the electronic device according to the thirteenth aspect, wherein the housing is perpendicular to the first surface on which the first heat radiating portion and the second heat radiating portion are disposed, and the first surface. It has the 3rd surface arranged along a direction, and the 4th surface arranged along the direction perpendicular to the 1st surface. The third surface and the fourth surface are disposed to face each other. Each of the third surface and the fourth surface has a vent hole through which gas flows in or out.
As a result, heat can be radiated from the heat generating component and the aluminum electrolytic capacitor by the air flow passing through the third surface vent hole and the fourth surface vent hole, and each can be radiated from separate heat radiating portions. it can. Note that the description of “vertical” in this specification does not indicate a strict meaning.

An electronic device according to a fifteenth aspect of the invention is the electronic device according to the thirteenth aspect of the invention, further comprising an attachment portion for attaching the housing to the support rail. The housing has a first surface on which the first heat radiating portion and the second heat radiating portion are disposed, and a fifth surface disposed along a direction perpendicular to the first surface. The attachment portion is disposed on the fifth surface. The first surface is arranged in the housing so as to be along a direction perpendicular to the longitudinal direction of the support rail when the housing is attached to the support rail.
Thereby, in the state attached to the support rail, the heat-emitting component and the aluminum electrolytic capacitor can be radiated from the side surface.

  An electronic device according to a sixteenth invention is the electronic device according to the fourteenth or fifteenth invention, wherein the first heat radiating portion and the second heat radiating portion are arranged in a state where the electronic device is arranged so that the first surface is along the vertical direction. Are separated into upper and lower parts, and the first heat radiating part is arranged above the second heat radiating part.

  Since the heat-generating component is more energetic than the heat generated by the aluminum electrolytic capacitor, the temperature of the first heat dissipating part is higher than that of the second heat dissipating part. Therefore, for example, if the first heat radiating part is disposed below the second heat radiating part, the heat of the first heat radiating part rises and affects the second heat radiating part, and the heat radiating efficiency of the aluminum electrolytic capacitor is reduced. However, by arranging the first heat radiating portion above the second heat radiating portion as described above, it is possible to reduce the influence of the heat of the first heat radiating portion on the second heat radiating portion.

  ADVANTAGE OF THE INVENTION According to this invention, while aiming at size reduction, the electronic device which has favorable heat dissipation and can ensure a suitable lifetime can be provided.

The perspective view of the front side of the power supply device in Embodiment 1 which concerns on this invention. The perspective view of the back side of the power supply device of FIG. The exploded view of the power supply device of FIG. (A), (b), (c), (d), (e) Front view, right side view, left side view, top view, bottom view of the case body of the power supply device of FIG. The perspective view which shows the power supply circuit unit of the power supply device of FIG. The left view which shows the internal structure of the power supply device of FIG. FIG. 7 is a cross-sectional view taken along the line AA in FIG. 6. The exploded view for demonstrating the manufacturing method of the power supply device of FIG. (A)-(c) The figure which shows the modification of the slit of Embodiment 1 which concerns on this invention. The figure which shows the modification of the slit of Embodiment 1 which concerns on this invention. The figure which shows the modification of the slit of Embodiment 1 which concerns on this invention. The figure which shows the modification of the slit of Embodiment 1 which concerns on this invention. The figure which shows the modification of the heat sink of Embodiment 1 which concerns on this invention. The perspective view of the front side of the power supply device in Embodiment 2 which concerns on this invention. The perspective view which shows the power supply circuit unit of the power supply device of FIG. The left view which shows the internal structure of the power supply device of FIG. The arrow directional cross-sectional view between BB of FIG. The left view which shows the internal structure of the power supply device of the modification of Embodiment 2 which concerns on this invention. 16 is a cross-sectional view taken along the line FF in FIG. (A), (b) The perspective view of the power supply device of the modification of embodiment which concerns on this invention. The front sectional view of the power supply device of FIG. The exploded view of the power supply device of FIG. The perspective view of the power supply device of the modification of embodiment which concerns on this invention. FIG. 22 is a front sectional view of the power supply device of FIG. 21. The exploded view of the power supply device of FIG. The perspective view of the power supply device of the modification of embodiment which concerns on this invention. The left view which showed the internal structure of the power supply device of FIG. (A) Arrow sectional drawing between DD of FIG. 25, (b) Arrow sectional drawing between EE of FIG.

Hereinafter, a power supply device according to an embodiment of the present invention will be described with reference to the drawings.
(Embodiment 1)
<1. Configuration of Power Supply Device 100>
FIG. 1 is a front perspective view of the power supply apparatus 100 according to the first embodiment. FIG. 2 is a perspective view of the back side of the power supply apparatus 100 of FIG. FIG. 3 is an exploded view of the power supply apparatus 100 of FIG.

The power supply apparatus 100 according to the first embodiment is a switching power supply apparatus, and can convert a commercial power supply input into high-frequency power using a semiconductor switching action to obtain a predetermined direct current.
As shown in FIGS. 1 to 3, the power supply device 100 according to the first embodiment includes a case 1, heat radiation plates 2 a and 2 b arranged outside both side surfaces of the case 1, and a power supply circuit housed in the case 1. Heat radiation gel sheets 4a and 4b (see FIGS. 5 and 7 to be described later) and slide sheets 5a and 5b (see FIGS. 5 and 7 to be described later) disposed in the unit 3, the transformer 34 and the aluminum electrolytic capacitor 35 of the power supply circuit unit 3. ). In FIG. 1, the support rail 9 to which the power supply device 100 according to the first embodiment is attached is indicated by a dotted line.

Hereafter, each structure is demonstrated in order.
(1-1. Case 1)
As shown in FIG. 3, the case 1 includes a case main body 10 and a case front portion 11.
4 (a), 4 (b), 4 (c), 4 (d), and 4 (e) are respectively a front view, a right side view, a left side view, and a top view of the case body 10. FIG.

  As shown in FIGS. 3 and 4 (a) to 4 (e), the case main body 10 has a box shape having an opening 17 on the front side, and includes a right side surface 12, a left side surface 13, an upper surface 14, a bottom surface 15, And a back surface 16. In the present specification, up / down / left / right and front / rear are defined with reference to the power supply device 100 attached to the support rail 9. The left-right direction indicates the left-right direction when the case front portion 11 is viewed from the front. Further, the front side is the case front portion 11 side, and the rear side is the back surface 16 side.

(1-1-1. Case body 10)
(1-1-1-1. Right side surface 12)
As shown in FIG. 4B, the right side surface 12 is formed with fitting holes 12a and 12b into which claws 11a and 11b (described later) of the case front portion 11 are fitted. The fitting holes 12a and 12b are formed at two positions on the right side 12 on the front end 12f side.

(1-1-1-2. Left side 13)
As shown in FIG. 4C, fitting holes 13 a and 13 b are formed in the left side surface 13 so that claws 11 c and 11 d (described later) of the case front portion 11 are fitted. The fitting holes 13a and 13b are formed at two places on the left side 13 on the front end 13f side.
(1-1-1-3. Upper surface 14)
As shown in FIG. 4D, the upper surface 14 is formed with a fitting hole 14a into which a claw portion 11e (described later) of the case front portion 11 is fitted. The fitting hole 14 a is formed on the front end 14 f side of the upper surface 14. Further, as shown in FIGS. 1, 3 and 4D, a vent hole 141 for releasing heat generated in the power supply circuit unit 3 to the outside is formed in the upper surface 14. The ventilation hole 141 has a substantially hexagonal ventilation hole 141a and a linear ventilation hole 141b. If the end on the right side 12 of the upper surface 14 is the right end 14c, the end on the left side 13 side of the upper surface 14 is the left end 14d, and the end on the back 16 side of the upper surface 14 is the rear end 14e, the vent hole 141b is the right end 14c. Two are provided along the right end 14c and the left end 14d at positions closer to the left end 14d. Further, a plurality of vent holes 141a are provided between the vent holes 141b formed along the right end 14c and the left end 14d so as to form a honeycomb structure in the front-rear direction (front end 14f to rear end 14e). .

(1-1-1-4. Bottom 15)
As shown in FIG. 4E, the bottom surface 15 is formed with a fitting hole 15a into which a claw portion 11f (described later) of the case front portion 11 is fitted. The fitting hole 15 a is formed on the front end 15 f side of the bottom surface 15. Further, as shown in FIGS. 1, 3, and 4 (e), a vent hole 151 for releasing heat generated in the power supply circuit unit 3 to the outside is formed in the bottom surface 15. The vent 151 has a substantially hexagonal vent 151a and a linear vent 151b. If the end of the bottom surface 15 on the right side 12 side is the right end 15c, the end of the bottom surface 15 on the left side 13 side is the left end 15d, and the end of the bottom surface 15 on the back 16 side is the rear end 15e, the vent hole 151b is the right end 15c. Two are provided along the right end 15c and the left end 15d at positions closer to the left end 15d. A plurality of vent holes 151a are provided between the vent holes 151b formed along the right end 15c and the left end 15d so as to form a honeycomb structure in the front-rear direction (front end 15f to rear end 15e). .

(1-1-1-5. Back 16)
As shown in FIG. 2, the back surface 16 is provided with an attachment portion 160 for attachment to the support rail 9. The attachment portion 160 is formed in a concave shape in the left-right direction at a substantially central portion in the up-down direction. More specifically, the back surface 16 has a top surface 16a, a substantially central surface 16b, and a bottom surface 16c in the vertical direction. The surface 16b is located in front of the lower end of the surface 16a and the upper end of the surface 16c. A locking portion 16d formed so as to protrude downward is formed at the lower end of the surface 16a. Further, a recessed portion 16e formed so as to be recessed upward is formed in the step portion between the surface 16a and the surface 16b.

On the other hand, a locking portion 16f formed in the upward direction is provided at the center upper end portion in the left-right direction of the surface 16c, and an inclined surface 16g is formed on the front surface of the locking portion 16f. Yes. The inclined surface 16g is inclined so that the position on the surface thereof is positioned forward as it goes upward. Further, the locking portion 16f has elasticity so as to bend in the front-rear direction.
The upper end portion 9a (see FIG. 1) of the support rail 9 is fitted in the recess 16e, and the lower end portion 9b (see FIG. 1) is fitted over the inclined surface 16g of the locking portion 16f, so that the upper end portion 9a is locked. The lower end portion 9b is locked by the locking portion 16f. As a result, the power supply device 100 is supported by the support rail 9. The support rail 9 is formed to be long in the left-right direction, and the left-right direction in FIG. 1 is an example of the longitudinal direction of the support rail 9.

(1-1-2. Case Front 11)
As shown in FIG. 3, the case front portion 11 is formed in a lid shape that closes the opening 17 of the case main body 10, and fits with the case main body 10. As shown in FIGS. 1 to 3, the case front portion 11 has a front surface 110, a right surface 112, a left surface 113, an upper surface 114, and a lower surface 115. In a state where the case front part 11 is fitted to the case body 10, the right surface 112, the left surface 113, the upper surface 114, and the lower surface 115 of the case front part 11 are respectively connected to the right side surface 12, the left side surface 13, and the upper surface 14 of the case body 10. And the bottom surface 15 and the end surfaces are adjacent to each other.

  The case front part 11 is formed with projecting parts 11g and 11h projecting rearward from the edge 11k on the left side 13 side of the rear end thereof, and in the fitting holes 13a and 13b of the left side 13 at the tip thereof. Claw portions 11c and 11d to be fitted are provided. The claw portions 11c and 11d have inclined surfaces 111c and 111d on the outside, and are formed so that the width in the left-right direction becomes narrower toward the rear.

  As shown in FIGS. 1 and 2, the case front portion 11 is formed with a protruding portion (not shown) protruding rearward from the edge 11j on the right side surface 12 side of the rear end. Claw portions 11a and 11b that fit into the fitting holes 12a and 12b of the surface 12 are provided (see FIG. 2). In addition, the shape of the protrusion part in which the nail | claw parts 11a and 11b are provided is the same shape as the protrusion parts 11g and 11h shown in FIG.

  As shown in FIG. 3, the case front portion 11 is formed with a plate-like protrusion 11 i that protrudes rearward from the edge 11 m on the upper surface 14 side of the rear end, and the plate-like protrusion 11 i A claw portion 11e that fits in the fitting hole 14a of the upper surface 14 is provided on the outer surface. The claw portion 11e has an inclined surface 111e on the outer side, and is formed so that the thickness in the vertical direction decreases toward the rear.

Further, as shown in FIG. 2, the case front portion 11 is formed with a plate-like protruding portion (not shown) protruding rearward from the edge 11 n on the bottom surface 15 side at the rear end. A claw portion 11f that fits in the fitting hole 15a is provided (see FIG. 2). In addition, the shape of the protrusion part in which the nail | claw part 11f is provided is the same shape as the protrusion part 11i shown in FIG.
Further, as shown in FIG. 3, the first wiring connection portion 39 a of the power supply circuit unit 3 is disposed in the vicinity of the upper end inside the case front portion 11. A through hole 11o for tightening or loosening the screw 390 of the first wiring connection portion 39a is provided in the front surface 110 of the case front portion 11. Further, a through hole 11p for inserting a wiring is provided in the upper surface 114.

Similarly, in the vicinity of the lower end inside the case front portion 11, the second wiring connection portion 39 b of the power circuit unit 3 is arranged. A through hole 11q for tightening or loosening the screw 390 of the second wiring connection portion 39b is provided in the front surface 110 of the case front portion 11. Furthermore, a through hole 11r (see FIG. 3) for inserting a wiring is provided on the lower surface 115 (see FIG. 2).
(1-2. Heat sink 2a, 2b)
In this embodiment, the heat sinks 2a and 2b are plate-like members formed of aluminum. The heat sinks 2a and 2b are an outer surface 12s of the right side surface 12 of the case body 10 (see FIG. 4B, see FIG. 7 described later) and an outer surface 13s of the left side surface 13 (see FIG. 4C), which will be described later. 7), the heat radiating plate on the right side surface 12 side is 2a, and the heat radiating plate on the left side surface 13 side is 2b.

The heat radiating plate 2 a is formed in substantially the same outer shape as the right side surface 12 so as to cover the entire right side surface 12 of the case body 10.
The heat radiating plate 2b is formed in substantially the same outer shape as the left side surface 13 so as to cover the entire left side surface 13 of the case body 10, and a slit 23 is formed in the heat radiating plate 2b.
The slit 23 is formed so as to penetrate the heat radiating plate 2b. As will be described in detail later, the slit 23 is formed at a position substantially surrounding the aluminum electrolytic capacitor 35 when viewed from the direction perpendicular to the left side surface 13. (See FIG. 6).

  As shown in FIG. 1, the slit 23 includes a first slit portion 23a formed in the front-rear direction, a second slit portion 23b formed downward from the front end of the first slit portion 23a, and a first slit portion. And a third slit portion 23c formed downward from the rear end of 23a. Further, the lower end 23bu of the second slit portion 23b and the lower end 23cu of the third slit portion 23c do not reach the lower end 2bu of the heat sink 2b.

  A portion outside the slit 23 of the heat radiating plate 2 b is a first heat radiating portion 24, and a portion surrounded by the slit 23 is a second heat radiating portion 25. That is, the 1st thermal radiation part 24 and the 2nd thermal radiation part 25 which were thermally isolate | separated by the slit 23 are formed in the heat sink 2b. As will be described in detail later, heat from the transformer 34 is radiated from the first heat radiating portion 24, and heat from the aluminum electrolytic capacitor 35 is radiated from the second heat radiating portion 25.

  In addition, since the 2nd slit part 23b and the 3rd slit part 23c are not formed to the lower end 2bu of the heat sink 2b, the 1st heat radiating part 24 and the 2nd heat radiating part 25 are the lower end 23bu and the lower end of the 2nd slit part 23b. 2bu (crossover portion 26) and a portion (crossover portion 27) between the lower end 23cu and the lower end 2bu of the third slit portion 23c (crossover portion 27), these crossover portions 26 and 27 are connected to the heat sink 2b. It is for maintaining mechanical strength.

That is, in the present embodiment, the first heat radiating portion 24 and the second heat radiating portion 25 are thermally separated as long as they are substantially thermally separated. For example, the mechanical properties of the heat radiating plate 2b It can be said that the structure in which the transition portions 26 and 27 for maintaining the strength are formed is also thermally separated.
Further, the heat sink 2a is formed with notches 21 and 22 so as not to block the fitting holes 12a and 12b formed on the right side surface 12, and the heat sink 2b is also formed on the left side surface 13. Cutouts 21 and 22 are formed so as not to block the fitting holes 13a and 13b.

Moreover, as an adhesive agent which attaches heat sink 2a, 2b to the right side surface 12 and the left side surface 13, a double-sided tape etc. are mentioned, However, The one where heat conductivity is higher than the case main body 10 after adhesion hardening is preferable.
(1-3. Power supply circuit unit 3)
FIG. 5 is a perspective view of the power supply circuit unit 3 of the power supply apparatus 100 according to the first embodiment. FIG. 6 is a side view showing the internal configuration of the power supply apparatus 100 according to the first embodiment. In FIG. 6, the internal configuration is indicated by a dotted line. 7 is a cross-sectional view taken along the line AA in FIG.

As shown in FIGS. 5 and 6, the power supply circuit unit 3 is housed in the case 1 and has a first substrate 31a and a second substrate 31b.
(1-3-1. First substrate 31a)
The first substrate 31 a is disposed so as to cover the entire inner side of the right side surface 12 along a direction parallel to the right side surface 12 of the case body 10. As shown in FIG. 7 to be described later, the first substrate 31a is slid and inserted into and supported by groove-shaped support portions 14m and 15m formed in the vicinity of the right side surface 12 on the inside of the upper surface 14 and the lower surface 15, respectively. ing. In addition, the description of "parallel" in this specification does not show a strict meaning.

On the first substrate 31a, a switching element 32, a heat sink 33a, a transformer 34, an aluminum electrolytic capacitor 35, a rectifier diode 30, a heat sink 33b, a bridge diode 36, an aluminum electrolytic capacitor 37, a coil 38, and the like are arranged as main components. ing. These components are arranged on the surface on the left side surface 13 side of the first substrate 31a.
The switching element 32 is a MOSFET (metal-oxide-semiconductor field-effect transistor) or the like, and is disposed on the back surface 16 side of the first substrate 31a. The heat sink 33a is plate-shaped and dissipates heat generated by the switching element 32. The heat sink 33 a is disposed along a direction in which the plate-like surface 33 as is perpendicular to the first substrate 31 a and perpendicular to the upper surface 14 and the bottom surface 15 of the case body 10.

  The transformer 34 and the aluminum electrolytic capacitor 35 are disposed on the opening 17 side (front side) of the heat sink 33a of the first substrate 31a. A transformer 34 is disposed on the upper surface 14 side, and an aluminum electrolytic capacitor 35 is disposed on the bottom surface 15 side of the transformer 34. The aluminum electrolytic capacitor 35 has a cylindrical shape and includes a side surface 35a, an end surface 35b, and an end surface 35c. Terminals 35d are provided on the end face 35b as shown in FIG. 7, and are electrically connected to the first substrate 31a. In the present embodiment, the aluminum electrolytic capacitor 35 has an end surface 35 b and an end surface 35 c arranged along a direction parallel to the top surface 14 and the bottom surface 15. It can also be said that the aluminum electrolytic capacitor 35 is arranged such that a part of the side surface 35a thereof faces the first substrate 31a.

The heat sink 33 b is provided to dissipate heat from the rectifier diode 30. The heat sink 33 b has a shape obtained by bending a plate-like member into an L shape, and is disposed on the opening 17 side of the transformer 34. Further, the heat sink 33 b is disposed along a direction in which the plate-like surface 33 bs is perpendicular to the upper surface 14 and the bottom surface 15 of the case body 10.
The bridge diode 36 is disposed below the heat sink 33b. The bridge diode 36 has a plate shape, and a surface 36 a (see FIG. 6) is arranged along a direction perpendicular to the upper surface 14 and the bottom surface 15 of the case body 10.

  Three aluminum electrolytic capacitors 37 are arranged in the vertical direction (opposite direction of the top surface 14 and the bottom surface 15). As shown in FIGS. 5 and 6, each aluminum electrolytic capacitor 37 has a cylindrical shape, and has a side surface 37a and two opposing end surfaces (only one end surface 37c is shown). The end surface 37c faces the left side surface 13 and is provided in parallel with the first substrate 31a. An end surface (not shown) faces the right side surface 12 and is provided in parallel with the first substrate 31a. Further, a terminal is provided on an end surface (not shown) facing the right side surface 12 and is electrically connected to the first substrate 31a.

A coil 38 is disposed on the bottom surface 15 side of these aluminum electrolytic capacitors 37.
The heat resistance temperature of the aluminum electrolytic capacitor is generally 100 to 105 degrees, which is lower than the heat resistance temperature 110 to 130 degrees of the transformer 34 and the like.
(1-3-2. Second substrate 31b)
The second substrate 31b is arranged on the case front part 11 side (not shown in FIG. 5 but shown in FIG. 6) from the three aluminum electrolytic capacitors 37 and the coil 38, as shown in FIG. It arrange | positions so that the opening 17 of the case main body 10 may be plugged up. In addition, the second substrate 31 b is disposed on the front side of the first substrate 31 a along a direction perpendicular to the first substrate 31 a and perpendicular to the upper surface 14 and the bottom surface 15 of the case body 10.

  The second substrate 31b is mainly provided with a first wiring connection portion 39a and a second wiring connection portion 39b. The first wiring connection portion 39a and the second wiring connection portion 39b are provided on the front surface 110 side surface of the second substrate 31b. When the case body 10 and the case front portion 11 are combined, the case front portion 11 is combined. Placed inside. The first wiring connection portion 39a and the second wiring connection portion 39b are each divided so that a plurality of wirings can be connected.

Screws 390 for fixing the wiring for each section are inserted into the first wiring connecting portion 39a from the front surface 110 side, and wiring for fixing the wiring fixed with the screws 390 is inserted into the upper surface 114 side. A portion 391 is provided. The second wiring connection portion 39b has the same structure as the first wiring connection portion 39a, but the wiring insertion portion 391 is provided on the lower surface 115 side.
(1-4. Heat dissipation gel sheets 4a and 4b)
The heat radiating gel sheets 4a and 4b of Embodiment 1 have insulating properties, heat transfer properties, elasticity, and adhesiveness.

  As shown in FIGS. 5 to 7, in the power supply device 100 according to the first embodiment, the heat radiating gel sheet 4 a is disposed in close contact with the surface 34 a of the transformer 34 that generates a large amount of heat (see arrow Y <b> 1 in FIG. 5). The surface 34a is a surface on the left side surface 13 side. The heat-dissipating gel sheet 4a has a rectangular parallelepiped shape as shown in FIG. 5, and has a first surface 4aa and a second surface 4ab facing each other as shown in FIG. The heat radiation gel sheet 4 is in direct contact with the surface 34a of the transformer 34 on the first surface 4aa. Further, the heat radiating gel sheet 4a is in direct contact with a slide sheet 5a described later on the second surface 4ab, and the slide sheet 5a is in contact with the first heat radiating portion 24 of the heat radiating plate 2b via the left side surface 13.

  Further, the heat radiating gel sheet 4b is disposed in close contact with the side surface 35a of the aluminum electrolytic capacitor 35 (see arrow Y3 in FIG. 5). The heat dissipating gel sheet 4b has a rectangular parallelepiped shape as shown in FIG. 5, and has a first surface 4ba and a second surface 4bb facing each other as shown in FIG. The heat dissipation gel sheet 4 is in direct contact with the side surface 35a of the aluminum electrolytic capacitor 35 on the first surface 4ba. The heat radiating gel sheet 4b is in direct contact with a slide sheet 5b described later on the second surface 4bb, and the slide sheet 5b is in contact with the second heat radiating portion 25 of the heat radiating plate 2b via the left side surface 13.

(1-5. Slide sheet 5a, 5b)
(1-5-1. Configuration and arrangement of slide sheets 5a and 5b)
The slide sheets 5a and 5b shown in FIGS. 5 to 7 are formed of resin or the like.
The slide sheet 5a is disposed between the second surface 4ab of the heat radiating gel sheet 4a and the inner surface 12i of the left side surface 13 in direct contact with the heat radiating gel sheet 4a and the left side surface 13 (see FIGS. 7 and 5). (See arrow Y2). In addition, as shown in FIG. 6, the slide sheet 5 a is disposed to face the first heat radiating portion 24 of the heat radiating plate 2 b with the left side surface 13 interposed therebetween.

The slide sheet 5b is disposed between the second surface 4bb of the heat radiating gel sheet 4b and the inner surface 13i of the left side surface 13 so as to be in direct contact with the heat radiating gel sheet 4b and the left side surface 13 (FIGS. 7 and 7). 5 arrow Y4). Further, as shown in FIG. 6, the slide sheet 5 b is disposed so as to face the second heat radiating portion 25 of the heat radiating plate 2 b with the left side surface 13 interposed therebetween.
The slide sheets 5a and 5b are used for inserting the power supply circuit unit 3 in a state in which the heat-dissipating gel sheets 4a and 4b having adhesive properties are arranged into the case main body 10. For this reason, the slide sheets 5a and 5b are formed of resin or the like, and preferably have a higher slidability with respect to the inner surface of the case body 10, particularly the inner surface 13i of the left side surface 13, and at least the first of the heat radiating gel sheets 4a and 4b. It is preferable that the slidability of the two surfaces 4ab and 4bb with respect to the inner surface 13i is higher.

With the above configuration, the heat generated in the transformer 34 is transmitted to the first heat radiating portion 24 of the heat radiating plate 2b via the heat radiating gel sheet 4a, the slide sheet 5a, and the case 1 (specifically, the left side surface 13). . The heat transmitted to the first heat radiating portion 24 of the heat radiating plate 2 b spreads in the surface direction at the first heat radiating portion 24 of the heat radiating plate 2 b and is radiated to the outside of the power supply device 100.
The heat of the aluminum electrolytic capacitor 35 is transmitted to the second heat radiating portion 25 of the heat radiating plate 2b through the heat radiating gel sheet 4b, the slide sheet 5b, and the case 1 (specifically, the left side surface 13). The heat transmitted to the second heat radiating portion 25 of the heat radiating plate 2 b spreads in the surface direction at the second heat radiating portion 25 of the heat radiating plate 2 b and is radiated to the outside of the power supply device 100.

Here, the heat transmitted to the first heat radiating portion 24 is generally blocked from being transmitted to the second heat radiating portion 25 due to the presence of the slits 23. Therefore, heat from the transformer 34 is not transmitted to the aluminum electrolytic capacitor 35 via the first heat radiating portion 24. Further, the heat of the aluminum electrolytic capacitor 35 can be radiated from the second heat radiating portion 25.
(1-5-2. Manufacturing Method of Power Supply Device 100 Using Slide Sheets 5a and 5b)
FIG. 8 is an exploded view for explaining a method of manufacturing the power supply device 100 of the first embodiment.

First, the heat radiating gel sheets 4a and 4b are respectively disposed on the surface 34a of the transformer 34 and the side surface 35a of the aluminum electrolytic capacitor 35 of the power supply circuit unit 3 (see arrows Y1 and Y3 in FIG. 5).
Next, the slide sheets 5a and 5b are respectively arranged on the heat radiation gel sheets 4a and 4b (see arrows Y2 and Y4 in FIG. 5). Here, since the heat-dissipating gel sheets 4a and 4b are adhesive, the slide sheets 5a and 5b are in close contact with the heat-dissipating gel sheets 4a and 4b by pressing the slide sheets 5a and 5b against the heat-dissipating gel sheets 4a and 4b. It becomes a state.

Next, as shown in FIG. 9, the power supply circuit unit 3 in which the slide sheets 5a and 5b and the heat radiating gel sheets 4a and 4b are arranged is inserted into the case body 10 while being slid (see arrow E).
Next, the case main body 10 and the case front part 11 are connected by fitting the respective claw portions 11a, 11b, 11c, 11d, and 11e into the fitting holes 12a, 12b, 13a, 13b, 14a, and 15a, respectively. Is formed. The claw portion 11c will be described in detail as an example. When the case front portion 11 is attached to the case body 10 from the direction of arrow E, the inclined surface 111c comes into contact with the front end 13f and slides on each other. At the same time, the protruding portion 11g bends inward, the claw portion 11c enters the inside of the case body 10, and the claw portion 11c fits into the fitting hole 13a. The same applies to the other claws.

And the heat sink 2a, 2b is adhere | attached on the outer surface 12s of the right side surface 12 of the case main body 10, and the outer surface 13s of the left side surface 13, respectively. As described above, the power supply device 100 of this embodiment can be manufactured.
As described above, since the heat radiating gel sheets 4a and 4b are sticky, only the heat radiating gel sheets 4a and 4b are disposed without the slide sheets 5a and 5b, and the power supply circuit unit 3 is inserted into the case body 10. Then, the heat radiating gel sheets 4a and 4b are in close contact with the inner surface of the case body 10 and are difficult to slide.

Therefore, by disposing the slide sheets 5a, 5b on the second surfaces 4ab, 4bb side of the heat radiating gel sheets 4a, 4b, the heat radiating gel sheets 4a, 4b are disposed in the transformer 34 and the aluminum electrolytic capacitor 35 of the power circuit unit 3. Can be inserted into the case body 10.
(1-6. Positional relationship between slit 23 and aluminum electrolytic capacitor 35)
As shown in FIG. 6, when viewed from the direction perpendicular to the heat sink 2 b and the left side surface 13, the slit 23 surrounds and surrounds at least the side of the aluminum electrolytic capacitor 35 other than the side opposite to the transformer 34. The transformer 34 is formed so as not to enter inside. A portion of the heat sink 2b on the opposite side of the transformer 34 of the aluminum electrolytic capacitor 35 is shown in FIG. 1 and FIG.

And the thermal radiation gel sheet | seat 4b and the slide sheet | seat 4b are also arrange | positioned inside the slit 23. FIG. Note that the heat radiating gel sheet 4 a and the slide sheet 5 a disposed in the transformer 34 are also formed so as not to enter the inside of the slit 23.
That is, when viewed from the direction perpendicular to the heat radiating plate 2 b, the transformer 34, the heat radiating gel sheet 4 a, and the slide sheet 5 a are disposed in the first heat radiating portion 24, and the aluminum electrolytic capacitor 35, heat radiating in the second heat radiating portion 25. A gel sheet 4b and a slide sheet 5b are arranged.

<2. Main features>
As described above, the power supply apparatus 100 (an example of an electronic device) according to the present embodiment includes the case 1 (an example of a housing), the aluminum electrolytic capacitor 35, the transformer 34 (an example of a heat generating component), and the heat radiating plate 2b. I have. Case 1 is formed of resin. The aluminum electrolytic capacitor 35 is disposed in the case 1. The transformer 34 is disposed in the case 1 and generates a larger amount of heat than the aluminum electrolytic capacitor 35. The heat radiating plate 2 b is disposed on the outer surface 13 s (an example of the outer surface) of the case 1 and has a higher thermal conductivity than the resin forming the case 1. The heat radiating plate 2 b is formed with a first heat radiating portion 24 that radiates heat from the transformer 34 and a second heat radiating portion 25 that radiates heat from the aluminum electrolytic capacitor 35 and is thermally separated from the first heat radiating portion 24. Has been.

  Since the first heat radiating portion 24 and the second heat radiating portion 25 are thermally separated, heat is not transferred from the first heat radiating portion 24 to which the heat generated by the transformer 34 is transmitted to the aluminum electrolytic capacitor 35, and further, aluminum. Since the heat of the electrolytic capacitor 35 is dissipated from the second heat radiating portion 25, it is possible to suppress the life of the aluminum electrolytic capacitor from being shortened, and the life of the electronic device equal to or longer than that of the conventional one can be realized. Here, the thermal separation means that the first heat radiating portion and the second heat radiating portion are connected to such an extent that the mechanical strength of the heat radiating plate is maintained.

For this reason, it is possible to provide electric air that can be miniaturized and has good heat dissipation and can ensure an appropriate life.
<3. Modification of Embodiment 1>
(A)
In the above embodiment, the slit 23 is formed so as to penetrate the heat radiating plate 2b as an example of a groove shape. However, the slit 23 may not be penetrated and may be a groove shape. Fig.9 (a) is sectional drawing which shows typically the part of the slit 23 of the heat sink 2b of this embodiment. The outer surface is indicated by 2bs, and the inner surface is indicated by 2bi. This inner surface 2bi indicates a surface in contact with the outer surface 13s of the left side surface 13.

As shown in FIG. 9B, the heat radiating plate 2b may not be penetrated, and may be a slit 231 formed in a concave shape from the outer surface 2bs.
Moreover, as shown in FIG.9 (c), the slit 232 formed in the concave shape from the inner surface 2bi which is the opposite side to FIG.9 (b) may be sufficient. In short, it is sufficient that heat is not easily transferred.

(B)
Moreover, in the said embodiment, although the 1st slit part 23a of the slit 23, the 2nd slit part 23b, and the 3rd slit part 23c are formed in linear form, it is not restricted to this.
For example, as shown in FIG. 10, it may be a slit 233 having a curved shape. In FIG. 10, the transformer 34 and the aluminum electrolytic capacitor 35 are schematically shown. In short, as long as it is viewed from the direction perpendicular to the left side surface 13, it suffices if it is formed so as to surround at least the side opposite to the transformer 34 of the aluminum electrolytic capacitor 35.

  Moreover, in the said embodiment, although the slit 23 is formed so that the thermal radiation part 2b may penetrate through the 1st slit part 23a, the 2nd slit part 23b, and the 3rd part, the heat sink 2b is attached to the left side surface 13. For the purpose of ensuring the strength of the heat radiating plate 2b so as to be easy, a connecting portion 23p for connecting the first heat radiating portion 24 and the second heat radiating portion 25 may be formed like a slit 234 shown in FIG. 11A.

  In the example shown in FIG. 11A, connecting portions 23p are formed between the first slit portion 23a and the second slit portion 23b and between the first slit portion 23a and the third slit portion 23c. Furthermore, as shown to FIG. 11B, the slit 235 in which multiple connection parts 23p were formed may be sufficient. It can be said that the slit 235 shown in FIG. 11B is formed of a plurality of slit portions 235p.

  Further, as shown in FIG. 11C, the heat radiating plate 2 b may be separated, and the first heat radiating portion 24 may be disposed above the second heat radiating portion 25. The heat radiating plate 2b shown in FIG. 11C is separated into two heat radiating plate portions 2000b (an example of a first heat radiating portion) and a heat radiating plate portion 2001b (an example of a second heat radiating portion) in the vertical direction. The upper heat radiating plate portion 2000b is disposed so as to cover the heat radiating gel sheet 4a placed on the transformer 34 with the left side surface 13 interposed therebetween, and the lower heat radiating plate portion 2001b has the left side surface 13 sandwiched therebetween. The heat dissipating gel sheet 4b disposed on the aluminum electrolytic capacitor 35 is disposed so as to cover. In FIG. 11c, the slide sheets 5a and 5b are omitted.

(C)
In the said embodiment, although the heat sink 2a was arrange | positioned also on the right side surface 12, it does not need to be arrange | positioned.
(D)
In the said embodiment, although the 1st thermal radiation part 24 and the 2nd thermal radiation part 25 were connected by the crossover parts 26 and 27, the crossover parts 26 and 27 are not left and may be isolate | separated completely.

(E)
In the above embodiment, the slide sheets 5a and 5b are described as being formed of resin, but may be made of glass, paper or other materials. It is not limited to resin. It is preferable that it is solid and has a strength that does not break even when housed in the housing while being in contact with the inner surface of the housing.

(Embodiment 2)
Next, the power supply apparatus 200 of Embodiment 2 which concerns on this invention is demonstrated. The power supply device 200 of the second embodiment has the same basic configuration as the power supply device 100 of the first embodiment, but differs from the first embodiment in that the heat of the aluminum electrolytic capacitor 35 is radiated from the heat radiating plate 2a. ing. Therefore, this difference will be mainly described. In addition, the same code | symbol is attached | subjected about the structure similar to Embodiment 1. FIG.

<1. Configuration>
FIG. 12 is a perspective view of the power supply apparatus 200 according to the second embodiment. As illustrated in FIG. 12, the power supply device 200 according to the second embodiment includes a left side surface 2b ′ in which a slit 23 is not formed instead of the left side surface 2b, as compared with the power supply device 100 according to the second embodiment. .
FIG. 13 is a perspective view showing a power supply circuit unit 3 ′ of the power supply apparatus 200 according to the second embodiment. 14 is a side view of the power supply device 200 of FIG. 13, and FIG. 15 is a cross-sectional view taken along the line BB of FIG.

  As shown in FIG. 13, the first substrate 31 a ′ of the power supply circuit unit 3 ′ of the present embodiment is formed with a through hole 31 ap ′ in a portion where the aluminum electrolytic capacitor 35 is disposed. An aluminum electrolytic capacitor 35 is fitted into the through hole 31ap ′. Assuming that the surface of the first substrate 31a ′ on which the transformer 34 and the like are disposed is the front surface 31as ′ and the opposite surface is the back surface 31ab ′, as shown in FIG. A part protrudes from the back surface 31ab ′.

  In the second embodiment, the heat radiating gel sheet 4b is not disposed on the left side surface 13 side of the aluminum electrolytic capacitor 35, and the heat radiating gel sheet 4c is disposed on the right side surface 12 side as shown in FIG. Yes. That is, the heat dissipating gel sheet 4c is disposed in contact with the side surface 35a of the aluminum electrolytic capacitor 35 protruding from the back surface 31ab 'of the first substrate 31a'. Here, since the heat radiating gel sheet 4c has elasticity, the heat radiating gel sheet 4c is deformed in accordance with the shape of the side surface 25a and comes into contact with the back surface 31ab 'of the first substrate 31a'.

And as shown to the C section enlarged view of FIG. 15, between the thermal radiation gel sheet 4c and the right side surface 12, the slide sheet 5c is arrange | positioned in contact with each. Similar to the first embodiment, the slide sheet 5 c is used to insert the heat radiating gel sheet 4 c into the case body 10 in a state where the heat radiating gel sheet 4 c is arranged in the power circuit unit 3.
As shown in the enlarged view of part C of FIG. 15, the aluminum electrolytic capacitor 35, the heat radiating gel sheet 4c, the slide sheet 5c, the right side surface 12, and the heat radiating plate 2a are arranged in direct contact in this order. The heat is transmitted to the heat radiating plate 2a, spreads in the surface direction of the heat radiating plate 2a, and is released to the outside of the power supply device 200.

On the other hand, the heat generated by the transformer 34 is transmitted to the heat radiating plate 2b ′ via the heat radiating gel sheet 4a, the slide sheet 5a, and the left side surface 13 as in the first embodiment, and is transmitted in the surface direction at the heat radiating plate 2b ′. It is discharged to the outside of the power supply device 200.
<2. Main features>
As described above, the power supply apparatus 200 according to the second embodiment includes the heat radiating plate 2b ′ (an example of the first heat radiating unit) that radiates the heat generated by the transformer 34 (an example of the heat generating component) and the aluminum electrolytic capacitor 35. The heat dissipating plate 2a (an example of the second heat dissipating part) that is thermally separated from the heat dissipating plate 2b 'is provided.

  As described above, in the first embodiment, the first heat radiating portion 24 that radiates heat from the transformer 34 and the second heat radiating portion 25 that radiates heat from the aluminum electrolytic capacitor 35 are formed on one heat radiating plate 2b. However, in the second embodiment, one of the two heat radiating plates 2a and 2b 'functions as a second heat radiating portion that radiates heat from the aluminum electrolytic capacitor 35, and the other heat radiating plate 2b. 'Functions as a first heat radiating section that releases heat from the transformer 34.

In this case, since the area of each of the first heat radiating part and the second heat radiating part can be ensured wider than that of the first embodiment, heat can be radiated more effectively.
Further, since there is no portion where the first heat radiating portion and the second heat radiating portion are connected, the heat of the first heat radiating portion is hardly transmitted by the second heat radiating portion, and the heat of the aluminum electrolytic capacitor 35 can be radiated more efficiently.
<3. Modification of Embodiment 2>
In the second embodiment, the aluminum electrolytic capacitor 35 is radiated, but the aluminum electrolytic capacitor 37 may be radiated.

  FIG. 16 is a left side view showing a power supply device 300 having a configuration for dissipating heat from the aluminum electrolytic capacitor 37. 17 is a cross-sectional view taken along the line FF in FIG. In the power supply device 300 shown in FIGS. 16 and 17, a first substrate 31a similar to that of the first embodiment is provided instead of the first substrate 31a ′ of the power supply device 200 of the second embodiment. As shown in FIG. 17, in the power supply device 300, the heat radiating gel sheet 4d is disposed in direct contact with the back surface 31ab of the first substrate 31a. A slide sheet 5d is provided between the heat radiating gel sheet 4d and the inner surface 12i of the right side surface 12. Here, the heat radiating gel sheet 4 d is disposed in direct contact with the terminals 37 d of the three aluminum electrolytic capacitors 37.

Thereby, the heat of the aluminum electrolytic capacitor 37 is transmitted from the terminal 37d to the heat radiating plate 2a via the heat radiating gel sheet 4d, the slide sheet 5d, and the right side surface 12, and spreads in the surface direction in the heat radiating plate 2a to the outside. Released.
In the power supply device 300, the aluminum electrolytic capacitor 35 may be radiated. That is, as in the second embodiment, a through hole may be formed in the first substrate 31a to radiate heat from the aluminum electrolytic capacitor 35, or the terminal 35d of the aluminum electrolytic capacitor 35 (see FIG. 15) without forming the through hole. The heat dissipating gel sheet 4 may be disposed in direct contact with the heat sink.

[Modifications common to Embodiments 1 and 2]
(A)
In the first and second embodiments, the heat radiating gel sheets 4 a, 4 b, 4 c, and 4 d disposed on the transformer 34 and the aluminum electrolytic capacitors 35 and 37 are radiated from the heat sinks via the slide sheets 5 a, 5 b, 5 c, 5 d, and the case 1. 2a, 2b, and 2b ′ were indirectly contacted, but it is not limited to such a configuration. In short, regardless of whether directly or indirectly, the heat generating component or the aluminum electrolytic capacitor is in contact with the heat sink, Any structure may be used as long as heat from the heat generating component or the aluminum electrolytic capacitor is transferred to the heat sink.

Hereinafter, various configurations of indirect or direct contact between the heat generating component, the aluminum electrolytic capacitor, and the heat radiating plate 2b will be described as modified examples.
(A1)
In the above embodiment, the transformer 34, which is an example of the heat generating component, indirectly contacts the heat radiating plate 2b via the heat radiating gel sheet 4a, the slide sheet 5a, and the case 1, and the heat from the transformer 34 is transferred to the heat radiating plate 2b. Has been communicated. Further, the aluminum electrolytic capacitor 35 is indirectly in contact with the heat radiating plate 2b via the heat radiating gel sheet 4b, the slide sheet 5b, and the case 1 in the power supply device 100 of the first embodiment. The heat radiating gel sheet 4c, the slide sheet 5c, and the case 1 are in contact with the heat radiating plate 2a. Further, in the power supply device 300, the heat radiating gel sheet 4d, the slide sheet 5d, and the case 1 are in contact with the heat radiating plate 2a. . In these configurations, the slide sheets 5a, 5b, 5c, and 5d may not be provided. This configuration corresponds to an example in which the heat generating component or the aluminum electrolytic capacitor is indirectly in contact with the heat sink via the heat transfer member and the housing.

FIG. 18A is a perspective view of the power supply device 400 having such a configuration, and FIG. 18B is a perspective view showing the internal configuration of the case main body 410 of FIG. 18A indicated by a dotted line. . FIG. 19 is a front sectional view of the power supply device 400 shown in FIG. 18A, and is a sectional view at the same position as between AA in FIG. FIG. 20 is an exploded view of the power supply apparatus 400.
The power supply device 400 is different in that the slide sheets 5a and 5b are removed from the power supply device 100 of the first embodiment.

  As shown in FIG. 19, in the power supply device 400, the first surface 4 aa of the heat radiating gel sheet 4 directly contacts the surface 34 a of the transformer 34, and the second surface 4 ab of the heat radiating gel sheet 4 a directly contacts the inner surface 13 i of the left side surface 13. doing. The heat radiating gel sheet 4a faces the first heat radiating portion 24 of the heat radiating plate 2b with the left side surface 13 interposed therebetween. In this power supply device 400, the heat generated by the transformer 34 is transmitted to the first heat radiating portion 24 of the heat radiating plate 2b via the heat radiating gel sheet 4a and the left side surface 13, and spreads in the surface direction by the first heat radiating portion 24 to the outside. Is released.

  The first surface 4ba of the heat radiating gel sheet 4b is in contact with the side surface 35a of the aluminum electrolytic capacitor 35, and the second surface 4bb of the heat radiating gel sheet 4b is in direct contact with the inner surface 13i of the left side surface 13. The heat radiating gel sheet 4b faces the second heat radiating portion 25 of the heat radiating plate 2b with the left side surface 13 interposed therebetween. The heat of the aluminum electrolytic capacitor 35 is transmitted to the second heat radiating portion 25 of the heat radiating plate 2b through the heat radiating gel sheet 4b and the left side surface 13, and spreads in the surface direction by the second heat radiating portion 25 and is released to the outside.

  Here, since the heat radiating gel sheets 4a and 4b have adhesiveness, if the power circuit unit 3 is slid and inserted as described with reference to FIG. Since the gel sheets 4a and 4b are in close contact with the inner surface 13i of the left side surface 13, it is difficult to insert them. Therefore, in the power supply apparatus 400, as shown in FIG. 18, the case body 410 of the case 401 is formed by joining two members 410a and 410b. One member 410 a includes the right side surface 12. The other member 410 b includes the left side surface 13. In other words, it can be said that the case main body 410 shown in FIG. 18A is obtained by dividing the case main body 10 of the first embodiment (see FIG. 4) into two parts.

  The case body 410 is cut along a plane parallel to the left side surface 13 and the right side surface 12. As shown in FIG. 18, this plane is a plane that passes between the vent hole 141b on the left side surface 13 side and the plurality of hexagonal vent holes 141a. A joint S where the cut surfaces are joined is shown in FIGS. 18 and 19. As shown in FIG. 18, the external appearance of the power supply device 400 is the same as that of the power supply device 100 shown in FIG. 1 except for the joint portion S in a state where the heat radiation plates 2 a and 2 b are attached to the case 401.

  As shown in FIG. 20, after the heat dissipation gel sheet 4a is disposed on the transformer 34 and the heat dissipation gel sheet 4b is disposed on the aluminum electrolytic capacitor 35, the power supply circuit unit 3 is accommodated in the second member 410b, and then the adhesive. By joining the first member 410a to the second member 410b by, for example, the power supply circuit unit 3 can be stored in the case body 410 with the heat-dissipating gel sheets 4a and 4b attached.

The joining of the first member 410a and the second member 410b is not limited to an adhesive, and may be performed with a screw or the like, or may be configured to fit each other.
In the power supply device 400 shown in FIG. 18, the case main body 410 has two members (first members 410a) in order to make it easy to store the power supply circuit unit 3 in the case main body 310 without arranging the slide sheets 5a and 5b. However, a box-shaped case main body 10 may be used as shown in FIG. However, in this case, it becomes difficult to insert the power supply circuit unit 3 into the case body 10 due to the adhesiveness of the heat radiating gel sheets 4a and 4b. Moreover, when using the box-shaped case main body 10 in this way, it is preferable to use the heat-dissipating gel sheets 4a and 4b having low adhesiveness because the power supply circuit unit 3 can be easily inserted.

  In addition, as a modification of the first embodiment, the configuration in which the heat radiating gel sheet 4 is directly in contact with the case 1 without using the slide sheet has been described, but the above configuration can also be applied to the second embodiment. That is, the slide sheet 5c shown in FIG. 15 is not provided, and the heat radiating gel sheet 4c may be in direct contact with the inner surface 12i of the right side surface 12, or the slide sheet 5d shown in FIG. 17 is not provided. The heat radiating gel sheet 4d may be in direct contact with the inner surface 12i of the right side surface 12.

(A2)
In the above embodiment, the transformer 34 or the aluminum electrolytic capacitor 35 is connected to the heat radiating plate 2 (4a, 4b, 4c, 4d), the slide sheet 5 (5a, 5b, 5c, 5d), and the case 1 via the case 1 ( 2a, 2b), but the heat radiating gel sheet 4 (4a, 4b, 4c, 4d) may be in direct contact with the heat radiating plate 2 (2a, 2b). This configuration corresponds to an example in which the heat generating component or the aluminum electrolytic capacitor is indirectly in contact with the heat sink via the heat transfer member.

FIG. 21 is a perspective view of the power supply device 500 having such a configuration, showing a state in which the heat sink 2b is removed. The power supply device 500 of FIG. 21 is different from the power supply device 100 in that the slide sheet 5 is not provided and that the openings 13e and 13h are formed in the left side surface 513 of the case 501.
FIG. 22 is a front sectional view of the power supply device 300 shown in FIG. 21, which is a cut surface parallel to the front surface 110 and passing through the transformer 34 and the electrolytic capacitor 35. FIG. 23 is an exploded view of the power supply device 500.

As shown in FIGS. 21 to 23, in the case 501 of the power supply device 500, an opening 13e facing the transformer 34 and an opening 13h facing the aluminum electrolytic capacitor 35 are formed on the left side surface 513 of the case body 510. Yes. The openings 13e and 13h penetrate the outside and the inside of the left side surface 513.
As shown in FIG. 22, in the power supply device 500, the first surface 4aa of the heat radiating gel sheet 4a is in direct contact with the surface 34a of the transformer 34, and the second surface 4ab of the heat radiating gel sheet 4a passes through the opening 13e. It is in direct contact with the first heat radiating portion 24 of the heat radiating plate 2b. With such a configuration, heat generated by the transformer 34 is transmitted from the heat radiating gel sheet 4a to the heat radiating plate 2b, spreads in the surface direction by the heat radiating plate 2b, and is released to the outside.

Further, the first surface 4ba of the heat radiating gel sheet 4b is in direct contact with the side surface 35a of the aluminum electrolytic capacitor 35, and the second surface 4bb of the heat radiating gel sheet 4b is brought into contact with the second heat radiating portion 25 of the heat radiating plate 2b through the opening 13h. Direct contact.
When the power supply device 500 is assembled, the power supply circuit unit 3 is first inserted into the main body case 510 without disposing the heat dissipating gel sheets 4a and 4b. Thereafter, the heat radiating gel sheets 4a and 4b are disposed on the transformer 34 and the aluminum electrolytic capacitor 35 through the openings 13 and 13h (see arrows T1 and T2 in FIG. 23). Thereafter, the case front portion 11 is attached to the case main body 510, and the heat radiating plates 2a and 2b are attached to the right side surface 12 and the left side surface 513 with double-sided tape.

  As described above, the configuration in which the heat radiating gel sheet 4 is in direct contact with the heat radiating plate 2 has been described using the power supply device 500 which is a modification of the first embodiment. However, such a configuration also applies to the second embodiment and the modification thereof. The same applies. That is, by forming an opening in the right side surface 12, the heat dissipating gel sheets 4c and 4d can be directly in contact with the heat dissipating plate 2a.

(A3)
In the above (A2), a heat dissipation gel sheet 4a, which is an example of a heat transfer member, is disposed in direct contact with a transformer 34, which is an example of a heat generating component, and the heat dissipation gel sheet 4a is in direct contact with the heat dissipation plate 2b. As described above, the heat generating component is not limited to the transformer 34, and the heat transfer member is not limited to the heat radiating gel sheet 4a.

For example, a configuration in which a heat sink 33b (an example of a heat transfer member) for radiating heat from the rectifier diode 30 (an example of a heat generating component and a semiconductor component) is in direct contact with the heat radiating plate 2b may be employed. This configuration corresponds to an example in which the heat generating component is in contact with the heat sink indirectly through the heat transfer member.
FIG. 24 is a perspective view of the power supply apparatus 600 having such a configuration. FIG. 25 is a left side view showing the internal configuration of the power supply device 600 of FIG. 26A is a cross-sectional view taken along the line DD in FIG. 25, and FIG. 26B is a cross-sectional view taken along the line EE in FIG.

  The power supply device 600 of FIG. 24 differs from the power supply device 400 shown in FIG. 18A in that an opening 13g for allowing the heat sink 33b to directly contact the heat radiating plate 2b is formed in the left side surface 613. . As shown in FIGS. 24, 26 (a), and 26 (b), the heat sink 33b has a shape obtained by bending a plate-like member into an L shape, and is shown in FIGS. 26 (a) and 26 (b). As shown, the first portion 33ba disposed along the direction perpendicular to the first substrate 31a and the tip of the first portion 33ba (the end on the left side 613 side) along the direction parallel to the first substrate 31a. The second portion 33bc is formed. The second portion 33bc is in direct contact with the first heat radiating portion 24 of the heat radiating plate 2b.

  In this power supply device 600, since it is necessary to insert the heat sink 33b into the opening 13g, the case main body 610 of the case 601 is connected to the first member 610a like the power supply device 400 shown in FIGS. The second member 410b is joined and configured. The first member 610a has the same configuration as the first member 410a shown in FIGS. 18 to 20 except for the opening 13g.

When the heat sink 33b is in direct contact with the heat radiating plate 2b as described above, it is necessary that the heat sink 33b and the rectifier diode 30 be insulated or the rectifier diode 0 itself be insulated.
In the power supply device 600, the heat sink 33b is in direct contact with the heat radiating plate 2b. However, the heat radiating gel sheet 4 may be disposed between the heat sink 33b and the heat radiating plate 2b in direct contact with each other. .

Moreover, the opening part 13g is not formed in the left side surface 613, but the heat sink 33b may contact the heat sink 2b indirectly via the heat dissipation gel sheet 4 and the left side surface 613.
Further, the heat sink 33b may be in direct contact with the left side surface 613 without the heat dissipation gel sheet 4 interposed therebetween.
In addition, the heat sink 33a may be used as an example of a heat transfer member similarly to the heat sink 33b and may be in direct contact with the heat radiating plate 2b directly or through a case.

In addition, when the electronic component itself is insulated, an opening may be formed in the case so that the electronic component is brought into direct contact with the heat sink 2b. Such a configuration corresponds to an example in which the heat generating component is in direct contact with the heat sink.
In addition to the semiconductor components such as the rectifier diode 30, the transformer 34 also radiates heat from the heat radiating plate 2 b, both of which generate a large amount of heat. Is preferred.

(B)
In the above embodiment and the above (A3), the transformer 34 and the rectifier diode 30 are exemplified as an example of the heat-generating component.
(C)
In the said embodiment, although the heat sink 2a, 2b was formed with aluminum, another metal may be sufficient and it does not need to be restricted to a metal. In short, it is only necessary to use a heat radiating plate having a higher thermal conductivity than the resin forming the cases 1, 401, 501, and 601 (particularly the case main bodies 10, 410, 510, and 610).

(D)
In the said embodiment, although the heat sink 2a, 2b was attached to the right side surface 12 and the left side surface 13 by adhesion | attachment, you may be attached by fitting or fastening.
(E)
Although the power supply device as an example of the electronic device has been described in the above embodiment, the power supply device is not limited to the power supply device, and the above-described structure can be applied to an electronic device having a heat generating component.

  The electronic device of the present invention is effective as a power supply device, particularly a switching power supply device and the like because it has the effect of reducing the size and ensuring good heat dissipation and an appropriate life.

1 Case (example of housing)
2 heat dissipation plate 2a heat dissipation plate (an example of a heat dissipation member, an example of a first heat dissipation part)
2b Heat dissipation plate (an example of heat dissipation member)
2b ′ (an example of a heat radiating member, an example of a second heat radiating portion)
2bu lower end 3 power supply circuit unit 4 heat dissipation gel sheet (an example of heat transfer member)
4a Heat-dissipating gel sheet (an example of a heat transfer member and a first heat transfer member)
4b Heat dissipation gel sheet (an example of a heat transfer member and a second heat transfer member)
4c Heat dissipation gel sheet (example of heat transfer member)
4d Heat dissipation gel sheet (an example of heat transfer member)
4aa, 4ba 1st surface 4ab, 4bb 2nd surface 5, 5a, 5b, 5c, 5d Slide sheet (an example of sheet-like member)
9 Support rail 9a Upper end portion 9b Lower end portion 10 Case body 11 Case front portion 11a, 11b, 11c, 11d, 11e, 11f Claw portion 11g, 11i Projection portion 11j Edge on the right side 11k Edge on the left side 11m On the upper side Edge 11n Bottom edge 11o, 11p, 11q, 11r Through-hole 12 Right side surface (an example of the second surface)
12a, 12b Fitting hole 12f Front end 12i Inner surface 12s Outer surface 13 Left side surface (example of first surface)
13a, 13b Fitting holes 13e, 13g, 13h Opening 13f Front end 13s Outer surface (an example of outer surface)
13i inner surface 14 upper surface (an example of the third surface or the fourth surface)
14a fitting hole 14c right end 14d left end 14e rear end 14f front end 14m support portion 15 bottom surface (an example of the third surface or the fourth surface)
15a fitting hole 15c right end 15d left end 15e rear end 15f front end 15m support part 16 back surface (an example of the fifth surface)
16a Upper end surface 16b Substantially central surface 16c Lower end surface 16d Locking portion 16e Recessed portion 16f Locking portion 16g Inclined surface 17 Opening 21, 22 Notch 23 Slit 23a First slit portion 23b Second slit portion 23bu Lower end 23c 3rd slit part 23cu lower end 23p connection part 24 1st thermal radiation part 25 2nd thermal radiation part 26, 27 Transition part 30 Rectifier diode 31a, 31a '1st board | substrate (an example of a board | substrate)
31ab ′ Back surface 31ap ′ Through hole (an example of a through hole)
31as ′ surface 31b second substrate 32 switching element 33a, 33b heat sink (an example of heat transfer member)
33ba 1st part 33bc 2nd part 33as, 33bs Surface 34 Transformer (an example of heat-generating component)
34a surface 35 aluminum electrolytic capacitor 35a side surface 35b, 35c end surface 35d terminal 36 bridge diode 36a surface 37 aluminum electrolytic capacitor 37a side surface 37b, 37c end surface 37d terminal 38 coil 39a first wiring connection portion 39b second wiring connection portion 100 power supply device 110 Front surface 111c, 111e Inclined surface 112 Right surface 113 Left surface 114 Upper surface 115 Lower surface 141, 141a, 141b Ventilation holes 151, 151a, 151b Ventilation holes 160 Mounting portion 200 Power supply device 201 Case 210 Case body 210a First member 210b Second member 231 232, 233, 234, 235 slit 235p slit portion 300 power supply device 390 screw 391 wiring insertion portion 400 power supply device 401 case 410 case main body 410a 1 member 410b second member 500 power supply 501 case 510 case main body 513 the left side 600 power supply 610 casing body 610a left side first member 613

Claims (13)

A box-shaped case main body having an opening, a lid portion disposed so as to close the opening, and a housing formed of resin;
An aluminum electrolytic capacitor disposed in the case body ;
A heating component that is disposed in the case body and has a larger heating value than the aluminum electrolytic capacitor,
Is disposed on the outer surface of the case body, and high plate-shaped heat radiating member thermal conductivity than the resin for forming the case body,
A first heat transfer member disposed between the heat generating component and the case main body, in direct contact with the heat generating component, indirectly in contact with the case main body, and having adhesiveness;
A second heat transfer member disposed between the aluminum electrolytic capacitor and the case body, in direct contact with the aluminum electrolytic capacitor, indirectly in contact with the case body, and having adhesiveness;
A first slide sheet in direct contact with the first heat transfer member and in direct contact with the case body;
A second slide sheet in direct contact with the second heat transfer member and in direct contact with the case body;
With
The heat dissipating member includes a first heat dissipating part that dissipates heat from the heat generating component via the first heat transfer member and the first slide sheet, and the second heat transfer member and the second heat dissipating from the aluminum electrolytic capacitor . and radiating heat through the sliding seat, Ri Contact the first heat radiating unit and the second heat radiating unit that is thermally separated is formed,
The case body covers both the heat generating component and the aluminum electrolytic capacitor,
The first heat radiating portion covers the first heat transfer member over the case body,
The second heat radiating portion covers the second heat transfer member over the case body.
Electronics. The heat radiating member covers at least the aluminum electrolytic capacitor and the heat generating component with a single member,
The heat radiating member is formed with a slit so as to surround at least other than the side away from the heat generating component of the aluminum electrolytic capacitor as viewed from a direction perpendicular to the heat radiating member,
The first heat radiating portion and the second heat radiating portion are separated by the slit,
The electronic device according to claim 1. The slit is formed in a groove shape in the heat dissipation member,
The electronic device according to claim 2. The housing has a first surface and a second surface,
The heat dissipation member is disposed on each of the first surface and the second surface,
The first heat radiating portion is the heat radiating member disposed on the first surface,
The second heat radiating portion is the heat radiating member disposed on the second surface.
The electronic device according to claim 1. The aluminum electrolytic capacitor and the heat generating component are provided, and includes a substrate disposed in the housing.
The first surface is disposed to face the second surface along a direction parallel to the second surface,
The substrate is disposed between the first surface and the second surface along a direction parallel to the first surface and the second surface;
The aluminum electrolytic capacitor and the heat generating component are provided on a surface of the substrate on the first surface side,
The electronic device according to claim 4. A through hole is formed in the substrate,
The second heat transfer member is disposed in direct contact with the aluminum electrolytic capacitor through the through hole .
The electronic device according to claim 5. The second heat transfer member is in direct contact with the terminal of the aluminum electrolytic capacitor and is disposed on the second surface side of the substrate.
The electronic device according to claim 5. The heat resistance temperature of the aluminum electrolytic capacitor is lower than that of the heat generating component,
The electronic device according to claim 1. The heat generating component is a transformer or a semiconductor component.
The electronic device according to claim 1.   The electronic device according to claim 1, wherein the first heat radiating portion and the second heat radiating portion are separately disposed on one surface of the housing. The housing includes a first surface on which the first heat radiating portion and the second heat radiating portion are disposed, a third surface disposed along a direction perpendicular to the first surface, and a perpendicular to the first surface. And a fourth surface arranged along a different direction,
The third surface and the fourth surface are arranged to face each other,
Each of the third surface and the fourth surface has a vent hole through which gas flows in or out.
The electronic device according to claim 10 . A mounting portion for mounting the housing to a support rail;
The housing includes a first surface on which the first heat radiating portion and the second heat radiating portion are disposed, and a fifth surface disposed along a direction perpendicular to the first surface,
The mounting only part is disposed on the fifth surface,
The first surface is disposed in the housing so as to be along a direction perpendicular to a longitudinal direction of the support rail when the housing is attached to the support rail.
The electronic device according to claim 10 . In the state where the electronic device is arranged so that the first surface is along the vertical direction, the first heat radiating portion and the second heat radiating portion are separated in the vertical direction,
The first heat radiating portion is disposed on the upper side of the second heat radiating portion,
The electronic device according to claim 11 or 12 .

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