JP3931543B2 - Electronics - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to various electronic devices such as a power supply device and a temperature control device in which a substrate having a heat generating component is incorporated in a casing.
[0002]
[Prior art]
Conventionally, as a power supply device which is an example of the electronic device, for example, one disclosed in Japanese Patent Application Laid-Open No. 8-37386 is known. FIG. 19 is a cross-sectional view of the main part of the power supply apparatus. In FIG. 19, reference numerals 50 and 51 denote printed circuit boards, and ICs 52, diodes 53, and other electronic components are mounted on the respective boards 50 and 51. Yes. Above the printed board 50 and on both sides, a heat conductive member 57 having a good thermal conductivity is provided, which includes a top plate portion 54 and both side plate portions 55 and 56. The IC 52 and the diode 53, which are heat generating components, are surface-bonded to the side plate portions 56 and 55 by the elastic force of the elastic members 58 and 59, and the heat generation is conducted to the side plate portions 56 and 57 to dissipate heat. ing.
[0003]
[Problems to be solved by the invention]
In the above structure, the insertion mounting type heat generating component inserted and mounted on the printed circuit boards 50 and 51 can be surface-bonded to the side plate portions 55 and 56 as heat radiating plates and efficiently radiated directly. The surface mount type heat-generating component that cannot be bonded to the portions 55 and 56 cannot directly radiate heat.
[0004]
The main object of the present invention is to provide an electronic device that can enhance the heat dissipation of a surface-mounting heat-generating component, and further provide an electronic device that can also improve the heat-dissipation of an insertion-mounting heat-generating component. In addition, an object is to reduce the size of the electronic device.
[0005]
[Means for Solving the Problems]
In order to achieve the above object, the present invention is configured as follows.
[0006]
That is, in the electronic device of the present invention, two adjacent walls of the casing containing the resin substrate and the metal substrate are configured by a plate-shaped metal radiator that is refracted in an L shape. The metal substrate is surface-bonded to the inner surface of one wall, and the resin substrate is disposed so as to face the inner surface of the other wall of the radiator, and an electronic component is inserted and mounted on the resin substrate, Electronic components including heat-generating components are surface-mounted on the metal substrate.
[0007]
Here, a casing accommodates a resin substrate and a metal substrate, and can also be expressed using terms such as a housing and housing.
[0008]
In addition, surface bonding means that the radiator and the metal substrate are connected by a surface, not only in direct surface contact but also in indirect surface contact through another heat conducting member or the like. It includes a state.
[0009]
According to the present invention, heat generated from a surface-mounting heat generating component mounted on a metal board is conducted from the metal board to the heat radiating body, and is efficiently radiated from the large heat radiating surface of the heat radiating body to the outside of the machine. Moreover, the heat generated from the heat-generating component can be efficiently dissipated outside the machine by directly joining the back surface of the metal substrate to the heat dissipator. Further, the heat radiating body refracted in the L shape has high strength, and the rigidity of the entire casing is increased, and the heat radiating area is increased. Furthermore, heat in the gap between the resin substrate and the inner surface of the heat radiating body is transmitted to the heat radiating body over a wide area and is radiated outside the machine. In addition, while mounting a tall component such as an electrolytic capacitor or a transformer on the resin substrate facing the other wall of the radiator refracted into an L shape, the space occupied by the height is used for the resin substrate. The metal substrates can be arranged so as to be orthogonal to each other, and the space inside the casing can be effectively used to mount components with high space efficiency, thereby reducing the size of the electronic device.
[0017]
In another embodiment of the present invention, the casing has a box shape, and the two wall surfaces formed by the heat radiating body refracted into the L shape are a back wall surface and a side wall surface of the casing.
[0018]
According to the present invention, the casing portion other than the back wall surface and the side wall surface formed by the radiator can be resin-molded, and a large number of slits can be formed on the upper wall surface and the lower wall surface, can do.
[0019]
In a preferred embodiment of the present invention, the back wall surface is on the mounting surface side of the electronic device to the support rail, and the area of the back wall surface is smaller than the area of the side wall surface. .
[0020]
According to this embodiment, the side wall surface and the back wall surface of the box-shaped casing are configured by a plate-like L-shaped radiator, and the area of the back wall surface that is the mounting surface side with respect to the support rail of the electronic device is Because it is smaller than the wall area, it can be used as an electronic device with an outer shape that has a narrow width on the left and right and a large depth, and is convenient for parallel installation in limited spaces such as switchboards and control panels. A highly convenient electronic device can be obtained.
[0023]
In still another embodiment of the present invention, a part of the heat dissipating member is cut inward, and a heat generating component inserted and mounted on the resin substrate is surface-bonded to the cut and raised piece.
[0024]
According to the present invention, it is possible to efficiently radiate the heat of the heat-generating component mounted on an arbitrary portion of the resin substrate from the radiator through the cut and raised pieces.
[0025]
In a preferred embodiment of the present invention, the heat generating component inserted and mounted on the resin substrate and the cut and raised piece of the heat radiating member are elastically clamped or screw-connected by a clamp fitting, and the heat generating component is cut and raised to contact the piece. It is combined.
[0026]
According to the present invention, the heat-generating component and the cut and raised piece can be reliably brought into close contact with each other to efficiently dissipate heat.
[0027]
In another embodiment of the present invention, a mounting mechanism to the support rail is mounted on the outer surface of the heat radiating body.
[0028]
According to the present invention, it is possible to mount an attachment mechanism at an arbitrary position of a heat-radiating body made of metal, and the degree of freedom of the attachment direction with respect to the support rail is increased.
[0029]
In still another embodiment of the present invention, the attachment mechanism is made of a metal material.
[0030]
According to the present invention, the heat transferred to the heat radiating body is transferred to the metal support rail through the mounting mechanism, and the heat dissipation can be further improved.
[0031]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments in which the present invention is applied to a power supply device will be described with reference to the drawings. 1 is an overall perspective view of the power supply device A as an example of the electronic apparatus according to the present invention as viewed from the front, FIG. 2 is an overall perspective view of the power supply device A as viewed from the back, and FIG. A side view and a cross-sectional plan view thereof are shown in FIG.
[0032]
This power supply device A is, for example, inside a box-shaped casing 1 having a thin width and having a width of several tens of millimeters on the left and right, a depth of about several tens of millimeters, and a height of about several tens of millimeters. The resin substrate 2 and the metal substrate 3 made of an aluminum plate are assembled, and the resin substrate 2 is mounted with the required group of electronic components 4 for insertion mounting and the metal substrate 3 with the required group of electronic components 5 for surface mounting. Thus, the power supply apparatus including the input filter unit, the rectifier unit, the active filter unit, the DC / DC unit, the output smoothing unit, and the output control unit illustrated in FIG. 18 is configured. In addition, the symbol (d) added to each component in the circuit diagram of FIG. 18 indicates an insertion mounting type, and (s) indicates a surface mounting type.
[0033]
Terminal blocks 6 and 7 for external wiring connection are exposed and arranged on the upper and lower front ends of the casing 1. In addition, for the connection of the circuit between the resin substrate 2 and the metal substrate 3, the pin 8a inserted into the resin substrate 2 and soldered as shown in FIG. 5 and the connection piece 8b soldered to the circuit pattern of the metal substrate 3 are used. A group of pin terminals 8 having the above is used.
[0034]
The casing 1 includes a resin-made casing main body 11 (see FIG. 8) in which a front wall surface, an upper wall surface, a lower wall surface, and a right wall surface are integrally formed, and an aluminum plate is bent into an L shape so that the back wall surface and the left wall surface are integrated. The casing main body is formed of a chassis 12 (see FIG. 6) as a formed heat radiator, and extends from the end of the upper wall surface and the lower wall surface of the casing main body 11 as shown in FIG. 11 is coupled to the chassis 12 by four screws 13. A large number of slits 14 are formed in the upper wall surface, the lower wall surface, and the right wall surface of the casing body 11 to perform ventilation and heat dissipation in the casing, and the chassis 12 has a large heat dissipation surface. Function as.
[0035]
As shown in FIG. 7, the resin substrate 2 on which the insertion mounting type electronic component 4 group is mounted is connected and fixed to the left wall surface of the chassis 12 with a screw 16 through a spacer 15 so as to face the surface with a small gap. Terminal blocks 6 and 7 are mounted and supported on the upper and lower front end corners of the resin substrate 2.
[0036]
The metal substrate 3 on which the surface mount type electronic components 5 group is mounted on the inner surface subjected to insulation processing and printed wiring is such that the outer surface where the metal surface is exposed is entirely surface-bonded to the inner surface of the back wall surface of the chassis 12. The heat generated from the surface mount type electronic component group is directly conducted to the chassis 12 through the metal substrate 3 and efficiently dissipated from the entire chassis 12 having a large area to the outside of the machine. It has become.
[0037]
Further, a cut-and-raised piece 21 formed by cutting and raising a part of the back wall surface of the chassis 12 is cantilevered from the left wall surface toward the inside of the casing and penetrates through the component mounting surface side of the resin substrate 2. Has been. Then, the IC element 22 of the active filter portion which is one of the heat generating components mounted on the resin substrate 2 is cut and raised along the surface of the piece 21, and a U-shaped clamp fitting 23 made of a spring plate material. The cut-and-raised piece 14 and the IC element 22 are elastically sandwiched so that both 21 and 22 are in close contact and surface-bonded. As a result, the heat generated from the IC element 22 is cut up and conducted directly to the piece 21 and is efficiently dissipated outside the machine through the chassis 12.
[0038]
The main body of the power supply device A, which is an example of the electronic apparatus according to the present invention, is configured as described above, and a mounting form on the switchboard or control panel will be described below.
[0039]
As shown in FIGS. 9, 10, and 11, a general-purpose din rail attachment mechanism 30 is attached and fixed to the outer surface of the back wall surface of the chassis 12. The attachment mechanism 30 includes a sheet metal main body 32 having a groove 32a that engages with an upward flange 31a as a support rail horizontally mounted on a switchboard or a control panel, and a downward direction of the dinrail 31. A sheet metal slide engagement piece 33 having an upper end with a claw portion 33a that engages with the flange 31b from below, and a spring 34 that slidably biases the slide engagement piece 33 upward. The screw 35 is fastened and fixed to the chassis 12.
[0040]
Thus, when the attachment mechanism 30 is equipped in the back surface of the casing 1, as shown in FIG. 12, a plurality of power supply devices A can be mounted side by side on the din rail 31 with little lateral space.
[0041]
The power supply device A is attached to and detached from the din rail 31 as follows. In mounting, first, the power supply device A is brought close to the din rail 31 in a slightly upwardly inclined posture, and the groove portion 32a is engaged with the upward flange 31a from above. Next, by pressing the power supply device A against the din rail 31 so as to swing down, the slide engagement piece 33 is brought into contact with the downward flange 31b and once pressed down, and then urged and slid upward, so that the claw portion 33a is Thus, the power supply device A can be mounted and fixed at an arbitrary position on the din rail 31. Further, when removing the power supply device A, a screwdriver or the like is inserted into the operation hole 36 formed at the lower end of the slide engagement piece 33 projecting downward from the casing 1 to resist the slide engagement piece 33 against the spring 34. After pulling down and releasing the engagement with the downward flange 31b, an operation reverse to the above procedure may be performed.
[0042]
As shown in FIG. 13, the attachment mechanism can be screwed to the outer surface of the left side wall surface of the chassis 12. In this case, as shown in FIG. 14, the power supply device A can be mounted in parallel on the din rail 31 with the right side wall surface being the front surface.
[0043]
FIGS. 15 and 16 are examples in which the power supply device A can be directly screwed to a switchboard, a control panel, or a frame or wall of other equipment, and mounting seats 12a on the upper and lower sides of the chassis 12 having high strength. And can be installed at a desired location using screws 37 and spacers 38.
[0044]
In addition, this invention can also be implemented with the following forms.
(1) For the circuit connection between the resin substrate 2 and the metal substrate 3, in addition to using the pin terminal 8 as described above, a bent pin 39 formed by bending can be used as shown in FIG. .
(2) As shown in FIG. 17, as a simple means for surface-joining the metal substrate 3 to the chassis 12, the both 3 and 12 may be elastically held by a U-shaped clamp fitting 40 made of a spring plate material.
(3) The heat-generating component may be screwed to the cut and raised piece 21 so that both are surface-bonded.
( 4 ) It can also be carried out by mounting an attachment mechanism constituted by a resin molded member.
( 5 ) In the above-described embodiment, the insertion mounting type heat-generating component is surface-bonded to the cut and raised piece of the chassis, but the metal substrate of the wall surface where the metal substrate of the L-shaped chassis is surface-bonded is An insertion mounting type heat generating component may be surface bonded directly or via a heat transfer member to a region that is not surface bonded.
[0045]
【The invention's effect】
As is apparent from the above description, according to the present invention, the heat generated by the surface-mounted heat generating component mounted on the metal substrate can be efficiently radiated through the heat radiating body having a large heat radiating surface. It was.
[0046]
Further, according to the present invention, the radiator bent into the L shape has a large heat radiating surface, and also exhibits a function of increasing the rigidity of the casing, and constitutes an electronic device with excellent heat dissipation and high durability. be able to.
[0047]
In addition, according to the present invention, the resin substrate and the metal substrate can be arranged in an orthogonal state, and tall components can be accommodated without waste in the casing, which is effective in constructing a compact electronic device with high space efficiency. .
[Brief description of the drawings]
FIG. 1 is a perspective view of a power supply device according to the present invention as viewed from the front side.
FIG. 2 is a perspective view of the power supply device according to the present invention as viewed from the back side.
FIG. 3 is a longitudinal side view of the entire power supply device.
FIG. 4 is a cross-sectional plan view of the entire power supply device.
FIG. 5 is a perspective view showing a part of the internal structure.
FIG. 6 is a perspective view of a single chassis.
FIG. 7 is a perspective view of a chassis on which a board is mounted.
FIG. 8 is a perspective view of a casing body.
FIG. 9 is a perspective view of a power supply device having a mounting mechanism on the back surface.
FIG. 10 is a rear view of a power supply device having an attachment mechanism on the back surface.
FIG. 11 is a side view showing an attachment state of a power supply device having an attachment mechanism on the back surface.
FIG. 12 is a perspective view showing an example of mounting a din rail of a power supply device having a mounting mechanism on the back surface.
FIG. 13 is a perspective view of a power supply device having a mounting mechanism on a side surface.
FIG. 14 is a perspective view showing an example of mounting a din rail of a power supply device having a mounting mechanism on a side surface thereof.
FIG. 15 is a perspective view seen from the back side of a power supply device provided with other attachment means.
FIG. 16 is a perspective view seen from the back side of a power supply device provided with other attachment means.
FIG. 17 is a perspective view showing a part of the internal structure in another embodiment.
FIG. 18 is a circuit diagram of a power supply device.
FIG. 19 is a cross-sectional view of a conventional example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Casing 2 Resin board 3 Metal board 12 Chassis 21 Cut and raised piece 23 Clamp metal fitting 30 Mounting mechanism 31 Din rail

Claims (7)

Two adjacent walls of the casing containing the resin substrate and the metal substrate are formed of a plate-shaped metal heat dissipating member bent in an L shape, and the metal substrate is formed on the inner surface of one wall of the heat dissipating member. The resin substrate is disposed so as to face the inner surface of the other wall of the radiator, and electronic components are inserted and mounted on the resin substrate, and the metal substrate includes a heat generating component. An electronic device in which an electronic component is surface-mounted . The electronic device according to claim 1,
2. The electronic apparatus according to claim 1, wherein the casing has a box shape, and two wall surfaces constituted by the heat radiating body refracted in the L shape are a back wall surface and a side wall surface of the casing . The electronic device according to claim 2 ,
The electronic apparatus according to claim 1, wherein the back wall surface is on the side of the mounting surface of the electronic device to the support rail, and the area of the back wall surface is smaller than the area of the side wall surface . An electronic device according to any one of claims 1 to 3 ,
An electronic apparatus, wherein a part of the heat dissipating member is cut and raised inward, and a heat generating component inserted and mounted on the resin substrate is surface-bonded to the cut and raised piece. The electronic device according to claim 4 ,
The heat-generating component inserted and mounted on the resin substrate and the cut-and-raised piece of the heat-dissipating member are elastically sandwiched or screw-connected by a clamp fitting, and the heat-generating component is cut-and-raised and surface-bonded to the piece. Electronics. An electronic device according to any one of claims 1 to 5 ,
An electronic device, wherein a mounting mechanism to a support rail is mounted on an outer surface of the heat radiating body. The electronic device according to claim 6 ,
An electronic apparatus, wherein the attachment mechanism is made of a metal material.

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