KR20000011078U - Heat dissipation device for heating parts of electronic products - Google Patents

Abstract

The present invention relates to a heat dissipation device for a heat generating part of an electronic product, the technical gist of which is provided in the fixing grooves 32 formed on both side wall surfaces of the fixing bracket 30 to which the heat generating part 10 is fixedly coupled to the lower one side. 1 The fixing piece 24 is partially inserted into and fixed to both side walls of the inner concave C-shaped seating portion 22 of the heat sink 20 so that the fixing bracket 30 is coupled to the first heat sink 20. Both ends of the fixing bar 42 are inserted into and fixed to the first and second fixing grooves 26 formed by adjusting the positions of the first and second heat sinks 20 and 40 to the first and second heat sinks 20 and 40. ) Heat dissipation of the heat generating part 10 is characterized in that the efficient heat dissipation.

Accordingly, by simply attaching and detaching the heat generating electronic components and the heat sink in the electronic product, the work of the heat generating components can be easily combined and the workability can be further improved, and the components can be installed regardless of the specification of the heat generating components. Maximized assembly productivity.

Description

Heat dissipation device for heating parts of electronic products

The present invention is designed to dissipate heat generated from heat-generating electronic components such as transistors (TRs) mounted on main printed circuit boards of electronic products such as televisions, and to easily adjust heat dissipation capacity according to component specifications. In more detail, in the fixing groove formed on both side walls of the fixing bracket in which the heat generating parts are fixedly coupled to the lower one side, the fixing piece which is partially cut and protruded on both side wall surfaces of the central concave U-shaped seat of the first heat sink is inserted Both ends of the fixing bar are inserted into and fixed to the first and second fixing grooves formed by fixing the bracket to the first heat sink, and adjusting the positions of the first heat sink and the second heat sink. This heat dissipation efficiently.

Accordingly, the workability of the heat generating electronic components and the heat sink in the electronic product can be easily combined, and the workability can be improved. In particular, the heat sinks can be separated regardless of the heat generating parts according to the heat generating capacity of the heat generating electronic components. The present invention relates to a heat dissipating device for a heating part of an electronic product, which is capable of maximizing component compatibility and improving assembly productivity while easily manufacturing and installing a structure by simply inserting and assembling the assembly.

In general, an electronic product such as a television is provided with a heating electronic component such as a transistor, and the heating electronic component performs a switching operation or an amplifier function. In this heating electronic component, considerable heat is generated to dissipate the heat. Thereby, according to the combination of the heat generating electronic components and the heat sink to be mounted on the printed circuit board.

In a heat dissipation plate for a heat generating electronic component of a conventional electronic product related to the above technique, as shown in FIG. 1, a lead protruding downward from the heat generating electronic component 100 on the printed circuit board 110 in the electronic product ( 112 is soldered and the heating electronic component 100 is mounted, and the heating electronic component 100 is fixed to the fixing bracket 120 by a fixing screw 124 through the fixing groove 122 formed thereon. Is coupled to the screw groove 132 of the heat sink 130 is made of a structure installed on the printed circuit board (110).

In the heat dissipation structure of a heat generating electronic component of a conventional electronic product having such a structure, as shown in FIG. 1, after the worker installs the heat sink 130 on the printed circuit board 110, the heat generating electronic component is shown. The fixing groove 122 of the fixing bracket 120 and the screw groove 132 of the heat dissipating plate 130 coupled to the 100 are matched to each other to be coupled as the fixing screw 124. At this time, the fixing bracket 120 is formed of a metal plate to transfer the heat generated from the heat generating electronic component 100 to the heat sink 130, whereby the heat generated from the heat generating electronic component 100 heat sink 130 Heat dissipation through), the electrical properties are maintained.

However, in the heat dissipation structure of the heat generating electronic component of the conventional electronic product as described above, as shown in FIG. 1, an operator manually combines the heat sink 130 and the heat generating electronic component 100 as the fixing screw 124. As the assembly performance is degraded due to the cumbersome work, and the heat sink 130 is replaced and installed in accordance with the specifications of the heat generating electronic component 100 used in particular, assembling compatibility is deteriorated, and an appropriate heat sink 130 is misused by an operator. If it is not installed, there are frequent problems such as poor operation caused by the heat radiation deterioration of the heat generating electronic component 100, and thus the reliability of the electronic product is weak.

The present invention has been made in order to improve the various problems of the prior art as described above, its purpose is to easily combine the heat generating parts and workability due to the simple attachment and detachment of the heat generating electronic components and the heat sink in the electronic products In addition, it is possible to install irrespective of the size of the heat generating parts by adjusting the heat sink that can be separated from each other according to the heat generation capacity of the heat generating electronic parts. The parts compatibility is maximized to improve the assembly productivity. It is an object of the present invention to provide a heat dissipation device for heat-generating components of electronic products.

1 is an exploded perspective view showing a heat sink for a heating electronic component of a conventional electronic product

Figure 2 is an exploded perspective view showing a heat dissipating device for heat generating parts of the electronic product according to the present invention

Figure 3 is a perspective view showing the installation state of the heat dissipating device for heat generating parts of the present invention

Explanation of symbols on the main parts of the drawings

1 .... heat sink 10 .... heating electronics

20 .. 1st heat sink 22,46 .... seat

24 .. Fixing piece 26,44 .... First fixing groove

30 .... Fixing bracket 32 .... Fixing groove

40 .... 2nd heat sink 42 .... Fixed bar

50 .... Auxiliary Heat Sink

Technical means of the present invention for achieving the above object, the lower lead portion to the one side in the center portion so that the fixing bracket coupled to the lower one side of the heating electronic components mounted on the printed circuit board installed in the electronic product. A concave U-shaped seating part is formed, and a plurality of fixing pieces are partially cut and pressed inwardly to protrude inward, and a plurality of fixing pieces are formed in the vertical direction. With heat sink,

A plurality of fixing grooves are formed on both sides of the wall so as to fix the fixing pieces, and the fixing brackets are fixed to the fixing parts.

The second fixing groove into which the other end of the fixing bar into which the other end of the fixing bar is inserted into the first fixing groove of the first heat sink is formed on both sides of the seating portion bent at the center, is installed to be separated as the first heat sink and the fixing bar. Comprising a second heat sink, and between the fixing bar connecting the first and second heat sinks by providing a heat dissipation device for a heating component of the electronic product made of a configuration in which the auxiliary heat sink is inserted and fixed to increase the heat radiation efficiency.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

Figure 2 is an exploded perspective view showing a heat dissipating device for a heating component of the electronic product according to the present invention, Figure 3 is a perspective view showing the installation state of the heat dissipating device for a heating component of the electronic product of the present invention, the electronic product of the present invention The heat dissipation device 1 for heat generating parts is comprised as the 1st heat sink 20, the fixed bracket 30, and the 2nd heat sink 40. As shown in FIG.

The first heat dissipation plate 20 has a fixing bracket 30 in which a lower heating part 10a is mounted on a printed circuit board 60 installed in the electronic product. The C-shaped seating portion 22 is formed in the central portion so as to be concave to one side, and the fixing piece 24 which is partially cut and pressed to protrude inward is formed on both inner wall surfaces of the seating portion 22 in the up and down directions. A plurality of first fixing grooves 26 are formed in the vertical direction on both sides of the seating part 22 of the first heat sink 20.

In addition, the fixing bracket 30 fixed to the mounting portion 22 of the first heat sink 20 is fixed to the fixing piece 24 on both side walls so as to be fixed in the mounting portion 22. A plurality of fixing grooves 32 are formed, and the heating component 30 is fixedly coupled to one lower side thereof.

In addition, the second heat sink 40 is connected to the first heat sink 20 to easily adjust the heat dissipation capacity, the fixing bar is inserted into one end of the fixing groove 26 of the first heat sink 20. Second fixing grooves 44 into which the other ends of the 42 are inserted and fixed are formed at both sides of the seating portion 46, which is bent at the center thereof, so that the first heat sink 20 and the fixing bar 42 can be separated. do.

On the other hand, between the fixing bar 42 connecting the first and second heat sinks 20 and 40, if necessary, the upper and lower sides of the auxiliary heat sink 50 to increase the heat dissipation efficiency of the heat generating parts 10, It is made of a configuration that is fitted and fixed.

Referring to the operation and effects of the present invention made in the above configuration in detail as follows.

As shown in Figs. 2 and 3, the heat generating electronic component 10 dissipates heat generated from the heat generating electronic component 10 such as a transistor installed in an electronic product such as a television and performs a switching operation or an amplifier function. The heat dissipation device 1, which maintains the electrical characteristics of the same and improves the compatibility of components by adjusting the first and second heat sinks 20 and 40 according to the specifications of the heat generating electronic component 10, in particular, Same as

First, as shown in FIG. 2, the heat generating electronic component 10 mounted on the printed circuit board 60 in which the lead portion 10a is installed in the electronic product is firmly fixed with an adhesive or the like on the lower side of one side of the fixing bracket 30. After the fixed fixing, the fixing bracket 30 is inserted into and fixed in the seating part 22 formed by the U-shape of the first heat sink 20 soldered to the printed circuit board 60.

At this time, the fixing grooves 32 are sequentially formed on both side wall surfaces of the fixing bracket 30 so that the fixing pieces may be partially cut into the concave c-shaped seating portion 22 of the first heat sink 20 and protrude. 24 is fixed to the fixing groove 32, so that the fixing bracket 30 can be easily coupled to the first heat sink 20 without additional screw coupling operation.

In addition, first fixing grooves 26 are formed in the vertical direction on both sides of the seating part 22 of the first heat sink 20, and the seating part 46 is formed at the center of the first heat sink 20 similarly to the first heat sink 20. As the second fixing grooves 44 are sequentially formed on both sides of the second heat sink 40 having the heat sink, the heat dissipation amount of the heat generating part 10 is large. The second heat sink 40 can be simply connected to the first heat sink 20 by being fixed to the heat sinks 20 and 40, which increases the amount of heat dissipation.

Subsequently, as shown in FIGS. 2 and 3, between the fixing bar 42 provided between the first and second heat sinks 20 and 40, an auxiliary heat sink 50 having upper and lower surfaces having an arc shape is inserted. In the case of the heat generating part 10 that generates high heat such as a power chip, the heat dissipation amount can be increased by the first and second bar heat sinks 20 and 40 and the auxiliary heat sink 50 to easily dissipate heat. It is.

At this time, the height of the first heat sink 20 and the second heat sink 40 is different so that only the first heat sink 20 soldered to the printed circuit board 60, the second heat sink 40 is the first heat sink ( Since the structure is connected to 20, the coupling operation with the printed circuit board 60 is also facilitated.

In addition, if necessary, other heat generating parts can be provided in the mounting portion of the second heat sink 40, so that more heat generating parts are radiated as one heat dissipation device 1, thereby reducing component space, and assembling the heat generating parts. It is easy to work.

Accordingly, by simply connecting the first and second heat dissipation plates 20 and 40 as the fixing bar 42 and installing the heat generating parts 10 inwardly, not only the installation work of the heat generating parts 10 but also the heat dissipation. The installation work of the apparatus 1 is also easy.

As described above, according to the heat dissipation device for a heat generating part of an electronic product according to the present invention, by simply attaching and detaching and fixing the heat generating electronic part and the heat sink in an electronic product, the work of the heat generating parts is easily combined and the workability is further improved. It is easy to adjust the heat sinks that can be separated from each other according to the heat generation capacity of the heat generating electronic parts, so it can be installed regardless of the size of the heat generating parts, which maximizes the compatibility of parts and improves the assembly productivity. There is an excellent effect that is easily performed.

Claims (1)

In the heat dissipation structure of the heating electronics installed inside the electronics, A c-shape concave to one side in the center portion so that the fixing bracket 30 to which the heat generating electronic component 10 mounted on the printed circuit board 60 installed in the electronic product is mounted on the lower side of the lower lead portion 10a is mounted. The seating portion 22 of the formed is formed in the inner both side wall surface is partially cut and protruded inwards a plurality of fixing pieces 24 are installed in the vertical direction, both sides of the seating portion 22 in the vertical direction A first heat sink 20 each having a fixing groove 26 formed therein; A plurality of fixing grooves 32 are formed on both side wall surfaces of the seating part 22 to fix and fix the fixing pieces 24, and the lower one side is fixedly coupled to the heat generating part 30. Bracket 30 and, The second fixing groove 44 into which the other end of the fixing bar 42 into which the one end is inserted is fixed to the fixing groove 26 of the first heat sink 20 is formed on both sides of the seating portion 46 bent at the center. And a second heat sink 40 installed to be detachable as the first heat sink 20 and the fixing bar 42. A heat dissipation device for a heating component of an electronic product, characterized in that the auxiliary heat sink 50 is inserted and fixed between the fixing bar 42 connecting the first and second heat sinks 20 and 40 to increase heat dissipation efficiency.