JP2014007362A - Power element heat dissipation structure and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a power element heat dissipation structure which excels in workability during assembly and disassembly and a manufacturing method therefor.SOLUTION: In a power element heat dissipation structure, heat generated by a power element 5 is conveyed from a product fitting heat sink 8 to a product casing body 7 having an opening 7a formed in the top surface thereof, whereby heat is dissipated. The power element heat dissipation structure comprises: the product fitting heat sink 8 disposed on the inner surface of the product casing body 7 in an inclined state, with the tip side down; a sheet member 2 disposed on the product fitting heat sink 8; a power element 5 having a rein encapsulated body section and a lead terminal extending from the body section, the body section being fixed in place on the sheet member 2, with the lead terminal directed diagonally downward; a printed circuit board 1 housed in the product casing body 7 so as not to overlap the power element, with the lead terminals thereof soldered; and a power element mounting board lockscrew 9 for fixing the sheet member 2 disposed on the product fitting heat sink 8 to the product fitting heat sink 8 by fastening together from the sheet member 2 side.

Description

  The present invention comprises an electrical equipment component including a plurality of circuit units, power elements, reactors, and coils, and a heat dissipation structure, and an electrical equipment configured to transfer heat generated by the power element to the heat dissipation structure. The present invention relates to a power element heat dissipation structure that realizes heat transfer from a power element to a heat dissipation structure easily and inexpensively and a manufacturing method thereof.

  In electrical equipment composed of multiple power elements and electric heating elements such as reactors, the heat-radiating structure that constitutes the housing is affected by dust and humidity when the heat-generating components are directly cooled by the outside air. A structure that transfers heat to the body and indirectly releases heat is used.

  In these configurations, the power elements that make up inverters, etc. generate a large amount of heat, and the operating voltage of the terminals is high. It was necessary to obtain a heat transfer structure that considered

  However, since power elements are used for switching, minimization of power line length and integration of gate drive circuits are required, and a method for mounting individual semiconductor power elements on a substrate at low cost has been demanded. In addition, when using a heat transfer insulating sheet as a heat transfer material between the power element and the housing, it is necessary to replace the heat transfer insulating sheet on the market. Sex has been needed.

  As a structure for mounting a plurality of power elements to a product casing heat dissipation member, for example, in a structure in which a substrate on which electronic components such as transistors are mounted is installed in parallel to the bottom surface, the power element is fixedly mounted on the casing heat dissipation surface. After that, it has been proposed that the board and the power element terminal are soldered by being inserted into a corresponding connection hole of the board.

  Patent Document 1 discloses a configuration in which a plurality of power elements are transferred to a bottom heat sink. In Patent Document 1, the power element is fixed to the inclined surface of the case radiator with a screw with a washer, and the lead terminal is attached facing upward. Then, after assembling the printed board from above so that the lead terminal is inserted into the through hole of the board, the lead terminal and the board are soldered. Patent Document 1 discloses a method of dissipating heat from the power element to the lower surface side of the substrate and shortening the lead terminal length by attaching the power element at an angle.

JP 2003-309384 A

  However, in the configuration disclosed in Patent Document 1, assembly work is not difficult. However, when the power element or the board is replaced, it is necessary to release the soldering between the lead terminal of the power element and the printed board. It is difficult to replace the power element and the substrate.

  In a structure that dissipates heat by attaching a power element to the bottom of the main unit housing, when installing the power element in the product assembly process, it is possible to operate the screwdriver used to screw the power element from above, There is an advantage that soldering work can be performed from above the board even when soldering the terminals of the power element.

  However, when it is necessary to dissipate heat from a plurality of power elements, the method using the bottom of the product parallel to the substrate is such that the upper substrate is used in a product having a configuration in which two substrates are stacked and accommodated in a housing. Since heat cannot be radiated from the bottom of the product and the amount of heat radiated is insufficient, it has been desired to provide a heat radiating surface also on the side of the product perpendicular to the printed board mounting surface.

  In the conventional product assembly method, when the printed circuit board surface and the product housing heat dissipation surface are mounted so as to be substantially vertical, the power element is attached to the heat dissipation surface on the side of the product with the substrate parallel to the ground. Since it is necessary to hold and operate a screwdriver used for screwing the power element horizontally, it is difficult to work from above.

  For this reason, a method of separating the power element mounting substrate and connecting it to another substrate with a connector or a lead wire has been used. However, it is necessary to assemble the power element mounting substrate during the substrate assembling process, and the work process is complicated. In addition, since the lead length of the power element, which is a switching element, is extended, there are problems in terms of workability and performance, such as an increase in disturbing waves.

  This invention is made | formed in view of the above, Comprising: It aims at obtaining the power element thermal radiation structure excellent in the workability | operativity at the time of an assembly | attachment and decomposition | disassembly, and its manufacturing method.

  In order to solve the above-described problems and achieve the object, the present invention provides a power element heat dissipation structure that transfers heat generated by a power element from a heat dissipation structure to a product housing having an opening formed on the top surface to dissipate the heat. A heat dissipating structure installed on the inner surface of the product housing in a state where the tip side is inclined, a thin plate disposed on the heat dissipating structure, a resin-sealed main body part, and a main body A power element with a lead terminal extending from the part, with the main body part fixed on a thin plate with the lead terminal facing diagonally downward, and the lead terminal being soldered so as not to cover the power element A printed circuit board housed in the product housing, and a fixing screw that fastens and fixes the thin plate material disposed on the heat dissipation structure to the heat dissipation structure from the thin plate material side.

  According to the present invention, there is an effect that it is possible to realize a power element heat dissipation structure excellent in workability not only at the time of assembly but also at the time of disassembly and a manufacturing method thereof.

FIG. 1 is a cross-sectional view showing a configuration of an embodiment of a power element heat dissipation structure according to the present invention. FIG. 2 is a diagram showing a structure of a printed circuit board on which the power element is mounted. FIG. 3 is a diagram showing the configuration of the power element mounting substrate. FIG. 4 is a diagram illustrating a state of the power element mounting substrate when assembled to the product heat sink. FIG. 5 is a diagram showing the structure of the printed circuit board according to the second embodiment of the power element heat dissipation structure according to the present invention. FIG. 6 is a diagram showing the configuration of the power element mounting substrate. FIG. 7 is a diagram showing a configuration of a power element mounting substrate in a third embodiment of the power element heat dissipation structure according to the present invention. FIG. 8 is a diagram showing a configuration of a power element mounting substrate in a fourth embodiment of the power element heat dissipation structure according to the present invention.

  Embodiments of a power element heat dissipation structure and a manufacturing method thereof according to the present invention will be described below in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

Embodiment 1 FIG.
FIG. 1 is a cross-sectional view showing a configuration of an embodiment of a power element heat dissipation structure according to the present invention. In the power element heat dissipation structure, the power element mounting board 20 is thermally connected to the product mounting heat sink 8 installed on the side surface of the product casing 7 having the opening 7a formed on the top surface by the power element mounting board fixing screw 9. In FIG. 1, the product casing 7 is cut and the inside is visualized. The product mounting heat sink 8 is installed on the side surface of the product housing 7 in a cantilever state inclined so that the front end side is lowered. The printed circuit board 1 is accommodated in the product housing 7 so as not to cover the power element 5. In the heat transfer structure from the power element 5 as the heat dissipating part to the product mounting heat sink 8 as the heat dissipating structure, the thin plate 2 is interposed between the power element 5 and the product mounting heat sink 8. As a material of the thin plate material 2, in addition to a metal material such as iron or aluminum, a heat transfer resin can be applied. The thin plate material 2 is arranged on the printed circuit board 1 on which the power element 5 is mounted, and the power element 5 is screwed to the thin plate material 2 with the power element fixing screw 3 through the insulating sheet 4, thereby assembling the product. Prior to assembly, the power element mounting substrate 20 is assembled in advance in the substrate manufacturing process.

  FIG. 2 is a diagram showing a structure of a printed circuit board on which the power element is mounted. The printed circuit board 1 is divided into a power element mounting part 1b and an assembling removal part 1c by a slit 1a provided so as to substantially cross the printed circuit board 1, and the power element mounting part 1b and the assembling removal part are assembled. 1c is partially connected in the cutting part 1d.

  3A and 3B are diagrams showing the configuration of the power element mounting substrate, in which FIG. 3A is a top view and FIG. 3B is a side view. The thin plate material 2 is disposed on the printed circuit board 1. A power element 5 is screwed to a thin plate material 2 disposed on the printed board 1 with a power element fixing screw 3 via an insulating sheet 4. A plurality of power elements 5 are inserted into the board holes, and batch soldering is performed in a solder bath. Here, a configuration in which two power elements 5 are arranged is taken as an example, but it goes without saying that a configuration in which more power elements 5 are arranged may be used. By assembling in advance the power element unit 15 in which the thin plate material 2 as the structural material, the insulating sheet 4 and the power element 5 are integrated and attaching the power element unit 15 to the printed circuit board 1, the assembly work of the power element mounting board 20 can be simplified.

  In addition, for the purpose of improving the tracking resistance of the sealing resin and the foot part constituting the power element 5, it is also possible to apply and fix a tracking resistance improving agent between the terminal creepage of the power element 5 and the insulating sheet 4. is there. A power which is sealed with a resin material having low tracking resistance by applying a tracking resistance improving agent between the creeping surface of the power element 5 and the insulating sheet 4 and then assembling the power element unit 15 on the printed circuit board 1. It is possible to improve the tracking resistance of the element 5 and realize a structure in which the power element mounting substrate 20 can be easily replaced. Needless to say, the product assembling property may be improved without removing the assembling removal portion 1c under the thin plate material 2.

  It is easy to assemble the power element unit 15 in a separate process by performing terminal shaping on the power element 5 in advance and tightening the power element 5 on the thin plate material 2 via the insulating sheet 4 with the power element fixing screw 3. If necessary, a tracking resistance improving agent can be applied to the lead end face side of the power element 5 and dried.

  4A and 4B are views showing the state of the power element mounting substrate when assembled to the product heat sink, FIG. 4A is a top view, and FIG. 4B is a side view. When the assembled power element mounting substrate 20 is assembled to the product mounting heat sink 8, the power element mounting portion 1 b and the assembling removal portion 1 c are separated by being cut off by the cutting portion 1 d, and the thin plate member 2 below The assembling removal section 1c is removed. Then, the thin plate material 2 is bent so as to have the same inclination angle as that of the product mounting heat sink 8, and the power element mounting substrate 20 is assembled to the heat radiating surface of the product mounting heat sink 8 installed in a tilted state on the product housing 7. This facilitates board transportation and product assembly, and enables mounting with a reduced projection area.

  The assembling removal section 1c under the thin plate 2 is discarded for the purpose of reducing thermal resistance when the power element mounting substrate 20 is assembled. When assembling the power element mounting substrate 20 to the product, the removal portion 1c at the time of assembly is removed, and the thin plate material 2 of the power element mounting substrate 20 is attached to the product mounting heat sink 8 installed obliquely. To obtain a heat transfer structure (see FIG. 1). In this product assembly process, by tilting the product mounting heat sink 8 serving as a screw fastening surface, the operability when operating the driver through the opening 7a from above the product housing 7 is not hindered. The power element mounting substrate 20 can be assembled to the side surface. As a result, it is possible to realize a structure that can be easily assembled and can replace the power element mounting substrate 20 without using a special tool in maintenance and replacement.

  Further, by using a SiC power element that can be used at a high temperature as the power element 5, a resin having continuous heat resistance at a temperature equal to or higher than the heat resistance temperature of the power element 5 between the power element 5 and the product mounting heat sink 8, for example, A polyphenylene sulfide (PPS) resin can be disposed and the insulating sheet 4 can be omitted. A resin having a large thermal resistance such as PPS resin but having a high insulating property is less expensive than a resin having a small thermal resistance and a high insulating property as the material of the insulating sheet 4, so that the manufacturing cost of the power element heat dissipation structure can be reduced. .

  According to the present embodiment, the lead connection process of the power element 5 is completed in the board mounting process, and the assembly process can be performed without hindering the operability of the driver in the product assembly process. In addition to performance, repairs can be made without using special tools in maintenance replacement.

  Further, when the power element 5 is screwed to the thin plate member 2, the power element 5 is not displaced, and the power element mounting substrate 20 is less likely to be bent due to an external force or the like after the power element mounting substrate 20 is manufactured. Therefore, management of the power element mounting substrate 20 is facilitated. In addition, since the process of assembling and replacing the power element mounting substrate 20 is simplified, stable quality is ensured in assembling and service.

Embodiment 2. FIG.
FIG. 5 is a diagram showing the structure of the printed circuit board according to the second embodiment of the power element heat dissipation structure according to the present invention. In the present embodiment, a thin plate material positioning hole 1e is formed in the assembling removal portion 1c of the printed circuit board 1.

  6A and 6B are diagrams showing the configuration of the power element mounting substrate, in which FIG. 6A is a top view and FIG. 6B is a side view. The thin plate member 2 is provided with mounting legs 2a at the peripheral portion. By inserting the mounting legs 2a into the thin plate member positioning holes 1e, the assembling removal portion 1c is tilted with respect to the substrate surface of the printed circuit board 1. Is placed on top. The inclination angle of the thin plate material 2 is the same as the inclination angle of the product mounting heat sink 8. A power element 5 is screwed to a thin plate material 2 disposed on the printed board 1 with a power element fixing screw 3 via an insulating sheet 4.

  When the power element mounting substrate 20 is attached to the product mounting heat sink 8, the power element mounting part 1b and the assembling removal part 1c are separated by being separated by the cutting part 1d, and the assembling removal part under the thin plate material 2 is separated. 1c is removed. Then, the power element mounting substrate 20 is assembled to the heat radiating surface of the product mounting heat sink 8 installed in a tilted state on the product housing 7. This facilitates board transportation and product assembly, and enables mounting with a reduced projection area.

  The assembling removal portion 1c under the thin plate member 2 is discarded when the power element mounting substrate 20 is assembled, but it goes without saying that it may be used as a space for arranging normal electronic components.

  According to the present embodiment, it is not necessary to incline the thin plate material 2 with respect to the printed circuit board 1 in the product assembling step, so that the number of steps can be saved and the production cost can be reduced. Others are the same as in the first embodiment.

Embodiment 3 FIG.
7A and 7B are diagrams showing the configuration of a power element mounting substrate in Embodiment 3 of the power element heat dissipation structure according to the present invention. FIG. 7A is a top view and FIG. 7B is a side view. In the present embodiment, the jig 18 that can be installed on the printed circuit board 1 at an inclination is used to form the thin plate material 2 in a flat plate shape (in a shape that does not include the mounting legs 2a), and at the time of product assembly. When the assembly removal portion 1c under the thin plate 2 is deleted, the jig 18 is removed.

  The power element mounting substrate 20 after assembly to the product mounting heat sink 8 is the same as that of the first embodiment.

  In the present embodiment, since it is not necessary to form mounting legs on the thin plate material 2, the processing cost can be reduced. Others are the same as in the second embodiment.

Embodiment 4 FIG.
8A and 8B are diagrams showing the configuration of the power element mounting substrate in the power element heat dissipation structure according to the fourth embodiment of the present invention. FIG. 8A is a top view and FIG. 8B is a side view. In the present embodiment, the power element positioning protrusion 19b is provided on the jig 19, and only the power element 5 is installed on the jig 19 without using a thin plate material. The jig 19 has the same shape as that of the thin plate 2 in the second embodiment, and includes a mounting leg 19a. In product assembly, the insulating sheet 4 or the like is installed on the product mounting heat sink 8 and the power element 5 is directly mounted.

  Since the thin plate material 2 used in the first to third embodiments is used as a positioning material for the power element 5, the jig 19 of the present embodiment can be used instead. The jig 19 can be easily reused by removing it when the product is assembled, and the power element 5 can be directly screwed to the product mounting heat sink 8 instead of the thin plate material 2.

  In the present embodiment, since a thin plate material is unnecessary, the number of parts can be reduced and the manufacturing cost can be reduced.

  As described above, the power element heat dissipation structure and the method of manufacturing the power element according to the present invention are inexpensive and can be assembled and disassembled with a structure that transfers heat generated by the power element that constitutes an electrical device such as a power conditioner to the heat dissipation structure. Is useful in that it can be easily realized.

DESCRIPTION OF SYMBOLS 1 Printed circuit board 1a Slit 1b Power element mounting part 1c Removal part at the time of assembly 1d Cutting part 1e Thin plate material positioning hole 2 Thin plate material 2a, 19a Mounting leg 3 Power element fixing screw 4 Insulation sheet 5 Power element 7 Product housing 7a Opening 8 Product mounting heat sink 9 Power element mounting board fixing screw 15 Power element unit 18, 19 Jig 20 Power element mounting board

Claims (7)

A power element heat dissipation structure that transfers heat generated by a power element from a heat dissipation structure to a product housing having an opening on the top surface to dissipate the heat,
The heat dissipating structure installed on the inner surface of the product housing in an inclined state so that the tip side is lowered;
A thin plate disposed on the heat dissipation structure;
The power element having a resin-sealed main body portion and a lead terminal extending from the main body portion, the main body portion being fixed on the thin plate material in a state where the lead terminal is directed obliquely downward,
The printed circuit board accommodated in the product housing so that the lead terminal is soldered and does not cover the power element;
A fixing screw for fastening the thin plate material disposed on the heat dissipation structure together with the heat dissipation structure from the thin plate material side;
A power element heat dissipation structure comprising: The power element is a SiC power element;
The power element heat dissipation structure according to claim 1, wherein a resin having continuous heat resistance at a temperature equal to or higher than the heat resistance temperature of the power element is disposed between the power element and the thin plate material. A power element heat dissipation structure that transfers heat generated by a power element from a heat dissipation structure to a product housing having an opening on the top surface to dissipate the heat,
The heat dissipating structure installed on the inner surface of the product housing in an inclined state so that the tip side is lowered;
A power element having a resin-sealed main body portion and a lead terminal extending from the main body portion, the main body portion being disposed on the heat dissipation structure with the lead terminal facing obliquely downward; ,
The printed circuit board accommodated in the product housing so that the lead terminal is soldered and does not cover the power element;
A fixing screw for fixing the main body portion of the power element disposed on the heat dissipation structure together with the heat dissipation structure from the power element side;
A power element heat dissipation structure comprising: Manufacture of a power element heat dissipation structure that dissipates heat by transferring heat generated by a power element having a resin-sealed main body portion and a lead terminal extending from the main body portion to a product housing having an opening formed on the top surface from the heat dissipation structure A method,
A step of installing the heat dissipation structure on the inner side surface of the product housing in an inclined state so that the tip side is lowered;
Arranging a thin plate material on a printed circuit board;
Fixing the body portion of the power element to the thin plate disposed on the printed circuit board;
Soldering the lead terminal of the power element with the body portion fixed to the thin plate material to the printed circuit board;
Inclining the thin plate material together with the power element with the lead terminal soldered to the printed circuit board so as to be inclined at substantially the same angle as the heat dissipation structure,
Accommodating the printed circuit board in the product housing such that the thin plate material inclined so as to be inclined at substantially the same angle as the heat dissipation structure is disposed on the heat dissipation structure;
Fixing the thin plate material disposed on the heat dissipation structure to the heat dissipation structure from the thin plate material side by screwing operation through the opening; and
A method for manufacturing a power element heat dissipation structure. Manufacture of a power element heat dissipation structure that dissipates heat by transferring heat generated by a power element having a resin-sealed main body portion and a lead terminal extending from the main body portion to a product housing having an opening formed on the top surface from the heat dissipation structure A method,
A step of installing the heat dissipation structure on the inner side surface of the product housing in an inclined state so that the tip side is lowered;
A step of placing a thin plate material on the printed circuit board by inclining at substantially the same angle as the heat dissipation structure;
Fixing the main body portion of the power element to the thin plate material disposed on the printed circuit board in a state where the lead terminal is directed obliquely downward;
Soldering the lead terminal of the power element with the main body portion fixed to the thin plate material to the printed circuit board;
Removing the portion of the printed board where the thin plate material is disposed;
Accommodating the printed circuit board in the product housing such that the thin plate material is disposed on the heat dissipation structure;
Fixing the thin plate material disposed on the heat dissipation structure to the heat dissipation structure from the thin plate material side by screwing operation through the opening; and
A method for manufacturing a power element heat dissipation structure. Manufacture of a power element heat dissipation structure that dissipates heat by transferring heat generated by a power element having a resin-sealed main body portion and a lead terminal extending from the main body portion to a product housing having an opening formed on the top surface from the heat dissipation structure A method,
A step of installing the heat dissipation structure on the inner side surface of the product housing in an inclined state so that the tip side is lowered;
Placing a jig having an upper surface inclined at substantially the same angle as the heat dissipation structure on the printed circuit board;
Placing a thin plate on the upper surface of the jig;
Fixing the main body portion of the power element to the thin plate material disposed on the jig in a state where the lead terminal is directed obliquely downward;
Soldering the lead terminal of the power element with the body portion fixed to the thin plate material to the printed circuit board;
Removing the portion of the printed circuit board where the jig is disposed together with the jig;
Accommodating the printed circuit board in the product housing such that the thin plate material is disposed on the heat dissipation structure;
Fixing the thin plate material disposed on the heat dissipation structure to the heat dissipation structure from the thin plate material side by screwing operation through the opening; and
A method for manufacturing a power element heat dissipation structure. Manufacture of a power element heat dissipation structure that dissipates heat by transferring heat generated by a power element having a resin-sealed main body portion and a lead terminal extending from the main body portion to a product housing having an opening formed on the top surface from the heat dissipation structure A method,
A step of installing the heat dissipation structure on the inner side surface of the product housing in an inclined state so that the tip side is lowered;
Placing a jig having an upper surface inclined at substantially the same angle as the heat dissipation structure on the printed circuit board;
Placing the power element on the jig in a state in which the lead terminal is inclined downward so that the main body portion of the power element contacts the upper surface of the jig;
Soldering the lead terminal of the power element placed on the upper surface of the jig to the printed circuit board;
Removing the portion of the printed circuit board on which the jig is placed together with the jig;
Accommodating the printed circuit board in the product housing such that the main body portion of the power element is disposed on the heat dissipation structure;
Fixing the body portion of the power element disposed on the heat dissipation structure together with the heat dissipation structure from the power element side by screwing operation through the opening; and
A method for manufacturing a power element heat dissipation structure.

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