JP5161192B2 - Power circuit wiring structure - Google Patents

Power circuit wiring structure Download PDF

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JP5161192B2
JP5161192B2 JP2009254500A JP2009254500A JP5161192B2 JP 5161192 B2 JP5161192 B2 JP 5161192B2 JP 2009254500 A JP2009254500 A JP 2009254500A JP 2009254500 A JP2009254500 A JP 2009254500A JP 5161192 B2 JP5161192 B2 JP 5161192B2
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circuit board
printed circuit
heat
heat radiation
pattern
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JP2011100848A (en
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雅樹 高田
茂生 高田
琢也 井上
真作 楠部
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Description

この発明は、パワー回路部品を実装したプリント基板のパターンの温度上昇を軽減することができるパワー回路配線構造に関するものである。   The present invention relates to a power circuit wiring structure capable of reducing a temperature rise of a printed circuit board pattern on which power circuit components are mounted.

パワー回路部品を実装したプリント基板においては、プリント基板上のパターンに大電流が流れる際に発生するジュール熱およびプリント基板上に実装された電気部品からの熱伝導によりパターンの温度が上昇する。プリント基板上のパターン自体に温度制限（例えば、メーカ標準値１００℃）があるため、パターンを流れる電流値が制限され、このプリント基板を内蔵した制御機器の定格容量が制限される要因となっていた。
近年、省エネ化・高性能化を目的にモータ駆動システム用にトランスファモールド構造のパワー半導体ＤＩＰＩＰＭ（Ｄｕａｌ-Ｉｎ-Ｌｉｎｅ Ｐａｃｋａｇｅ ｉｎｔｅｌｌｉｇｅｎｔ Ｐｏｗｅｒ Ｍｏｄｕｌｅ）をはじめとするパワー半導体が大容量化され、パワー半導体がプリント基板上に実装されたパワー回路の高電流化が更に進んでいるため、プリント基板上のパターンの温度上昇を軽減する対策の重要性が増している。
従来、プリント基板上のパターンの温度上昇を軽減する対策として、プリント基板のパターン上に放熱部材を設ける方法（特許文献１および非特許文献１参照)および回路部品とパターンがネジ等で電気的に接続する箇所に放熱部材をネジ止めする方法（特許文献２参照)がある。 In a printed circuit board on which a power circuit component is mounted, the temperature of the pattern rises due to Joule heat generated when a large current flows through the pattern on the printed circuit board and heat conduction from the electrical component mounted on the printed circuit board. Since the pattern itself on the printed circuit board has a temperature limit (for example, the manufacturer's standard value of 100 ° C.), the current value flowing through the pattern is limited, which is a factor that limits the rated capacity of the control device incorporating this printed circuit board. It was.
In recent years, power semiconductors such as transfer-molded power semiconductor DIPIPM (Dual-In-Line Package Intelligent Power Module) for motor drive systems have been increased for the purpose of energy saving and high performance, and the power semiconductor has been printed. As the current of the power circuit mounted on the substrate is further increased, the importance of measures for reducing the temperature rise of the pattern on the printed circuit board is increasing.
Conventionally, as a measure for reducing the temperature rise of the pattern on the printed circuit board, a method of providing a heat dissipation member on the pattern of the printed circuit board (see Patent Document 1 and Non-Patent Document 1) and the circuit component and the pattern are electrically connected with screws or the like. There is a method (refer to Patent Document 2) in which a heat dissipating member is screwed to a connecting portion.

特開２００７−２５８５３９号公報（３頁、図２）JP 2007-258539 A (page 3, FIG. 2) 特開２００７−２１４４１４号公報（３頁、図１）JP 2007-214414 A (page 3, FIG. 1)

実開平３−１０４７９３号公報（図１）Japanese Utility Model Publication No. 3-104793 (FIG. 1)

従来のパワー回路部品を実装したプリント基板上のパターンの温度上昇を軽減する方法では、プリント基板上に複数の高電圧、大電流の回路が実装されている場合は、複数の放熱部材を取り付ける必要があるが、複数の放熱部材をプリント基板のパターン上に安全な絶縁距離を確保して配置することが難しいという問題点があった。   In the conventional method of reducing the temperature rise of the pattern on the printed circuit board on which power circuit components are mounted, if multiple high-voltage, high-current circuits are mounted on the printed circuit board, it is necessary to install multiple heat dissipation members However, there is a problem that it is difficult to arrange a plurality of heat dissipating members on a printed circuit board pattern while ensuring a safe insulating distance.

この発明は上記のような課題を解決するためになされたものであり、パワー回路部品を実装したプリント基板上のパターンの温度上昇を軽減でき、安全な絶縁距離を確保しつつ放熱部を設けたパワー回路配線構造を提供することを目的とする。   The present invention has been made to solve the above-described problems, and can reduce the temperature rise of the pattern on the printed circuit board on which the power circuit component is mounted, and the heat dissipating portion is provided while ensuring a safe insulation distance. An object is to provide a power circuit wiring structure.

この発明に係るパワー回路配線構造は、パワー回路部品を実装する実装用プリント基板と、この実装用プリント基板上に配されたパワー回路部品に接続する被放熱パターンと、電気的に絶縁された複数の放熱部を有する放熱部材と、この放熱部材を実装用プリント基板上の被放熱パターンに熱的に結合すると共に実装用プリント基板に固定する接続部材とを備え、放熱部材は放熱用プリント基板であり、放熱部は放熱パターンであり、放熱用プリント基板の両面に異電圧の前記放熱パターンを対向して配置し、コンデンサを形成したものである。 A power circuit wiring structure according to the present invention includes a printed circuit board for mounting a power circuit component, a heat radiation pattern connected to the power circuit component disposed on the printed circuit board for mounting, and a plurality of electrically insulated patterns. A heat radiating member having a heat radiating portion, and a connecting member that thermally couples the heat radiating member to the heat radiation pattern on the printed circuit board for mounting and fixes the heat radiating member to the printed circuit board for mounting. The heat radiation part is a heat radiation pattern, and the heat radiation pattern of the different voltage is arranged opposite to both surfaces of the printed board for heat radiation to form a capacitor .

この発明に係るパワー回路配線構造は、パワー回路部品を実装した実装用プリント基板に、電気的に絶縁された複数の放熱部を有する放熱部材を設置し、実装用プリント基板上に配された被放熱パターンと放熱部を熱的に結合させ、放熱部材は放熱用プリント基板であり、放熱部は放熱パターンであり、放熱用プリント基板の両面に異電圧の前記放熱パターンを対向して配置し、コンデンサを形成した構造であるため、高電圧、大電流が流れる複数のパターンの温度上昇の軽減を安全な絶縁距離を確保した複数の放熱部を有する放熱部材で実現できるとともに、過渡的な母線電圧変動を抑制することができる。 In the power circuit wiring structure according to the present invention, a heat dissipating member having a plurality of electrically insulated heat dissipating portions is installed on a mounting printed circuit board on which power circuit components are mounted, and the circuit board disposed on the mounting printed circuit board. The heat dissipation pattern and the heat dissipation part are thermally coupled , the heat dissipation member is a heat dissipation printed circuit board, the heat dissipation part is the heat dissipation pattern, and the heat dissipation patterns of different voltages are arranged opposite to both surfaces of the heat dissipation printed circuit board, Since the capacitor is formed, it is possible to reduce the temperature rise of multiple patterns through which high voltage and large current flow with a heat dissipating member having a plurality of heat dissipating parts that secure a safe insulation distance, and a transient bus voltage Variations can be suppressed .

この発明の実施の形態１のパワー回路配線構造の構成を示す斜視図および断面図である。It is the perspective view and sectional drawing which show the structure of the power circuit wiring structure of Embodiment 1 of this invention. この発明の実施の形態２のパワー回路配線構造の構成を示す断面図である。It is sectional drawing which shows the structure of the power circuit wiring structure of Embodiment 2 of this invention. この発明の実施の形態３のパワー回路配線構造の構成を示す断面図である。It is sectional drawing which shows the structure of the power circuit wiring structure of Embodiment 3 of this invention. この発明の実施の形態４のパワー回路配線構造の構成を示す斜視図および断面図である。It is the perspective view and sectional drawing which show the structure of the power circuit wiring structure of Embodiment 4 of this invention. この発明の実施の形態５のパワー回路配線構造の構成を示す断面図である。It is sectional drawing which shows the structure of the power circuit wiring structure of Embodiment 5 of this invention. この発明の実施の形態６のパワー回路配線構造の構成を示す断面図である。It is sectional drawing which shows the structure of the power circuit wiring structure of Embodiment 6 of this invention. この発明の実施の形態７のパワー回路配線構造の構成を示す断面図である。It is sectional drawing which shows the structure of the power circuit wiring structure of Embodiment 7 of this invention. この発明の実施の形態８のパワー回路配線構造の構成を示す斜視図および断面図である。It is the perspective view and sectional drawing which show the structure of the power circuit wiring structure of Embodiment 8 of this invention.

実施の形態１．
以下、本願発明の実施の形態について図に基づいて説明する。図１はこの発明の実施の形態１におけるパワー回路配線構造１の全体構成を示す図であり、図１ａは斜視図、図１ｂはＡ−Ａ’断面を示す断面図である。
パワー回路配線構造１は、パワー回路部品（図示せず）を実装した実装用プリント基板２１に電気的に絶縁された複数の放熱部である放熱パターン３、４、５を有する放熱部材である放熱用プリント基板２から構成される。放熱用プリント基板２上の放熱パターン３、４、５と実装用プリント基板２１上の被放熱パターン２２、２３、２４とは接続端子６、７、８で熱的に接続されている。この接続端子６、７、８は放熱パターン３、４、５と被放熱パターン２２、２３、２４とを熱的に結合すると共に、放熱用プリント基板２を実装用プリント基板２１に固定する機能も有する。ここで、放熱パターンおよび被放熱パターンの材質は銅箔である。 Embodiment 1 FIG.
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing an overall configuration of a power circuit wiring structure 1 according to Embodiment 1 of the present invention. FIG. 1a is a perspective view, and FIG. 1b is a sectional view showing an AA ′ section.
The power circuit wiring structure 1 is a heat dissipating member having heat dissipating patterns 3, 4, 5 which are a plurality of heat dissipating portions electrically insulated from a printed circuit board 21 for mounting a power circuit component (not shown). The printed circuit board 2 is used. The heat radiation patterns 3, 4, 5 on the heat radiation printed circuit board 2 and the heat radiation patterns 22, 23, 24 on the mounting printed circuit board 21 are thermally connected by connection terminals 6, 7, 8. The connection terminals 6, 7, and 8 thermally couple the heat radiation patterns 3, 4, and 5 to the heat radiation patterns 22, 23, and 24, and also have a function of fixing the heat radiation printed circuit board 2 to the mounting printed circuit board 21. Have. Here, the material of the heat radiation pattern and the heat radiation pattern is copper foil.

接続端子６、７、８による熱的結合方法および固定方法を放熱パターン３と被放熱パターン２２と接続端子６を例にして説明する。接続端子６は熱伝導率が高く、固定部材としての機械的強度が必要であるため、縦長の金属板である。放熱用プリント基板２と結合するため接続端子６の上部には、接続端子固定用ボルト（以下、固定用ボルトという）６ａが取り付けられ、下部６ｃは実装用プリント基板２１に固定するため、被放熱パターン２２に設けた固定用穴の形に合わせた形状とされる。図１では、接続端子６の接続端子結合部６ｃを被放熱パターン２２に半田付で結合されている。   A thermal coupling method and a fixing method using the connection terminals 6, 7, and 8 will be described using the heat radiation pattern 3, the heat radiation pattern 22, and the connection terminal 6 as examples. Since the connection terminal 6 has high thermal conductivity and requires mechanical strength as a fixing member, it is a vertically long metal plate. A connection terminal fixing bolt (hereinafter, referred to as a fixing bolt) 6a is attached to the upper portion of the connection terminal 6 for coupling with the heat dissipation printed circuit board 2, and the lower portion 6c is fixed to the mounting printed circuit board 21. The shape matches the shape of the fixing holes provided in the pattern 22. In FIG. 1, the connection terminal coupling portion 6 c of the connection terminal 6 is coupled to the heat radiation pattern 22 by soldering.

以下、パワー回路配線構造の組み立て手順について説明する。
別工程で、放熱用プリント基板２と接続端子６、７、８を固定用ボルト６ａ、７ａ、８ａと接続端子固定用ナット（以下、固定用ナットという）６ｂ、７ｂ、８ｂを用いて固定し、組み立てる。実装用プリント基板２１に回路部品を実装し、組み立てる際は、放熱用プリント基板２と接続端子６、７、８は既に組み上がっている。実装用プリント基板２１をフロー半田付けする時に、その他の部品と一緒に一部品として半田付けされる。 Hereinafter, a procedure for assembling the power circuit wiring structure will be described.
In a separate process, the heat-dissipation printed circuit board 2 and the connection terminals 6, 7, 8 are fixed using fixing bolts 6a, 7a, 8a and connection terminal fixing nuts (hereinafter referred to as fixing nuts) 6b, 7b, 8b. ,assemble. When circuit components are mounted and assembled on the printed circuit board 21 for mounting, the printed circuit board 2 for heat dissipation and the connection terminals 6, 7, and 8 are already assembled. When the mounting printed circuit board 21 is flow-soldered, it is soldered as one component together with other components.

図１において、放熱部材である放熱用プリント基板２に形成された放熱部である放熱パターン数が３の場合を示しているが、放熱パターンの数は２以上であればよく、各放熱パターンの形状も図示した長方形に限定されない。
また、放熱用プリント基板２に形成された放熱パターン３、４、５は片面としたが、両面でも良い。放熱パターン３、４、５が両面の場合は、固定用ボルト６ａ、７ａ、８ａと固定用ナット６ｂ、７ｂ、８ｂを用いて固定すると共に、表面パターンと裏面パターン間を熱的に結合する。
図１では、接続端子６を放熱用プリント基板２に固定する方法として、接続端子固定用ボルト６ａと接続端子固定用ナット６ｂを用いて接続端子６を放熱用プリント基板２に固定するネジ留め方式を説明したが、機械的強度と良好な熱伝導率が得られる固定方法として、半田付やかしめ方式も採用できる。一方、放熱用プリント基板２を実装用プリント基板２１に固定する方法として、接続端子６を被放熱パターン２２、２３、２４に半田付で固定する場合を説明したが、機械的強度と良好な熱伝導率が得られる固定方法として、かしめやネジ留め方式も採用できる。
更に、上記説明では、接続端子６、７、８を金属製とし、固定用および熱的結合用に共用したが、接続端子を非金属製（例えば、合成樹脂製）として固定用のみに使用して、別に熱的結合用の金属で、放熱パターン３、４、５と被放熱パターン２２、２３、２４と熱的に結合しても良い。 In FIG. 1, although the case where the number of the heat dissipation patterns which are the heat dissipation portions formed on the heat dissipation printed circuit board 2 which is the heat dissipation member is 3 is shown, the number of the heat dissipation patterns may be two or more. The shape is not limited to the illustrated rectangle.
Moreover, although the heat radiation patterns 3, 4, and 5 formed on the heat radiation printed board 2 are single-sided, they may be double-sided. When the heat radiation patterns 3, 4, and 5 are double-sided, they are fixed using fixing bolts 6 a, 7 a, and 8 a and fixing nuts 6 b, 7 b, and 8 b and thermally coupled between the front surface pattern and the back surface pattern.
In FIG. 1, as a method of fixing the connection terminal 6 to the heat dissipation printed circuit board 2, a screwing method for fixing the connection terminal 6 to the heat dissipation printed circuit board 2 using the connection terminal fixing bolt 6 a and the connection terminal fixing nut 6 b. However, as a fixing method for obtaining mechanical strength and good thermal conductivity, a soldering or caulking method can also be adopted. On the other hand, as a method of fixing the heat radiation printed circuit board 2 to the mounting printed circuit board 21, the case where the connection terminals 6 are fixed to the heat radiation patterns 22, 23, and 24 by soldering has been described. As a fixing method for obtaining conductivity, a caulking or screwing method can also be adopted.
Further, in the above description, the connection terminals 6, 7, and 8 are made of metal and shared for fixing and thermal coupling. However, the connection terminal is made of nonmetal (for example, made of synthetic resin) and used only for fixing. In addition, the heat radiation patterns 3, 4, 5 and the heat radiation patterns 22, 23, 24 may be thermally coupled with a metal for thermal coupling.

この実施の形態１に係るパワー回路配線構造１は、パワー回路部品を実装した実装用プリント基板２１に、電気的に絶縁された２つ以上の放熱部である放熱パターン３、４、５を有する放熱部材である放熱用基板２を設置し、実装用プリント基板２１上に配された被放熱パターン２２、２３、２４と放熱パターン３、４、５を各々熱的に結合させた構造であるため、高電圧、大電流が流れる複数の被放熱パターン２２、２３、２４の温度上昇の軽減が、安全な絶縁距離を確保した複数の放熱部を有する放熱部材で実現できる。   The power circuit wiring structure 1 according to the first embodiment includes heat radiation patterns 3, 4, and 5, which are two or more electrically insulated heat radiation portions, on a mounting printed board 21 on which power circuit components are mounted. Since the heat dissipating board 2 which is a heat dissipating member is installed, and the heat dissipating patterns 22, 23 and 24 and the heat dissipating patterns 3, 4 and 5 arranged on the printed circuit board 21 for mounting are respectively thermally coupled. The reduction in temperature rise of the plurality of heat radiation patterns 22, 23, and 24 through which a high voltage and a large current flow can be realized by a heat radiation member having a plurality of heat radiation portions that ensure a safe insulation distance.

放熱パターン３、４、５には回路電流が流れないため、回路電流による自己発熱はなく、放熱パターン３、４、５の放熱効果を最大限利用できる。
また、この実施の形態１に係るパワー回路配線構造１は、被放熱パターン２２、２３、２４における温度上昇を軽減する効果があるため、従来、プリント基板上のパターンの温度上昇を軽減するために行われていたパターンの厚銅箔化が不要となり、市場に流通している汎用プリント基板を使用できるという効果がある。銅箔パターンの厚銅箔化以外の対策として、銅箔パターンの幅広化も行われているが、銅箔パターンの狭幅化が可能となり、実装用プリント基板を小型化できる効果がある。銅箔パターンの狭幅化により、回路部品のリードの小径化およびリード間ピッチを狭幅化でき、回路部品パッケージを小型化できるという効果もある。 Since no circuit current flows through the heat radiation patterns 3, 4, and 5, there is no self-heating due to the circuit current, and the heat radiation effect of the heat radiation patterns 3, 4, and 5 can be utilized to the maximum.
In addition, since the power circuit wiring structure 1 according to the first embodiment has an effect of reducing the temperature rise in the heat radiation patterns 22, 23, and 24, conventionally, to reduce the temperature rise of the pattern on the printed circuit board. There is an effect that it is not necessary to make the pattern thick copper foil, and a general-purpose printed circuit board distributed in the market can be used. As measures other than the thick copper foil of the copper foil pattern, the copper foil pattern is also widened, but the copper foil pattern can be narrowed, and there is an effect that the printed circuit board for mounting can be downsized. By narrowing the copper foil pattern, it is possible to reduce the diameter of the leads of the circuit component and the pitch between the leads, and to reduce the size of the circuit component package.

パワ−エレクトロニクス機器（以降、パワエレ機器という）の定格容量は、通常、回路部品およびプリント基板パターンの温度上昇で制限されるため、機器の定格容量を上げるためには回路部品の定格容量の向上とプリント基板パターンの温度上昇の軽減が必要である。近年、高電圧・高電流化対応パワー半導体の実用化が進んでおり、パワエレ機器の定格容量がプリント基板パターンの温度で制限されている場合は、この実施の形態１に係るパワー回路配線構造１を採用することで、パワエレ機器の定格容量を上げることができるという効果がある。   The rated capacity of power electronics equipment (hereinafter referred to as power electronics equipment) is usually limited by the temperature rise of circuit components and printed circuit board patterns. Therefore, to increase the rated capacity of equipment, It is necessary to reduce the temperature rise of the printed circuit board pattern. In recent years, power semiconductors for high voltage and high current have been put into practical use, and when the rated capacity of the power electronics device is limited by the temperature of the printed circuit board pattern, the power circuit wiring structure 1 according to the first embodiment is used. By adopting, there is an effect that the rated capacity of the power electronics device can be increased.

実施の形態２．
図２はこの発明の実施の形態２に係るパワー回路配線構造３１の全体構成を示す断面図である。図において、図１と同一あるいは相当部分には同一符号を付している。
放熱用プリント基板３２は、表面および裏面の両面に放熱パターン３３ａと３３ｂを有し、この放熱パターン３３ａと３３ｂ間をスルーホールで熱的に結合している。
図示していないが、放熱用プリント基板３２には、実施の形態１と同様に、複数の放熱パターン３４ａと３４ｂおよび３５ａと３５ｂがあり、それぞれ表面および裏面パターン間がスルーホールで結合されている。
また、放熱用プリント基板３２は、接続端子６（接続端子７、８は図示せず）により、実装用プリント基板２１の被放熱パターン２２に固定されると共に熱的に結合されている。 Embodiment 2. FIG.
FIG. 2 is a sectional view showing an overall configuration of a power circuit wiring structure 31 according to Embodiment 2 of the present invention. In the figure, the same or corresponding parts as in FIG.
The heat radiation printed circuit board 32 has heat radiation patterns 33a and 33b on both the front and back surfaces, and the heat radiation patterns 33a and 33b are thermally coupled to each other through holes.
Although not shown, the heat radiation printed board 32 has a plurality of heat radiation patterns 34a and 34b and 35a and 35b as in the first embodiment, and the front surface and the back surface pattern are coupled by through holes, respectively. .
Further, the heat radiation printed circuit board 32 is fixed and thermally coupled to the heat radiation pattern 22 of the mounting printed circuit board 21 by connection terminals 6 (connection terminals 7 and 8 are not shown).

この実施の形態２に係るパワー回路配線構造３１では、スルーホールが無く接続端子６でのみ放熱用プリント基板の両面を熱的に結合した場合と比べて、放熱用プリント基板３２の両面に形成された放熱パターン３３ａ、３３ｂ間における熱伝導が良くなり、放熱パターンの表面温度が均一化され、放熱性が向上するという効果がある。   The power circuit wiring structure 31 according to the second embodiment is formed on both surfaces of the heat radiation printed circuit board 32 as compared to the case where both surfaces of the heat radiation printed circuit board are thermally coupled only at the connection terminal 6 without the through hole. The heat conduction between the heat radiation patterns 33a and 33b is improved, the surface temperature of the heat radiation pattern is made uniform, and the heat radiation performance is improved.

実施の形態３．
図３はこの発明の実施の形態３に係るパワー回路配線構造４１の全体構成を示す断面図である。図において、図１と同一あるいは相当部分には同一符号を付している。
放熱用プリント基板４２は、両面に放熱パターン４３ａと４３ｂを有すると共に、内層にパターン４３ｄを有している。
図示していないが、放熱用プリント基板４２には、実施の形態１と同様に、複数の放熱パターン４４ａと４４ｂおよび４５ａと４５ｂがある。
また、放熱用プリント基板４２は、接続端子６（接続端子７、８は図示せず）により、実装用プリント基板２１の被放熱パターン２２、２３、２４に固定されると共に熱的に結合されている。
放熱用プリント基板４２の内層パターンは、放熱パターン４３ａと４３ｂ、４４ａと４４ｂおよび４５ａと４５ｂのそれぞれ別に設けてもよいし、共通に内層パターンを１枚としてもよい。 Embodiment 3 FIG.
FIG. 3 is a sectional view showing an overall configuration of a power circuit wiring structure 41 according to Embodiment 3 of the present invention. In the figure, the same or corresponding parts as in FIG.
The heat radiation printed circuit board 42 has heat radiation patterns 43a and 43b on both sides and a pattern 43d on the inner layer.
Although not shown, the heat radiation printed circuit board 42 has a plurality of heat radiation patterns 44a and 44b and 45a and 45b as in the first embodiment.
The heat radiation printed circuit board 42 is fixed and thermally coupled to the heat radiation patterns 22, 23, and 24 of the mounting printed circuit board 21 by connection terminals 6 (connection terminals 7 and 8 are not shown). Yes.
The inner layer pattern of the heat radiation printed circuit board 42 may be provided separately for each of the heat radiation patterns 43a and 43b, 44a and 44b, and 45a and 45b, or may be a single inner layer pattern.

この実施の形態３に係るパワー回路配線構造４１では、放熱用プリント基板４２の熱伝導が良くなり、放熱パターン４３ａ、４３ｂの表面温度が均一化され、放熱性が向上するという効果がある。
また、放熱用プリント基板４２に内層パターン４３ｄを有していることにより、実施の形態１のパワー回路配線構造の組立手順で説明したフロー半田付けを実施する際、放熱用プリント基板４２に発生する基板の反りが軽減されるという効果がある。 In the power circuit wiring structure 41 according to the third embodiment, the heat conduction of the heat radiating printed circuit board 42 is improved, and the surface temperatures of the heat radiating patterns 43a and 43b are made uniform, and the heat radiating property is improved.
Further, since the heat dissipating printed circuit board 42 has the inner layer pattern 43d, it is generated in the heat dissipating printed circuit board 42 when performing the flow soldering described in the assembly procedure of the power circuit wiring structure of the first embodiment. There is an effect that the warpage of the substrate is reduced.

実施の形態４．
図４はこの発明の実施の形態４に係るパワー回路配線構造５１の全体構成を示す図であり、図４ａは斜視図、図４ｂはＡ−Ａ’断面を示す断面図、図４ｃはＢ−Ｂ’断面を示す断面図である。図において、図１と同一あるいは相当部分には同一符号を付している。
パワー回路配線構造５１においては、実施の形態１と同様に接続端子６、８は放熱パターン３、５と被放熱パターン２２、２４とを熱的に結合すると共に、放熱用プリント基板２を実装用プリント基板２１に固定する機能も有する。接続端子９は放熱パターン４と被放熱パターン２３とを熱的に結合すると共に、放熱用プリント基板２を実装用プリント基板２１に固定する機能も有するが、接続端子９の形状は縦長の平面板ではなく、実装用プリント基板２１に対して水平部分を持つ階段形状としている。
接続端子９を階段形状としているので、接続端子６、９、８を実装用プリント基板２１の被放熱パターン２２、２３、２４に固定する位置は直線状ではなく、千鳥状となる。 Embodiment 4 FIG.
4 is a diagram showing the overall configuration of a power circuit wiring structure 51 according to Embodiment 4 of the present invention. FIG. 4a is a perspective view, FIG. 4b is a sectional view showing an AA ′ section, and FIG. It is sectional drawing which shows a B 'cross section. In the figure, the same or corresponding parts as in FIG.
In the power circuit wiring structure 51, as in the first embodiment, the connection terminals 6 and 8 thermally couple the heat radiation patterns 3 and 5 and the heat radiation patterns 22 and 24 and mount the heat radiation printed board 2 for mounting. It also has a function of fixing to the printed circuit board 21. The connection terminal 9 thermally couples the heat radiation pattern 4 and the heat radiation pattern 23 and also has a function of fixing the heat radiation printed circuit board 2 to the mounting printed circuit board 21, but the shape of the connection terminal 9 is a vertically long flat plate. Instead, a staircase shape having a horizontal portion with respect to the mounting printed circuit board 21 is employed.
Since the connection terminal 9 has a staircase shape, the positions at which the connection terminals 6, 9, 8 are fixed to the heat radiation patterns 22, 23, 24 of the mounting printed circuit board 21 are not linear but staggered.

この実施の形態４に係るパワー回路配線構造５１では、接続端子６、９、８を実装用プリント基板２１に固定する位置が千鳥状となるため、放熱用プリント基板２の自立安定性が向上すると共に、実施の形態１で説明したフロー半田付けを実施する際に放熱用プリント基板２を固定する治具が不要となり、半田付け作業が容易となる効果がある。   In the power circuit wiring structure 51 according to the fourth embodiment, the positions at which the connection terminals 6, 9, 8 are fixed to the mounting printed board 21 are staggered, so that the self-supporting stability of the heat radiating printed board 2 is improved. At the same time, when the flow soldering described in the first embodiment is performed, a jig for fixing the heat-dissipation printed circuit board 2 is not required, and the soldering operation is facilitated.

実施の形態５．
図５はこの発明の実施の形態５に係るパワー回路配線構造６１の全体構成を示す断面図である。図において、図１と同一あるいは相当部分には同一符号を付している。
パワー回路部品である発熱部品６２と非発熱部品６３が実装用プリント基板に実装されており、この発熱部品６２と非発熱部品６３の間に放熱用プリント基板２が接続端子６（接続端子７、８は図示せず）で固定されている。 Embodiment 5 FIG.
FIG. 5 is a sectional view showing an overall configuration of a power circuit wiring structure 61 according to Embodiment 5 of the present invention. In the figure, the same or corresponding parts as in FIG.
A heat generating component 62 and a non-heat generating component 63, which are power circuit components, are mounted on a mounting printed circuit board. Between the heat generating component 62 and the non-heat generating component 63, the heat dissipation printed circuit board 2 is connected to the connection terminal 6 (connection terminal 7, 8 is not shown).

この実施の形態５に係るパワー回路配線構造６１では、放熱用プリント基板２を発熱部品６２と自己発熱のない非発熱部品６３の間に配置したので、発熱部品６２から非発熱部品６３への輻射熱の影響を抑えることができ、非発熱部品６３が受ける熱ストレスを軽減できるという効果がある。例えば、使用温度が高いと部品寿命が短くなる電解コンデンサなどは、熱ストレスを軽減することでパワエレ機器の高寿命化が図れる。   In the power circuit wiring structure 61 according to the fifth embodiment, the heat radiation printed circuit board 2 is disposed between the heat generating component 62 and the non-heat generating component 63 that does not generate heat. This can reduce the thermal stress that the non-heat generating component 63 receives. For example, an electrolytic capacitor that shortens the component life when the operating temperature is high can extend the life of the power electronics device by reducing thermal stress.

実施の形態６．
図６はこの発明の実施の形態６に係るパワー回路配線構造７１の全体構成を示す断面図である。図において、図１と同一あるいは相当部分には同一符号を付している。
パワー回路部品７２のリード端子７２ａを実装用プリント基板上の被放熱パターン２２に半田付けする位置は、放熱用プリント基板２を固定する接続端子６の接続端子結合部６ｃの半田付け位置の近傍に設けている。 Embodiment 6 FIG.
FIG. 6 is a sectional view showing an overall configuration of a power circuit wiring structure 71 according to Embodiment 6 of the present invention. In the figure, the same or corresponding parts as in FIG.
The position where the lead terminal 72a of the power circuit component 72 is soldered to the heat radiation pattern 22 on the printed circuit board for mounting is in the vicinity of the soldering position of the connection terminal coupling portion 6c of the connection terminal 6 for fixing the printed circuit board 2 for heat radiation. Provided.

この実施の形態６に係るパワー回路配線構造７１では、パワー回路部品７２のリード端子７２ａを半田付けする際、接続端子結合部６ｃが、パワー回路部品７２のリード端子７２ａの近傍に設けられるため、半田付け時のリード端子７２ａ近傍の銅箔パターンが、リード端子７２ａのみの場合と比べ、広範囲に均一に加熱されることから、半田付け性が向上するという効果がある。   In the power circuit wiring structure 71 according to the sixth embodiment, when the lead terminal 72a of the power circuit component 72 is soldered, the connection terminal coupling portion 6c is provided in the vicinity of the lead terminal 72a of the power circuit component 72. Since the copper foil pattern in the vicinity of the lead terminal 72a at the time of soldering is heated uniformly over a wide range as compared with the case of only the lead terminal 72a, there is an effect that solderability is improved.

実施の形態７．
図７はこの発明の実施の形態７に係るパワー回路配線構造８１の全体構成を示す断面図である。図において、図１と同一あるいは相当部分には同一符号を付している。
ノイズ発生部品８２とノイズ耐量の低い回路部品の具体例として半導体集積回路８３が実装用プリント基板８７に実装されており、このノイズ発生部品８２と半導体集積回路８３間に放熱用プリント基板２が接続端子６（接続端子７、８は図示せず）で固定されている。 Embodiment 7 FIG.
FIG. 7 is a sectional view showing an overall configuration of a power circuit wiring structure 81 according to Embodiment 7 of the present invention. In the figure, the same or corresponding parts as in FIG.
A semiconductor integrated circuit 83 is mounted on a mounting printed circuit board 87 as a specific example of the noise generating component 82 and a circuit component with low noise tolerance, and the heat dissipation printed circuit board 2 is connected between the noise generating component 82 and the semiconductor integrated circuit 83. It is fixed with a terminal 6 (connection terminals 7 and 8 are not shown).

パワー回路部品が大電流をスイッチングするパワーモジュールの場合、スイッチング動作時、周辺回路部品へノイズを放射するが、同じプリント基板上にノイズの影響を受けやすい半導体集積回路が実装されている場合は、ノイズ低減対策が必要である。   When the power circuit component is a power module that switches a large current, noise is emitted to peripheral circuit components during switching operation, but when a semiconductor integrated circuit that is susceptible to noise is mounted on the same printed circuit board, Noise reduction measures are necessary.

この実施の形態７に係るパワー回路配線構造８１では、放熱用プリント基板２をノイズ発生部品８２と半導体集積回路８３の間に配置して、放射ノイズをシールドすることで、ノイズ発生部品８２から半導体集積回路８３へのノイズの影響を軽減できるという効果がある。   In the power circuit wiring structure 81 according to the seventh embodiment, the printed circuit board 2 for heat dissipation is disposed between the noise generating component 82 and the semiconductor integrated circuit 83 to shield radiation noise, so that the noise generating component 82 and the semiconductor are shielded. There is an effect that the influence of noise on the integrated circuit 83 can be reduced.

実施の形態８．
図８はこの発明の実施の形態８におけるパワー回路配線構造９１の全体構成を示す図であり、図８ａは斜視図、図８ｂはＡ−Ａ’断面を示す断面図、図８ｃはＢ−Ｂ’断面を示す断面図である。図において、図１と同一あるいは相当部分には同一符号を付している。 Embodiment 8 FIG.
8A and 8B are diagrams showing an overall configuration of a power circuit wiring structure 91 according to Embodiment 8 of the present invention, in which FIG. 8a is a perspective view, FIG. 8b is a cross-sectional view showing a cross section AA ′, and FIG. It is a sectional view showing a section. In the figure, the same or corresponding parts as in FIG.

放熱用プリント基板９２は、片面に放熱パターン９３を有し、対向する面に放熱パターン９４を有している。放熱パターン９３は金属製接続端子９５により、実装用プリント上の被放熱パターン９８に電気的に接続されると共に、熱的に結合されている。また、放熱パターン９４は金属製接続端子９６により、実装用プリント上の被放熱パターン９９に電気的に接続されると共に、熱的に結合されている。放熱パターン９３および９４は、それぞれ右端下部をカットしているため、対向している接続端子および固定用ボルト、ナットには接触せず、互いに電気的に絶縁が保たれている。
以上説明したように、放熱パターン９３および９４は絶縁物であるエポキシ樹脂製のプリント基板を挟んで対向し、かつ電気的に絶縁されているため、コンデンサを形成する。ここで、被放熱パターン９８および９９は、電力変換回路のインバータ部もしくはコンバータ部を構成するパワーモジュールの電源母線に相当するパターンである。 The heat dissipation printed circuit board 92 has a heat dissipation pattern 93 on one surface and a heat dissipation pattern 94 on the opposite surface. The heat dissipating pattern 93 is electrically connected to the heat dissipating pattern 98 on the mounting print by the metal connection terminals 95 and is thermally coupled. The heat radiation pattern 94 is electrically connected to the heat radiation pattern 99 on the mounting print by the metal connection terminals 96 and is thermally coupled. Since each of the heat radiation patterns 93 and 94 is cut at the lower right end, it does not come into contact with the connecting terminals, fixing bolts, and nuts facing each other, and is electrically insulated from each other.
As described above, the heat radiation patterns 93 and 94 are opposed to each other with an epoxy resin printed board as an insulator interposed therebetween and are electrically insulated, so that a capacitor is formed. Here, the heat radiation patterns 98 and 99 are patterns corresponding to the power supply buses of the power modules constituting the inverter unit or the converter unit of the power conversion circuit.

この実施の形態８に係るパワー回路配線構造９１では、放熱用プリント基板９２の両面に互いに絶縁された放熱パターン９３および９４を設けて、コンデンサを形成することで、パワーモジュールの電源母線パターンの温度上昇を軽減すると共に、パワーモジュールがスイッチング動作する際の過渡的な母線電圧変動を抑制するという効果がある。 In the power circuit wiring structure 91 according to the eighth embodiment, the heat radiation patterns 93 and 94 insulated from each other are provided on both surfaces of the heat radiation printed board 92 to form capacitors, thereby forming the temperature of the power bus pattern of the power module. As well as alleviating the rise, there are effects of suppressing a transient bus voltage fluctuation when the power module performs a switching operation.

１，３１，４１，５１，６１，７１，８１，９１ パワー回路配線構造、
２，３２，４２，９２ 放熱用プリント基板、
３，４，５，３３ａ，３３ｂ，４３ａ，４３ｂ，９３，９４ 放熱パターン、
６，７，８，９５，９６ 接続端子、９ 階段状接続端子、
６ａ 接続端子固定用ボルト、６ｂ 接続端子固定用ナット、６ｃ 接続端子結合部、
２１，６７，７７，８７，９７ 実装用プリント基板、
２２，２３，２４，９８，９９ 被放熱パターン、３３ｃ スルーホール、
４３ｄ 内層パターン、６２ 発熱部品、６３ 非発熱部品、７２ パワー回路部品、
７２ａ パワー回路部品リード線、８２ ノイズ発生部品、８３ 半導体集積回路。 1, 31, 41, 51, 61, 71, 81, 91 Power circuit wiring structure,
2,32,42,92 Printed circuit board for heat dissipation,
3, 4, 5, 33a, 33b, 43a, 43b, 93, 94 heat radiation pattern,
6, 7, 8, 95, 96 connection terminal, 9 stepped connection terminal,
6a connection terminal fixing bolt, 6b connection terminal fixing nut, 6c connection terminal coupling part,
21, 67, 77, 87, 97 Printed circuit board for mounting,
22, 23, 24, 98, 99 Heat radiation pattern, 33c Through hole,
43d inner layer pattern, 62 heat generating component, 63 non-heat generating component, 72 power circuit component,
72a Power circuit component lead wire, 82 Noise generating component, 83 Semiconductor integrated circuit.

Claims (1)

パワー回路部品を実装する実装用プリント基板と、この実装用プリント基板上に配され前記パワー回路部品に接続する被放熱パターンと、電気的に絶縁された複数の放熱部を有する放熱部材と、この放熱部材を前記被放熱パターンに熱的に結合すると共に前記実装用プリント基板に固定する接続部材とを備え、前記放熱部材は放熱用プリント基板であり、前記放熱部は放熱パターンであり、前記放熱用プリント基板の両面に異電圧の前記放熱パターンを対向して配置し、コンデンサを形成したパワー回路配線構造。 A printed circuit board for mounting a power circuit component, a heat dissipation pattern disposed on the printed circuit board for connection and connected to the power circuit component, a heat dissipation member having a plurality of electrically insulated heat dissipation portions, A heat dissipating member thermally coupled to the heat dissipation pattern and fixed to the printed circuit board for mounting , the heat dissipating member is a heat dissipating printed circuit board, the heat dissipating part is a heat dissipating pattern, A power circuit wiring structure in which a capacitor is formed by disposing the heat radiation patterns of different voltages on both sides of a printed circuit board .
JP2009254500A 2009-11-06 2009-11-06 Power circuit wiring structure Active JP5161192B2 (en)

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