JP2008010779A - Small-sized module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that a sufficient heat radiation can not be performed if a heater element is mounted in a small-sized module. <P>SOLUTION: The small-sized module is accommodated in a chassis where a chip including a heater element connected onto a multilayered substrate comprising a plurality of dielectric layers and a plurality of conductive layers. The module has the conductive layers that are provided on an upper surface of the multilayered substrate and comprise a conductive pattern electrically connected to the chip; and a substrate internal layer that is provided in the internal layer of the multilayered substrate, protrudes beyond the surface of the multilayered substrate, and has an elastic protruded portion. Heat generated by the chip is radiated to the chassis by pressure welding the protrusion onto the chassis. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a heat dissipation structure for a small module on which a chip including a heating element is mounted.

When mounting a chip that generates heat on a multilayer board, mount it at a location sufficiently away from the block that may cause deterioration of the characteristics due to heat in order to prevent the effect of heat on other blocks mounted on the multilayer board. Or, a means of heat dissipation is needed.

As a conventional heat dissipation method for a multilayer board, a chip whose operation characteristics change according to heat generation prevention and temperature is provided on another layer in the multilayer board to thermally shut off, and the generated heat is on the upper surface side in the multilayer board And a method of diffusing to the lower surface side (see, for example, Patent Document 1).
Japanese Patent Laid-Open No. 2003-204013 (FIG. 1)

  In the conventional configuration, the heat generated by the chip is diffused in the module. In this case, there is no problem when the module is relatively large compared to the heat generation amount of the chip, but there is a problem that sufficient heat dissipation cannot be performed when the module is downsized or the heat generation amount of the chip increases. .

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a small module that can sufficiently dissipate heat generated in the small module.

  To achieve the above object, the present invention provides a small module in which a chip including a heating element is connected to a multilayer substrate composed of a plurality of dielectric layers and a plurality of conductor layers, and is accommodated in a chassis. A conductive layer that forms a conductive pattern electrically connected to the chip, and a substrate that is provided in an inner layer of the multilayer substrate and has a protruding portion that has elasticity and protrudes from the surface of the multilayer substrate. An inner layer, and heat generated by the chip is dissipated to the chassis by the projecting portion being pressed against the chassis.

  By having such a configuration, it is possible to sufficiently dissipate heat by dissipating heat generated from the chip including the heating element to the chassis.

As described above, in the present invention, since the protrusion is provided in the inner layer of the substrate, the heat generated from the chip can be sufficiently radiated by radiating the heat to the chassis.
For this reason, it becomes possible to disperse | distribute the heat in a module to a chassis via a flexible substrate.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a diagram for explaining the overall configuration of an embodiment of the present invention.
A heat generating component 2 (for example, an IC) and other components are mounted on the multilayer substrate 1.
FIG. 2 is a cross-sectional view for explaining the structure of the multilayer substrate 1.
The multilayer substrate 1 has a conductive pattern as an inner layer of the substrate and is configured around a flexible substrate 3 having elasticity. And the dielectric material layer 5 is provided in both surfaces of this flexible substrate, Furthermore, the conductor layer 6 which comprises a conductor pattern is provided in the surface. The heat generating component 2 is mounted so as to be in contact with the conductor layer 6 of the multilayer substrate 1.

Here, the flexible substrate 3 is configured with a protruding portion 4 whose end protrudes vertically and horizontally from the multilayer substrate 1.
Further, the conductor layer 6 and the flexible substrate 3 are connected through a through hole or a via 7 in order to improve heat conduction.
The multilayer board having such a configuration is incorporated into the chassis 9.
FIG. 3 is a view showing a state when the multilayer substrate 1 is assembled into the chassis 9.
When the protruding portion 4 of the flexible substrate 3 is assembled into the chassis 9, the protruding portion 4 is bent by the inner wall of the chassis and is pressed against the chassis 9.
For this reason, the heat generated from the heat generating component 2 is transmitted to the conductor portion of the flexible substrate 3 via the conductor layer 6 and through the through hole or Via 7. Further, heat can be radiated to the chassis 9 via the protrusion 4.

  Thereby, it is not necessary to provide a heat dissipation pattern on the back surface of the heat generating component, and the other component 8 can be mounted in the space, and the module can be miniaturized.

Furthermore, the protrusion 4 can be electrically and structurally strengthened by connecting the chassis 9 by soldering or by connecting with a conductive adhesive.
Furthermore, according to the amount of heat in the module, other signal lines can be assembled on the flexible substrate 3 and can be used as terminals for connection to other substrates.
In addition, although the present Example demonstrated the case where the protrusion part 4 of the flexible substrate 3 had both upper and lower sides and right and left, it is not necessarily limited to this. Various modifications can be made as long as the protruding portion 4 of the flexible substrate 3 is pressed against the inner wall of the chassis. For example, only the upper and lower sides or only the left and right sides may be used.

Further, the layer structure of the multilayer substrate 1 is not limited to this.
As described above, according to the present embodiment, the heat in the module can be distributed to the chassis via the flexible substrate. Further, by disposing the flexible substrate in the inner layer, it is possible to mount components on the back surface of the heat generating component, and it is possible to reduce the size of the module.

The figure for demonstrating the whole structure in connection with embodiment of this invention. Sectional drawing for demonstrating the structure of the multilayer board | substrate in connection with embodiment of this invention. The figure which shows a state when it integrates in the chassis concerning embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 .... Multilayer substrate 2 .... Heat generation component 3 .... Flexible substrate 4 .... Projection part 5 .... Dielectric layer 6 ...・ ・ ・ Conductor layer 7 ・ ・ ・ ・ ・ ・ Through hole or Via 8 ・ ・ ・ ・ ・ ・ ・ ・ Other parts 9 ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Chassis

Claims (3)

In a small module in which a chip including a heating element is connected to a multilayer substrate composed of a plurality of dielectric layers and a plurality of conductor layers, and accommodated in a chassis,
A conductor layer provided on an upper surface of the multilayer substrate and constituting a conductor pattern electrically connected to the chip;
A substrate inner layer provided on an inner layer of the multilayer substrate, protruding from the surface of the multilayer substrate, and having a protruding portion having elasticity;
The small module is characterized in that heat generated by the chip is dissipated to the chassis by the projecting portion being pressed against the chassis.   2. The small module according to claim 1, wherein the inner layer of the substrate is formed of a flexible substrate.   2. The small module according to claim 1, wherein the substrate inner layer is provided with a via hole that connects a conductor pattern provided in the conductor layer and a second conductor pattern provided in the substrate inner layer.

Images