JP2012195525A - Electronic controller - Google Patents

Abstract

PROBLEM TO BE SOLVED: To miniaturize an electronic controller.SOLUTION: A heat generating electronic component 2 disposed on a surface 3a of a circuit board 3 is mounted adjacent to a connector pin 15 of a connector 4 attached to the surface of the circuit board 3, and a conductor pattern 14 adjacent to both the electronic component 2 and the connector pin 15 is disposed on the surface 3a of the circuit board 3, thereby conducting heat generated in the electronic component 2 to the connector pin 15. When the heat generated in the electronic component 2 is dissipated, there is no need to perform heat dissipation from a rear surface 3b of the circuit board 3 with respect to a case 6 for storing the circuit board 3, allowing an electronic component to be mounted at a position on the rear side of the electronic component 2. Therefore, a component mounting area of the circuit board 3 can be increased without enlarging the circuit board 3, and the miniaturization of the circuit board allows miniaturization of an electronic controller 1.

Description

  The present invention relates to an electronic control device including a circuit board on which electronic components are mounted, and a connector that electrically connects an electronic circuit formed on the circuit board and an external device.

  For example, Patent Document 1 discloses a pedestal that comes into close contact with the electronic component from the back side of the wiring substrate to a case where a wiring substrate having electronic components mounted on the surface thereof is attached, and heat dissipation that continues to the pedestal. There is disclosed a technique in which a protrusion is provided and heat generated in the electronic component is diffused from the pedestal to the wide range of the case through the heat dissipation protrusion.

JP 2009-158796 A

  However, in such Patent Document 1, the pedestal and the radiating ridge portion will protrude inside the case, and at the position where the pedestal and the radiating ridge portion are provided, Since it becomes difficult to mount the electronic component on the back surface of the wiring board, the wiring board becomes larger correspondingly, and there is a possibility that the entire apparatus will be enlarged.

  Therefore, the present invention mounts the heat generating component provided on one surface of the circuit board so as to be close to the connector pin of the connector attached to the one surface side of the circuit board, and the heat generating component and the heat generating component. Conductive patterns close to both of the adjacent connector pins are provided on one surface of the circuit board, and heat generated by the heat generating component is conducted to the connector pins.

  According to the present invention, heat conducted from the heat generating component to the connector pin can be efficiently radiated to the outside of the electronic control device via the connector pin close to the heat generating component. Therefore, in dissipating the heat generated in the heat generating component, it is not necessary to dissipate heat from the other surface side of the circuit board to the housing in which the circuit board is accommodated. Components can be mounted, the component mounting area of the circuit board can be increased without increasing the circuit board, and the electronic control device can be downsized by downsizing the circuit board.

The disassembled perspective view which showed typically the schematic structure of the electronic controller which concerns on this invention. Explanatory drawing which showed typically the cross section of the position along the AA of FIG. The explanatory view showing typically the portion where electronic parts were mounted among the surfaces of a circuit board. It is explanatory drawing which showed the principal part of 2nd Embodiment of this invention typically, Comprising: Explanatory drawing equivalent to the cross section of the position along the AA line of FIG. It is explanatory drawing which showed typically the principal part of 3rd Embodiment of this invention, Comprising: Explanatory drawing equivalent to the cross section of the position along the AA of FIG. It is explanatory drawing which showed the principal part of 4th Embodiment of this invention typically, Comprising: Explanatory drawing equivalent to the cross section of the position along the AA of FIG. In 4th Embodiment of this invention, explanatory drawing which showed typically the part by which the electronic component was mounted among the surfaces of a circuit board. In 5th Embodiment of this invention, explanatory drawing which showed typically the part by which the electronic component was mounted among the surfaces of a circuit board. It is explanatory drawing which showed typically the principal part of 5th Embodiment of this invention, Comprising: Explanatory drawing equivalent to the cross section of the position along the AA of FIG. In other embodiment of this invention, explanatory drawing which showed typically the part by which the electronic component was mounted among the surfaces of a circuit board. In other embodiment of this invention, explanatory drawing which showed typically the part by which the electronic component was mounted among the surfaces of a circuit board.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is an exploded perspective view schematically showing a schematic configuration of an electronic control device 1 according to the present invention. The electronic control device 1 is mounted on an automobile and used for controlling an engine, a transmission, a brake, and the like, for example, and includes a rectangular plate-like circuit board 3 on which a heat-generating electronic component 2 is mounted, and a circuit A connector 4 that is attached to the board 3 and electrically connects an electronic circuit formed on the circuit board 3 and an external device, and a housing 5 that houses the circuit board 3 are roughly configured. In addition to the electronic component 2 shown in the figure, a plurality of various electronic components are actually mounted on the circuit board 3. Further, since FIG. 1 shows the electronic control device 1 in a simplified manner, the terminals of the electronic component 2 and the conductor pattern 14 (described later) formed on the surface 3a of the circuit board 3 to which the terminals are connected are omitted. (Not shown).

  The housing 5 includes a lower case 6 in which the circuit board 3 is accommodated and fixed, and an upper cover 7 that covers the circuit board 3 accommodated in the case 6.

  The case 6 has a substantially rectangular dish shape and is integrally formed of a metal material having excellent heat dissipation such as aluminum or iron. The four corners of the case 6 are fixed to the cover 7 with screws 13.

  On the other hand, the cover 7 has a substantially rectangular dish shape that is deeper than the case 6 and is integrally formed of a resin material.

  The case 6 can be made of a resin material, and the cover 7 can be made of a metal material such as aluminum or iron.

  A breathing filter 9 that adjusts the pressure difference between the inside and the outside of the housing 5 is attached to a through hole (not shown) formed in the upper wall 8 of the cover 7. On the outer peripheral edge of the through hole (not shown), an outer peripheral wall 10 that protrudes directly from the water to the breathing filter 9 is formed so as to protrude over the entire periphery.

  On the upper wall 8 of the cover 7, a connector housing portion 11 that protrudes in accordance with the outer shape of the connector 4 is formed. On one side wall of the cover 7 that is continuous with the connector housing portion 11, a notch portion 12 is formed so that one end of the connector 4 faces the outside. When the case 6 and the cover 7 are assembled, the notch 12 forms an opening on one side surface of the housing 5, and one end of the connector 4 protrudes from the opening to the outside.

  Note that an adhesive (not shown) is applied to the contact portions (contact portions) of the case 6, the cover 7, and the connector 4, and foreign matter such as moisture and dust is applied to the housing 5 from these contact portions. Sealed liquid-tight to prevent intrusion.

  The circuit board 3 is made of, for example, glass epoxy resin and the like, and copper conductor patterns 14 are formed on the front and back surfaces 3a and 3b and inside thereof. As shown in FIGS. 2 and 3, this conductor pattern 14 is used for an electronic circuit configuration in which terminals (not shown) of the electronic component 2 and terminals of various electronic components (not shown) are electrically connected by soldering or the like. It has a conductor pattern 14a and a heat dissipating conductor pattern 14b (details will be described later) for conducting heat generated mainly in the electronic component 2 to the connector 4. Further, the circuit board 3 is fixed to the case 6 at a plurality of locations on the outer peripheral edge thereof by screws (not shown). The circuit board 3 can be fixed to the case 6 with an adhesive.

  Examples of electronic components mounted on the circuit board 3 include IC, FET (field effect transistor), MOSFET (oxide film semiconductor field effect transistor), transistor, diode, resistor, and the like.

  The connector 4 is attached to the surface 3 a side of the outer edge portion on one end side of the circuit board 3. From the other end side of the connector 4, a plurality of metal connector pins 15 protrude in two upper and lower stages. As shown in FIG. 2, each connector pin 15 is bent into a substantially L shape, and the tip side thereof is inserted into a through hole 16 formed in the circuit board 3. 2 is an explanatory view schematically showing a cross section at a position along the line AA in FIG.

  Of the plurality of connector pins 15, the one protruding from the upper stage of the other end of the connector 4 is bent more inside the circuit board 3 than the one protruding from the lower stage of the other end of the connector 4. Therefore, the through hole 16a into which the connector pin 15 protruding from the upper stage of the other end of the connector 4 is inserted is one end of the circuit board 3 than the through hole 16b into which the connector pin 15 protruding from the lower stage of the other end of the connector 4 is inserted. It is formed more inside as viewed from the side outer edge.

  As shown in FIGS. 1 and 2, the connector pin 15 of the connector 4 includes a plurality of first connector pins 15a through which a relatively small current flows and a plurality of second connector pins 15b through which a relatively large current flows. ing. In the connector 4 of this embodiment, only the two right-hand columns in FIG. 1 are the second connector pins 15b. Further, one end of the connector 4 is connected to a vehicle-side connector 17 that is connected to an external device (such as various sensors and various electromagnetic valves). Note that reference numeral 18 in FIG. 2 denotes a harness connected to the above-described external device.

  As shown in FIG. 3, the first connector pin 15 a in the present embodiment has a substantially circular cross section, and an input signal (for example, vehicle speed, engine speed, water temperature, etc.) from a vehicle on which the electronic control device 1 is mounted. A relatively small current flows, such as a drive signal (for example, a fuel injection valve, various electromagnetic valves, etc.) for moving a small load.

  The second connector pin 15b is set to have a larger cross-sectional area than the first connector pin 15a. The second connector pin 15b of this embodiment has a different cross-sectional shape (substantially rectangular cross section) from the first connector pin 15a. The second connector pin 15b includes a drive signal for moving a heavy load (for example, an electric throttle valve, a motor, a heater, etc.), a drive current for moving the electronic control device 1, a current dropped to the ground (GND), A relatively large current flows. The shape of the connector pin 15 is not limited to this. If the second connector pin 15b is set to have a larger cross-sectional area than the first connector pin 15a, for example, both are substantially rectangular, or substantially circular, or those A combination of these may be used.

  In the present embodiment, the heat-generating electronic component 2 is mounted on the surface 3 a of the circuit board 3 so as to be close to the connector pin 15. Further, on the surface 3 a of the circuit board 3, a heat radiation conductor pattern 14 b is provided that is close to both the electronic component 2 close to the connector pin 15 and the connector pin 15 close to the electronic component 2.

  Specifically, as shown in FIG. 3, the electronic component 2 is disposed on a heat radiation conductor pattern 14 b formed on the surface 3 a of the circuit board 3. The conductor pattern 14b is formed so as to contact the lower surface of the casing of the electronic component 2 and not be electrically connected to a terminal (not shown) of the electronic component 2. Further, the heat dissipating conductor pattern 14b is adjacent to the three first connector pins 15a to which the electronic component 2 is adjacent, among the first connector pins 15a inserted into the through holes 16a, and the three adjacent first pins 15a. One of the connector pins 15a (is formed so as to be electrically connected (contacted) with the first connector pin 15a at the center in FIG. 3).

  FIG. 3 is an explanatory diagram schematically showing the surface 3a of the circuit board 3, and the terminals of the electronic component 2 are omitted (not shown). Further, a conductor pattern 14a for configuring an electronic circuit formed on the surface 3a of the circuit board 3 to which a terminal (not shown) of the electronic component 2 is connected is also shown in a simplified manner. Actually, a conductor pattern 14a for electronic circuit configuration is connected to each terminal (not shown) of the electronic component 2, but in FIG. 3, the electronic circuit configuration conductor connected to each terminal of the electronic component 2 is connected. The conductor pattern is shown in a simplified manner.

  The surface 3 a of the circuit board 3 is filled with a heat dissipating material 19 between the electronic component 2 and the first connector pin 15 a adjacent to the electronic component 2. The heat dissipating material 19 covers the outer surface of the electronic component 2 and is electrically connected to the electronic component 2 and the first connector pin 15a adjacent to the electronic component 2 (the heat dissipating conductor pattern 14b on which the electronic component 2 is placed). The first connector pin 15a) is provided so as to cover the outer surface on the distal end side. The heat dissipating material 19 is heat dissipating grease based on, for example, silicon, and has an insulating property.

  In addition, the electronic circuit configuration conductor pattern 14a formed inside the circuit board 3 is formed so that a part thereof is close to the first connector pin 15a to which the electronic component 2 is close. In the present embodiment, a conductor pattern for electronic circuit configuration (not shown) formed on the back surface 3b of the circuit board 3 is formed so as not to be electrically connected to the heat radiating conductor pattern 14b. .

  In such an embodiment, the heat generated in the electronic component 2 through the conductor pattern 14b and the heat dissipating material 19 by the heat dissipating conductor pattern 14b and the heat dissipating material 19 provided on the surface 3a side of the circuit board 3. Can be conducted to the first connector pin 15 a adjacent to the electronic component 2. Further, since a part of the conductor pattern 14a for electronic circuit configuration formed inside the circuit board 3 is close to the first connector pin 15a that is close to the electronic component 2, the conductor pattern 14a inside the circuit board 3 is used. Through this, the heat generated in the electronic component 2 can be conducted to the first connector pin 15a adjacent to the electronic component 2.

  That is, since the heat generated in the electronic component 2 is efficiently conducted to the first connector pin 15a adjacent to the electronic component 2, the heat can be efficiently radiated from the harness 18 connected to the first connector pin 15a.

  Therefore, the first connector in which the electronic component 2 approaches the heat generated in the electronic component 2 without providing a configuration for dissipating the heat generated in the electronic component 2 separately on the back side of the circuit board 3 and dissipating the heat in the case 6. Heat can be radiated to the outside through the pin 15a. Therefore, an electronic component can be mounted on the back surface 3b of the circuit board 3 at a position on the back side of the electronic component 2, and the substantial component mounting area of the circuit board 3 can be increased without increasing the circuit board 3. can do. In other words, the circuit board 3 can be reduced in size by increasing the substantial component mounting area of the circuit board 3, and thus the electronic control device 1 can be reduced in size.

  In the above-described embodiment, the heat dissipating material 19 is interposed between the electronic component 2 and the first connector pin 15a adjacent to the electronic component 2, but the electronic component 2 is not provided without providing the heat dissipating material 19. The heat generated in the electronic component 2 is conducted to the first connector pin 15a adjacent to the electronic component 2 only by the heat radiating conductor pattern 14b formed on the surface 3a of the circuit board 3. It is also possible.

  The conductor pattern 14b is not necessarily in direct contact with the lower surface of the casing of the electronic component 2, and a gap, an adhesive, or the like may be interposed between the conductive pattern 14b and the lower surface of the casing of the electronic component 2. Good.

  Hereinafter, although other embodiment of this invention is described, the same code | symbol is attached | subjected about the component same as 1st Embodiment mentioned above, and the overlapping description is abbreviate | omitted.

  FIG. 4 shows a second embodiment of the present invention. The electronic control device 21 according to the second embodiment has substantially the same configuration as the electronic control device 1 according to the first embodiment described above, but the heat dissipating conductor pattern 14b formed on the surface 3a of the circuit board 3 is provided. The electronic component 2 is close to the adjacent first connector pin 15a but is not electrically connected (not in contact with the first connector pin 15a). In addition, a conductor pattern (not shown) for configuring an electronic circuit on the inside and the back surface 3b of the circuit board 3 is not electrically connected to the first connector pin 15a to which the electronic component 2 is adjacent. ing.

  Also in the second embodiment, the heat generated in the electronic component 2 is made close to the electronic component 2 by the heat radiation conductor pattern 14b and the heat radiating material 19 provided on the surface 3a side of the circuit board 3. It can conduct to the pin 15a. That is, since the heat generated in the electronic component 2 is conducted to the first connector pin 15a adjacent to the electronic component 2, the heat can be radiated from the first connector pin 15a to the outside of the electronic control device 21.

  Therefore, also in the second embodiment, as in the first embodiment described above, the electronic component can be mounted on the back side of the electronic component 2 in the back surface 3b of the circuit board 3, and the circuit board 3 The substantial component mounting area of the circuit board 3 can be expanded without increasing the size.

  In the second embodiment, the heat radiation conductor pattern 14b is not electrically connected (not in contact) with the first connector pin 15a adjacent to the electronic component 2 as compared with the first embodiment. Thus, the thermal conductivity between the heat dissipating conductor pattern 14b and the first connector pin 15a is lowered.

  FIG. 5 shows a third embodiment of the present invention. The electronic device 31 according to the third embodiment has substantially the same configuration as the electronic control device 1 according to the first embodiment described above, but includes the electronic component 2 and the first connector pin 15a adjacent to the electronic component 2. In between, the heat dissipation material which contacts both is not filled.

  Then, on the back surface 3 b of the circuit board 3, an electronic component 32 having a smaller amount of heat generation than the electronic component 2 is mounted at a position on the back side of the electronic component 2. The electronic component 32 is disposed on a heat radiation conductive pattern 14 b formed on the back surface of the circuit board 3. The heat dissipating conductor pattern 14b formed on the back surface of the circuit board 3 is in contact with the lower surface of the housing of the electronic component 32, and among the first connector pins 15a inserted into the through holes 16a, the electronic component 2 is The three first connector pins 15a adjacent to each other are formed so as to be close to each other but not electrically connected. Further, the heat dissipating conductor pattern 14b formed on the back surface of the circuit board 3 is formed so as not to be electrically connected to the terminals (not shown) of the electronic component 32 provided on the back surface 3b of the circuit board 3. Has been.

  In such a third embodiment, heat generated in the electronic component 2 is conducted to the first connector pin 15a adjacent to the electronic component 2 by the heat radiation conductive pattern 14b provided on the surface 3a side of the circuit board 3. can do. Further, the heat generated by the electronic component 32 mounted on the back surface 3b of the circuit board 3 is transferred to the first connector adjacent to the electronic components 2 and 32 by the conductive pattern 14b for heat dissipation provided on the back surface 3b side of the circuit board 3. It can conduct to the pin 15a. That is, the heat generated in the electronic components 2 and 32 is efficiently conducted to the first connector pins 15a adjacent to the electronic components 2 and 32, and therefore efficiently dissipated from the first connector pins 15a to the outside of the electronic control device 2. be able to. In other words, since the electronic component 32 can be mounted on the back surface 3b of the circuit board 3 at a position on the back side of the electronic component 2, the circuit board 3 is not enlarged as in the first embodiment described above. 3 can be expanded. Here, also in the third embodiment, similarly to the first and second embodiments described above, a heat dissipation material is interposed between the electronic component 2 and the first connector pin 15a adjacent to the electronic component 2, The heat generated in the electronic component 2 may be conducted to the first connector pin 15a adjacent to the electronic component 2.

  Further, since the front surface 3a of the circuit board 3 is closer to the outside through the connector pins 15 than the back surface 3b and is excellent in heat dissipation, the electronic component 32 is mounted on the back side of the electronic component 2 close to the connector 4. In such a case, an electronic component having a large amount of generated heat is mounted on the front surface 3a side of the circuit board 3 as an electronic component 2, and an electronic component having a small amount of generated heat is mounted on the back surface 3b side of the circuit board 3 as an electronic component. The heat generated in 2 and 32 can be efficiently radiated. In addition, as an electronic component with a large calorific value, for example, an IC, a power driver and the like can be cited. Examples of the electronic component that generates a small amount of heat include a diode and a signal transistor.

  When the electronic component 32 is mounted on the back side of the electronic component 2 close to the connector 4, the component that cannot be electrically connected to the first connector pin 15 a is mounted on the back surface 3 b of the circuit board 3 as the electronic component 32. It is desirable to do so.

  6 and 7 show a fourth embodiment of the present invention. The electronic control device 41 according to the fourth embodiment has substantially the same configuration as the electronic control device 1 according to the first embodiment described above. However, the electronic control device 41 is formed on the surface 3a of the circuit board 3 and has terminals (see FIG. A first connector in which the electronic component 2 is close to the first connector pin 15a that is inserted into the through hole 16b is a conductor pattern 14a (right conductor pattern 14a in FIG. 7) for electronic circuit configuration to which a not-shown electronic circuit is connected. It is extended so that it may adjoin also to pin 15a. The conductor pattern 14a for electronic circuit configuration formed on the surface 3a of the circuit board 3 is formed so as not to be electrically connected to the first connector pins 15a.

  In other words, in the fourth embodiment, the electronic circuit constituting conductor pattern 14a to which the terminal (not shown) of the electronic component 2 is connected is extended to the periphery of the first connector pin 15a to which the electronic component 2 is close. In essence, it also has the function of the conductive pattern 14b for heat dissipation.

  In the fourth embodiment, the conductor pattern 14a adjacent to both the electronic component 2 and the connector pin 15a is set not to be electrically connected to the first connector pin 15a. It is set so as to partially overlap the housing.

  The heat dissipating material 19 is provided so as to fill a space between the electronic component 2 and the first connector pin 15a inserted into the through hole 16a and the through hole 16b adjacent to the electronic component 2.

  FIG. 7 is an explanatory diagram schematically showing the surface 3a of the circuit board 3, and the terminals of the electronic component 2 are omitted (not shown). Further, a conductor pattern 14a for configuring an electronic circuit formed on the surface 3a of the circuit board 3 to which a terminal (not shown) of the electronic component 2 is connected is also shown in a simplified manner.

  In the fourth embodiment, the heat generated in the electronic component 2 by the conductor pattern 14a for electronic circuit configuration and the heat dissipating material 19 is applied to a wider range of the first connector pins 15a than in the first embodiment. Can be conducted.

  Accordingly, also in the fourth embodiment, the heat generated in the electronic component 2 can be conducted to the connector pin 15 adjacent to the electronic component 2 as in the first embodiment described above. An electronic component can be mounted at a position on the back side of the electronic component 2 in the back surface 3b, and a substantial component mounting area of the circuit board 3 can be expanded without increasing the circuit board 3.

  In the fourth embodiment, the first embodiment corresponds to the amount that the conductor pattern 14a for electronic circuit configuration is not electrically connected (not in contact) with the first connector pin 15a adjacent to the electronic component 2. In comparison with this, the thermal conductivity between the heat dissipating conductor pattern 14b and the first connector pin 15a is lowered.

  8 and 9 show a fifth embodiment of the present invention. The electronic device 51 in the fifth embodiment has substantially the same configuration as the electronic control device 1 in the first embodiment described above, but the electronic component 2 is a second connector having a larger cross-sectional area than the first connector pin 15a. It is mounted so as to be close to the pin 15b, and heat generated in the electronic component 2 is conducted to the second connector pin 15b and the first connector pin 15a adjacent to the second connector pin 15b. That is, since the electronic component 2 is mounted at a position facing the second connector pin 15b and offset with respect to the first connector pin 15a adjacent to the second connector pin 15b, the heat generated in the electronic component 2 is reduced. Heat can be preferentially transferred to the second connector pin having a high heat dissipation effect (large cross-sectional area). Further, the heat dissipation material is not filled between the electronic component 2 and the second connector pin 15b and the first connector pin 15a adjacent to the electronic component 2.

  In addition, 52 in FIG. 8 is a terminal of the electronic component 2 connected to the conductor pattern 14a for an electronic circuit structure.

  The electronic component 2 in the fifth embodiment is an electronic component that generates a large amount of heat, and a non-potential (ground) heat sink 53 is provided on the back surface of the electronic component 2. The heat radiation conductor pattern 14b is formed so as to extend to the lower surface of the electronic component 2 across the portion of the electronic component 2 where the terminals 52 are not provided. Opposite.

  In the fifth embodiment as described above, the heat generated in the electronic component 2 is transferred to the first connector pin 15a adjacent to the electronic component 2 and the first heat by the conductive pattern 14b for heat dissipation provided on the surface 3a side of the circuit board 3. 2 can be conducted to the connector pin 15b.

  Accordingly, also in the fifth embodiment, the heat generated in the electronic component 2 can be conducted to the connector pin 15 in the vicinity of the electronic component 2 as in the first embodiment described above. An electronic component can be mounted at a position on the back side of the electronic component 2 in the back surface 3b, and a substantial component mounting area of the circuit board 3 can be expanded without increasing the circuit board 3.

  In the fifth embodiment, the heat sink 53 is in contact with the heat dissipating conductor pattern 14b. However, the heat dissipating conductor pattern 14b and the heat sink 53 are not necessarily in direct contact with each other. Further, a gap, an adhesive, or the like may be interposed between the conductor pattern 14b and the heat sink 53. However, it is more advantageous in terms of heat dissipation to directly contact the heat dissipating conductor pattern 14b and the heat sink 53.

  As in the fifth embodiment, it is more efficient to dissipate the heat generated in the electronic component 2 by conducting the heat generated in the electronic component 2 to the second connector pin 15b having a large cross-sectional area (large heat capacity). This is advantageous particularly when the heat generated in the electronic component 2 is large.

  Here, also in the fifth embodiment, similarly to the first, second, and fourth embodiments described above, a heat dissipation material is provided between the electronic component 2 and the first connector pin 15a adjacent to the electronic component 2. It is also possible to configure such that the heat generated in the electronic component 2 is conducted to the first connector pin 15a adjacent to the electronic component 2 by being interposed.

  In each of the above-described embodiments, the electronic component 2 is substantially disposed on the heat dissipation conductor pattern 14b. However, the electronic component 2 and the heat dissipation conductor pattern 14b are electrically connected. If the connection is not possible, the electronic component 2 is not disposed on the heat dissipation conductor pattern 14b, and the heat dissipation conductor pattern 14b is placed close to the electronic component 2 as in the electronic control device 61 shown in FIG. May be formed on the surface 3 a of the circuit board 3.

  Further, when the electronic component 2 is not arranged on the conductive pattern 14b for heat dissipation, the side close to the electronic component 2 of the conductive pattern 14b for heat dissipation (in FIG. 11), as in the electronic control device 71 shown in FIG. The upper side and the side close to the first connector pin 15a of the conductive pattern for electronic circuit 14a (the lower side in FIG. 11) are formed in a substantially comb-like shape, and the substantially comb-like portions of the two are alternately arranged. When configured to be combined, heat conduction is further promoted between the heat dissipating conductor pattern 14b and the electronic circuit forming conductor pattern 14a.

  In each of the above-described embodiments, when the heat radiation material 19 is provided on the surface 3a of the circuit board 3, a resist is applied to a portion of the surface 3a of the circuit board 3 that is covered (adhered to) the heat radiation material 19 In this case, thermal conductivity can be improved by the absence of the resist.

  Further, in each of the above-described embodiments, if the heat dissipating material 19 is filled between the electronic component 2 and the housing 5, in addition to the heat radiation to the connector pins 15, the heat radiation to the housing 5 can be performed together. Thus, the heat dissipation effect can be enhanced.

  The technical ideas of the invention other than the claims that can be understood from the above-described embodiments are listed below.

[Claim a]
The connector pin penetrates the circuit board, and on the other side of the circuit board, on the back side of the heat generating component close to the connector pin, a second amount of heat generated is smaller than that of the heat generating component. The electronic control device according to claim 1, wherein a heat generating component is mounted.

DESCRIPTION OF SYMBOLS 1 ... Electronic control apparatus 2 ... Electronic component 3 ... Circuit board 3a ... Front surface 3b ... Back surface 4 ... Connector 5 ... Case 6 ... Case 14 ... Conductor pattern 14a ... Conductor pattern 14b ... Conductor pattern 15 ... Connector pin 15a ... 1st connector Pin 15b ... 2nd connector pin 16 ... Through hole 16a ... Through hole 16b ... Through hole 17 ... Vehicle side connector 18 ... Harness 19 ... Heat dissipation material

Claims (2)

A circuit board on which electronic components are mounted; and a connector that is attached to one surface of the circuit board and electrically connects an electronic circuit formed on the circuit board and an external device. In the electronic control device in which the connector pin is connected to the circuit board from one side of the circuit board,
Of the electronic components provided on one surface of the circuit board, a heat generating component having heat generation is mounted so as to be close to the connector pin, the heat generating component close to the connector pin, and the connector where the heat generating component is close An electronic control device, wherein a conductor pattern adjacent to both pins is provided on one surface of the circuit board, and heat generated by the heat generating component is conducted to the connector pin.   The electronic control device according to claim 1, wherein a heat radiating material is filled between a heat generating component close to the connector pin and the connector pin close to the heat generating component.

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