KR200146566Y1 - Cooling plate mounting structure for ics - Google Patents
Cooling plate mounting structure for ics Download PDFInfo
- Publication number
- KR200146566Y1 KR200146566Y1 KR2019960026332U KR19960026332U KR200146566Y1 KR 200146566 Y1 KR200146566 Y1 KR 200146566Y1 KR 2019960026332 U KR2019960026332 U KR 2019960026332U KR 19960026332 U KR19960026332 U KR 19960026332U KR 200146566 Y1 KR200146566 Y1 KR 200146566Y1
- Authority
- KR
- South Korea
- Prior art keywords
- heat sink
- integrated circuit
- fixed
- present
- clip
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
본 고안은 집적회로용 방열판 고정구에 관한 것으로, 인쇄회로기판상에 고정된 집적회로에 방열판을 설치함에 있어서 보다 신속하고 용이하게 고정시킬수 있는 집적회로용 방열판 고정구를 제공하기 위한 것이다. 본 고안은 인쇄회로기판(50)상에 고정된 집적회로(20)에 방열핀을 갖는 방열판(10)을 결합함에 있어서, 판상형 금속을 절곡하여 한 쌍의 다리(41, 43)를 형성하여 일측의 다리(41)는 상기 방열판(10)의 몸통의 일측면에 탄력지지되도록 결합하고, 타측의 다리(43)는 상기 방열판(10)의 타측 표면과 집적회로(20)의 표면을 탄력적으로 결합되도록 체결되는 클립(40)으로 구성되어 있다. 본 고안은 클립을 통해 집적회로와 방열판을 서로 밀착되도록 밀착시킴에 있어 매우 손쉽고 용이하게 달성할 수 있는 효과가 있다.The present invention relates to a heat sink fixture for an integrated circuit, and to provide a heat sink fixture for an integrated circuit that can be fixed more quickly and easily in installing a heat sink in an integrated circuit fixed on a printed circuit board. The present invention is to bond the heat sink 10 having a heat radiation fin to the integrated circuit 20 fixed on the printed circuit board 50, by bending a plate-shaped metal to form a pair of legs (41, 43) Leg 41 is coupled to elastically supported on one side of the body of the heat sink 10, the other leg 43 is elastically coupled to the other surface of the heat sink 10 and the surface of the integrated circuit (20). The clip 40 is fastened. The present invention has an effect that can be achieved very easily and easily in close contact between the integrated circuit and the heat sink through the clip.
Description
본 고안은 집적회로용 방열판 고정구에 관한 것으로, 더욱 상세하게는 인쇄회로기판상에 고정된 집적회로에 방열판을 설치함에 있어서 보다 신속하고 용이하게 고정시킬수 있는 집적회로 방열판 고정구에 관한 것이다.The present invention relates to a heat sink fixture for an integrated circuit, and more particularly, to an integrated circuit heat sink fixture that can be fixed more quickly and easily in installing a heat sink in an integrated circuit fixed on a printed circuit board.
일반적으로, 각종 전기전자 제품속에는 제품의 기능을 수행하기 위한 회로와 그와 관련된 소자들이 인쇄회로기판상에 배열되어 있다. 이러한 소자들중에는 집적회로와 같이 비교적 고가인 소자들도 포함되어 있는데, 집적회로는 전기적인 동작시 내부에서 많은 열이 발생되어 이를 냉각시키기 위하여 방열판을 부설하는 경우가 많다.In general, in various electrical and electronic products, circuits and related elements for performing the functions of the product are arranged on a printed circuit board. Among these devices, relatively expensive devices such as integrated circuits are also included. In an integrated circuit, a large amount of heat is generated during electrical operation, and a heat sink is often installed to cool the integrated circuit.
도 1에 도시된 바와 같이 방열판(10)은 열전도도가 우수한 금속 바람직하게는 알루미늄으로 제작되어 있는데, 인쇄회로기판상(도시되지 않았음)에 집적회로(20)와 밀착되도록 나사(30)를 이용하여 고정시켰다.As shown in FIG. 1, the heat sink 10 is made of a metal having excellent thermal conductivity, preferably aluminum, and includes a screw 30 to be in close contact with the integrated circuit 20 on a printed circuit board (not shown). And fixed.
그러나 전술한 바와 같이 방열판(10)을 고정시키기 위하여 나사(30)를 이용하고 있기 때문에 나사(30)의 체결에 따른 조립성이 저하되는 불편함이 있었다.However, since the screw 30 is used to fix the heat sink 10 as described above, there is an inconvenience in that the assemblability due to the fastening of the screw 30 is reduced.
따러서, 본 고안은 전술한 바와 같은 종래의 방열판 고정에 따른 불편함을 개선하기 위하여 본 고안을 안출하게 되었다.Therefore, the present invention has been made to devise the present invention in order to improve the inconvenience caused by the conventional heat sink fixing as described above.
본 고안의 목적은 인쇄회로기판상에 고정된 집적회로에 방열판을 설치함에 있어서 보다 신속하고 용이하게 고정시킬수 있는 집적회로용 방열판 고정구를 제공하는데 있다.It is an object of the present invention to provide a heat sink fixture for an integrated circuit that can be fixed more quickly and easily in installing a heat sink in an integrated circuit fixed on a printed circuit board.
본 고안에 따른 집적회로용 방열판 고정구은 인쇄회로기판상에 고정된 집적회로에 방열핀을 갖는 방열판을 결합함에 있어서, 일측단은 상기 방열판의 몸통의 일측면에 탄력지지되고, 타측단은 상기 몸통의 타측 표면과 집적회로의 표면을 탄력적으로 결합되는 클립으로 달성되어 질 수 있다.The heat dissipation plate fixture for an integrated circuit according to the present invention is coupled to a heat sink having a heat dissipation fin to an integrated circuit fixed on a printed circuit board, one end of which is elastically supported on one side of the body of the heat sink, the other end is the other side of the body It can be achieved with a clip that elastically couples the surface and the surface of the integrated circuit.
도 1은 종래의 집적회로용 방열판 고정예를 예시적으로 도시하는 분해 사시도이다.1 is an exploded perspective view illustrating a conventional heat sink fixing example for an integrated circuit.
도 2는 본 고안의 집적회로용 방열판 고정구의 설치상태를 보여주는 사시도이다.Figure 2 is a perspective view showing the installation state of the heat sink fixture for integrated circuit of the present invention.
도 3은 도 2의 요부 단면도이다.3 is a cross-sectional view illustrating main parts of FIG. 2.
*** 도면의 주요부분에 대한 부호의 설명 ****** Explanation of symbols for main parts of drawing ***
10:방열판 11:방열핀10: heat sink 11: heat sink fin
20:집적회로 40:클립20: integrated circuit 40: clip
41, 43:다리 50:인쇄회로기판41, 43: leg 50: printed circuit board
이하, 본 고안에 따른 집적회로용 방열판 고정구에 대한 실시예를 설명하면 다음과 같다.Hereinafter, an embodiment of a heat sink fixture for an integrated circuit according to the present invention will be described.
도 2에는 본 고안에 따른 집적회로용 방열판 고정구의 분해 사시도가 예시적으로 도시되어 있다. 도면에서 알 수 있는 바와 같이, 본 고안은 크게 방열판(10), 집적회로(20), 클립(40) 및 인쇄회로기판(50)으로 구성되어 있다.2 is an exploded perspective view of the heat sink fixture for an integrated circuit according to the present invention is shown by way of example. As can be seen in the figure, the subject innovation is largely composed of a heat sink 10, an integrated circuit 20, a clip 40 and a printed circuit board (50).
방열판(10)은 복수개의 방열핀(11)를 구비하고 있으며, 그 방열판(10)에 집적회로(20)가 클립(40)에 의해 부착되어 있다.The heat sink 10 includes a plurality of heat sink fins 11, and an integrated circuit 20 is attached to the heat sink 10 by a clip 40.
클립(40)은 판상형 금속을 절곡되어 각각의 다리(41, 43)를 구비하고 있는데, 각각의 다리(41, 43)중 일측의 다리(41)는 그 내면이 방열판(10)의 일측면에 접속되고, 타측의 다리(43)는 방열판(10)의 타측면과 집적회로(20) 표면에 밀착되어 진다. 전술한 다리(41, 43)는 서로 마주보는 방향으로 탄성력이 작용하고 있기 때문에 방열판(10)과 집적회로(20)를 탄성력에 의해 견고히 결합시킨다. 참고적으로 집적회로(20)는 집적회로와 연결된 리드 프레임이 도 3에 도시된 바와 같이 인쇄회로기판(50)에 솔더링되어 고정되어 있다.The clip 40 is bent plate-shaped metal and has respective legs 41 and 43. One of the legs 41 and 43 has an inner surface thereof on one side of the heat sink 10. The other leg 43 is in close contact with the other side surface of the heat sink 10 and the surface of the integrated circuit 20. Since the elastic force acts in the direction in which the legs 41 and 43 face each other, the heat sink 10 and the integrated circuit 20 are firmly coupled by the elastic force. For reference, in the integrated circuit 20, a lead frame connected to the integrated circuit is soldered and fixed to the printed circuit board 50 as shown in FIG. 3.
이상에서 설명한 바와 같이 본 고안에 따른 집적회로용 방열판 고정구는 클립을 통해 집적회로와 방열판을 서로 밀착되도록 밀착시킴에 있어 매우 손쉽고 용이하게 달성할 수 있는 효과가 있다.As described above, the heat dissipation plate fixture for an integrated circuit according to the present invention has an effect that can be achieved very easily and easily in close contact between the integrated circuit and the heat dissipation through a clip.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019960026332U KR200146566Y1 (en) | 1996-08-28 | 1996-08-28 | Cooling plate mounting structure for ics |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019960026332U KR200146566Y1 (en) | 1996-08-28 | 1996-08-28 | Cooling plate mounting structure for ics |
Publications (2)
Publication Number | Publication Date |
---|---|
KR19980012752U KR19980012752U (en) | 1998-06-05 |
KR200146566Y1 true KR200146566Y1 (en) | 1999-06-15 |
Family
ID=19465081
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019960026332U KR200146566Y1 (en) | 1996-08-28 | 1996-08-28 | Cooling plate mounting structure for ics |
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KR (1) | KR200146566Y1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024205008A1 (en) * | 2023-03-29 | 2024-10-03 | 엘지이노텍 주식회사 | Fixing assembly and switching element comprising same |
-
1996
- 1996-08-28 KR KR2019960026332U patent/KR200146566Y1/en not_active IP Right Cessation
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Publication number | Publication date |
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KR19980012752U (en) | 1998-06-05 |
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