JPH0888303A - Heat-dissipating device of ic - Google Patents

Abstract

PURPOSE: To obtain a heat-dissipating device which is mounted without using an adhesive and which can be attached or removed easily by a method wherein an upper-stage face and a lower-stage face which have a horizontal square plane are formed, one remaining end of the upper-stage face is provided with a horizontal coupling face in which a through hole has been made and a heat sink which is fixed to the coupling face by a coupling utensil inserted into the through hole so as to be coupled is provided. CONSTITUTION: An upper-stage face 4 which is formed by bending a sheet metal in a step shape, which comprises both upward-bent side-end parts and which has a nearly square plane is formed on the upper part of an IC body 1. In addition, a coupling part 6 which is formed by bending a tip to the inside in such a way that its cross section is nearly U-shaped is provided, and a lowerstage face 5 which has a nearly square plane is formed. Then, a horizontal coupling face 7 which is connected to one remaining end of the upper-stage face 4 and in which a through hole 8 is made in a required position connected to the tip of a vertical face is formed, and a heat sink 3 is constituted. The through hole 8 in the coupling face 7 for the heat sink 3 is aligned with a through hole which is made in the corresponding position of a printed-circuit board 20, and the heat sink 3 is fixed to the printed-circuit board by means of a rivet 9. Consequently, a heat-dissipating device can be attached or removed easily.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radiator of an IC (integrated circuit) attached to a printed circuit board (PCB) or the like with a locking tool.

[0002]

2. Description of the Related Art Conventionally, since a large amount of heat is generated, the temperature becomes high I
In C, for example, an IC (power IC) in which electronic circuits with large power consumption such as a power amplifier are integrated, heat dissipation measures are indispensable. As an example, as shown in FIG. 4, there is an IC having a structure in which a fin 2 for heat dissipation is provided on a side wall of the IC body 1 having no lead.

The method for actually mounting this finned IC on the PCB 20 is to place the IC body 1 in a predetermined position direction,
The lead hole number provided in the PCB 20 and the lead number of the IC body 1 are matched and inserted into the PCB 20.
The fin leg, which is formed by bending both sides of the fin downward, is used as the substrate hole 2
2 and solder it to the land or pattern on the back surface of the same PCB 20, for example. Conventionally, a method of using the pattern as a pattern for heat dissipation by forming the pattern in a large area has been implemented.

The heat radiation operation will be described. The heat generated by the power consumption inside the IC conducts through the fins 2 and is dissipated into the air from here, and at the same time, it passes through the fin leg portions to the PCB.
It conducts to the heat radiation pattern provided on the back surface of 20 and the like and diffuses into the air from here. Also, the heat from inside the IC is
It is transmitted to the entire C body 1 and also diffused from the entire package. Therefore, the generated heat mainly transfers through the above-mentioned path,
Dissipating in the air balances heat generation and cooling and prevents overheating inside the IC.

However, it may be difficult to form a large-sized heat dissipation pattern due to the area limitation of the PCB 20, and conventionally, in order to improve the heat dissipation performance, for example, as shown in FIG. It becomes necessary to attach the container to the IC body 1. The radiator 13 has a structure in which, for example, a sheet metal such as a copper plate is bent in a stepwise manner, and the upper step surface 4 of a substantially horizontal rectangular flat surface having both end portions bent upward and the leg portions 11 bent both sides downward. The lower step surface 5 is a substantially horizontal rectangular plane. This radiator 13 is mounted by placing the upper step surface 4 on the IC body 1 and the lower step surface 5 on the upper surface of the fin 2, and also by placing the leg 11 in the board hole 22 together with the fin leg. Insert and solder to the pattern. Further, in order to prevent the heavy heat radiator 13 made of sheet metal such as a copper plate from peeling off the soldering due to vibrations or the like and to make the thermal coupling thin, the IC body 1 and the fins 2 and the radiator 1
The upper surface 4 and the lower surface 5 of 3 are fixed by using an adhesive 24. By the mounting method described above, heat generation and cooling are balanced, and overheating inside the IC can be prevented.

However, when the IC body 1 is replaced due to a failure or the like, it is difficult to remove the bonded radiator 13 from the IC. Further, since it is necessary to mount the radiator 13 by a method of soldering, there is a problem that the member is limited to solderable materials such as iron and copper.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and provides an IC heat dissipation device that can be mounted without soldering and without using an adhesive and can be easily attached and detached. The purpose is to provide.

[0008]

In order to achieve the above object, a sheet metal is bent stepwise, and an upper step surface of a substantially horizontal square plane having both side ends bent upward, and a tip end of the upper surface of the rectangular flat surface are substantially in cross section. A substantially horizontal engaging member provided with a through hole at a predetermined position connected to a lower step surface having a substantially horizontal rectangular flat surface provided with a locking portion bent in a letter shape and a tip of a vertical surface connected to the remaining one end of the upper step surface. The heat radiator comprises a stop surface, and a locking tool that is inserted into and engages with a through hole provided in the locking surface.

Further, the sheet metal is bent in a stepwise manner, and an upper step surface of a substantially horizontal rectangular flat surface having both side ends bent upward, an intermediate step surface of the substantially horizontal rectangular flat surface, and a first through hole at a required position. A heat radiator comprising a substantially horizontal lower surface provided and a substantially horizontal locking surface having a second through hole provided at a required position connected to the tip of a vertical surface connected to the remaining one end of the upper surface,
The engaging member is inserted through and engaged with the first through hole and the second through hole.

Further, a sheet metal is bent in a stepwise manner, and an upper step surface of a substantially horizontal rectangular flat surface having both side ends bent upward, and a lower step formed of a substantially horizontal rectangular flat surface with a locking piece having an L-shaped cross section at its tip. Radiator having a surface and a substantially horizontal locking surface provided with a through hole at a predetermined position connected to the tip of a vertical surface connected to the remaining one end of the upper surface, and a through hole provided in the locking surface. And a locking tool that is inserted into and engaged with the.

[0011]

With the configuration as described above, referring to FIG.
Engage the locking part provided at the tip of the lower step with the fin of the IC,
The lower surface is placed on the upper surface of the fin, the upper surface is placed on the IC body, and the through hole is provided in the printed circuit board at the same position as the through hole provided with the locking tool on the locking surface. Insert the heat sink in order and fix the radiator to the printed circuit board.

Referring to FIG. 2, the upper surface is placed on the IC body, and the lower surface is placed on the upper surface of the fin.
The radiator is fixed to the printed circuit board by inserting the locking tool from above every two through holes provided in the printed circuit board at the same position as the first through hole and the second through hole.

Further, referring to FIG. 3, the locking piece is inserted into the engaging hole provided in the printed circuit board from above to be locked, and the lower surface is placed on the upper surface of the fin, and the upper surface is mounted. The surface is placed on the IC body, and the locking tool is inserted into the through hole provided in the printed circuit board at the same position as the through hole provided in the locking surface to fix the radiator to the printed circuit board.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An IC heat dissipation device according to the present invention will be described in detail below with reference to the drawings. FIG. 1 shows I according to the invention.
It is a figure which shows the Example of the heat dissipation device of C. Reference numeral 1 is an IC body, and 2 is a fin provided on the side wall of the IC body 1 on the side where the leads are not installed. 3 is, for example, a metal plate made of aluminum or the like, which is bent in a stepwise manner, and is an upper step surface 4 of a substantially horizontal rectangular flat surface having both end portions bent upward, and a locking portion whose tip is bent inward in a substantially U-shape. 6 and has a through hole 8 at a predetermined position connected to a lower step surface 5 formed of a substantially horizontal rectangular plane and a tip of a vertical surface connected to the remaining one end of the upper step surface 4.
And a substantially horizontal locking surface 7 provided with the heat radiator. 9
Is for fixing the radiator 3 to the PCB 20 by inserting and engaging the through hole 8 and the through hole provided at a corresponding position of the printed circuit board (PCB) 20 in order from the upper side to the lower side.
For example, it has a notch and a jaw on the tip that can be repeatedly attached and detached,
A rivet made of an elastic plastic made up of a substantially cylindrical body and a head having a diameter larger than the maximum outer diameter of the body.

The mounting operation of the IC heat dissipation device according to the present invention will be described with reference to FIG. The locking portion 6 provided at the tip of the lower surface 5 of FIG. 1 is mounted so as to cover the tip of the fin 2 of the IC, the lower surface 5 is placed on the upper surface of the fin, and the upper surface 4 is placed on the IC body. The heat sink 3 is fixed to the printed circuit board 20 by placing the rivet 9 through the through hole 8 of the locking surface 7 and the through hole provided in the printed circuit board 20 at the same position in order. The rivet 9 is inserted into the through-hole when the rivet 9 is inserted, because the notch provided at the tip portion contracts and narrows. After passing through the through hole, the notch returns to its original position by elasticity, and the jaw is locked to the edge of the through hole of the PCB 20. Further, the locking tool is not limited to the rivet, and may be a screw. Also, in order to make the heat bond thin, I
C body 1 and fins 2 and upper surface 4 of heat dissipation device body 3
Further, silicon grease or the like may be interposed between the lower surface 5 and the lower surface 5.

FIG. 2 is a diagram showing another embodiment of an IC heat dissipation device according to the present invention. The same parts as those of the heat dissipation device of the IC shown in FIG. 3 is
A sheet metal is bent in a stepwise manner, and an upper step surface 4 of a substantially horizontal rectangular flat surface having both side ends bent upward, an intermediate step surface 16 of a substantially horizontal rectangular flat surface, and a first through hole 18 at a required position. Heat radiation consisting of a substantially horizontal lower surface 5 provided and a substantially horizontal locking surface 7 having a second through hole 17 at a required position connected to the tip of a vertical surface connected to the remaining one end of the upper surface 4. It is a vessel. The mounting operation of the radiator 3 is similar to the mounting operation shown in FIG. 1, but the rivet 9 is inserted into the first through hole 18 and the second through hole 17 and the corresponding through holes provided in the printed circuit board 20. To fix the radiator 3 to the PCB 20.

FIG. 3 is a diagram showing another embodiment of the heat dissipation device for an IC according to the present invention. The same parts as those of the heat dissipation device of the IC shown in FIG. 3 is
A sheet metal is bent in a stepwise manner, and an upper step surface 4 of a substantially horizontal rectangular plane having both end portions bent upward and a cross section L at the tip.
A lower step surface 5 which is a substantially horizontal rectangular flat surface provided with a letter-shaped locking piece 10 and a through hole 8 which is provided at a required position connected to the tip of a vertical surface which is connected to the remaining one end of the upper step surface 4 and which is substantially horizontal. It is a radiator composed of the locking surface 7. The mounting operation of the radiator 3 is similar to the mounting operation shown in FIG.
The operation of engaging with the engagement hole 23 provided in B20 is different.

[0018]

As described above, the present invention provides a heat dissipation device for an IC that can be mounted without soldering and without using an adhesive, and can be easily attached and detached. Therefore, when replacing the IC body due to a failure, etc., the radiator body can be easily removed and attached simply by attaching and detaching the locking tool.
It becomes easy to replace the IC body. In addition, since the radiator is mounted by using the engaging action and the locking tool, the material of the radiator is not limited to iron, copper, etc., and a material that is difficult to solder,
For example, it has the advantage of being excellent in heat conductivity and using light aluminum.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of an IC heat dissipation device according to the present invention.

FIG. 2 is a diagram showing another embodiment of an IC heat dissipation device according to the present invention.

FIG. 3 is a diagram showing another embodiment of an IC heat dissipation device according to the present invention.

FIG. 4 is a diagram showing an embodiment of a conventional IC heat dissipation device.

[Explanation of symbols]

 1 IC Main Body 2 Fins 3 Heat Sink 4 Upper Surface 5 Lower Surface 6 Locking Part 7 Locking Surface 8 Through Hole 9 Rivet 10 Locking Piece 11 Leg 13 Radiator 17 Second Through Hole 18 First Through Hole 20 Printed Circuit Board (PCB) 22 Board hole 23 Engagement hole 24 Adhesive

Claims (8)

[Claims] 1. An upper step surface of a substantially horizontal rectangular flat surface having both side end portions obtained by bending a sheet metal in a stepwise manner and bending the sheet metal upward.
A lower step surface formed of a substantially horizontal rectangular flat surface having a locking portion whose tip is bent inward, and a substantially horizontal through hole provided at a predetermined position connected to the tip of a vertical surface connected to the remaining one end of the upper step surface. A heat dissipation device for an IC, comprising: a heat dissipator including a locking surface, and a locking tool that is inserted into and engages a through hole provided in the locking surface. 2. An upper step surface of a substantially horizontal rectangular flat surface having side edges which are obtained by bending a sheet metal in a stepwise manner and bending upward.
A substantially horizontal middle plane surface of the square plane, a substantially horizontal lower plane surface provided with a first through hole at a required position, and a second location at a required position connected to the tip of a vertical plane connected to the remaining one end of the upper stage surface. A heat dissipating device for an IC, comprising: a radiator having a substantially horizontal locking surface provided with a through hole; and a locking tool inserted and engaged with the first through hole and the second through hole. 3. An upper step surface of a substantially horizontal quadrangular plane having both side ends which are formed by bending a sheet metal in a stepwise manner and bending the sheet metal upward.
A lower step surface having a substantially horizontal rectangular flat surface with a locking portion having an L-shaped cross section, and a through hole provided at a predetermined position connected to the tip of a vertical surface connected to the remaining one end of the upper step surface are provided with a through hole. A heat dissipation device for an IC, comprising: a heat dissipator including a locking surface, and a locking tool that is inserted into and engages a through hole provided in the locking surface. 4. A heat dissipation device for an IC according to claim 1, 2 or 3, wherein the member of the sheet metal is aluminum. 5. The rivet as the locking tool,
2. A heat dissipation device for an IC according to 2 and 3. 6. The rivet according to claim 5, wherein the rivet includes a notch and a jaw at a tip thereof, a substantially cylindrical body made of an elastic member, and a head having a diameter larger than a maximum outer diameter of the body. IC heat dissipation device. 7. An IC heat dissipation device according to claim 6, wherein the rivet member is made of plastic. 8. The heat dissipation device for an IC according to claim 1, 2 or 3, wherein the locking member is a screw.