JPH11135693A - Apparatus for fixing electronic element package to heat sink - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat sink which can be applied to various kinds of electronic element package merely by combining small number of components. SOLUTION: A heat sink has a retaining base, which retains a base plate, which is used for fixing one or more element packages on a circuit board or the like. The retaining base is used for being fixed to a circuit board. The base plate has a main plate 11 on the opposite side, which is used for engaging with the element package. A plate segment or a clipping means fixes each element package independently on the main plate 11. Element packages are detachably fixed on one surface or both surfaces of the base plate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an assembly of an electronic device package and a heat sink. In particular, fix the electronic element package on the opposite side of the heat sink body,
The present invention relates to a device for mounting an assembly on a circuit board or the like.

[0002]

2. Description of the Related Art Many electronic element packages are designed to transfer heat generated from a circuit element chip contained therein to a surface of the package. Generally, one surface of the package is made of plastic, ceramic, or metal, and functions as a medium for conducting heat from the electronic device to the outer surface of the package. External heat releasing means, such as heat sinks, must be arranged in thermal association with the heat conducting medium to absorb heat and / or release it to the surrounding environment. A heat sink is composed of a body such as a metal with relatively high thermal conductivity, and by the convection, conduction, or radiation of energy,
The form is suitable for releasing energy. Typically, the body of the heat sink is aluminum or aluminum alloy in the form of a large surface area, such as fins, pins, etc., to facilitate heat dissipation therefrom.

[0003] The element package is fixed to the heat sink by an adhesive and / or a screw or other mechanical means. If easy installation and removal are considered, a spring clip tougue
Are used. However, many spring-loaded clips are an integral part of the heatsink, which requires that each heatsink be made in a separate form, each adapted to a particular device package.

[0004]

[Problems to be Solved] When mounting an element package on a circuit board or the like, those packages requiring a heat sink are combined with a proper heat sink, and the circuit board is so arranged that the heat sink can properly dissipate heat. Care must be taken to place it on top. In many cases, to ensure the stability of the assembly,
Sometimes to help conduct heat from the device package,
The heat sink itself is attached to the circuit board. Therefore, heat sinks of numerous sizes, types, and shapes, each of which can only be applied to a single or a small percentage of device packages, need to be designed, manufactured, and stocked by circuit board manufacturers. It becomes.

[0005]

Means for Solving the Problem [Structure] The present invention relates to a method of assembling an element package to a heat sink by using a heat sink plate having a mounting projection or a plate piece on an opposite side to a circuit board. Means and apparatus for mounting on a circuit board or the like are provided. This assembly allows the device package to be mounted on one or both sides of the heat sink plate, thus further increasing the density of the device package on the circuit board. Therefore, it is not always necessary to attach to both sides of the heat sink plate. The assembly of the heat sink can therefore be used to support the device package on one or both sides, so that the device package on one side and others are completely independent of the mounting of the device package on the other side. Things.

[0006]

In a preferred embodiment, the heat sink comprises a mounting plate adapted for mounting on a circuit board or the like, and
A heat sink plate mounted on the mounting plate. The outer shape, size, etc. of the heat sink plate (as well as the installation base) can be varied according to the predetermined number of electronic element packages and the need for heat dissipation. Since the mounting plate and heat sink plate are made separately, only one or a few installation bases need to be designed,
Compatible with many types of heat sink plates. Thus, once the required amount of heat dissipation is determined, an appropriate heat sink plate can be selected and inserted directly into a common or common mounting plate. Since the clip projections or strips are on both sides of the heat sink plate and work independently of each other, a wide range of different sizes, shapes and numbers of packages can be mounted on one or both sides of the plate. Since the heatsink plate is a stand-alone component mounted on a standard or common mounting plate, a wide variety of heatsinks and device packages can be mounted on a circuit board using a minimum number or a single common standard mounting plate. I can do it. Other features and advantages will become more apparent from the following detailed description, taken in conjunction with the appended claims and the drawings.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The illustrated embodiment includes a mounting plate (20) supported on a heat sink plate (10) (see FIGS. 1-4). The heat sink plate (10) has opposed main face plates (11) and (11a) and includes a plurality of radiating fins (12) and the like. The heat sink plate (10) is stamped or otherwise formed of sheet material to have a large surface area for heat dissipation. Heat sink plate (1
The size and outer shape of 0) are, of course, determined by the required heat radiation amount and size of the electronic element package installed therein. Of course, the size, outer shape, arrangement, etc. of the heat sink plate (10) can be changed as desired or necessary.

[0008] The mounting plate (20) includes a base portion (21),
It supports the upwardly projecting plate pieces (22) and tabs (24). In an ideal embodiment, the mounting plate (20) is also molded from sheet metal material, but can be made by other methods. The upwardly extending tab (24) includes a slot (25) for receiving a heat sink plate (10), as shown in FIG. The mounting plate (20) is preferably
It includes a base portion (21) extending in a substantially first plane direction, and a tab (24) extending therefrom in a direction substantially perpendicular to the first plane as shown in FIG.

As depicted in the embodiment, the heat sink plate (10) is inserted into a slot (25) in a tab (24), and thus a major face (11) (11).
a) is arranged perpendicular to the horizontal plane of the base part (21) of the mounting plate (20). One or more tabs, as desired
(24) may have a slide stop (26) that engages the fin (12) or notch edge of the heat sink plate (10), thereby allowing the heat sink plate to be slotted
(25) will be locked firmly and stably.

[0010] The mounting plate (20) supports a set of plate pieces (22), which are arranged facing each other and project upward, which are on the side opposite to the tab (24), namely the heat sink plate. It is arranged on the facing surface of (10). The mounting plate (20) also has a hole (23) in the base portion (21), and the leads of the element package mounted adjacent to the main face plates (11) and (11a) are shown in FIGS. Project through the mounting plate (20) so that it can be The mounting plate (20) also includes legs (27) that extend in a direction opposite to the tabs (24). The legs (27) are plugged into the circuit board or other suitable slots to secure the assembly to the circuit board.

As shown in FIGS. 5 and 6, the electronic element package (30) is inserted between the main face plate (11) and the plate piece (22) and is fixed thereto, and the heat conductive plate (31) is attached. The heat sink plate (10) is brought into thermal close contact with the main face plate (11).

It should be noted that each plate piece (22) acts independently of the other plate pieces. Heat sink plate (1
0) is a rigid plate, which is firmly fixed to the mounting plate (20), so that the plate pieces (22) act completely independently of each other. Thus, an element package (such as a package (30)) can be attached to one or both sides of the base plate (10).

In the illustrated embodiment, each electronic element package (30) has its leads (32) extending parallel to the planes (11) and (11a) and through the holes (23). Thus, because it is mounted vertically, the entire assembly can be manually or automatically assembled to a circuit board or the like. The device package (or device package) assembly and heat sink are thus easily handled like components, and the leads (32) and legs (27) (by hand or by robot) are properly mounted on the circuit board. It can be inserted into a hole and placed on a single circuit board. The heat sink is like this
By the same soldering method as the lead of the electronic element,
The electronic element package (30) can be removed without melting the heat sink from the circuit board by simply melting the solder to which the leads (32) are attached and pulling the electronic element package (30) vertically. In this way, the assembly allows the device package to be removed relatively easily.

The heat sink plate (10) is connected to the base (21).
And the base portion (21) has a hole in it, so that the element package is mounted on the base portion (2).
1) Can be inserted from above or below. With this arrangement, the heat sink and device package assembly can be assembled by a robot.

While the invention has been described and described with particular reference to a two-part heat sink assembly formed by stamping sheet metal material, the invention is not so limited. The heat sink, for example,
Multiple molding and material processed parts (m
achine component), molded (molded), machined (mach
It may be monolithic, formed by ined, stamped, etc. Similarly, the spring projections or plate pieces (22) may take any shape or shape.
For example, they may be plastic protrusions, or permanent slots, protrusions, flanges, bosses, etc., to conform and / or secure the component package to the heat sink plate. One plate (2) on each side of the assembly
Although only 2) is illustrated, pins that can hold a plurality of plate pieces or one or more element packages may be provided on both sides of the heat sink plate. Furthermore, the plate piece (22) may be formed as a part of the heat sink plate (10) instead of the mounting plate (20).

Although the invention has been described with particular reference to circuit board and other hole mounting assemblies, the invention is not so limited. For example, legs (27)
Is a leg that is molded into a simple shape that is included in the horizontally extending surface
(27) and can be used for surface mounting. Electronic element packages can likewise be used for surface mounting without departing from the spirit of the invention.

It will be readily appreciated that the materials used to make the heat sink mounting assembly of the present invention can be varied depending on the application, if desired.
Similarly, the physical dimensions and outlines of the components can be varied to suit the various dimensions, outlines, needs, etc. of the various element packages. For example, as described above, the heat sink plate and its mounting plate are separate components, but the heat sink plate can be changed to meet various energy dissipation needs. Heatsink plates of various sizes, shapes, etc. can be designed for use with mounting plates of a single size or shape.

From the foregoing, it will be appreciated that the principles of the present invention can be utilized in a variety of applications, and obtain the advantages of many of the disclosed advantages and features. Although numerous features and advantages of the invention have been described in detail along with details of the structure and function of the invention, it is to be understood that this disclosure is by way of example only. Various changes and embodiments can be made, particularly with regard to the size, shape and arrangement of parts, without departing from the spirit and purpose of the invention as defined in the appended claims.

[Brief description of the drawings]

FIG. 1 is a perspective view of one embodiment of a heat sink plate of a heat sink assembly used in the presently preferred embodiment of the invention.

2 is a perspective view of one embodiment of a mounting plate for the heat sink plate of FIG.

FIG. 3 is a front perspective view of the assembly shown in FIGS. 1 and 2;

FIG. 4 is a rear perspective view of the assembly of FIG. 3;

FIG. 5 is an exploded perspective view of the heat sink component and the element package assembly according to the present invention from the entire surface.

FIG. 6 is a rear perspective view of the assembly of FIG. 5;

[Explanation of symbols]

 (10) Heat sink plate (11) (11a) Main face plate (12) Fin (20) Mounting plate (22) Plate piece (30) Electronic element package

Claims (16)

[Claims] 1. A rigid heat sink plate having first and second main face plates disposed opposite to each other; and (b) an electronic element package disposed opposite to each main face plate so as to hold the electronic device package in a first position. And an at least one pin provided to press against one of the second main face plates. 2. The apparatus defined in claim 1, wherein said rigid heat sink plate is mounted on a mounting plate. 3. The apparatus defined in claim 2, wherein said mounting plate includes a base portion extending substantially in a first plane and a tab extending therefrom in a direction substantially perpendicular to said first plane. 4. The tab according to claim 1, wherein said tab has a slot, said heat sink plate is mounted in said slot, and said first and second main face plates are disposed substantially perpendicular to said first plane. An apparatus as defined in 3. 5. The apparatus as defined in claim 3, wherein said tab includes a slide to engage said heat sink plate to secure said heat sink plate to said mounting plate. 6. The apparatus defined in claim 3, wherein said mounting plate supports at least two plate pieces extending therefrom in a direction substantially perpendicular to said first plane. 7. An apparatus as defined in claim 3, wherein said mounting plate has legs for soldering to a circuit board or the like. 8. The apparatus defined in claim 2, wherein said mounting plate includes a base portion extending substantially in a first plane direction, and a hole included in said base portion. 9. (a) a mounting plate having a base portion extending substantially in the direction of the first plane; (b) a heat sink plate having first and second main face plates disposed opposite to each other; An apparatus for mounting an electronic element package, comprising at least one plate piece disposed opposite a main face plate and pressing the electronic element package into close contact with the main face plate. 10. The apparatus defined in claim 9, wherein said mounting plate has a tab extending from said base portion in a direction substantially perpendicular to said first plane. 11. The mounting plate having legs extending therefrom for securing the mounting plate to a circuit board or the like.
Equipment specified in. 12. The device as defined in claim 9, wherein said base has at least one aperture therein. 13. The tab has sliding means for securing the heat sink plate to the mounting plate.
An apparatus as defined in claim 10. 14. A heat sink, comprising: a mounting plate having a base extending substantially in the direction of a first plane; a heat sink having first and second main face plates disposed opposite to each other. A plate; and at least one plate piece disposed to face the main face plate and pressing the electronic element package tightly against the main face plate;
And (b) a combination of an electronic element package fixed between the main face plate and the main face plate of the heat sink plate. 15. The electronic device of claim 15, wherein the base has at least one hole, the electronic device package has a lead extending therefrom, and the device package is disposed such that the lead protrudes through the hole. The combination defined in Clause 14. 16. (a) Producing a mounting plate having holes and being attached to a circuit board or the like by soldering; (b) Producing a plurality of heat sink plates to be fixed to the mounting plate; c) installing at least one heat sink plate on the mounting plate; (d) fixing at least one electronic element package to the heat sink plate and extending the leads through the holes; (e) mounting Board and the lead of the electronic element package,
A method of forming an assembly of a heat sink and an element package, which is simultaneously soldered to a circuit board and is placed in a solderable state.