GB9819380D0 - Attachment of electronic device packages to heat sinks - Google Patents

Attachment of electronic device packages to heat sinks

Info

Publication number
GB9819380D0
GB9819380D0 GBGB9819380.8A GB9819380A GB9819380D0 GB 9819380 D0 GB9819380 D0 GB 9819380D0 GB 9819380 A GB9819380 A GB 9819380A GB 9819380 D0 GB9819380 D0 GB 9819380D0
Authority
GB
United Kingdom
Prior art keywords
attachment
electronic device
heat sinks
device packages
packages
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB9819380.8A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thermalloy Inc
Original Assignee
Thermalloy Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thermalloy Inc filed Critical Thermalloy Inc
Publication of GB9819380D0 publication Critical patent/GB9819380D0/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1405—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by clips or resilient members, e.g. hooks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GBGB9819380.8A 1997-10-07 1998-09-04 Attachment of electronic device packages to heat sinks Ceased GB9819380D0 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US94616097A 1997-10-07 1997-10-07

Publications (1)

Publication Number Publication Date
GB9819380D0 true GB9819380D0 (en) 1998-10-28

Family

ID=25484034

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB9819380.8A Ceased GB9819380D0 (en) 1997-10-07 1998-09-04 Attachment of electronic device packages to heat sinks

Country Status (7)

Country Link
JP (1) JPH11135693A (en)
KR (1) KR19990036628A (en)
CN (1) CN1219838A (en)
DE (1) DE19846186A1 (en)
FR (1) FR2769457A1 (en)
GB (1) GB9819380D0 (en)
IT (1) IT1302354B1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014165231A (en) * 2013-02-22 2014-09-08 Fujitsu Ltd Electronic component unit and fixing structure
US9467190B1 (en) * 2015-04-23 2016-10-11 Connor Sport Court International, Llc Mobile electronic device covering
DE102019115500A1 (en) * 2019-06-07 2020-12-10 OSRAM CONTINENTAL GmbH Arrangement and method for making an arrangement

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4054901A (en) * 1975-10-14 1977-10-18 Thermalloy, Inc. Index mounting unitary heat sink apparatus with apertured base
JPS59208762A (en) * 1983-05-09 1984-11-27 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン Device for contacting under pressure solid state unit with heat sink member
US4847449A (en) * 1986-07-09 1989-07-11 Thermalloy Incorporated Alignment apparatus for use in mounting electronic components and heat sinks on circuit boards
US4933746A (en) * 1988-09-12 1990-06-12 Aavid Engineering, Inc. Three-legged clip
CN1152428C (en) * 1995-10-13 2004-06-02 热合金公司 Solderable transistor clip and heat sink

Also Published As

Publication number Publication date
FR2769457A1 (en) 1999-04-02
CN1219838A (en) 1999-06-16
DE19846186A1 (en) 1999-05-12
JPH11135693A (en) 1999-05-21
KR19990036628A (en) 1999-05-25
IT1302354B1 (en) 2000-09-05
ITRM980624A1 (en) 2000-04-02

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)