KR19990036628A - Device with electronics package attached to heat sink - Google Patents

Abstract

Heat sinks having a support base for supporting the base plate are used to mount one or more electronic device packages on a circuit board or the like. The support base is suitable for securing to a circuit board. The base plate has opposing major surfaces suitable for coupling to the electronic device package. The tongue or clip secures each electronic device package to the major surface of the base plate separately from which the electronic device package can be detachably attached to both or one side of the base plate.

Description

A device with an electronics package attached to a heat sink.

The present invention relates to an assembly of an electronic device package and a heat sink. In particular, the present invention relates to mounting the assembly to a circuit board or the like by fixing an electronic device package to opposite surfaces of a heat sink body.

Many electronic device packages are made to conduct heat from the embedded circuit device chip to the surface of the package. Generally, one side of the package is formed of a plastic, ceramic or metal body that acts as a heat transfer medium to conduct heat from the electronic device to the outer side of the package. An external heat dissipation device, such as a heat sink, must be arranged to heat transfer with the heat transfer medium to absorb heat and disperse it to outside air. The heat sink will be a body, such as a metal having a relatively high thermal conductivity, suitably shaped to dissipate energy by convection, conduction and radiation. Generally, heat is easily dissipated in the heat sink since the heat sink is a body made of aluminum or an aluminum alloy molded to exhibit a high surface area in the form of a fin.

The electronic device package may be secured to the heat sink with a mechanical device such as an adhesive or a screw. Spring clip tongues and the like are used where they should be easy to attach and remove. However, most spring clips are integral parts of the heat sink, so each heat sink must be tailored for each particular electronics package.

When mounting an electronics package on a circuit board, care must be taken to ensure that the package requiring the heat sink is matched with a suitable heat sink and that the heat sink is placed on the substrate to produce adequate heat dissipation. In many cases, the heat sink itself is attached to the circuit board to ensure the stability of the assembly, and in some cases, to the circuit board to help heat conduction from the electronic device package. Therefore, heat sinks of various sizes, styles, and shapes must be designed, designed, and processed by the substrate assembler, and each heat sink should only fit into a single electronic device package or a few electronic device packages.

The present invention provides an apparatus and method for assembling an electronic device package to a heat sink and mounting the assembly to a circuit board or the like applied to the heat sink plate with attachment fingers or tongues on opposite sides. The assembly allows for attachment of the electronic device package to one or both sides of the heat sink plate, thereby increasing the density of the device package on the substrate. The heat sink of this assembly is secured against the clip tongue. Therefore, both sides of the heat sink plate need not be high in density. The heat sink assembly can be used to hold the electronics package on one or both sides, and attaching the electronics package to one side is independent of attaching the electronics package to the other side.

In a preferred embodiment, the heat sink consists of a mounting base suitable for attaching to a circuit board or the like and a heat sink plate suitable for mounting to the mounting base. The structure and size of the heat sink plate as well as the mounting base can vary as required to dissipate heat at a specific number and heat dissipation conditions of the electronics package. Since the mounting base and heat sink plate are produced separately, one or a few of the mounting bases will be designed to fit a variety of heat sink plates. Therefore, a suitable heat sink plate may be selected as determined by the heat dissipation requirements and will be inserted directly into the general mounting base. Since the chip fingers or tongue operate independently on opposite sides of the heat sink plate, various sizes, shapes and numbers of packages will be mounted on one or both sides of the plate. Since the heat sink plate is an independent component mounted on a standard or common mounting base, various heat sink plates and electronics packages will be mounted on the circuit board using a minimal standard mounting base or using only one standard mounting base. . Other features and advantages will be more readily understood from the following detailed description with reference to the appended claims and drawings.

1 is a perspective view of a heat sink plate of a heat sink assembly according to a preferred embodiment of the present invention;

FIG. 2 is a perspective view of a mounting base for the heat sink plate of FIG. 1; FIG.

3 is a front view of the assembly of FIGS. 1 and 2;

4 is a rear view of the assembly of FIG. 3;

5 is an exploded front view of an assembly of heat sink prose and an electronic device package according to the present invention; And

6 is a rear view of the assembly of FIG. 5;

* Sign Description

10 ... heat sink plate 11,11a ...

12 ... heat dissipation pin 20 ... mounting base

21 ... Base 22 ... Tongue

23 ... opening 24 ... tab

25 ... slots 27 ... feet

30 ... electronics package 32 ... leads

The illustrated embodiment includes a mounting base 20 supporting a heat sink plate 10 (see FIGS. 1-4). The heat sink plate 10 has a plurality of heat dissipation fins 12 with opposing major surfaces 11 and 11a. The heat sink plate 10 is formed by stamping sheet stock or has a wider surface to dissipate heat. The size and shape of the plate 10 is determined by the heat dissipation demand, size, etc. of the electronic device package to be mounted on the plate. The size, shape, and structure of the heat sink plate 10 can be changed as clearly required.

The mounting base 20 includes a tongue 22 extending upwards and a base 21 supporting the tab 24. In a preferred embodiment the mounting base 20 may be formed of sheet metal stock or assembled. Each tab 24 extending upwards has a slot 25 suitable for receiving a heat sink plate 10 as shown in FIG. The mounting base 20 includes a tab 24 extending in a direction orthogonal to the first plane and a base 21 extending in the first plane as shown in FIG. 2.

In the embodiment shown, the heat sink plate 10 is inserted into the slot 25 in the tab 24, so that the major surfaces 11, 11a are arranged perpendicular to the plane of the base 21 of the mounting base 20. If desired, the one or more tabs 24 are secured to the heat sink plate in the slot 25 as they include a stopper 26 suitable for mating with edges such as pins 12 or notches in the plate 10.

The mounting base 20 supports a pair of opposedly extending upwardly extending tongues 22, which are disposed on opposite sides of the tab 24, ie opposite sides of the heat sink plate 10. Since the mounting base 20 includes an opening 23 at the base 21, the leads of the electronic device package mounted adjacent to the main surfaces 11 and 11a may be mounted as shown in FIGS. 5 and 6. Sticking out through. The mounting base 20 includes a plurality of feet 27 extending in the opposite direction from the tab 24. The pit 27 is suitable for being inserted into a suitable opening in the circuit board to secure the assembly to the circuit board.

As shown in FIGS. 5 and 6, the electronic device package 30 is inserted between the face 11 and the tongue 22 and the heat transfer plate 31 so that the heat transfer with the face 11 of the heat sink plate 10 is well performed. Is fixed to. As shown in FIG. 6, another electronic device package may be similarly mounted on opposite surfaces.

It should be noted that each tongue 22 operates independently of the other tongue. Since the heat sink plate 10 is a rigid plate and is firmly fixed to the mounting base 20, the tongues 22 operate completely independently of each other. Therefore, the electronic device package 30 may be mounted on each side or both sides of the base plate 10.

In the embodiment shown, each electronic device package 30 is mounted perpendicularly to the leads 32 extending parallel to the main surfaces 11, 11a through the opening 23 so that the entire assembly can be assembled manually or automatically on a circuit board or the like. Can be. Thus, the assembly of electronics package and heat sink can be easily handled as a single unit and placed either manually or automatically on a circuit board so that leads 32 and pits 27 protrude into the appropriate openings of the substrate. The heat sink will thus be coupled to the substrate in the same soldering process as the electronic device leads. After the assembly is mounted to the substrate, the electronics package 30 can be removed without the need to separate the heat sink from the circuit board by simply melting the solder that couples the leads 32 and vertically removing the package 30. Can be. This assembly can thus replace the electronic device package relatively easily.

Since the heat sink plate 10 is disposed perpendicular to the base 21 and the base 21 has an opening therein, the electronic device package can be inserted from the upper as well as the lower base 21. This arrangement allows for fully automatic assembly of the heat sink and electronic device package assembly.

Although the invention has been described with reference to a heat sink assembly consisting of two charges stamped from sheet metal stock, the invention is not limited thereto. For example, the heat sink may be assembled from multiple molded or processed components or may be molded, processed, stamped or molded as a single unit. Similarly, spring finger or tongue 22 can take any other form. For example, it may be in the form of a flexible finger or in the form of permanent slots, flanges, bosses, etc., which align the electronics package and secure it to the heat sink package. Although only one tongue 22 is shown on each side of the assembly, a number of tongues capable of supporting one or more electronic device packages may be applied to each side of the heat sink plate. Again, the tongue 22 will be shaped as part of the heat sink plate 10 rather than the mounting base 20.

Although the present invention is shown and described with reference to an assembly for mounting into a hole in a circuit board, the present invention is not limited thereto. For example, the pits 27 are suitable for surface mounting by simply molding the pits 27 having horizontally extending surfaces. The electronic device package is suitable for surface mounting without departing from the principles of the present invention.

It will be readily appreciated that the materials used to fabricate the heat sink mounting assembly of the present invention may vary as desired depending on the application. Similarly, the physical size and shape of each component can be varied to meet the various sizes, shapes, and requirements of various electronic device packages. For example, the heat sink plate and its mounting base are separate components as described above, but the heat sink plate can be modified to suit various energy dissipation requirements. Heat sink plates of different sizes and shapes are made for use with a mounting base of a single size and shape.

From the foregoing, it can be seen that the principles of the present invention can be applied to various devices in order to realize many of the features and advantages described. While the various advantages and features of the present invention have been described in addition to the detailed description of the features and structure of the present invention, it is to be considered that this is merely a mere example. Accordingly, the forms of the invention are capable of various changes or modifications in the size, shape and arrangement of the components without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (16)

(a) a rigid heat sink plate having first and second major surfaces disposed opposite each other; And (b) an apparatus for mounting an electronic device package disposed opposite one major surface and composed of one or more tongues suitable for pushing the electronic device package into contact with one of the first and second major surfaces. 2. The apparatus of claim 1, wherein the rigid heat sink plate is mounted to a mounting base. 3. The apparatus of claim 2, wherein the mounting base comprises a base extending in a first plane and a tab extending orthogonal to the first plane. 4. The apparatus of claim 3, wherein the tab comprises a slot and the heat sink plate is secured by the slot to align the first major surface and the second major surface orthogonal to the first surface. 4. The apparatus of claim 3, wherein the tab includes a stopper that engages the heat sink plate to secure the heat sink plate to the mounting base. 4. The device of claim 3, wherein the mounting base support supports two or more tongues extending perpendicular to the first face. 4. The apparatus of claim 3, wherein the mounting base comprises a fit suitable for soldering to a circuit board or the like. 3. The device of claim 2, wherein the mounting base includes a base extending from the first side and an opening in the base. (a) a mounting base having a base extending from the first side; (b) a heat sink plate having major surfaces disposed opposite to the first and second sides; And (c) an apparatus for mounting an electronic device package, the electronic device package comprising one or more tongues disposed opposite each major surface and adapted to squeeze the electronic device package into contact with the major surface. 10. The apparatus of claim 9, wherein the mounting base comprises a tab extending from the base orthogonal to the first face. 10. The apparatus of claim 9, wherein the mounting base has a pits extending from the mounting base to secure the mounting base to a circuit board or the like. 10. The apparatus of claim 9, wherein the base has one or more openings. 11. The apparatus of claim 10, wherein the tab comprises a stopper for securing the heat sink to the mounting base. (a) (iii) a mounting base having a base extending from the first surface; (Ii) heat sink plates having first and second major surfaces disposed opposite each other; (Iii) one or more tongues disposed opposite each major surface and adapted to push the electronics package into contact with the major surface; (b) an assembly consisting of an electronic device package fixed between one of the tongues and a major surface of a heat sink plate. 15. The combination of claim 14, wherein the base portion has one or more openings, the electronics package having leads extending from the package, and wherein the electronics package is aligned so that the leads protrude through the openings. (a) forming a mounting base having an opening and suitable for attaching to a circuit board or the like by soldering; (b) forming a plurality of heat sink plates suitable for securing to said mounting base; (c) securing one or more heat sink plates to the mounting base; (d) securing one or more electronic device packages to a heat sink plate having leads extending into the openings; And (e) simultaneously soldering the mounting base and the leads of the electronic device package to a circuit board.