CN1219838A - Attachment of electronic device packages to heat sinks - Google Patents
Attachment of electronic device packages to heat sinks Download PDFInfo
- Publication number
- CN1219838A CN1219838A CN98119435A CN98119435A CN1219838A CN 1219838 A CN1219838 A CN 1219838A CN 98119435 A CN98119435 A CN 98119435A CN 98119435 A CN98119435 A CN 98119435A CN 1219838 A CN1219838 A CN 1219838A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- underframe
- heat
- radiator
- device package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
- H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
- H05K7/1405—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by clips or resilient members, e.g. hooks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to assemblage composed of electron device packages and radiator. The invention particularly relates to fixing the electron device packages on the two oppositing sides of the radiator body and mounting the assemblage on the circuitry board 5.
Description
The present invention relates to the packaging part of electronic device and the assembly of radiator.The invention particularly relates to the electron device package part is fixed on two opposite flanks of radiator body, and relate to assembly is contained on wiring board etc.
A lot of electronic component packages are designed to make the heat of the electric wire device chip generation that wherein comprises to be sent on the surface of packaging part.Usually, a surface of packaging part is made of plastics, pottery or metalwork, and they play hot transmission medium, and the heat that electronic device is produced is transmitted on the outer surface of packaging part.Must the configuring external heat abstractor radiator for example, make its and this hot transmission medium form the heat transferred relation, thus absorption heat and/or it is dissipated in the surrounding environment.Radiator can be the quite high metalwork of thermal conductivity, suitably is formed, and makes it can be by convection current, conduction or radiation dissipation energy.Heats ink is the aluminum or aluminum alloy shell normally, has very big surface area, becomes shapes such as fin, heat radiation thorn, and heat is distributed from above easily.
Device package can with adhesive and/or mechanical device to as bolt etc. because of fixing on the radiator.For the fixing and dismounting of easily carrying out device package can also applied spring folder tongue.Yet most spring clip is the integral part of radiator, and each fin that therefore need ad hoc be shaped is so that admit each specific element package.
In the time of on device package being contained in wiring board etc., must guarantee, need these packaging parts of radiator and the radiator coupling that is fit to, and in the circuit board, make heat dissipation normally the radiator location.Under many circumstances, itself is fixed in wiring board radiator, to guarantee the stability of assembly, in some cases then in order to help the transmission of heat in the device package.Therefore wiring board assembling people must design, makes and store the radiator of the huge amount of various sizes, style and shape, and every kind of radiator can only hold a kind of or seldom several device package.
The invention provides a kind of method and apparatus, be used for device package is assembled on the radiator and the assembly of assembling is contained in wiring board etc., the present invention uses a kind of heat-radiator plate that has fixing finger or tongue in its relative both sides.This assembly can make element package be fixed on any side or two sides of heat-radiator plate, has therefore increased the population density of device package in the circuit board.The heat-radiator plate of assembly is fixing rigidly with respect to the intermediate plate tongue.Therefore do not need to occupy two sides of the heat-radiator plate of assembly.Therefore heat sink assembly can be used for making device package be bearing in one or both sides.Device package does not rely on device package fixing at opposite side fully fixing of a side.
In a preferred embodiment, radiator comprises installs underframe and heat-radiator plate, and the former is suitable for being fixed in wiring board etc., and the latter is adapted to be mounted within and installs on the underframe.Number and its heat radiation of the electron device package part that the configuration of heat-radiator plate and installation underframe, size etc. can be dispelled the heat as required require to change.Underframe and heat-radiator plate be formed separately because install, so can design a kind of and a few is installed underframe and admits heat-radiator plate miscellaneous.Therefore can require to select suitable heat-radiator plate according to heat radiation, directly insert shared or general installation underframe then.Because intermediate plate finger or tongue are independently operated in the relative both sides of heat-radiator plate, the packaging part of various different sizes, shape and number can be installed in the one or both sides of plate.Because heat-radiator plate is a kind of independent member, be contained on installation underframe standard or general, so with minimal amount or even a kind of general standard underframe is installed just various heat-radiator plates and device package can be contained on the wiring board.
Be elaborated below in conjunction with appended claims and accompanying drawing, can understand further feature and advantage easily thus, these accompanying drawings are:
Fig. 1 is the perspective view of an embodiment of the heating panel of heat sink assembly used in the present preferred embodiment of the present invention;
Fig. 2 is the perspective view of an embodiment of the installation underframe of heat-radiator plate shown in Figure 1;
Fig. 3 is the front perspective view of the assembly of Fig. 1 and 2;
Fig. 4 is the back perspective view of assembly shown in Figure 3;
Fig. 5 is its exploded front perspective view of assembly that radiator component and device package of the present invention constitutes;
Fig. 6 is the back perspective view of assembly shown in Figure 5.
Shown embodiment comprises the installation underframe 20 (seeing Fig. 1～4) of supporting radiator plate 10.Heat-radiator plate 10 has opposed major surfaces 11,11a and many fin 12 and similar heat sink.Heat-radiator plate 10 sheet metal drawing, or, form very big cooling surface area with other method shaping.The size and dimension of heating panel 10 is certainly according to the decision of factors such as heat radiation requirement that is contained in the electron device package part on the heating panel and size.Clearly, the size of heat-radiator plate 10, shape and structure etc. can as required or require to change.
In illustrative embodiment, heat-radiator plate 10 inserts the notch 25 on the vertical pieces 24, makes first type surface 11, the 11a plane perpendicular to the underframe part 21 that underframe 20 is installed.If desired, one or more vertical pieces 24 can comprise lock pin 26, this lock pin be suitable for plate 10 on fin 12 or notching edge engagement, thereby heating panel 10 is locked in the groove 25 securely and rigidly.
The tongue protruding upward 22 of a pair of relative configuration of underframe 20 supportings is installed, and this tongue is positioned at the relative both sides of vertical piece 24, thereby is positioned at relative two of heat-radiator plate.Installation underframe 20 also comprises the hole 23 on the underframe part 21, and the feasible lead-in wire that is pasting the device package of surface 11,11a installation can pass installs underframe 20, as illustrated in Figures 5 and 6.Underframe 20 is installed is also comprised many pin 27 that extend in contrast to the direction of vertical piece 24.Pin 27 is suitable for inserting in the suitable hole on the wiring board etc., so that assembly is fixing in the circuit board.
As illustrated in Figures 5 and 6, device package 30 can be inserted between surface 11 and the tongue 22, and fixing with heat transfer plate 31, and this transmission board and heat-radiator plate 10 are with the heat-conducting mode close proximity.As shown in Figure 6, another device package can be contained in opposite side in a similar manner.
Should be noted that each tongue 22 is independent of other tongue operation.Because heat-radiator plate 10 is rigidity, and be fixed in installation underframe 20 rigidly, so tongue 22 operation independently of one another fully.Therefore device package (for example packaging part 30) can be contained in the wherein one or both sides of heat-radiator plate 10.
In illustrative embodiment, each electronic device assembly 30 vertically is installed, make that its lead-in wire 32 is parallel to surface 11,11a extends and pass hole 23, but make whole assembly hand by hand or automated process be contained on the wiring board etc.Therefore the assembly that is made of device package (or a plurality of packaging part) and radiator can be used as a single unit and easily handles and place in the circuit board (manual operations or operation automatically), makes lead-in wire 32 and pin 27 pass in the suitable hole of wiring board.Radiator can adopt with the welding operation of electronic device lead-in wire and weld in the circuit board.After being contained in assembly on the circuit board, can take off device package 30 and need not take off radiator from wiring board, method is to scald the fixing lead-in wire of welding down simply, vertically pulls out packaging part 30 then.Therefore can quite easily replace device package.
Because heat-radiator plate 10 is perpendicular to underframe part 21 configuration, and porose on the underframe part 21, so not only can be below underframe part 21 but also can be from top insertion device package.This configuration allows automatically to assemble the assembly of radiator and device package.
Although specifically with reference to the heat sink assembly explanation the present invention who constitutes by two metal sheet punch, but the invention is not restricted to this, for example the present invention can be with the assembling of many moulded parts or machined piece, maybe can be molded, process, strikes out or be processed to integral unit with other processing mode.Equally, elasticity finger or tongue 22 can be any form or shape.For example be flexible finger or permanent notch, flange, protuberance etc., these parts can make device package aim at heating panel and/or device package is fixed on the heating panel.Although each side at assembly only illustrates a tongue 22, can use multiple tongue or a plurality of tongue in each side of heating panel, with fixing one or more device packages.In addition, tongue 22 can form the part of heat-radiator plate 10 rather than the part that underframe 20 is installed.
Illustrate and illustrate the present invention though had, the invention is not restricted to this with reference to the assembly in the hole that can be contained in circuit board etc.For example, pin 27 can be adapted as Plane Installation, and method is to form a horizontally extending surface on pin.Equally, the electron device package part also can be adapted as and be suitable for Plane Installation and without prejudice to principle of the present invention.
Be easy to see that making the used material of radiator installation component of the present invention can be as requested, look the needs of application and change.The physical size of member and shape equally also can change, to admit the various device packages of various sizes, shape and requirement.For example, although heat-radiator plate and its installation underframe are member separately according to the above description, heat-radiator plate can change as required, to regulate various energy dissipation requirements.Can design the heat-radiator plate of different size, shape etc., make the installation underframe coupling of itself and a kind of size or shape.
According to the above as can be seen, principle of the present invention can be used in the various configurations, to obtain many useful advantages and feature.Even should be understood that details and Action Specification many feature and advantage of the present invention in conjunction with structure of the present invention, but this openly can only think illustrative.Can carry out various changes and modification in detail, particularly change and modification aspect chi spare, shape and the configuration of parts, like this and the spirit and scope of the present invention of determining without prejudice to described claims.
Claims (16)
1. device that is used to install the electron device package part comprises:
(a) heat-radiator plate of rigidity has first and second first type surfaces of relative configuration;
(b) at least one tongue facing to the configuration of each first type surface, is suitable for pushing the electron device package part, make its with above-mentioned first and second first type surfaces in surperficial a contact;
2. device as claimed in claim 1 is characterized in that, above-mentioned rigid heat sink plate is contained in to be installed on the underframe.
3. device as claimed in claim 2 is characterized in that, above-mentioned installation underframe comprise basically the underframe part of extending along first plane and stretch out from this first surface and generally along the vertical piece that extends perpendicular to the direction on this first plane.
4. device as claimed in claim 3 is characterized in that above-mentioned vertical piece comprises notch, and above-mentioned heat-radiator plate is fixed on mouth in the above-mentioned groove, and above-mentioned notch is aimed at above-mentioned first and second first type surfaces that are substantially perpendicular to above-mentioned first plane.
5. device as claimed in claim 3 is characterized in that above-mentioned vertical piece comprises the lock pin that meshes above-mentioned heating panel, so that above-mentioned heat-radiator plate is fixed on the above-mentioned installation underframe.
6. device as claimed in claim 3 is characterized in that, at least two tongues that extend perpendicular to the direction on above-mentioned first plane substantially from the underframe upper edge of above-mentioned installation underframe supporting.
7. device as claimed in claim 3 is characterized in that, above-mentioned installation underframe comprises and is suitable for the pin of soft soldering on wiring board etc.
8. device as claimed in claim 2 is characterized in that, above-mentioned installation underframe comprises generally along the underframe part of first plane extension and the hole on the above-mentioned underframe part.
9. device that the electron device package part is installed comprises:
(a) underframe is installed, is had the underframe part of extending generally along first plane;
(b) have the first and second relative heat-radiator plates of the first type surfaces of configuration;
(c) at least one tongue faces toward each above-mentioned first type surface configuration and is suitable for pushing the electron device package part, and it is closely contacted with above-mentioned first type surface.
10. device as claimed in claim 9 is characterized in that, above-mentioned installation underframe comprises from above-mentioned underframe part upper edge the vertical piece that extends perpendicular to the direction on above-mentioned first plane substantially.
11. device as claimed in claim 9 is characterized in that, above-mentioned installation underframe has the pin that stretches out from this, is used for above-mentioned installation underframe is fixed on wiring board etc.
12. device as claimed in claim 9 is characterized in that, above-mentioned underframe partly has at least one hole.
13. device as claimed in claim 10 is characterized in that, above-mentioned vertical piece comprises and is used for above-mentioned radiator is fixed on lock pin on the above-mentioned installation underframe.
14. a conjunction comprises:
(a) radiator comprises:
(ⅰ) underframe is installed, is had the underframe part of extending generally along first plane;
(ⅱ) has the heat-radiator plate of first and second first type surfaces of relative configuration;
(ⅲ) at least one tongue faces toward each above-mentioned first type surface configuration and is suitable for pushing the electron device package part, and it is closely contacted with above-mentioned first type surface;
(b) electron device package part is fixed between the first type surface of tongue in the above-mentioned tongue and above-mentioned heat-radiator plate.
15. conjunction as claimed in claim 14 is characterized in that, above-mentioned underframe partly has at least one hole, and the lead-in wire of above-mentioned electron device package part passes this hole, and above-mentioned electron device package part is aimed at like this, makes the extended above-mentioned hole of above-mentioned lead-in wire.
16. but the method that the radiator and the electron device package part of welded and installed are assembled into assembly may further comprise the steps:
(a) underframe form to be installed, this underframe has the hole and is suitable for being fixed on the wiring board etc. with welding method;
(b) form many heat-radiator plates that are suitable for being fixed on the above-mentioned installation underframe;
(c) at least one above-mentioned heat-radiator plate is fixed on the above-mentioned installation underframe;
(d) at least one electron device package part is fixed on the above-mentioned heat-radiator plate, and makes its lead-in wire pass above-mentioned hole;
(e) in the circuit board simultaneously with above-mentioned mounting seat and the soft soldering of above-mentioned electron device package part.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US94616097A | 1997-10-07 | 1997-10-07 | |
| US946160 | 2001-09-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1219838A true CN1219838A (en) | 1999-06-16 |
Family
ID=25484034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN98119435A Pending CN1219838A (en) | 1997-10-07 | 1998-10-07 | Attachment of electronic device packages to heat sinks |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPH11135693A (en) |
| KR (1) | KR19990036628A (en) |
| CN (1) | CN1219838A (en) |
| DE (1) | DE19846186A1 (en) |
| FR (1) | FR2769457A1 (en) |
| GB (1) | GB9819380D0 (en) |
| IT (1) | IT1302354B1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104009009A (en) * | 2013-02-22 | 2014-08-27 | 富士通株式会社 | Electronic component unit and fixing structure |
| CN106068068A (en) * | 2015-04-23 | 2016-11-02 | 联合运动集团有限合伙公司 | The capping of mobile electronic equipment |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102019115500A1 (en) * | 2019-06-07 | 2020-12-10 | OSRAM CONTINENTAL GmbH | Arrangement and method for making an arrangement |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4054901A (en) * | 1975-10-14 | 1977-10-18 | Thermalloy, Inc. | Index mounting unitary heat sink apparatus with apertured base |
| JPS59208762A (en) * | 1983-05-09 | 1984-11-27 | インタ−ナシヨナル ビジネス マシ−ンズ コ−ポレ−シヨン | Device for contacting under pressure solid state unit with heat sink member |
| US4847449A (en) * | 1986-07-09 | 1989-07-11 | Thermalloy Incorporated | Alignment apparatus for use in mounting electronic components and heat sinks on circuit boards |
| US4933746A (en) * | 1988-09-12 | 1990-06-12 | Aavid Engineering, Inc. | Three-legged clip |
| CN1152428C (en) * | 1995-10-13 | 2004-06-02 | 热合金公司 | Solderable transistor clip and heat sink |
-
1998
- 1998-08-24 JP JP10237093A patent/JPH11135693A/en not_active Withdrawn
- 1998-09-04 GB GBGB9819380.8A patent/GB9819380D0/en not_active Ceased
- 1998-09-11 KR KR1019980037470A patent/KR19990036628A/en not_active Application Discontinuation
- 1998-10-01 FR FR9812315A patent/FR2769457A1/en not_active Withdrawn
- 1998-10-02 IT IT1998RM000624A patent/IT1302354B1/en active IP Right Grant
- 1998-10-07 CN CN98119435A patent/CN1219838A/en active Pending
- 1998-10-07 DE DE19846186A patent/DE19846186A1/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104009009A (en) * | 2013-02-22 | 2014-08-27 | 富士通株式会社 | Electronic component unit and fixing structure |
| CN106068068A (en) * | 2015-04-23 | 2016-11-02 | 联合运动集团有限合伙公司 | The capping of mobile electronic equipment |
| CN106068068B (en) * | 2015-04-23 | 2019-06-04 | 联盟体育用品有限合股集团 | The capping of mobile electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2769457A1 (en) | 1999-04-02 |
| GB9819380D0 (en) | 1998-10-28 |
| DE19846186A1 (en) | 1999-05-12 |
| JPH11135693A (en) | 1999-05-21 |
| KR19990036628A (en) | 1999-05-25 |
| IT1302354B1 (en) | 2000-09-05 |
| ITRM980624A1 (en) | 2000-04-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C01 | Deemed withdrawal of patent application (patent law 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |