CN218888884U

CN218888884U - Electronic product radiator and electronic product provided with same

Info

Publication number: CN218888884U
Application number: CN202222137739.XU
Authority: CN
Inventors: 葛天壮
Original assignee: Beijing Zuojiang Technology Co ltd
Current assignee: Beijing Zuojiang Technology Co ltd
Priority date: 2022-08-15
Filing date: 2022-08-15
Publication date: 2023-04-18
Anticipated expiration: 2032-08-15

Abstract

The utility model relates to an electronic product radiator and install electronic product of this radiator belongs to the inside electronic components heat dissipation technical field of electronic product. The utility model discloses a radiating radiator is concentrated to inside multiple circuit board many first devices of electronic product, it passes through structural design, has solved the system heat dissipation problem of many integrated circuit board many first devices in the electronic product.

Description

Electronic product radiator and electronic product provided with same

Technical Field

The utility model belongs to the technical field of the inside electronic components heat dissipation of electronic product, concretely relates to electronic product radiator and install electronic product of this radiator.

Background

The radiator is used as a main component for radiating the electronic components and is widely applied to electronic products, the density of the electronic components on a circuit board in the existing electronic products is high, multiple heating components can generate heat simultaneously in the operation process of equipment, the heat generated by the electronic components needs to be timely dissipated, and otherwise, the stability and the service life of the electronic products are greatly influenced.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The to-be-solved technical problem of the utility model is: how to design a radiator to solve the system heat dissipation problem of multi-board card multi-element devices in electronic products.

(II) technical scheme

In order to solve the above technical problem, the utility model provides an electronic product radiator, which comprises a heat absorption base 1, a heat pipe 2, a radiating fin 3 and a fan 4;

heat-conducting silicone grease is coated between the heat-absorbing base 1 and electronic components on a circuit board of an electronic product;

the heat pipe 2 comprises a heat absorption end 2.1 and a heat generation end 2.2 which are connected with each other; the heat absorption end 2.1 is fixedly connected with the heat absorption base 1 through welding, and the heating end 2.2 is fixedly connected with the radiating fin 3 through welding;

the radiating fin 3 is formed by arranging a plurality of sheet radiating fins in parallel, the middle part of the radiating fin can be ventilated, and a concave part 3.1 at the bottom of the radiating fin 3 and a heating end 2.2 of the heat pipe 2 are welded and fixed into a whole;

the fan 4 is provided with four mounting and fixing holes 4.1, the fan 4 can be correspondingly mounted and fixed at the threaded hole 3.2 of the radiating fin 3 through the mounting and fixing holes 4.1, and the air outlet of the fan 4 is vertical to the heat conducting surface of the radiating fin 3.

Preferably, the material of the heat absorbing base 1 is copper material.

Preferably, the housing of the heat pipe 2 is made of copper.

Preferably, the heat sink 3 is made of copper.

Preferably, the fins 3 have dimensions of 102mm 64mm 39mm.

Preferably, the fan 4 is a direct current fan.

Preferably, the heat conduction surface is the largest surface of the sheet-like heat dissipation fin.

Preferably, the heat absorption base 1 is provided with a mounting hole 1.1, and the heat sink can be integrally mounted inside the electronic product through the mounting hole 1.1 by using a screw.

Preferably, the heat absorption base 1 is provided with a plurality of bosses 1.2, and heat conduction silicone grease is coated between the plurality of bosses 1.2 and the electronic components on the circuit board.

The utility model also provides an install the electronic product of radiator.

(III) advantageous effects

The utility model provides a pair of electronic product radiator concentrates radiating radiator for the inside multiple circuit board multielement device of electronic product, and it has solved the system's of many integrated circuit boards multielement device heat dissipation problem in the electronic product through structural design.

Drawings

Fig. 1 is a schematic perspective view of an electronic product heat sink according to the present invention;

fig. 2 is a front view of a heat sink for electronic products according to the present invention;

fig. 3 is a side view of a heat sink for electronic products according to the present invention;

fig. 4 is a rear view of the heat sink of the electronic product according to the present invention;

fig. 5 is a front view of the heat absorbing base provided by the present invention;

fig. 6 is a schematic perspective view of the heat sink according to the present invention.

Detailed Description

In order to make the objects, contents and advantages of the present invention clearer, the following description will make a detailed description of embodiments of the present invention with reference to the accompanying drawings and examples.

As shown in fig. 1 to fig. 6, the heat sink for electronic products provided by the present invention is a heat sink for centralized heat dissipation of multiple circuit board components in an electronic product, and includes a heat absorption base 1, a heat pipe 2, a heat sink 3, and a fan 4;

the material of the heat absorption base 1 is a copper material and is fixedly connected with the structure of an electronic product, and heat conduction silicone grease is coated between the heat absorption base 1 and a heating electronic component on a circuit board of the electronic product.

The shell of the heat pipe 2 is made of copper material and comprises a heat absorption end 2.1 and a heat generation end 2.2 which are connected with each other. The heat absorption end 2.1 is fixedly connected with the heat absorption base 1 through welding, and the heating end 2.2 is fixedly connected with the radiating fin 3 through welding.

The radiating fin 3 is made of copper materials, the size of the radiating fin is 102mm 64mm 39mm, the radiating fin is formed by arranging a plurality of sheet radiating fins in parallel, the middle of the radiating fin can be ventilated, and the concave part 3.1 at the bottom of the radiating fin 3 and the heating end 2.2 of the heat pipe 2 are welded and fixed into a whole.

The fan 4 is a direct current fan with 6025 standard, four mounting and fixing holes 4.1 are arranged on the fan, the fan 4 can be correspondingly mounted and fixed at the threaded hole 3.2 of the radiating fin 3 through the mounting and fixing holes 4.1, and the air outlet of the fan 4 is vertical to the heat conducting surface of the radiating fin 3, namely the maximum surface of the sheet-shaped radiating fin.

The use method of the electronic product radiator comprises the following steps: the heat sink is integrally installed inside an electronic product through a mounting hole 1.1 formed in a heat absorbing base 1 in the heat sink by using a screw, wherein the heat absorbing base 1 is located on the upper portion of a circuit board needing heat dissipation, a heat radiating fin 3 is located at an air outlet of the electronic product, and heat conducting silicone grease is coated between a plurality of bosses 1.2 on the heat absorbing base 1 and heating electronic components on the circuit board.

In the working process of an electronic product, a plurality of electronic components on the circuit board can generate heat, the surfaces of the heating electronic components are correspondingly contacted with a plurality of bosses 1.2 on the heat absorption base 1, and the heat is conducted to the heat absorption base 1 through the heat-conducting silicone grease;

because the heat absorption end 2.1 of the heat pipe 2 is fixedly connected with the heat absorption base 1 by welding, heat is conducted to the heat absorption end 2.1 of the heat pipe 2 from the heat absorption base 1, and then the heat is conducted to the heat emitting end 2.2 through the heat absorption end 2.1 of the heat pipe 2;

because the heating end 2.2 of the heat pipe 2 is fixedly connected with the radiating fin 3 by welding, the heat is conducted to the radiating fin 3 from the heating end 2.2 of the heat pipe 2;

finally, because the fan 4 is fixedly installed on the heat sink 3 through the plurality of installation fixing holes 4.1, the air outlet of the fan 4 is perpendicular to the heat conducting surface (i.e. the largest surface of the sheet-shaped heat dissipating fin) of the heat sink 3, and the air generated by the fan 4 flows to dissipate the heat on the heat sink 3 to the outside of the housing of the electronic product.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be considered as the protection scope of the present invention.

Claims

1. A radiator of an electronic product is characterized by comprising a heat absorption base (1), a heat pipe (2), a radiating fin (3) and a fan (4);

heat-conducting silicone grease is coated between the heat-absorbing base (1) and electronic components on a circuit board of an electronic product;

the heat pipe (2) comprises a heat absorption end (2.1) and a heat generation end (2.2) which are connected with each other; the heat absorption end (2.1) is fixedly connected with the heat absorption base (1) through welding, and the heating end (2.2) is fixedly connected with the radiating fin (3) through welding;

the heat radiating fin (3) is formed by arranging a plurality of sheet-shaped heat radiating fins in parallel, the middle part of the heat radiating fin can be ventilated, and a concave part (3.1) at the bottom of the heat radiating fin (3) and a heating end (2.2) of the heat pipe (2) are welded and fixed into a whole;

the fan (4) is provided with four mounting and fixing holes (4.1), the fan (4) can be correspondingly mounted and fixed to the threaded holes (3.2) of the radiating fins (3) through the mounting and fixing holes (4.1), and the air outlet of the fan (4) is perpendicular to the heat conducting surface of the radiating fins (3).

2. The heat sink for electronic products according to claim 1, wherein the material of the heat absorbing base (1) is copper.

3. The heat sink for electronic products according to claim 1, wherein the housing of the heat pipe (2) is made of copper.

4. The heat sink for electronic products according to claim 1, wherein the heat sink (3) is a copper material.

5. The electronic product heat sink according to claim 1, characterized in that the fins (3) have dimensions of 102mm 64mm 39mm.

6. The heat sink for electronic products according to claim 1, wherein the fan (4) is a dc fan.

7. The electronic product heat sink of claim 1, wherein the heat conducting surface is the largest surface of the sheet-like heat dissipating fin.

8. The heat sink for electronic products according to claim 1, wherein the heat absorbing base (1) is provided with mounting holes (1.1), and the heat sink can be integrally mounted inside the electronic product through the mounting holes (1.1) by screws.

9. The electronic product radiator according to claim 1, wherein the heat absorbing base (1) is provided with a plurality of bosses (1.2), and heat-conducting silicone grease is coated between the plurality of bosses (1.2) and the electronic components on the circuit board.

10. An electronic product mounted with the heat sink as recited in any one of claims 1 to 9.