CN218273305U - Radiator for tablet computer - Google Patents
Radiator for tablet computer Download PDFInfo
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- CN218273305U CN218273305U CN202222139994.8U CN202222139994U CN218273305U CN 218273305 U CN218273305 U CN 218273305U CN 202222139994 U CN202222139994 U CN 202222139994U CN 218273305 U CN218273305 U CN 218273305U
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- fan
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Abstract
The utility model relates to a panel computer radiator belongs to computer heat dissipation technical field. The utility model discloses a structural design has realized absorbing the heat that electronic components produced on the inside mainboard of panel computer through the heat absorption base, and on the heat pipe was arrived in the conduction of heat pipe, the produced air of rethread fan was flowed and is finally distributed away the heat.
Description
Technical Field
The utility model belongs to the technical field of the computer heat dissipation, concretely relates to panel computer radiator.
Background
A tablet computer, also called a laptop, is a computer product with a light and thin appearance and convenient carrying, and uses a touch screen as a basic input device. The tablet personal computer integrates a touch screen function, and allows a user to operate through a touch pen, a digital pen and handwriting operation without relying on a traditional keyboard and mouse. The user can realize input through built-in handwriting recognition, a soft keyboard on a screen and voice recognition.
At present, the tablet personal computer generally has the characteristics of light weight and thin thickness, so that the internal space is very narrow and the radiator of the common desktop computer cannot be installed. Meanwhile, as the density of electronic original devices on the mainboard inside the tablet computer is high, multiple heating devices can generate heat simultaneously in the operation process of the tablet computer, the heat generated by the electronic devices needs to be dissipated timely, and the stability and the service life of the tablet computer can be greatly influenced by a person who does not need to dissipate the heat.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The to-be-solved technical problem of the utility model is: how to provide a heat sink to solve the system heat dissipation problem of a tablet computer with a smaller thickness (for example, a tablet computer with a thickness less than 30 mm).
(II) technical scheme
In order to solve the technical problem, the utility model provides a tablet personal computer radiator, which comprises a heat absorption base 1, a heat pipe 2, a radiating fin 3 and a fan 4;
the heat absorption base 1 is fixedly connected with a mainboard inside the tablet personal computer, and heat conduction silicone grease is coated between the heat absorption base 1 and heating electronic components on the mainboard;
the shell of the heat pipe 2 is made of copper materials and comprises a heat absorption end and a heat generation end which are connected with each other; the heat absorbing end is fixedly connected with the heat absorbing base 1 through welding, and the heat emitting end is fixedly connected with the radiating fin 3 through welding;
the radiating fin 3 is formed by arranging a plurality of sheet-shaped radiating fins in parallel, and the middle part of the radiating fin can be ventilated;
the fan 4 is a direct-current turbofan, a plurality of mounting and fixing holes 4.1 are formed in the fan 4, the fan 4 can be mounted and fixed inside the tablet personal computer through the mounting and fixing holes 4.1, and an air outlet of the fan 4 is perpendicular to a heat conduction surface of the radiating fin 3.
Preferably, the material of the heat absorbing base 1 is copper material.
Preferably, the heat sink 3 is made of copper.
Preferably, the size of the heat dissipation fins 3 is 60mm 22.2mm 24.2mm.
Preferably, the heat sink 3 is welded and fixed with the heating end of the heat pipe 2 into a whole through a Z-shaped multi-plane part 3.1 arranged at the top and a U-shaped multi-plane part 3.3 arranged in the middle.
Preferably, the heat absorption base 1 is provided with a mounting hole 1.2, and the fan 4 is provided with a mounting fixing hole 4.1, so that the heat radiator can be integrally mounted inside the tablet computer.
Preferably, the heat absorption base 1 is provided with a plurality of bosses 1.1, and heat conduction silicone grease is coated between the plurality of bosses 1.1 and the heating electronic components on the tablet computer motherboard.
Preferably, the heat-conducting surface is the largest surface of the sheet-like heat-dissipating fin.
Preferably, the heat generating electronic component includes a CPU and a north-south bridge.
The utility model also provides an install the panel computer of radiator.
(III) advantageous effects
The utility model discloses a structural design has realized absorbing the heat that electronic components produced on the inside mainboard of panel computer through the heat absorption base, and on the heat pipe was arrived in the conduction of heat pipe, the produced air of rethread fan was flowed and is finally distributed away the heat.
Drawings
Fig. 1 is a schematic perspective view of a heat sink for a tablet pc according to the present invention;
fig. 2 is a front view of a heat sink for a tablet pc according to the present invention;
fig. 3 is a side view of a heat sink for a tablet pc according to the present invention;
fig. 4 is a rear view of the heat sink of the tablet pc according to the present invention;
fig. 5 is a front view of the heat absorbing base provided by the present invention;
fig. 6 is a schematic perspective view of the heat sink according to the present invention.
Detailed Description
In order to make the objects, contents and advantages of the present invention clearer, the following description will make a detailed description of embodiments of the present invention with reference to the accompanying drawings and examples.
As shown in fig. 1 to fig. 3, the present invention provides a heat sink for a tablet computer, especially a heat sink for cooling electronic components inside a tablet computer, comprising a heat absorption base 1, a heat pipe 2, a heat sink 3, and a fan 4.
The heat absorption base 1 is made of copper materials and is fixedly connected with a mainboard inside the tablet computer, and heat conduction silicone grease is coated between the heat absorption base 1 and heating electronic components (such as chip devices of a CPU, a north bridge and a south bridge) on the mainboard.
The shell of the heat pipe 2 is made of copper materials and comprises a heat absorption end and a heat generation end which are connected with each other; the heat absorbing end is fixedly connected with the heat absorbing base 1 through welding, and the heat emitting end is fixedly connected with the radiating fin 3 through welding.
As shown in fig. 6, the heat dissipation plate 3 is made of copper, has a size of 60mm × 22.2mm × 24.2mm, is formed by arranging a plurality of sheet-like heat dissipation fins in parallel, and is ventilated in the middle, and the heat dissipation plate 3 is welded and fixed integrally with the heat generation end of the heat pipe 2 through a Z-shaped multi-plane portion 3.1 arranged at the top and a U-shaped perforated multi-plane portion 3.3 arranged in the middle.
As shown in fig. 4, the fan 4 is a 6020 dc turbofan, which has a plurality of mounting holes 4.1, and the fan 4 can be mounted and fixed in the tablet pc through the mounting holes 4.1, and the outlet of the fan 4 is perpendicular to the heat-conducting surface of the heat sink 3, i.e., the largest surface of the sheet-like heat dissipating fin.
As shown in fig. 1 to 6, the method for using the tablet pc heat sink includes: the heat sink is integrally installed inside the tablet personal computer through a mounting hole 1.2 formed in a heat absorbing base 1 in the heat sink and a mounting fixing hole 4.1 formed in a fan 4 through screws, wherein the heat absorbing base 1 is located above a mainboard of the tablet personal computer (or below the mainboard according to different definitions of the front side and the back side of the mainboard), a heat radiating fin 3 is located at an air outlet of the tablet personal computer, and heat conducting silicone grease is coated between a plurality of bosses 1.1 on the heat absorbing base 1 and heating electronic components on the mainboard of the tablet personal computer.
In the working process of the tablet personal computer, a plurality of electronic components on the mainboard can generate heat, the surfaces of the heating electronic components are correspondingly contacted with a plurality of bosses 1.1 on the heat absorption base 1, and the heat can be conducted to the heat absorption base 1 through the heat conduction silicone grease;
because the heat absorption end of the heat pipe 2 is fixedly connected with the heat absorption base 1 by welding, heat is conducted to the heat absorption end of the heat pipe 2 from the heat absorption base 1, and then the heat is conducted to the heat emitting end through the heat absorption end of the heat pipe 2;
because the heating end of the heat pipe 2 is fixedly connected with the radiating fin 3 by welding, the heat is conducted to the radiating fin 3 from the heating end of the heat pipe 2;
finally, as the fan 4 is fixedly installed through the plurality of installation fixing holes 4.1, the air outlet of the fan 4 is perpendicular to the heat conducting surface of the heat sink 3, i.e. the largest surface of the sheet-shaped heat sink fin, and the air generated by the fan 4 flows to dissipate the heat on the heat sink 3 to the outside of the case of the tablet computer.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (9)
1. A flat computer radiator is characterized by comprising a heat absorption base (1), a heat pipe (2), a radiating fin (3) and a fan (4);
the heat absorption base (1) is fixedly connected with a mainboard inside the tablet personal computer, and heat conduction silicone grease is coated between the heat absorption base (1) and heating electronic components on the mainboard;
the shell of the heat pipe (2) is made of copper materials and comprises a heat absorption end and a heat generation end which are connected with each other; the heat absorbing end is fixedly connected with the heat absorbing base (1) by welding, and the heat emitting end is fixedly connected with the radiating fin (3) by welding;
the radiating fin (3) is formed by a plurality of sheet-shaped radiating fins which are arranged in parallel, and the middle part of the radiating fin can be ventilated;
the fan (4) is a direct-current turbine fan, a plurality of mounting and fixing holes (4.1) are formed in the fan, the fan (4) can be mounted and fixed inside the tablet personal computer through the mounting and fixing holes (4.1), and an air outlet of the fan (4) is perpendicular to a heat conduction surface of the radiating fin (3).
2. The heat sink for tablet personal computer according to claim 1, wherein the heat absorbing base (1) is made of copper.
3. The heat sink for tablet computers according to claim 1, characterized in that the heat sink (3) is copper material.
4. The tablet pc heat sink according to claim 1, wherein the fins (3) have a size of 60mm x 22.2mm x 24.2mm.
5. The tablet personal computer radiator as claimed in claim 1, wherein the radiating fins (3) are welded and fixed with the heating ends of the heat pipes (2) into a whole through Z-shaped multi-plane parts (3.1) arranged at the tops and U-shaped multi-plane parts (3.3) arranged in the middle.
6. The tablet personal computer radiator as claimed in claim 1, wherein the heat absorption base (1) is provided with a mounting hole (1.2), and the fan (4) is provided with a mounting fixing hole (4.1), so that the radiator can be integrally mounted in the tablet personal computer.
7. The tablet personal computer radiator as claimed in claim 1, wherein the heat absorbing base (1) is provided with a plurality of bosses (1.1), and heat-conducting silicone grease is coated between the plurality of bosses (1.1) and the heating electronic components on the tablet personal computer mainboard.
8. The tablet computer heat sink of claim 1, wherein the thermally conductive surface is the largest surface of the laminar heat sink fins.
9. The tablet pc heat sink of claim 1, wherein the heat generating electronic components comprise a CPU, a north-south bridge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222139994.8U CN218273305U (en) | 2022-08-15 | 2022-08-15 | Radiator for tablet computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222139994.8U CN218273305U (en) | 2022-08-15 | 2022-08-15 | Radiator for tablet computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218273305U true CN218273305U (en) | 2023-01-10 |
Family
ID=84775276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222139994.8U Active CN218273305U (en) | 2022-08-15 | 2022-08-15 | Radiator for tablet computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218273305U (en) |
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2022
- 2022-08-15 CN CN202222139994.8U patent/CN218273305U/en active Active
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