CN215526589U - An accelerated heat dissipation structure of a fanless industrial computer - Google Patents
An accelerated heat dissipation structure of a fanless industrial computer Download PDFInfo
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- CN215526589U CN215526589U CN202121923935.9U CN202121923935U CN215526589U CN 215526589 U CN215526589 U CN 215526589U CN 202121923935 U CN202121923935 U CN 202121923935U CN 215526589 U CN215526589 U CN 215526589U
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Abstract
本实用新型涉及一种无风扇工控机的加速散热结构，属于工控机技术领域，包括箱体，所述箱体上侧设置有散热板，所述箱体内部位于散热板下方的位置设置有线路板，所述线路板与散热板之间设置有导热垫板，所述散热板上靠近导热垫板的一侧开设有导热槽，所述导热槽内设置有与导热垫板贴合的导热条。本实用新型提供的无风扇工控机的加速散热结构通过在线路板与散热板之间设置导热垫板，其中导热垫板两侧分别设置第一导热板和第二导热板，线路板产生的热量依次通过第二导热板、导热垫板、第一导热板和导热条传递给散热板，最后通过散热板将热量传递到箱体外的环境中，散热结构整体采用无风扇结构，散热效果较好，实用性好。
The utility model relates to an accelerated heat dissipation structure of a fanless industrial computer, belonging to the technical field of industrial computers. A heat-conducting pad is arranged between the circuit board and the heat-dissipating plate, a heat-conducting groove is formed on the side of the heat-dissipating plate close to the heat-conducting plate, and a heat-conducting strip is arranged in the heat-conducting groove to fit the heat-conducting plate. . The accelerated heat dissipation structure of the fanless industrial computer provided by the utility model is through arranging a heat conduction pad between the circuit board and the heat dissipation plate, wherein a first heat conduction plate and a second heat conduction plate are respectively arranged on both sides of the heat conduction plate, and the heat generated by the circuit board The heat is transmitted to the heat dissipation plate through the second heat conduction plate, the heat conduction pad plate, the first heat conduction plate and the heat conduction strip in turn, and finally the heat is transferred to the environment outside the box through the heat dissipation plate. The heat dissipation structure adopts a fanless structure as a whole, and the heat dissipation effect is better. , good practicality.
Description
Technical Field
The utility model relates to an accelerated heat dissipation structure of a fan-free industrial personal computer, and belongs to the technical field of industrial personal computers.
Background
An Industrial Personal Computer (IPC), i.e. an Industrial control Computer, is a general name of tools for detecting and controlling a production process, electromechanical equipment and process equipment by adopting a bus structure, and has important Computer attributes and characteristics, such as a Computer CPU, a hard disk, a memory, peripherals and an IO interface, an operating system, a control network and a protocol, computing power and a friendly human-Computer interface.
The industrial personal computer is a common control device, and generally comprises a case, a circuit board (also called a mainboard) in the case and various functional modules, wherein a CPU processing module is generally arranged on the circuit board, and the CPU processing module generates a large amount of heat during working, so that heat dissipation processing of a CPU processor is required. The traditional processing mode is that a fan is arranged on a CPU processor for heat dissipation, but the working of the heat dissipation fan can generate large noise and vibration, and the normal operation of other modules in the industrial personal computer is influenced. And for some industrial personal computers with small volume and compact space, the fan structure can occupy larger internal space of the case. Therefore, it is of great significance to design a heat dissipation structure which can replace a fan and has a good heat dissipation effect.
Disclosure of Invention
Therefore, the utility model provides an accelerated heat dissipation structure of a fan-free industrial personal computer, which is characterized in that a heat conduction base plate and a heat conduction strip are arranged between a circuit board and a heat dissipation plate, so that heat dissipation is carried out on the circuit board and modules on the circuit board. In order to achieve the above purpose, the utility model provides the following technical scheme:
an accelerated heat dissipation structure of a fan-free industrial personal computer comprises a box body, wherein a heat dissipation plate is arranged on the upper side of the box body, a circuit board is arranged in the box body and is positioned below the heat dissipation plate, a heat conduction base plate is arranged between the circuit board and the heat dissipation plate, one side, close to the heat conduction base plate, of the heat dissipation plate is provided with a heat conduction groove, and a heat conduction strip attached to the heat conduction base plate is arranged in the heat conduction groove; a first padding plate groove is formed in one side, close to the heat conducting strips, of the heat conducting padding plate, and a first heat conducting plate attached to the heat conducting strips is arranged in the first padding plate groove; one side that is close to the circuit board on the heat conduction backing plate is provided with the second backing plate groove, the second backing plate inslot is provided with the second heat-conducting plate with the circuit board laminating.
As an improvement of the scheme, the number of the heat conducting grooves is two, and a heat conducting strip is arranged in each heat conducting groove.
As an improvement of the above solution, the two heat conduction grooves on the heat dissipation plate are arranged in an inclined manner, and the range of the inclination angle θ is as follows: theta is more than 0 and less than or equal to 30 degrees.
As an improvement of the above scheme, a fixing piece for pressing the heat conducting strip is arranged on the heat radiating plate.
As an improvement of the scheme, a plurality of radiating fins are uniformly distributed on one side of the radiating plate, which is far away from the heat conducting base plate.
As an improvement of the scheme, the heat conducting strip, the first heat conducting plate and the second heat conducting plate are all made of copper materials.
As an improvement of the scheme, a plurality of first notches are formed in the edge of the first base plate groove, and a plurality of second notches are formed in the edge of the second base plate groove.
As an improvement of the scheme, the first heat conducting plate is provided with a plurality of heat conducting plate mounting holes connected with the heat conducting base plate.
As an improvement of the scheme, the heat conducting base plate is provided with base plate mounting feet, base plate mounting holes are formed in the base plate mounting feet, and the circuit board is provided with a plurality of circuit board through holes matched with the base plate mounting holes.
As an improvement of the scheme, a soft stop block is arranged between the circuit board and the heat dissipation plate.
According to the accelerated heat dissipation structure of the fan-free industrial personal computer, the heat conduction base plate is arranged between the circuit board and the heat dissipation plate, the first heat conduction plate and the second heat conduction plate are respectively arranged on two sides of the heat conduction base plate, the heat conduction strip attached to the first heat conduction plate is arranged on the heat dissipation plate, when the circuit board and a CPU (central processing unit) on the circuit board work, generated heat is transmitted to the heat dissipation plate through the second heat conduction plate, the heat conduction base plate, the first heat conduction plate and the heat conduction strip in sequence, and finally the heat is transmitted to the environment outside the box body through the heat dissipation plate.
Drawings
FIG. 1 is a schematic diagram of an external structure of a box body of an accelerated heat dissipation structure of a fan-free industrial personal computer;
FIG. 2 is a schematic diagram of the internal structure of a box body of an accelerated heat dissipation structure of a fan-free industrial personal computer;
FIG. 3 is a schematic view of the installation position of a heat conduction base plate of an accelerated heat dissipation structure of a fanless industrial personal computer;
FIG. 4 is a schematic view of the installation position of a heat conducting strip of an accelerated heat dissipation structure of a fanless industrial personal computer;
FIG. 5 is a schematic view of a heat conduction base plate of an accelerated heat dissipation structure of a fanless industrial personal computer, as viewed from the side where a first heat conduction plate is located;
FIG. 6 is a schematic view of a heat conduction pad of an accelerated heat dissipation structure of a fanless industrial personal computer, as viewed from the side of a second heat conduction plate.
In the figure: 10-case, 20-heat sink, 21-heat sink, 22-heat conduction groove, 23-heat conduction bar, 24-fixing piece, 30-bottom plate, 31-bottom plate installation hole, 40-joint side plate, 50-circuit board, 51-CPU processor, 52-joint, 53-soft stop, 60-heat conduction base plate, 61-first base plate groove, 62-first heat conduction plate, 63-base plate installation pin, 64-second base plate groove, 65-second heat conduction plate, 501-circuit board through hole, 611-first notch, 621-heat conduction plate installation hole, 631-base plate installation hole, 641-second notch.
Detailed Description
The present invention is described in terms of particular embodiments, other advantages and features of the utility model will become apparent to those skilled in the art from the following disclosure, and it is to be understood that the described embodiments are merely exemplary of the utility model and that it is not intended to limit the utility model to the particular embodiments disclosed. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the present specification, the terms "upper", "lower", "inner" and "outer" are used for clarity of description only, and are not intended to limit the scope of the present invention, and changes or modifications in the relative relationship therebetween may be made without substantial changes in the technical content.
In the description of the embodiments that follow, unless explicitly stated or limited otherwise, the terms "disposed," "connected," and the like are to be construed broadly and include, for example, "connected" that may be either fixedly connected or detachably connected, or integrally formed; may be a mechanical, plumbing, or electrical connection, may be indirectly connected through intervening media, may be internal to two elements, or may be in an interactive relationship with two elements, unless expressly defined otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
As shown in fig. 1, 2, 5 and 6, the utility model provides an accelerated heat dissipation structure of a fanless industrial personal computer, which comprises a box body 10, wherein a heat dissipation plate 20 is arranged on the upper side of the box body 10, a circuit board 50 is arranged in the box body 10 and below the heat dissipation plate 20, a heat conduction pad 60 is arranged between the circuit board 50 and the heat dissipation plate 20, a heat conduction groove 22 is arranged on one side of the heat dissipation plate 20 close to the heat conduction pad 60, and a heat conduction strip 23 attached to the heat conduction pad 60 is arranged in the heat conduction groove 22; a first cushion plate groove 61 is formed in one side, close to the heat conducting strips 23, of the heat conducting cushion plate 60, and a first heat conducting plate 62 attached to the heat conducting strips 23 is arranged in the first cushion plate groove 61; a second pad groove 64 is formed in the side of the heat conducting pad 60 close to the circuit board 50, and a second heat conducting plate 65 attached to the circuit board 50 is arranged in the second pad groove 64.
The heat conductive pad 60 may be directly connected to a module with a higher calorific value on the circuit board 50, for example, the heat conductive pad 60 may be closely attached to the CPU 51 on the circuit board 50, so that heat generated by the CPU 51 during operation can be transferred to the heat dissipation plate 20 through the heat conductive pad 60. The two sides of the heat conducting base plate 60 are respectively provided with a first base plate groove 61 and a second base plate groove 64, and the first base plate groove 61 and the second base plate groove 64 are respectively provided with a first heat conducting plate 62 and a second heat conducting plate 65. The second heat conducting plate 65 can firstly transfer the heat generated by the CPU processor 51 to the heat conducting base plate 60, and the second heat conducting plate 65 can be replaced correspondingly in order to adapt to CPU processors 51 with different specifications; the heat is then transferred to the first heat conductive plate 62 through the heat conductive pad 60, and the first heat conductive plate 62 transfers the heat to the heat dissipation plate 20. In order to improve the efficiency of the first heat conduction plate 62 for transferring heat to the heat dissipation plate 20, the heat conduction groove 22 may be formed in the heat dissipation plate 20, the heat conduction bar 23 attached to the heat conduction pad 60 and the first heat conduction plate 62 on the heat conduction pad 60 is disposed in the heat conduction groove 22, and the heat conduction bar 23 rapidly transfers heat to other regions of the heat dissipation plate 20 along the heat conduction groove 22.
In order to facilitate the installation and replacement of the first heat conducting plate 62 and the second heat conducting plate 65 in the first padding plate groove 61 and the second padding plate groove 64, a plurality of first notches 611 may be formed in the edge of the first padding plate groove 61, and a plurality of second notches 641 may be formed in the edge of the second padding plate groove 64, so that when the first heat conducting plate 62 and the second heat conducting plate 65 need to be taken out, one end of the first heat conducting plate 62 and one end of the second heat conducting plate 65 may be easily lifted up through the first notches 611 and the second notches 641, thereby conveniently taking out the first heat conducting plate 62 and the second heat conducting plate 65.
As shown in fig. 3, in order to improve the firmness of the first heat-conducting plate 62 disposed in the first pad groove 61 of the heat-conducting pad 60, a plurality of heat-conducting plate mounting holes 621 connected to the heat-conducting pad 60 may be formed in the first heat-conducting plate 62, and the first heat-conducting plate 62 may be fixed by fastening screws penetrating through the heat-conducting plate mounting holes 621. Second heat-conducting plate 65 is in the one side that is close to circuit board 50, fastness when in actual installation in order to improve the installation of second heat-conducting plate 65, can set up backing plate installation foot 63 on heat conduction backing plate 60, set up backing plate mounting hole 631 on the backing plate installation foot 63, be provided with a plurality ofly on the circuit board 50 with backing plate mounting hole 631 complex circuit board through-hole 501, pass through fastening bolt connection backing plate mounting hole 631 and circuit board through-hole 501 during the installation, can be fixed heat conduction backing plate 60 to circuit board 50 on, because second heat-conducting plate 65 is located between heat conduction backing plate 60 and the circuit board 50, consequently, after heat conduction backing plate 60 is fixed to circuit board 50, second heat-conducting plate 65 will also be in fixed state. In order to improve the reliability of the heat conductive pad 60 between the circuit board 50 and the heat sink 20 after mounting, a soft stopper 53 may be provided between the circuit board 50 and the heat sink 20, and the soft stopper 53 may flexibly support the circuit board 50 and the heat sink 20.
In the above scheme, as shown in fig. 4, the number of the heat conduction grooves 22 is two, the heat conduction strips 23 are arranged in each heat conduction groove 22, and the heat transfer efficiency of the heat conduction pad 60 and the first heat conduction plate 62 on the heat conduction pad 60 after contacting the heat conduction strips 23 can be improved by using a plurality of heat conduction strips 23. In order to firmly arrange the heat conducting strip 23 in the heat conducting groove 22, fixing pieces 24 for pressing the heat conducting strip 23 may be arranged on the heat dissipating plate 20, the fixing pieces 24 are installed outside the heat conducting groove 22 of the heat dissipating plate 20, and the number of the fixing pieces 24 may be adjusted according to the length of the heat conducting strip 23.
Further, the two heat conduction grooves 22 of the heat dissipation plate 20 may be inclined, and the inclination angle θ may be in the range: theta is more than 0 and less than or equal to 30 degrees. In this embodiment, the heat-conducting groove 22 is obliquely formed, so that the heat-conducting strip 23 in the heat-conducting groove 22 is also obliquely formed, thereby improving the heat transfer efficiency of the heat-conducting strip 23 on the surface of the heat-dissipating plate 20.
In order to improve the heat conduction performance, the heat conduction bar 23, the first heat conduction plate 62 and the second heat conduction plate 65 may be made of copper material with better heat conduction, the heat conduction pad 60 may be made of aluminum material, and the heat dissipation plate 20 may be made of copper-aluminum alloy or aluminum alloy material. The plurality of radiating fins 21 are uniformly distributed on the side of the radiating plate 20 away from the heat conducting base plate 60, and the radiating area of the radiating plate 20 is increased by the plurality of radiating fins 21, so that the radiating efficiency is further improved.
The case 10 is provided at upper and lower sides thereof with a heat dissipation plate 20 and a base plate 30, respectively, and the circuit board 50 is positioned between the heat dissipation plate 20 and the base plate 30. A joint side plate 40 is arranged on one side of the box body 10, a joint 52 used for being connected with the circuit board 50 is arranged on the joint side plate 40, and the joint 52 can be connected with a power line, a signal transmission line and other lines, so that normal operation of all functions of the industrial personal computer is ensured. The outer side of the bottom plate 30 under the box 10 is provided with a bottom plate mounting hole 31, and the box 10 can be fixed on the corresponding mounting surface through the bottom plate mounting hole 31 on the bottom plate 30.
Although the present invention has been described in detail hereinabove with reference to the general description and the specific embodiments, it will be apparent to those skilled in the art that modifications and improvements can be made to the embodiments of the present invention. Accordingly, such modifications and improvements are intended to be within the scope of the utility model as claimed.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121923935.9U CN215526589U (en) | 2021-08-17 | 2021-08-17 | An accelerated heat dissipation structure of a fanless industrial computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121923935.9U CN215526589U (en) | 2021-08-17 | 2021-08-17 | An accelerated heat dissipation structure of a fanless industrial computer |
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| Publication Number | Publication Date |
|---|---|
| CN215526589U true CN215526589U (en) | 2022-01-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121923935.9U Expired - Fee Related CN215526589U (en) | 2021-08-17 | 2021-08-17 | An accelerated heat dissipation structure of a fanless industrial computer |
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| CN (1) | CN215526589U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115657823A (en) * | 2022-10-31 | 2023-01-31 | 广东虹勤通讯技术有限公司 | Notebook Cooling Module |
| CN121704662A (en) * | 2025-12-20 | 2026-03-20 | 苏州海特自动化设备有限公司 | Fanless industrial personal computer |
-
2021
- 2021-08-17 CN CN202121923935.9U patent/CN215526589U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115657823A (en) * | 2022-10-31 | 2023-01-31 | 广东虹勤通讯技术有限公司 | Notebook Cooling Module |
| CN121704662A (en) * | 2025-12-20 | 2026-03-20 | 苏州海特自动化设备有限公司 | Fanless industrial personal computer |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220114 |