CN216748588U - Heat energy storage module applied to notebook computer - Google Patents
Heat energy storage module applied to notebook computer Download PDFInfo
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- CN216748588U CN216748588U CN202122927449.0U CN202122927449U CN216748588U CN 216748588 U CN216748588 U CN 216748588U CN 202122927449 U CN202122927449 U CN 202122927449U CN 216748588 U CN216748588 U CN 216748588U
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Abstract
The utility model relates to a be applied to notebook computer's heat energy storage module, this notebook computer is inside to be equipped with an at least circuit board, has an at least heating element on this circuit board, and heat energy storage module includes: at least one abutting metal sheet abutting and positioned on the upper surface of the heating element; at least one heat pipe, one end of which is connected and assembled with the abutting metal sheet; and the liquid tank is assembled at the other end of the heat pipe, a cooling liquid is stored in the liquid tank, the cooling liquid receives the heat energy transmitted by the heat pipe through the liquid tank and stores the heat energy, and the heat energy stored in the cooling liquid can be naturally radiated in the notebook computer.
Description
Technical Field
The present invention relates to a heat storage module for a notebook computer, and more particularly to a closed heat storage module formed by attaching a metal plate, a heat pipe and a liquid tank, which can increase the heat energy accumulated by a heating element such as a cpu when the operating frequency is increased in a peak period (e.g., performing a complicated operation game, a complicated video-audio shift or high-level drawing), and transmit the heat energy to the liquid tank through the metal plate and the heat pipe, and continuously store the heat energy through a cooling liquid.
Background
In order to meet the requirements of various electronic operations, internet browsing, information query, video appreciation and drawing operations, Personal Computers (PCs), Notebook computers (notebooks), tablet computers (Table PCs) and Industrial computers (Industrial computers) are all types of computers manufactured according to different applications of various types, and computers have become indispensable electronic products in life.
Notebook computers are also mainstream computers because they have portability and performance close to personal computers, and a Central Processing Unit (CPU), a north bridge Chip (Northbridge), a Graphics Processing Unit (GPU) or a System On a Chip (SOC) integrating the above chips are all chips for processing electronic signals at high speed, and these chips become the largest heat sources for computer processing operations. In order to quickly dissipate the heat generated by various chips of the motherboard during high-speed operation and maintain the chips in normal operation for a long time, most of the conventional heat dissipation methods are mainly air-cooled. The air-cooled Heat dissipation module directly abuts against the upper surface of the chip by using a Heat Sink (Heat Sink) so as to conduct the Heat energy of the chip to the Heat Sink, and then, in cooperation with the cooling airflow provided by the Heat dissipation fan arranged between the surfaces C, D of the notebook computer, the Heat energy generated by the chip absorbed by the Heat Sink during high-speed operation is blown to the air outlet by the cooling airflow and is transmitted to the outside, so as to achieve the air-cooled Heat dissipation effect.
The air-cooled heat dissipation module utilizes the airflow of the fan to discharge the hot air in the notebook computer to the outside so as to achieve the purpose of heat dissipation. However, for a narrow space inside the notebook computer, the heat sink is locked above the chip and the fan is further locked above the heat sink, the heat dissipation structure occupies too much space, the rotation speed of the fan is increased to dissipate heat along with the temperature rise of the chip, the generated wind-cut noise is increased, and after a large amount of heat energy is absorbed by cooling airflow, when the air inlet or the air outlet is blocked to prevent the cooling airflow from being smooth, the working temperature inside the notebook computer is easily over high, and once the chip or other high-temperature elements exceed the normal working temperature, the system is lowered in frequency or the system is shut down, which is a possible problem of an air-cooled heat dissipation module.
The conventional desktop computer has a large accommodation space enough to install a water-cooled Heat dissipation module, and utilizes a Heat conduction device (Thermal Contact) to Contact with the upper surface of a chip (commonly called a water-cooled head), and a cooling pipeline (Coolant Pipe) to correspondingly connect the Heat conduction device and an internal pipeline of a Heat exchanger (Heat Transfer) (commonly called a water-cooled drain), so that Heat energy is conducted to the Heat exchanger through cooling liquid inside the cooling pipeline, thereby forming a water-cooled Heat dissipation structure. However, the heat exchanger must increase the cooling effect of the water flow by the large area of the heat dissipation fins and the cooling air flow of the fan. The water cooling and heat dissipating module is suitable for a desktop computer, but is not suitable for a notebook computer.
In addition, some notebook computers are designed with low-power and low-heat central processing units for only performing document processing or web page browsing functions, and such notebook computers do not need to be designed with fans for air cooling, but the central processing unit in the fan-less computer still needs to transfer heat energy to a heat dissipation metal block through a heat pipe for heat dissipation. Or the heat pipe design is omitted and the heat dissipation metal block is directly contacted with the central processing unit for heat dissipation, but the heat dissipation structure is carried out by the energy storage of the heat dissipation metal block. Please refer to fig. 4, which is a graph of performance/time line of the conventional heat dissipation through the heat dissipation metal block, the performance of the conventional computer system gradually increases from small to large (PL1 → PL2 → PL3) in three stages, but the corresponding conventional heat storage regions (I1, I2, I3) do not increase, so that the heat energy storage is limited, and the heat dissipation performance is not good. Therefore, how to design an effective water-cooling heat dissipation structure for a smaller internal space of a notebook computer is an urgent objective of the present industry.
SUMMERY OF THE UTILITY MODEL
Therefore, in view of the above problems and disadvantages, the present invention provides a heat storage module for a notebook computer, which is designed by collecting relevant data and evaluating and considering the data in multiple ways.
A primary object of the present invention is to provide a heat energy storage module for a notebook computer, wherein at least one circuit board is disposed inside the notebook computer, and at least one heating element is disposed on the circuit board, and the heat energy storage module comprises: at least one sticking metal sheet sticking and positioning on the upper surface of the heating element; at least one heat pipe, one end of which is connected and assembled with the abutting metal sheet; and the liquid tank is assembled at the other end of the heat pipe, a cooling liquid is stored in the liquid tank, the cooling liquid receives the heat energy transmitted by the heat pipe through the liquid tank and stores the heat energy, and the heat energy stored in the cooling liquid can naturally dissipate heat in the notebook computer. The closed heat energy storage module formed by the sticking metal sheet, the heat pipe and the liquid groove can greatly increase the heat energy accumulated by the heating element when the operation frequency of the heating element such as a central processing unit is increased in a peak time period (for example, complex operation games, complex video and audio conversion or high-order drawing is carried out), the heat energy is transmitted to the liquid groove through the sticking metal sheet and the heat pipe and is continuously stored by cooling liquid, the heat energy transmitted to the liquid groove is greatly reduced after the heating element such as the central processing unit passes the peak time period, the cooling liquid in the liquid groove can be naturally radiated by the inside of the notebook computer and gradually reduced to the original temperature, and the heat storage effect can be generated in the next peak time period.
Another objective of the present invention is to provide a frame plate between the abutting metal sheet and the liquid tank, and the frame plate abuts against the bottom side of the heat pipe to form a stable assembly structure positioned on the circuit board.
It is still another object of the present invention that the cooling fluid is composed of pure water or a water-cooling fluid of a composite component.
Another object of the present invention is to provide a heat pipe having a connection with an expansion module, wherein the expansion module includes an expansion heat pipe abutting against the heat pipe and being bent in a flat shape, and an expansion abutting metal sheet is disposed at one side of the expansion heat pipe, and the bottom side of the expansion abutting metal sheet abuts against the upper surface of another heating element.
In an embodiment of the present invention, the heat pipe is a flat bent structure.
In an embodiment of the present invention, the heating element is a cpu, a north bridge chip, a graphics chip or a system on a chip.
Drawings
Fig. 1 is a perspective view of the thermal energy storage module of the present invention.
Fig. 2 is an exploded perspective view of the thermal energy storage module of the present invention.
Fig. 3 is a perspective exploded view of another perspective of the thermal energy storage module of the present invention.
Fig. 4 is a diagram of the performance/time line of the conventional heat dissipation through the heat dissipation metal block.
Fig. 5 is a graph of the thermal performance/time line of the heat dissipation of the thermal energy storage module of the present invention.
Description of reference numerals: 1-sticking metal sheets; 2-a heating element; 3-a heat pipe; 4-a liquid tank; 5-frame plate; 6-an expansion module; 61-expanding heat pipes; 62-expanding the abutting metal sheet; i1, I2, I3 — existing thermal storage section; i4, I5 and I6-the heat storage interval of the scheme; PL1, PL2, PL 3-existing computer system performance; PL4, PL5, PL 6-the performance of the computer system of this document.
Detailed Description
To achieve the above objects and advantages, the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Please refer to fig. 1 to 3, which are a three-dimensional external view of the thermal energy storage module, a three-dimensional exploded view of the thermal energy storage module, and a three-dimensional exploded view of another view angle of the thermal energy storage module of the present invention, at least one circuit board (not shown) is disposed inside the notebook computer (not shown), at least one heating element is disposed on the circuit board, and it can be clearly seen from the drawings that the thermal energy storage module of the present invention mainly comprises: the metal sheet 1, the heating element 2, the heat pipe 3 and the liquid tank 4 are abutted, and the connection relationship and the detailed structure of each element are as follows:
at least one abutting metal sheet 1 abutting and positioned on the upper surface of the heating element 2.
At least one heat pipe 3, one end of which is connected and assembled with the abutting metal sheet 1, the heat pipe 3 is a flat bending structure, and the skilled person can also use a strip-shaped metal plate (the material can be copper, aluminum, iron) or a pipe body with cooling liquid inside to replace the heat pipe 3 without being limited by the heat conduction material which is filled in the pipe body and can generate liquid and vapor phase changes, and the simple change implementing structure should be included in the protection scope of the utility model.
The liquid tank 4 is assembled at the other end of the heat pipe 3, a cooling liquid (not shown) is stored in the liquid tank 4, the cooling liquid receives the heat energy transmitted by the heat pipe 3 through the liquid tank 4 and stores the heat energy, the heat energy stored in the cooling liquid can be naturally dissipated in the notebook computer, and the cooling liquid is composed of pure water or water cooling liquid with composite components.
A frame plate 5 is disposed between the abutting metal sheet 1 and the liquid tank 4, and the frame plate 5 abuts against the bottom side of the heat pipe 3 to form a stable assembly structure positioned on the circuit board.
The heating element 2 refers to a Central Processing Unit (CPU), a north bridge Chip (Northbridge), a Graphics Processing Unit (GPU), or a System On a Chip (SOC).
The heat pipe 3 is further connected to an expansion module 6, the expansion module 6 includes an expansion heat pipe 61 which is located against the heat pipe 3 and is in a flat bending shape, and an expansion abutting metal sheet 62 is disposed at an end portion of the expansion heat pipe 61 extending to one side, and a bottom side of the expansion abutting metal sheet 62 abuts against an upper surface of another heating element (not shown).
The utility model discloses when heat energy storage module assembles in notebook computer, this notebook computer is inside to be equipped with an at least circuit board, has at least one heating element 2 on this circuit board, and the heating element 2 that needs to cool down includes central processing unit, north bridge chip, drawing chip or the system single-chip with aforementioned chip integration, and Power component (Power Components) that can produce the high temperature even also can implement the within range. When assembling, firstly, the positions of the heating element 2 and the liquid groove 4 which can be placed on the circuit board are found, the distance between the heating element 2 and the liquid groove 4 is measured, then the heat pipe 3 is cut to a proper length according to the distance, and the heat pipe needs to be bent according to the position of the element necessary for evading, then the heat pipe 3 and the abutting metal sheet 1 and the liquid groove 4 are fixed, in addition, a frame plate 5 is arranged between the abutting metal sheet 1 and the liquid groove 4, and the frame plate 5 is abutted against the bottom side of the heat pipe 3, the assembled heat energy storage module can be fixed with the circuit board, after the top surface of the heating element 2 is coated with heat dissipation paste or phase change material, the abutting metal sheet 1 can be attached to the top surface of the heating element 2, and then the liquid groove 4 and the frame plate 5 are fixed on the circuit board by utilizing a locking or adhering mode, and the basic assembly of the heat energy storage module is completed. If the other heating elements 2 on the circuit board are to be cooled together, the expansion module 6 is needed to be used for implementation, and the specific method is that the cooling paste or the phase change material is coated on the top surface of the other heating element 2, then the expansion abutting metal sheet 62 is used for being adhered on the top surface of the other heating element 2, and the expansion heat pipe 61 connected and extended on one side of the expansion abutting metal sheet 62 is abutted and positioned on one side of the original heat pipe 3, so that the heat energy absorbed by the expansion heat pipe 61 can be transferred to the heat pipe 3 and then transferred to the liquid tank 4 for heat storage and cooling, and the expansion structure of the cooling storage module is completed through the above.
The utility model discloses a main technical characterized in that: the closed heat energy storage module formed by the abutting metal sheet 1, the heat pipe 3 and the liquid groove 4 can greatly increase the heat energy accumulated by the heating element 2 when the operation frequency of the heating element 2 such as a central processing unit is increased in a peak time period (Rush Hour) (for example, complex operation games, complex video and audio conversion or high-level drawing are executed), the heat energy is transmitted to the liquid groove 4 through the abutting metal sheet 1 and the heat pipe 3 and is continuously stored by the cooling liquid, after the heating element 2 such as the central processing unit passes the peak time period, the heat energy transmitted to the liquid groove 4 is greatly reduced, the cooling liquid in the liquid groove 4 can naturally dissipate heat through the inside of the notebook computer, the temperature is gradually reduced to the original temperature, and the heat storage function can be carried out in the next peak time period. Please refer to fig. 5, which is a graph of performance/time line of the heat dissipation of the heat storage module of the present invention, along with the three stages of performance of the computer system gradually increasing from small to large (PL4 → PL5 → PL6), the corresponding heat storage sections (I4, I5, I6) of the present invention are about three times as large as the existing heat storage sections (I1, I2, I3) disclosed in fig. 4, so that the heat storage module can store about three times as large as the existing heat storage sections, and through the comparison results of fig. 4 and 5, it can be known that the heat storage module of the present invention has a better heat storage effect and longer heat storage time compared with the existing heat dissipation structure using heat dissipation metal block for energy storage. Simultaneously the utility model discloses occupation space is minimum when applying to notebook computer inside, but it can exert the radiating effect but not inferior to current circulating water-cooling system of computer, also can be applied to among the notebook computer of no fan design simultaneously.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention, and not for the purpose of limiting the scope of the present invention, so that the simple modifications and equivalent structural changes made by the contents of the specification and drawings should be similarly included in the scope of the present invention.
To sum up, the heat energy storage module applied to the notebook computer of the present invention is able to achieve its function and purpose when in use.
Claims (6)
1. The utility model provides a be applied to thermal energy storage module of notebook computer, this notebook computer is inside to be equipped with at least a circuit board, has at least one heating element on this circuit board, its characterized in that, thermal energy storage module includes:
at least one abutting metal sheet abutting and positioned on the upper surface of the heating element;
at least one heat pipe, one end of which is connected and assembled with the abutting metal sheet; and
and the liquid tank is assembled at the other end of the heat pipe, a cooling liquid is stored in the liquid tank, the cooling liquid receives the heat energy transmitted by the heat pipe through the liquid tank and stores the heat energy, and the heat energy stored in the cooling liquid can naturally dissipate heat in the notebook computer.
2. The thermal energy storage module of claim 1, wherein a frame plate is disposed between the abutting metal sheet and the liquid tank, and the frame plate abuts against the bottom side of the heat pipe to form a stable assembly structure positioned on the circuit board.
3. The thermal energy storage module of claim 1, wherein the cooling fluid is pure water or a composite water cooling fluid.
4. The thermal energy storage module of claim 1, wherein the heat pipe is further connected to an expansion module, the expansion module comprises an expansion heat pipe which is positioned against the heat pipe and is bent in a flat shape, and an expansion abutting metal sheet is disposed at an end of the expansion heat pipe extending to one side, and a bottom side of the expansion abutting metal sheet abuts against an upper surface of another heating element.
5. The thermal energy storage module of claim 1, wherein the heat pipe is a flat bent structure.
6. The thermal energy storage module of claim 1, wherein the heat generating component is a CPU, a north bridge chip, a graphics chip or a system-on-a-chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122927449.0U CN216748588U (en) | 2021-11-24 | 2021-11-24 | Heat energy storage module applied to notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122927449.0U CN216748588U (en) | 2021-11-24 | 2021-11-24 | Heat energy storage module applied to notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216748588U true CN216748588U (en) | 2022-06-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122927449.0U Active CN216748588U (en) | 2021-11-24 | 2021-11-24 | Heat energy storage module applied to notebook computer |
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| Country | Link |
|---|---|
| CN (1) | CN216748588U (en) |
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2021
- 2021-11-24 CN CN202122927449.0U patent/CN216748588U/en active Active
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