1325754 070365.TW 24547twf.doc/n 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種散熱模組，且特別是有關於一種 對於多個位於電路板（circuit board )上的發熱元件 (heat-generating element)進行散熱的散熱模組。 【先前技術】1325754 070365.TW 24547twf.doc/n IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipation module, and more particularly to a plurality of heats on a circuit board A heat-generating element that dissipates heat. [Prior Art]
電腦在操作使用的過程中，電腦之運算元件皆會產生 相冨的熱里。其中’中央處理早元（central processing unit, CPU)因為經常用以提供數量極為龐大的運算功能，而使 其所產生的熱量極為可觀。因此，中央處理單元通常會配 備有（in company with)散熱裝置。 另外，隨著科技的進步，電腦中之其他晶片如影像圖 形陣列晶片（video graphic array chip，VGA 之運算 功能也大幅提升，以使其可提供更強A的運算功能。也^During the operation of the computer, the computing components of the computer will produce a relative heat. Among them, the central processing unit (CPU) is often used to provide a very large number of computing functions, so that the heat generated by it is extremely impressive. Therefore, the central processing unit is usually equipped with a heat sink in the company. In addition, with the advancement of technology, other chips in the computer, such as the video graphics array chip (video graphics array chip, VGA computing function is also greatly improved, so that it can provide a stronger A computing function. Also ^
此’目前電腦中部分運算功能較為強大的晶片也會配備有 獨立的散熱裝置》 值得注意的是，在筆記型電腦（nQteb 他!攜式電子裝置中’除了中央處理單Μ外的晶片^常 =配備有獨立·熱裝置，以維持其輕薄短= =能較為強大的晶片提供散熱的功能== 6 1325754 070365.TW 24547twf.doc/n 【發明内容】 本發明提供一種散熱模組，以使其可對多個發熱元件 提供散熱的功能。 本發明提出一種散熱模組，適於組裝於一電路板以及 一蓋體（cover )之間。電路板具有一第一發熱元件 (heat-generating element)以及至少一第二發熱元件，且 第一發熱元件的發熱功率（heat generation rate )大於第二This 'currently some of the more powerful chips in the computer will also be equipped with independent heat sinks.' It is worth noting that in the notebook computer (nQteb he! portable electronic device 'in addition to the central processing unit of the wafer ^ often = equipped with an independent thermal device to maintain its light and thin short = = a more powerful chip to provide heat dissipation function == 6 1325754 070365.TW 24547twf.doc/n [Invention] The present invention provides a heat dissipation module to enable The utility model provides a heat dissipation function for a plurality of heating elements. The invention provides a heat dissipation module suitable for being assembled between a circuit board and a cover. The circuit board has a first heat generating element (heat-generating element) And at least one second heating element, and the heat generation rate of the first heating element is greater than the second
發熱元件的發熱功率。散熱模組包括一導熱連接件 (heat-transferring connection element )、一冷卻裝置 (cooling device )、一第一導熱件（heat-transferring element)、至少一第二導熱件、至少一彈性件（也切匕 element)以及至少一導電緩衝體（conductive buffer)。導 熱連接件之一端連接於冷卻裝置’而其另一端連接於第一 導熱件與第一發熱元件之間。第一導熱件對應於第一發熱 元件。第二導熱件對應於第二發熱元件，並位於冷卻 與第一導熱件之間。彈性件之一端連接於第一導熱件，而 其另一端對應於第二導熱件。導電緩衝體配置於蓋體上。 當散熱模組組裝於蓋體與電路板之間時，導電緩衝體接觸 彈性件，以使彈性件接觸第二導熱件，進而使導熱連接件 連接於第二導熱件與第二發熱元件之間。 在本發明之一實施例中，上述之冷卻裝置包括一散熱 鰭片（fin)以及一風扇（fan)。散熱鰭片連接於導熱連接 件之一端。風扇適於提供一冷卻氣流以冷卻散執妹片。 在本發明之-實施例中，上述之第—導熱括1 7 1325754 070365.TW 24547twf.doc/n 一導熱片（heat-transferring plate)以及一框架（frame)。 弟‘熱片配置於導熱連接件與第一發熱元件之間。框架 連接於電路板，以將導熱連接件與第一導熱片固定於框架 與第一發熱元件之間。 在本發明之一實施例中，上述之第一導熱件更包括多 個螺栓’且框架藉由螺栓鎖固於電路板。 在本發明之一實施例中，上述之第一導熱件更包括一 配置於第一導熱片與第一發熱元件之間的熱傳介質 (thermal conducting medium )。 在本發明之一實施例中，上述之熱傳介質為導熱膏 (thermal grease ) 〇 在本發明之一實施例中’上述之彈性件與框架一體成 形（formed integrally )。 在本發明之一實施例中，上述之第一導熱片之材質包 括鋼。 在本發明之一實施例中’上述之第二導熱件包括—第 —導熱片以及一連接蓋（connecting cover)。第二導熱片 配置於導熱連接件與第二發熱元件之間。導熱連接件^置 於連接蓋與第二導熱片之間。 在本發明之一實施例中’上述之第二導熱片具有—折 彎部’且當散熱模组組裝於蓋體與電路板之間時了彈性件 接觸折彎部。 在本發明之一實施例中’上述之第二導熱件更包括一 配置於第二導熱片與第二發熱元件之間的熱傳介質。 8 1325754 070365.TW 24547twf.doc/n 在本發明之一實施例中，上述之熱傳介質為導熱膏。 在本發明之一實施例中，上述之第二導熱片之材質包 括銘。 在本發明之一實施例中，上述之第一導熱件之材質包 括導電材質（conductivematerial)，且第一導熱件透過電 路板接地。 在本發明之一實施例中，上述之第二導熱件與彈性件 之材質包括導電材質’且第二導熱件藉由彈性件與導電緩 衝體透過蓋體接地。 在本發明之一實施例中，上述之第一發熱元件為一中 央處理單元’而第二發熱元件為一影像圖形陣列晶片。 在本發明之一實施例中，上述之導熱連接件為熱管 (heat pipe )。 在本發明之一實施例中，上述之導電緩衝體為導電泡 棉（conductive formed plastic )。 在本發明十’由於第一導熱件與第二導熱件分別對應 於第一發熱元件與第二發熱元件，且第一導熱件、第二導 熱件與冷卻裝置藉由導熱連接件互相連接，因此，冷卻裝 置可用以冷卻第一發熱元件與第二發熱元件。 為讓本發明之上述特徵和優點能更明顯易僅，下文特 舉較佳實施例，並配合所附圖式，作詳細說明如下。 【實施方式】 圖1為本發明一實施例之一種散熱模組之上視示意 9 1325754 070365.TW 24547twf.doc/n 圖。圖2為圖1沿l_l線之剖面圖。圖3為圖！沿咖線 之剖面@ °其中’目1省略蓋體以顯露出組裝於電路板盘 蓋體之間之散熱模組。 ~ 請參考圖1至圖3，散熱模組100適於組裝於一電路 板200以及盍體300之間，並適於對於電路板2q〇上之 一第一發熱元件210與至少一第二發熱元件22〇 (圖示中 僅繪不出-個）進行散熱。其中，第—發熱^件21〇的發 熱功率大於第二發熱元件22〇的發熱功率。於此實施例 中，第一發熱元件210例如是中央處理單元，而第二發熱 元件220例如是影像圖形陣列晶片。 散熱模組100包括—導熱連接件11〇、一冷卻裝置 120、一第一導熱件13〇、至少一第二導熱件14〇、至少一 彈性件150以及至少一導電緩衝體16〇 (圖示中僅繪示出 一個第二導熱件140、一個彈性件15〇與一個導電緩衝體 160)。導熱連接件11〇例如是熱管，而冷卻裝置12〇包括 一散熱鰭片122以及一風扇。導熱連接件11()適於將 第一發熱兀件210與第二發熱元件22〇之熱能傳遞至連接 於導熱連接件110之一端112之散熱鰭片122，而風扇124 適於提供一冷卻氣流以冷卻散熱鰭片122。 第一導熱件130對應於第—發熱元件21〇，並連接於 導熱連接件110之另一端114,其包括一第一導熱片132、 /框架134、多個螺栓136以及一熱傳介質138。第一導熱 片132之材質例如是高導熱係數之材質’且其較佳材質例 如是銅’並配置於導熱連接件110與第一發熱元件210之 1325754 070365.TW 24547twf.doc/n 間。熱傳介質138例如是導熱賞，並配置於第一導熱片in 與第一發熱元件210之間，以減少第一導熱片132與第一 發熱元件210之間的間隙。框架134藉由這些螺栓ΐ3ό鎖 固於電路板200 ’以將導熱連接件no之另一端114、第一 導熱片132與熱傳介質138固定於框架134與第一發熱元 件210之間。 ' 雖然本實施例中以框架134固定導熱連接件no具體 貝施，但並非用以限制本發明。此外，冷卻裝置12〇除了 以風扇124提供冷卻氣流之外，亦可以水幫泵驅動水冷液 流經導熱連接件110，以將熱傳導到外界。 第二導熱件140對應於第二發熱元件220 ,並位於冷 部裝置120與第一導熱件130之間，其包括一第二導熱片 142、一連接蓋144以及一熱傳介質146。第二導熱片142 之材質例如是高導熱係數之材質，且其較佳材質例如是 鋁，並配置於導熱連接件110與第二發熱元件22〇之間。 熱傳介質146例如是導熱膏，並配置於第二導熱片142與 第一發熱元件220之間，以減少第二導熱片m2與第二發 熱元件220之間的間隙。而導熱連接件11〇則配置於連接 蓋144與第二導熱片142之間。另外，連接蓋144並具有 一折彎部144a，且折彎部144a朝向遠離於第二發熱元件 220的方向延伸。 彈性件150之一端152連接於框架134，而其另一端 154則對應於折彎部144a。於此實施例中，框架134可具 有一開孔134a，而彈性件15〇則例如是由框架134位於開 11 丄 JZ：)/：)4 070365.TW24547twf.doc/, ，134&中之部份所折彎而成之彈片，以與框架134 -體成 形而可不需要使用額外的材料製作。因此，彈性件15〇之 二端152會連接於開孔⑽之側緣，而其另一端154會遠 ===而對應於折·f部144a。再者，導電缓衝體⑽ 例如疋導電泡棉，其配置於蓋體300之—内表面31〇上， 並對應於彈性件15〇之另一端154。The heating power of the heating element. The heat dissipation module includes a heat-transferring connection element, a cooling device, a first heat-transferring element, at least one second heat-conducting member, and at least one elastic member (also cut匕 element) and at least one conductive buffer. One end of the heat conducting connector is connected to the cooling device' and the other end is connected between the first heat conducting member and the first heat generating component. The first heat conducting member corresponds to the first heat generating component. The second heat conducting member corresponds to the second heat generating component and is located between the cooling and the first heat conducting member. One end of the elastic member is connected to the first heat conducting member, and the other end thereof corresponds to the second heat conducting member. The conductive buffer body is disposed on the cover. When the heat dissipation module is assembled between the cover body and the circuit board, the conductive buffer body contacts the elastic member, so that the elastic member contacts the second heat conduction member, thereby connecting the heat conduction connection member between the second heat conduction member and the second heat generation component. . In an embodiment of the invention, the cooling device comprises a heat sink fin and a fan. The heat sink fins are attached to one end of the heat conductive connector. The fan is adapted to provide a cooling airflow to cool the distracting pieces. In the embodiment of the present invention, the above-mentioned first heat conduction includes a heat-transferring plate of 1 7 1325754 070365.TW 24547 twf.doc/n and a frame. The diaper 'hot sheet is disposed between the heat conducting connector and the first heat generating component. The frame is coupled to the circuit board to secure the thermally conductive connector and the first thermally conductive sheet between the frame and the first heat generating component. In an embodiment of the invention, the first heat conducting member further includes a plurality of bolts' and the frame is locked to the circuit board by bolts. In an embodiment of the invention, the first heat conducting member further includes a thermal conducting medium disposed between the first heat conducting sheet and the first heat generating component. In one embodiment of the invention, the heat transfer medium is a thermal grease. In one embodiment of the invention, the elastic member is integrally formed with the frame. In an embodiment of the invention, the material of the first thermal conductive sheet comprises steel. In an embodiment of the invention, the second heat conducting member comprises a first heat conducting sheet and a connecting cover. The second heat conducting sheet is disposed between the heat conducting connector and the second heat generating component. The heat conducting connector ^ is disposed between the connecting cover and the second heat conducting sheet. In an embodiment of the invention, the second heat conducting sheet has a bent portion and the elastic member contacts the bent portion when the heat dissipating module is assembled between the cover and the circuit board. In an embodiment of the invention, the second heat conducting member further includes a heat transfer medium disposed between the second heat conductive sheet and the second heat generating element. 8 1325754 070365.TW 24547twf.doc/n In one embodiment of the invention, the heat transfer medium described above is a thermal paste. In an embodiment of the invention, the material of the second thermal conductive sheet comprises a name. In an embodiment of the invention, the material of the first heat conducting member comprises a conductive material, and the first heat conducting member is grounded through the circuit board. In an embodiment of the invention, the material of the second heat conducting member and the elastic member comprises a conductive material and the second heat conducting member is grounded through the cover body by the elastic member and the conductive buffer. In one embodiment of the invention, the first heat generating component is a central processing unit and the second heat generating component is an image pattern array wafer. In an embodiment of the invention, the heat conducting connector is a heat pipe. In an embodiment of the invention, the conductive buffer body is a conductive formed plastic. In the present invention, since the first heat-conducting member and the second heat-conducting member respectively correspond to the first heat-generating component and the second heat-generating component, and the first heat-conducting component, the second heat-conducting component and the cooling device are connected to each other by the heat-conducting connection member, A cooling device can be used to cool the first heating element and the second heating element. The above described features and advantages of the present invention will become more apparent from the following detailed description. [Embodiment] FIG. 1 is a top view of a heat dissipation module according to an embodiment of the present invention. 9 1325754 070365.TW 24547twf.doc/n. Figure 2 is a cross-sectional view of Figure 1 taken along line l-1. Figure 3 is a picture! The section along the line of the coffee line @°1 omits the cover to reveal the heat dissipation module assembled between the cover of the circuit board. Referring to FIG. 1 to FIG. 3, the heat dissipation module 100 is adapted to be assembled between a circuit board 200 and the body 300, and is adapted to be coupled to the first heat generating component 210 and the at least one second heat on the circuit board 2q. The element 22 〇 (only one is shown in the drawing) is used for heat dissipation. The heating power of the first heating element 21 is greater than the heating power of the second heating element 22A. In this embodiment, the first heat generating component 210 is, for example, a central processing unit, and the second heat generating component 220 is, for example, an image pattern array wafer. The heat dissipation module 100 includes a heat conduction connector 11 , a cooling device 120 , a first heat conduction member 13 , at least one second heat conduction member 14 , at least one elastic member 150 , and at least one conductive buffer body 16 . Only one second heat conducting member 140, one elastic member 15A and one conductive buffer 160) are shown. The heat conducting connector 11 is, for example, a heat pipe, and the cooling device 12A includes a heat sink fin 122 and a fan. The heat conducting connector 11 () is adapted to transfer the thermal energy of the first heat generating element 210 and the second heat generating element 22 to the heat sink fin 122 connected to one end 112 of the heat conducting connector 110, and the fan 124 is adapted to provide a cooling airflow To cool the fins 122. The first heat conducting member 130 corresponds to the first heat generating component 21A and is connected to the other end 114 of the heat conducting connector 110. The first heat conducting member 130 includes a first heat conducting piece 132, a frame 134, a plurality of bolts 136, and a heat transfer medium 138. The material of the first heat conducting sheet 132 is, for example, a material having a high thermal conductivity, and a preferred material thereof is, for example, copper, and is disposed between the heat conducting connecting member 110 and the first heat generating component 210 between 1325754 070365.TW 24547twf.doc/n. The heat transfer medium 138 is, for example, thermally conductive and disposed between the first heat conductive sheet in and the first heat generating element 210 to reduce a gap between the first heat conductive sheet 132 and the first heat generating element 210. The frame 134 is secured to the circuit board 200' by the bolts ό3ό to secure the other end 114 of the thermally conductive connector no, the first thermally conductive sheet 132 and the heat transfer medium 138 between the frame 134 and the first heat generating component 210. Although the thermally conductive connector no is fixed by the frame 134 in this embodiment, it is not intended to limit the present invention. In addition, the cooling device 12 can also drive the water-cooled liquid through the heat-conducting connection member 110 to conduct heat to the outside, in addition to providing the cooling air flow by the fan 124. The second heat conducting member 140 corresponds to the second heat generating component 220 and is located between the cold portion device 120 and the first heat conducting member 130. The second heat conducting member 140 includes a second heat conducting sheet 142, a connecting cover 144 and a heat transfer medium 146. The material of the second thermal conductive sheet 142 is, for example, a material having a high thermal conductivity, and a preferred material thereof is, for example, aluminum, and is disposed between the thermal conductive connector 110 and the second heat generating component 22A. The heat transfer medium 146 is, for example, a thermal paste, and is disposed between the second heat transfer sheet 142 and the first heat generating element 220 to reduce a gap between the second heat transfer sheet m2 and the second heat generating element 220. The heat conducting connector 11 is disposed between the connecting cover 144 and the second heat conducting sheet 142. Further, the connection cover 144 has a bent portion 144a, and the bent portion 144a extends in a direction away from the second heat generating element 220. One end 152 of the resilient member 150 is coupled to the frame 134 and the other end 154 corresponds to the bent portion 144a. In this embodiment, the frame 134 may have an opening 134a, and the elastic member 15 is, for example, the frame 134 located at the opening 11 丄 JZ :) / :) 4 070365. TW24547twf.doc /, , 134 & The shrapnel that is bent is formed into a body with the frame 134 without the use of additional materials. Therefore, the two ends 152 of the elastic member 15 are connected to the side edges of the opening (10), and the other end 154 is farther than === and corresponds to the folded portion f 144a. Furthermore, the conductive buffer (10), for example, a conductive foam, is disposed on the inner surface 31 of the cover 300 and corresponds to the other end 154 of the elastic member 15 .
基於上述，當散熱模組1⑻組裝於蓋體3⑽與電路板 200之間時，導電緩衝體16〇會接觸彈性件15〇，以使彈性 件150產生彈性變形而接觸折彎部144a。此時，連接蓋144 會被保持於彈性件15〇與導熱連接件11〇之間，並使導熱 連接件11〇連接於第二導熱件140與第二發熱元件22〇 = 間:此Ϊ，由於第一發熱元件210與第二發熱元件220之 熱能可藉由導熱連接件no傳遞至冷卻裝置120，因此， 冷卻裝置12〇可用以冷卻第一發熱元件21〇與第二發埶元 件 220。 ”、、Based on the above, when the heat dissipation module 1 (8) is assembled between the cover 3 (10) and the circuit board 200, the conductive buffer 16 接触 contacts the elastic member 15 〇 to elastically deform the elastic member 150 to contact the bent portion 144a. At this time, the connecting cover 144 is held between the elastic member 15 〇 and the heat conducting connecting member 11 ,, and the heat conducting connecting member 11 〇 is connected between the second heat conducting member 140 and the second heat generating member 22 〇 = Ϊ, Since the thermal energy of the first heat generating component 210 and the second heat generating component 220 can be transferred to the cooling device 120 by the heat conducting connector no, the cooling device 12 can be used to cool the first heat generating component 21 and the second hairpin component 220. ",,
除此之外，框架134可以是由導電材質所製成，以使 第一導熱件130可透過電路板200接地，而連接蓋144與 彈性件150亦可以是由導電材質所製成，以使第二導熱件 140可纟翌由導電緩衝體mo而透過蓋體3〇〇接地。 值得注意的是，由於電路板200鄰近第一發熱元件21〇 (中央處理單元）處的結構強度通常會較高。因此，導熱 連接件110與第一導熱片132可藉由這些螺栓136鎖固於 電路板200。但是’電路板200鄰近第二發熱元件220 (影 像圖形陣列晶片）處的結構強度通常會較弱。因此，第二 導熱件140不以鎖固的方式連接於電路板2〇〇，而是藉由 12 1325754 070365.TW 24547twf.doc/n 彈性件150接觸折彎部144a的方式將導熱連接件11〇、第 二導熱片142與連接蓋144固定於蓋體300與電路板2〇〇 之間。In addition, the frame 134 may be made of a conductive material so that the first heat conducting member 130 can be grounded through the circuit board 200, and the connecting cover 144 and the elastic member 150 can also be made of a conductive material, so that The second heat conducting member 140 can be grounded through the cover 3 from the conductive buffer body mo. It is worth noting that the structural strength at the circuit board 200 adjacent to the first heat generating component 21 (the central processing unit) is generally higher. Therefore, the heat conducting connector 110 and the first heat conducting sheet 132 can be locked to the circuit board 200 by the bolts 136. However, the structural strength of the circuit board 200 adjacent to the second heat generating component 220 (image pattern array wafer) is generally weak. Therefore, the second heat conducting member 140 is not connected to the circuit board 2〇〇 in a locking manner, but the heat conducting connecting member 11 is connected by the 12 1325754 070365.TW 24547twf.doc/n elastic member 150 contacting the bent portion 144a. The second heat conducting sheet 142 and the connecting cover 144 are fixed between the cover 300 and the circuit board 2 。.
乡示上所述’本發明之散熱模組至少具有以下的優點： 1.由於第一導熱件與第二導熱件分別對應於第一發熱 元件與第二發熱元件，且第一導熱件、第二導熱件與冷卻 裝置藉由導熱連接件互相連接，因此，冷卻裝置可用以冷 卻第一發熱元件與第二發熱元件。 2‘彈性件與框架一體成形而可不需要使用額外的材料 製作。 3.框架可以是由導電材質所製成，以使第—導轨件可 透過電路板接地。 ” ^連接蓋娜性件可以是由導電㈣所製成，以使第 一導熱件可經由導電緩衝體而透過蓋體接地。The heat dissipation module of the present invention has at least the following advantages: 1. Since the first heat conduction member and the second heat conduction member respectively correspond to the first heat generation element and the second heat generation element, and the first heat conduction member, The two heat conducting members and the cooling device are connected to each other by a heat conducting connecting member, and therefore, the cooling device can be used to cool the first heat generating component and the second heat generating component. 2 'The elastic member is integrally formed with the frame and can be made without using additional materials. 3. The frame may be made of a conductive material so that the first rail member can be grounded through the board. The ^Gina element can be made of conductive (four) so that the first heat conducting member can be grounded through the cover via the conductive buffer.
限定佳實施例揭露如上，然其並非用以 _本二常知識者，在不 因此本發明W〜圍内田了作些权更動與潤飾， 發熱元件處較不容易===損J路板鄰近第二 因此本發明之俘噌欽问丄 ，’.又軔兴濶飾， 為準。狀__當視後社申請專利範騎界定者 【圖式簡單說明】 圖 1為本發明—實施例之i散熱模社上視示意 13 1325754 070365.TW 24547twf.doc/n 圖2為圖1沿I-I線之剖面圖。 • 圖3為圖1沿II-II線之剖面圖。 【主要元件符號說明】 100 :散熱模組 U〇 :導熱連接件 112、114、152、154 : —端 ® 120:冷卻裝置 122 :散熱鰭片 124 :風扇 130、140 :導熱件 132、142 :導熱片 134 :框架 134a :開孔 136 :螺絲 • 138、146 :熱傳介質 144 :連接蓋 144a :折彎部 150 :彈性件 160 :導電缓衝體 200 :電路板 210、220 :發熱元件 300 :蓋體 310 :内表面 14The preferred embodiment is disclosed as above, but it is not used for the knowledge of the second common knowledge. In the present invention, the W~Wan Ueda has made some weight changes and retouching, and the heating element is less likely to be ===damage J road board adjacent Secondly, the captives of the present invention asked, ". _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ A section along the line II. • Figure 3 is a cross-sectional view of Figure 1 taken along line II-II. [Main component symbol description] 100: heat dissipation module U: heat conduction connector 112, 114, 152, 154: - end ® 120: cooling device 122: heat dissipation fin 124: fan 130, 140: heat conduction member 132, 142: Thermal conductive sheet 134: frame 134a: opening 136: screw • 138, 146: heat transfer medium 144: connection cover 144a: bent portion 150: elastic member 160: conductive buffer body 200: circuit boards 210, 220: heat generating element 300 : cover 310: inner surface 14