M250535 捌、新型說明： 【新型所屬之技術領域】 本創作係關於一種散熱片，尤其係關於一種利用一熱傳 導性良好且熱容積較低之第一金屬板配舍一散熱性良好且 直接包覆結合於該第一金屬板外之第二金屬板，而可快速 傳導熱量並快速散熱而顯著增進整體散熱特性之覆合式散 熱片。 【先前技術】 散熱片（heatsink或heat dis sip at er)係一種廣泛使用於導 引發散發熱體熱量之裝置。由於現今電腦所用之中央處理 單元（CPU)功率不斷提高且發熱量大，故使散熱片或散熱器 (配設有散熱風扇之散熱片）更成為CPU運轉非常重要之辅 助70件。習知之散熱片一般係以單一金屬材料（例如銅或鋁） 製作使其具有一可直接大面積接觸發熱體之接觸面，並在 該接觸面之相反側形成具有溝槽或突柱（散熱，鰭片）而擴大 散熱面積之散熱面。經發現，由於單—金屬材料—般若且 有較佳熱導率者，則其散熱性通常不佳；而具有較佳散数M250535 新型 Description of the new type: [Technical field to which the new type belongs] This creation relates to a heat sink, especially to a first metal plate with a good thermal conductivity and a low thermal volume. A laminated heat sink combined with a second metal plate outside the first metal plate, which can conduct heat quickly and rapidly dissipate heat and significantly improve overall heat dissipation characteristics. [Previous technology] A heat sink (heatsink or heat dis sip at er) is a device that is widely used to induce the dissipation of heat from a heating body. As the power of central processing units (CPUs) used in today's computers continues to increase and generate large amounts of heat, heat sinks or heat sinks (heat sinks equipped with cooling fans) have become 70 very important auxiliary CPU aids. The conventional heat sink is generally made of a single metal material (such as copper or aluminum) so that it has a contact surface that can directly contact a heating element in a large area, and a groove or a protrusion (heat dissipation, Fins) and the heat dissipation surface to expand the heat dissipation area. It has been found that, because of the single-metal material-if there is a better thermal conductivity, its heat dissipation is usually not good;
Γ者，則其熱傳導性不佳。因此，若㈣熱傳導性較佳I 早-金屬作為散熱材料’以銅(一般散熱片用；熱導率 lllw/m*°C ;熱容積 0.385J/ ^ .rpTn ^ )為例，則其雖可將發熱源 (例如CPU)之熱量快速傳導至整 料之…f 熱材料，惟因該散熱材 枓之放熱性較差，使熱量蓄積於盆 體胃 ，、不易散逸，進而使整 菔月文…效羊無法铨歼。另外，若 鮫差ϋ 一 & 歧熱性較佳而熱傳導性 車差之早一金屬（例如一般散熱片 用之鋁金屬；熱導率Γ, its thermal conductivity is not good. Therefore, if the thermal conductivity is better I early-metal as a heat sink material, take copper (for general heat sinks; thermal conductivity lllw / m * ° C; thermal capacity 0.385J / ^. RpTn ^) as an example. It can quickly transfer the heat from the heating source (such as CPU) to the whole material ... f thermal material, but because the heat dissipation material of the heat sink is poor in heat dissipation, it can accumulate heat in the pelvic stomach, and it is not easy to dissipate. … The sheep cannot be wiped out. In addition, if 鲛 ϋ ϋ a & better thermal diffusivity and thermal conductivity, early metal (such as aluminum metal for general heat sinks; thermal conductivity)
Ο: \61 \61947-930228. DOC 137w/nT°C ;熱容積 o 896j 散執效率將@ W Η “ C)作H熱材料’則其整體 傳輸熱量，而使整體散熱效果無法提昇。…U㈣以 邇近’雖有許多人對於散熱器進行研究改良，惟—般均 僅針對如何使用散熱風扇或如何#埒埶。„ ^ ^ 何使散熱益良好接觸結合於 ^體，^有針對散熱以身之整體散熱 貫用之創新手段。 风®适/ 【新型内容】 本創作之主要目的即為提高 圾同政熱片（益）本身之整體散熱 效率而提供一種覆合式勒 一 復口式放熱片，其包含••一第一金屬板及 :第二金屬板；其中該第—金屬板係以熱傳導性良好且熱 谷積較小之金屬材料（例㈣合金、銅、鎢料）製成板片 狀，用以直接接觸發熱源以傳導熱量，而第二金屬板則係 二散熱性良好之金屬材料（例如鋁）直接一體包覆結合於該 第一金屬板外，以可配合散熱風扇快速發散由第一金屬板 所傳來之熱量。藉熱傳導性良好且熱容積較小之第一金屬 板直接接觸發熱源，可將發熱源之熱量快速傳遞至第二金 屬板，再藉第二金屬板之良好散熱性快速散逸第一金屬板 所傳來之熱量，而可將發熱體之熱量高效率快速傳遞及散 逸’以達顯著進步之散熱效果。 藉由本創作所提供之覆合式散熱片，發熱體之熱量可以 簡便、穩定且無故障憂慮的方式快速傳遞散逸而顯著提昇 整體散熱效率。 【實施方式】 0:\61\61947-930228. DOC -6- M250535 如圖1所示’根據本創作較佳具體實施例之覆合式散熱片 1主要包含一第一金屬板11及一第二金屬板12，其中該第一 金屬板11係以熱傳導性良好且熱容積較低之金屬（例如鎂 合金、銅、鎢等等）製成板片狀，使其具有一發熱源接觸面 111以及一位於相反側之傳熱面丨丨2，該發熱源接觸面丨丨i係 用以直接接觸一發熱源（晶片）2(如圖3所示）以將發熱源2之 熱量由該發熱源接觸面U1快速傳遞至該傳熱面112。第二 金屬板12則係以散熱性良好之金屬材料（例如銘）至少直接 一體包覆形成並結合於該第一金屬板丨丨之傳熱面112，並使 第一金屬板11之發熱體接觸面ηι未被該、二金屬板12包 覆而暴露於外。該第二金屬板12在與第一金屬板丨丨結合之 相反側形成散熱面121。該散熱面121上形成有許多凹槽或 凸柱以增加該散熱面121之散熱面積。 如圖1所示，在本較佳具體實施例中，該第一金屬板丨丨在 其發熱體接觸面111與傳熱面π 2之間形成楔形邊緣丨丨3。該 楔形邊緣113在第二金屬板12—體包覆於傳熱面及該楔形 邊緣113時’可防止第一金屬板11鬆脫於第二金屬板丨2。第 一金屬板11之傳熱面112可形成為不規則粗糙表面，俾增加 其表面積，以於第二金屬板12—體包覆於於其上時，用以 增加第一與第二金屬板11、12之間之傳熱面積，以提高熱 傳導效果。 如圖1、2及3所示，第一金屬板11係成具有傾斜邊緣之截 頭角錐狀。該第一金屬板丨丨，因係呈截頭角錐狀，故具有 一較大面積表面及一較小面積表面，其中該較大面積表面Ο: \ 61 \ 61947-930228. DOC 137w / nT ° C; Thermal volume o 896j Dissipation efficiency @ W Η "C) as H thermal material 'will transmit heat as a whole, and the overall heat dissipation effect cannot be improved ... Although there are many people who have researched and improved the heat sink, they generally only focus on how to use a cooling fan or how to use # 埒 埶. Innovative means consistently used by the body as a whole. Wind® / [New Content] The main purpose of this creation is to provide a laminated, double-mouthed heat sink for improving the overall heat dissipation efficiency of the junk Tongzheng heat sheet (benefit) itself, which contains •• a first metal Plate and: a second metal plate; wherein the first-metal plate is made of a metal material (such as alloy, copper, tungsten material) with good thermal conductivity and small thermal valley, and is used to directly contact the heat source It is used to conduct heat, and the second metal plate is two metal materials (such as aluminum) with good heat dissipation, which are directly integrated and integrated outside the first metal plate, so as to cooperate with the cooling fan to quickly dissipate from the first metal plate. Of heat. The first metal plate with good thermal conductivity and small thermal volume directly contacts the heating source, which can quickly transfer the heat of the heating source to the second metal plate, and then quickly dissipate the first metal plate by the good heat dissipation of the second metal plate. The heat transferred can quickly and efficiently transfer and dissipate the heat of the heating element, so as to achieve a significantly improved heat dissipation effect. With the laminated heat sink provided by this creation, the heat of the heating element can be quickly and easily dissipated in a simple, stable, and trouble-free manner, thereby significantly improving the overall cooling efficiency. [Embodiment] 0: \ 61 \ 61947-930228. DOC -6- M250535 As shown in Fig. 1, the laminated heat sink 1 according to the preferred embodiment of the present invention mainly includes a first metal plate 11 and a second A metal plate 12, wherein the first metal plate 11 is made of a metal (eg, magnesium alloy, copper, tungsten, etc.) with a good thermal conductivity and a low thermal volume, and has a heat source contact surface 111 and A heat transfer surface on the opposite side 丨 丨 2, the heat source contact surface 丨 i is used to directly contact a heat source (wafer) 2 (as shown in FIG. 3) to transfer the heat of the heat source 2 from the heat source The contact surface U1 is quickly transferred to the heat transfer surface 112. The second metal plate 12 is at least directly and integrally covered with a metal material (such as a Ming) with good heat dissipation and is bonded to the heat transfer surface 112 of the first metal plate. The second metal plate 12 is a heating element of the first metal plate 11. The contact surface η is not covered by the two metal plates 12 and is exposed to the outside. The second metal plate 12 forms a heat dissipation surface 121 on the opposite side to the first metal plate 丨 丨. A plurality of grooves or protrusions are formed on the heat dissipation surface 121 to increase the heat dissipation area of the heat dissipation surface 121. As shown in FIG. 1, in the present preferred embodiment, the first metal plate 丨 丨 forms a wedge-shaped edge 丨 3 between its heating element contact surface 111 and the heat transfer surface π 2. The wedge-shaped edge 113 prevents the first metal plate 11 from being loosened from the second metal plate when the second metal plate 12 is entirely covered on the heat transfer surface and the wedge-shaped edge 113. The heat transfer surface 112 of the first metal plate 11 may be formed as an irregular rough surface, so as to increase its surface area so as to increase the first and second metal plates when the second metal plate 12 is entirely covered thereon. Heat transfer area between 11 and 12 to improve heat transfer effect. As shown in Figs. 1, 2 and 3, the first metal plate 11 is formed into a truncated pyramid shape having an inclined edge. The first metal plate has a large-area surface and a small-area surface because the first metal plate has a truncated pyramid shape, and the large-area surface
O:\61\6I947-930228.DOC M250535 係與第二金屬板12接觸，而且該第一金屬板u之諸傾斜邊 緣亦包覆接觸於第二金屬板12，而較小面積表面則用以與 發熱體2接觸，故而第二金屬板12與第一金屬板丨丨之間之接 觸傳熱面之面積係大於第一金屬板丨丨與發熱體3之間之接 觸面之面積。如圖3所示，當本創作之覆合式散熱片丨配合 一散熱風扇3使用於一晶片2散熱時，該第一金屬板丨丨之發 熱體接觸面111可直接接觸貼合或以導熱膏黏結於晶片2之 上。當晶片2運轉使用而發熱時，熱量即經由發熱體接觸面 111快速傳遞至第一金屬板丨丨。由於第一金屬板丨丨係以熱容· 積較低之金屬材料（例如鎂合金、銅、鎢等金屬）製成，故在 接文少篁熱量時即可快速昇溫而可將晶片（發熱體）2之高溫 與熱量經由傳熱面112而快速傳遞至第二金屬板12。再由於 垓第二金屬板12係以散熱性較好之金屬（例如：一般散熱片 用之鋁金屬）製成，而第一金屬板丨丨又快速傳來較接近發熱 體溫度之高溫，使該第二金屬板12相較於周圍空氣有較大 之溫度差（註：熱傳導及對流散熱量均與高低溫物體間之溫_ 度梯度成正比），而有助於熱量由第二金屬板12之散熱面快 速散逸；尤其，當配合散熱風扇3強制通風散熱時，尤可展 現顯著之快速散熱效果。 為實驗比較’以一般散熱片用之銅金屬（熱導率11 lw/m· °C ;熱容積0.385J/g^C)作為第一金屬板丨丨，並以一般散熱 片用之鋁金屬（熱導率137w/m#cc ;熱容積〇 896J/g，c )作為 第二金屬板12而製成本創作之銅/鋁覆合式散熱片1。另單 、、’屯以 般政熱片用紹金屬（熱導率137w/m· °C ;熱容積O: \ 61 \ 6I947-930228.DOC M250535 is in contact with the second metal plate 12, and the inclined edges of the first metal plate u are also in contact with the second metal plate 12, and the smaller area surface is used for It is in contact with the heating element 2, so the area of the contact heat transfer surface between the second metal plate 12 and the first metal plate 丨 丨 is larger than the area of the contact surface between the first metal plate 丨 丨 and the heating element 3. As shown in FIG. 3, when the laminated heat sink of this creation is used with a cooling fan 3 to dissipate heat from a chip 2, the heating body contact surface 111 of the first metal plate can be directly attached or bonded with a thermal paste. Bonded to the wafer 2. When the chip 2 runs and is used to generate heat, the heat is quickly transferred to the first metal plate 丨 丨 through the heating element contact surface 111. Because the first metal plate is made of a metal material with a lower heat capacity and volume (such as magnesium alloy, copper, tungsten, and other metals), it can quickly heat up and heat the chip (heating when the heat is reduced). The high temperature and heat of the body 2) are quickly transferred to the second metal plate 12 through the heat transfer surface 112. Because the second metal plate 12 is made of a metal with good heat dissipation (for example, aluminum metal used for general heat sinks), and the first metal plate quickly transmits a high temperature close to the temperature of the heating body, so that The second metal plate 12 has a larger temperature difference than the surrounding air (Note: the heat conduction and convection heat dissipation are both proportional to the temperature gradient between high and low temperature objects), which helps the heat from the second metal plate The heat dissipation surface of 12 quickly dissipates; in particular, when it is used with the forced cooling fan 3 to dissipate heat, it can show a significant rapid heat dissipation effect. For experimental comparison, 'the copper metal used for general heat sinks (thermal conductivity: 11 lw / m · ° C; heat capacity 0.385J / g ^ C) was used as the first metal plate, and the aluminum metal used for general heat sinks (Thermal conductivity 137w / m # cc; thermal capacity 0896J / g, c) As the second metal plate 12, the original copper / aluminum laminated heat sink 1 was produced. In addition, the metal materials used in ordinary and thermal films (thermal conductivity 137w / m · ° C; thermal capacity)
0:\61 \61947-930228. DOC M250535 g C )製成習知之對照鋁製散熱片，該對照鋁製散熱 片具有與前述根據本創作之銅/鋁覆合式散熱片相同大小 及相同外形。 字本創作之銅/鋁覆合式散熱片及該習知對照鋁製散熱 片均配合相同之散熱風扇，在相同環境條件下，同時使用 於筆逗型電腦之20wCPU。經過一段相同長時間運轉後，發 見本創作之銅/鋁覆合式散熱片可將該CPU之溫度維持在77 c左右，而對照鋁製散熱片則僅可將該CPU維持在85t左 右。由該事實得知，本創作確可將散熱效率顯著提高，並鲁 使發熱體之溫度維持在較低之溫度。 本創作為一突破習知技藝之新穎技術手段。本創作如前 述之較佳具體實施例可達成本創作之技術目的及進步功 效；,彳其亦可以其他之特定形式來實現，而不脫離本創作 之精神和重要特性。因此上文所列之實施例在各方面都應 被視為例示性而非限制性，而所有之改變只要合乎本案之 申請專利範圍所定義或與其範圍等效者，均應包含在本創 作的範傳之Θ。 響 【圖式簡單說明】 圖1係本根據本創作之一較佳實施例之立體分解圖； 圖2係圖1所示之根據本創作較佳實施例之側向剖面示意 圖； ’ 圖係本創作之貫施狀態剖面示意圖，顯示根據本創作之 覆。式政熱片結合於一晶片發熱體且配合一散熱風扇之散 熱狀態。0: \ 61 \ 61947-930228. DOC M250535 g C) is made into a conventional reference aluminum heat sink. The control aluminum heat sink has the same size and the same shape as the copper / aluminum laminated heat sink according to the above-mentioned creation. The copper / aluminum laminated heat sink created by the script and the conventional control aluminum heat sink are matched with the same cooling fan, and used at the same time under the same environmental conditions for the 20wCPU of the pen-type computer. After a period of the same long period of operation, it was found that the copper / aluminum laminated heat sink of this creation can maintain the temperature of the CPU at about 77 ° C, while the control aluminum heat sink can only maintain the CPU at about 85t. It is known from this fact that the present invention can indeed significantly improve the heat dissipation efficiency and keep the temperature of the heating element at a lower temperature. This creation is a novel technical means that breaks through the know-how. The above-mentioned preferred embodiment of the creation can achieve the technical purpose and progress effect of the cost creation; it can also be realized in other specific forms without departing from the spirit and important characteristics of the creation. Therefore, the embodiments listed above should be regarded as illustrative and not restrictive in all aspects, and all changes should be included in the creation of the invention as long as they are within the scope of the scope of the patent application for the application or are equivalent to the scope of the invention. Fan Chuanzhi Θ. [Simplified illustration of the drawing] FIG. 1 is an exploded perspective view of a preferred embodiment of the present invention; FIG. 2 is a schematic side sectional view of the preferred embodiment of the present invention shown in FIG. 1; A cross-sectional schematic view of the state of creation and execution, showing the repertoire based on this creation. The type of government heat piece is combined with a chip heating element and cooperates with a heat dissipation state of a cooling fan.
O:\6I\6I947-930228.DOC -9- M250535 【圖式代表符號說明】 1 覆合式散熱片 2 發熱源（晶片） 3 散熱風扇 11 第一金屬板 12 第二金屬板 111 發熱體接觸面 112 傳熱面 113 楔形邊緣 121 散熱面O: \ 6I \ 6I947-930228.DOC -9- M250535 [Description of Symbols of Drawings] 1 Laminated heat sink 2 Heating source (chip) 3 Cooling fan 11 First metal plate 12 Second metal plate 111 Heating body contact surface 112 heat transfer surface 113 wedge-shaped edge 121 heat dissipation surface
O:\61\6I947-Q30228.DOCO: \ 61 \ 6I947-Q30228.DOC