J296367 ι - 九、發明說明： 【發明所屬之技術領域】 本發明係涉及一種散熱裝置，尤係涉及一種能與發熱 電子元件緊密結合之散熱裝置。 【先前技術】 隨著中央處理器（CPU)等電子元件功率的不斷提高， 散熱問題越來越受到人們的重視，在電腦中更是如此。爲 _ 了在有限的空間内T%效地帶走系統産生的熱量，目前業界 主要採用由散熱片、熱管及散熱風扇組合的方式進行散 熱。該方式的熱傳遞路徑爲：CPU産生的熱量經熱管傳到 散熱片，再由散熱風扇産生的氣流將傳至散熱片的熱量帶 走。 爲了提南散熱器的散熱效率，在CPU與熱管之間還設 有一集熱塊。此集熱塊用熱傳導率比較高的材料如銅製 • 成，從而提高熱量從CPU到熱管間的傳導效率。該集熱塊 具有一平面底面，與CPU的外表面熱連接。cPU裝設於一 電路板上，通過一扣具將該電路板與該集熱塊鎖合在一 起。該扣具包括一鎖合部，與該集熱塊之兩對邊或者四個 角相靠接。這樣-來扣具施加在與集熱塊相接觸的部分的 堅力要比其他部分大’也就是說扣具施加在集熱塊上的壓 力不均衡，其在中央部分的壓力要比兩邊或者四個角上的 n要丨、因此集熱塊的中央部分與CPU接觸不夠緊密， 從而在集魏財央部分與CPU之㈣生 大 阻。然而-般情況下集熱塊的中央部分正對CPU的中心 6 1296367 特別是對雙核的CPU來說，其中心部分有兩個熱源點，易 於在其中央部位形成熱區（hot spot)。 在以上的熱傳導路徑中，CPU與集熱塊之間的熱阻， 往往在散熱模組中占很大的比重，CPU與集熱塊在傳熱過 程中接觸是否緊密，對整體熱阻的大小有很大的影響。因 此若能有效減小其接觸熱阻，就能大大提高散熱裝置的散 熱效率。 【發明内容】 有鑒於此，實有必要提供一種能與發熱電子元件緊密 接觸的散熱裝置。 本散熱裝置包括一用於與發熱元件熱連接的集熱塊， 一與該集熱塊熱連接的熱管以及一與該熱管熱連接的鰭片 組，該集熱塊設有一曲形底面，該曲形底面系用於與發熱 元件熱連接從而吸收其産生的熱量，該熱管包括一與該集 熱塊熱連接的蒸發端以及一與該鰭片組熱連接的冷凝端。 與習知技術相比，該集熱塊的曲形底面能與CPU的中 心部分更有效的熱連接，減小其間的熱阻，從而提高熱傳 導效率。 【實施方式】 如圖1所示爲本發明散熱裝置的一較佳實施例，該散 熱装置包括一集熱塊10、一熱管30、一鰭片組90及一對 將集熱塊10鎖合在電路板70上的扣具5〇。 如圖2所示，該集熱塊10置於一發熱元件，如CPU 80 上。該CPU 80裝設於電路板70上。集熱塊；[〇由如銅、 7 ^296367 銘等熱傳導輪高的材料製成。該餘塊w包括一基 向上2正和兩侧板14，該兩側板14沿基板12左右兩側垂直 熱故延伸而成。基板12和兩側板14共同形成一空間13， ^官3〇的一端即容置在此空間13内。基板12大致呈方 面如圖3所示，基板12的上下兩侧分別爲頂面122和底 底面124爲一近似的拋物面即底面124的橫截面 二物線形，相對基板12的中心轴χ_χ呈對稱結構。沿 左 '八方向底面124的中間部分126低於底面124的 與▲右兩部分127、128。該左、右兩部分127、128分別 二兩側板14相連。沿兩側板14的頂端橫向向外水平延伸 为別形成一邊緣16。 每一扣具50整體呈“T”形，包括一連接部52和一 ^配部54。連接部52通過鉚接與集熱塊1〇的邊緣16的 間部分相連，當然也可通過焊接或者螺合的方式相連 接。裝配部54從連接部52的末端縱向向兩邊延伸，與邊 緣16平行。裝配部54的兩端各開一孔540，供裝配集熱 塊10至電路板70的螺絲1〇〇穿設之用。兩扣具50上的四 個裝配孔54〇相對軸X-X對稱分佈。 熱管30包括一蒸發端32和一冷凝端34,其内部有毛 細結構並填充了工作液體（圖未示）。熱管30的蒸發端 32放置在集熱塊1〇所形成的空間13内，蒸發端32的外 表面36與集熱塊10的頂面122相連接。冷滅端34向外延 伸與鰭片組90熱連接。鰭片組90包括複數個平行相間排 列的鰭片，每相鄰兩鰭片間形成一通風道92。一風扇（圖 8 1296367 - 未不）可置於鰭片組90 一側，産生的氣流玎通過通風道 92，從而對鰭片組90進行散熱。 組裝時，如圖1所示，集熱塊1〇置於CPU 80之上， 其底面124與CPU 80的頂面相接觸。如圖3所示，集熱 塊10的中央部分126與CPU 80的中心部分相抵靠，左、 右兩部分127、128則與CPU 80的周邊部分相抵靠。爲了 提咼熱傳導率，通常會在集熱塊10的底面124與cpu 8〇 φ 的外表面之間填充一些熱介面材料如導熱膏（圖未示）等。 熱管30的蒸發端32容置在集熱塊1〇形成的空間13内， 其外表面36與集熱塊1〇的頂面122直接接觸。熱管3〇 的冷凝端34則與鰭片組9〇相連。在將此散熱裝置裝在cpu 80上之別，可先將熱管3〇與集熱塊1〇通過焊接連接在一 起。將螺絲100通過扣具50上的四個裝配孔54〇與電路板 上的螺孔相鎖固從而將集熱塊1〇與電路板7〇鎖合固定在 一起。至此，該散熱裝置的裝配過程完畢。 Φ 當該散絲置^時，CPU 8G產生的熱量及時地傳遞 到集熱塊10的基板12上。熱管3〇内的工作液體 32吸收熱量變成氣體，然後流向冷凝端34，在冷凝端 氣體釋放出熱量並轉換成液態。由於熱管3〇設有毛細結 構，這些工作液體受到毛細作用力又重新回到熱管3〇的蒸 發端32，如此反復的進行吸熱、放熱的過程。因❿cpu 8〇 所產生的熱量能及時的傳遞到鰭片組9()，進而通過風扇産 ，的強制氣流（方向如圖i中箭頭所示）對讀片組卯進行 散熱，從而將熱量散發到周圍環境中去。 9 1296367 當該集熱塊10裝在CPU 80上時，集熱塊10主要靠 四周的螺絲100的作用力來固定在電路板70上。由於螺絲 100的作用力施加於扣具50上，扣具50與集熱塊10的邊 緣16相接合，從而基板12的左、右兩部分127、128受到 的力比其中間部分126大，因而左、右兩部分127、128 産生的形變相對較大。而集熱塊10的基板12呈抛物面形 狀’中間部分126比左、右兩部分127、128的位置要低， 因此基板12最終的形變結果爲近似於一個平面，使得基板 12的中間部分126加在CPU 80中心部分的力與基板12的 左、右兩部分127、128加在CPU 80四周部分的力相當。 也就是集熱塊10加在CPU80上的力大致是均勻的，集熱 塊10的基板12的每一部分都與CPu 80緊密接觸。因而 CPU 80中心部分的熱量能及時的傳遞到集熱塊1〇，避免 熱區的産生，能夠保證CPU 80安全有效的工作。 由於加在CPU 80各個部分的力與集熱塊1〇的形狀相 關’可以通過改變集熱塊10的具體形狀來適應不同熱載荷 的CPU。例如，通過增加集熱塊1〇基板12的曲率，其中 間部分I26與周邊部分的垂直距離將要增加。因此組裝後 基板12的中間部分126與cpu 8〇巾心部分接觸更加緊 雄進#減小兩者之間的接觸熱阻。這種設計特別適用 於産熱量更多的雙核CPU。只要集熱塊的底面爲曲面形 狀’其中間部分比周邊部分位置低，其加在cpu中心部分 的力就會增大&板底面的形狀不限於上述的抛物面結 構’也可以是呈球面、圓柱面或麵似形狀的曲形底面。 1296367 同樣集熱塊10的侧板14也可以沿基板12兩側傾斜延 伸而成。例如可以是傾斜向外並向上延伸，兩側板與基板 之間形成沿轴X-X方向向上逐漸擴張的空間。也可以是傾 斜向内並向上延伸，其形成沿軸X-X方向向上逐漸縮小的 空間。 只要不背離本發明的精神，本發明也可以以其他方式 實現，並非僅限於上述實施例。 【圖式簡單說明】 圖1是本發明散熱裝置一較佳實施方式及相關元件的 組裝圖。 圖2是圖1所示散熱裝置的立體分解圖。 圖3是圖2中圈III部分的放大圖。 【主要元件符號說明】 集熱塊 10 螺絲 100 基板 12 頂面 122 底面 124 .基板中間部分 126 基板左部分 127 基板右部分 128 空間 13 侧板 14 邊緣 16 熱管 30 蒸發端 32 冷凝端 34 外表面 36 扣具 50 連接部 52 裝配部 54 裝配孔 540 電路板 70 CPU 80 鰭片組 90 π 1296367 通風道 92BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device that can be closely coupled with a heat generating electronic component. [Prior Art] With the continuous improvement of the power of electronic components such as a central processing unit (CPU), the problem of heat dissipation has been receiving more and more attention, especially in computers. In order to take away the heat generated by the system in a limited space, the industry currently uses a combination of heat sinks, heat pipes and cooling fans to dissipate heat. The heat transfer path of the method is: the heat generated by the CPU is transmitted to the heat sink through the heat pipe, and the air flow generated by the heat dissipation fan carries the heat transferred to the heat sink. In order to improve the heat dissipation efficiency of the south radiator, a heat collecting block is arranged between the CPU and the heat pipe. This collector block is made of a material with a high thermal conductivity such as copper to improve the conduction efficiency of heat from the CPU to the heat pipe. The heat collecting block has a planar bottom surface that is thermally coupled to the outer surface of the CPU. The cPU is mounted on a circuit board, and the circuit board is locked with the heat collecting block by a fastener. The buckle includes a locking portion that abuts two opposite sides or four corners of the heat collecting block. In this way, the force exerted by the buckle on the portion in contact with the heat collecting block is greater than that of the other portions, that is, the pressure exerted by the buckle on the heat collecting block is not balanced, and the pressure in the central portion is higher than either side or The n at the four corners is 丨, so the central part of the heat collecting block is not in close contact with the CPU, so that it is greatly resistant to the CPU and the CPU. However, in general, the central part of the collector block is facing the center of the CPU. 6 1296367 Especially for the dual-core CPU, there are two heat source points in the center part, which is easy to form a hot spot in the center. In the above heat conduction path, the thermal resistance between the CPU and the heat collecting block often occupies a large proportion in the heat dissipation module, and the CPU and the heat collecting block are in close contact during the heat transfer process, and the overall thermal resistance is small. Have a great impact. Therefore, if the contact resistance is effectively reduced, the heat dissipation efficiency of the heat sink can be greatly improved. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat sink that can be in close contact with a heat-generating electronic component. The heat dissipating device comprises a heat collecting block for thermally connecting with the heat generating component, a heat pipe thermally connected to the heat collecting block, and a fin set thermally connected to the heat pipe, wherein the heat collecting block is provided with a curved bottom surface, The curved bottom surface is for thermally connecting with the heat generating component to absorb the heat generated therefrom, and the heat pipe includes an evaporation end thermally coupled to the heat collecting block and a condensation end thermally coupled to the heat sink block. Compared with the prior art, the curved bottom surface of the heat collecting block can be more effectively thermally connected with the central portion of the CPU, reducing the thermal resistance therebetween, thereby improving the heat transfer efficiency. [Embodiment] FIG. 1 shows a preferred embodiment of a heat dissipating device of the present invention. The heat dissipating device includes a heat collecting block 10, a heat pipe 30, a fin group 90, and a pair of heat collecting blocks 10 The clips on the circuit board 70 are 5 turns. As shown in FIG. 2, the heat collecting block 10 is placed on a heat generating component such as the CPU 80. The CPU 80 is mounted on the circuit board 70. Collecting heat block; [〇 is made of materials such as copper, 7 ^ 296367 Ming and other heat conducting wheel heights. The remaining block w includes a base-up 2 positive and two side plates 14, and the two side plates 14 are formed by extending vertically along the left and right sides of the substrate 12. The substrate 12 and the two side plates 14 together form a space 13 in which one end of the body 3 is accommodated. The substrate 12 is substantially in the aspect shown in FIG. 3. The upper and lower sides of the substrate 12 have a top surface 122 and a bottom bottom surface 124 respectively. The approximate paraboloid, that is, the bottom surface 124 has a cross-sectional two-object line shape, and is symmetric with respect to the central axis 基板_χ of the substrate 12. structure. The intermediate portion 126 along the left 'eight-direction bottom surface 124 is lower than the right and left portions 127, 128 of the bottom surface 124. The left and right portions 127 and 128 are respectively connected to the two side plates 14. The edges of the side plates 14 extend horizontally outwardly to form an edge 16. Each of the fasteners 50 has a "T" shape as a whole, and includes a connecting portion 52 and a fitting portion 54. The connecting portion 52 is connected to the portion of the edge 16 of the heat collecting block 1 by riveting, and may of course be joined by welding or screwing. The fitting portion 54 extends longitudinally from both ends of the connecting portion 52 to be parallel to the edge 16. A hole 540 is formed in each end of the mounting portion 54 for the screw 1 of the heat collecting block 10 to the circuit board 70 to be pierced. The four fitting holes 54 on the two clips 50 are symmetrically distributed with respect to the axis X-X. The heat pipe 30 includes an evaporation end 32 and a condensation end 34 having a capillary structure inside and filled with a working liquid (not shown). The evaporation end 32 of the heat pipe 30 is placed in the space 13 formed by the heat collecting block 1 , and the outer surface 36 of the evaporation end 32 is connected to the top surface 122 of the heat collecting block 10. The cold-extinguishing end 34 is extended to the fin group 90 to be thermally connected. The fin set 90 includes a plurality of fins arranged in parallel, and an air passage 92 is formed between each adjacent fin. A fan (Fig. 8 1296367 - not available) can be placed on one side of the fin set 90, and the resulting airflow passes through the air passages 92 to dissipate the fin sets 90. When assembled, as shown in FIG. 1, the heat collecting block 1 is placed on the CPU 80, and its bottom surface 124 is in contact with the top surface of the CPU 80. As shown in Fig. 3, the central portion 126 of the heat collecting block 10 abuts against the central portion of the CPU 80, and the left and right portions 127, 128 abut against the peripheral portion of the CPU 80. In order to improve the thermal conductivity, some thermal interface material such as a thermal paste (not shown) or the like is usually filled between the bottom surface 124 of the heat collecting block 10 and the outer surface of the cpu 8 〇 φ. The evaporation end 32 of the heat pipe 30 is housed in the space 13 formed by the heat collecting block 1 , and its outer surface 36 is in direct contact with the top surface 122 of the heat collecting block 1〇. The condensation end 34 of the heat pipe 3〇 is connected to the fin group 9〇. In the case where the heat sink is mounted on the cpu 80, the heat pipe 3〇 and the heat collecting block 1〇 may be first joined by welding. The screw 100 is locked to the screw hole on the circuit board through the four mounting holes 54 of the clip 50 to fix the heat collecting block 1〇 to the circuit board 7 〇. At this point, the assembly process of the heat sink is completed. Φ When the filament is placed, the heat generated by the CPU 8G is transferred to the substrate 12 of the heat collecting block 10 in time. The working liquid 32 in the heat pipe 3 occupies heat to become a gas, and then flows to the condensing end 34 where the gas releases heat and is converted into a liquid state. Since the heat pipe 3 is provided with a capillary structure, these working liquids are returned to the evaporation end 32 of the heat pipe 3 by the capillary force, so that the heat absorption and heat release processes are repeated. Because the heat generated by the cpu 8〇 can be transmitted to the fin group 9() in time, and then the forced airflow (direction shown by the arrow in the figure i) is dissipated by the fan to dissipate heat from the reading group, thereby dissipating heat. Go to the surroundings. 9 1296367 When the heat collecting block 10 is mounted on the CPU 80, the heat collecting block 10 is mainly fixed to the circuit board 70 by the force of the screws 100 around it. Since the force of the screw 100 is applied to the clip 50, the clip 50 is engaged with the edge 16 of the heat collecting block 10, so that the left and right portions 127, 128 of the substrate 12 are subjected to a greater force than the intermediate portion 126 thereof. The left and right parts 127, 128 produce relatively large deformations. The substrate 12 of the heat collecting block 10 has a parabolic shape 'the intermediate portion 126 is lower than the left and right portions 127, 128, so that the final deformation of the substrate 12 is approximately one plane, so that the intermediate portion 126 of the substrate 12 is added. The force at the center portion of the CPU 80 is equivalent to the force applied to the peripheral portions of the CPU 80 by the left and right portions 127, 128 of the substrate 12. That is, the force applied to the CPU 80 by the heat collecting block 10 is substantially uniform, and each portion of the substrate 12 of the heat collecting block 10 is in close contact with the CPu 80. Therefore, the heat of the central portion of the CPU 80 can be transferred to the heat collecting block 1及时 in time to avoid the generation of the hot zone, and the CPU 80 can be safely and effectively operated. Since the force applied to the respective portions of the CPU 80 is related to the shape of the heat collecting block 1', it is possible to adapt the CPU of different heat loads by changing the specific shape of the heat collecting block 10. For example, by increasing the curvature of the heat collecting block 1 〇 substrate 12, the vertical distance between the intermediate portion I26 and the peripheral portion will increase. Therefore, the intermediate portion 126 of the substrate 12 after assembly is more intimately contacted with the cpu 8 core portion to reduce the contact thermal resistance between the two. This design is especially suitable for dual-core CPUs that generate more heat. As long as the bottom surface of the heat collecting block has a curved shape, the middle portion thereof is lower than the peripheral portion, and the force applied to the central portion of the cpu increases. The shape of the bottom surface of the plate is not limited to the above-described parabolic structure, and may be a spherical surface. A curved bottom surface with a cylindrical or surface-like shape. 1296367 The side plates 14 of the same heat collecting block 10 may also be formed to extend obliquely along both sides of the substrate 12. For example, it may be inclined outward and upward, and a space is formed between the side plates and the substrate to gradually expand upward in the direction of the axis X-X. It may also be inclined inwardly and upwardly, which forms a space that tapers upward in the direction of the axis X-X. The present invention may be embodied in other forms without departing from the spirit of the invention, and is not limited to the embodiments described above. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an assembled view of a preferred embodiment of a heat sink according to the present invention and related components. Figure 2 is an exploded perspective view of the heat sink shown in Figure 1. Figure 3 is an enlarged view of the portion of the circle III of Figure 2. [Main component symbol description] Heat collecting block 10 Screw 100 Substrate 12 Top surface 122 Base surface 124. Substrate intermediate portion 126 Substrate left portion 127 Substrate right portion 128 Space 13 Side plate 14 Edge 16 Heat pipe 30 Evaporating end 32 Condensing end 34 Outer surface 36 Buckle 50 Connecting portion 52 Mounting portion 54 Mounting hole 540 Circuit board 70 CPU 80 Foil set 90 π 1296367 Ventilation path 92
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