TWI411385B - Heat sink and heat dissipation device using same - Google Patents

Abstract

A heat sink includes a first fin unit and a second fin unit. The first fin unit includes a plurality of first heat dissipation fins stacked together. Each of the first heat dissipation fins includes a main body and a flange extending perpendicularly from one end of the main body. The second fin unit includes a plurality of second heat dissipation fins stacked together. Each of the second heat dissipation fins includes a main body and a flange extending perpendicularly from one end of the main body. When assembled, the main body of an outermost first heat dissipation fin of the first fin unit and the main body of the outermost second heat dissipation fin, which is next to the first fin unit, of the second fin unit contact with each other. The flange of each of the first heat dissipation fins of the first fin unit extends towards a front side of the heat sink, and the flange of each of the second heat dissipation fins of the second fin unit extends towards an opposite rear side of the heat sink.

Description

Radiator and heat sink using the same

The present invention relates to a heat sink, and more particularly to a heat sink for dissipating heat from a heat-generating electronic component and a heat sink using the heat sink.

In the field of heat dissipation, a heat sink is generally used to dissipate heat-generating electronic components. The heat sink includes a substrate and a plurality of heat-dissipating fins disposed on the substrate. Each of the heat dissipation fins includes a body and a flange that is bent in the same direction from both sides of the body. The heat dissipating fins are sequentially arranged along the longitudinal direction of the substrate, and the folded edges of each of the heat dissipating fins are in contact with the main body of the adjacent heat dissipating fins, and a joint surface is respectively formed at the top end and the bottom end of the heat sink. The substrate is in contact with the heat-generating electronic component, and the heat-dissipating fin is soldered to the substrate by soldering.

However, in the above soldering process, solder and flux are required, especially in the soldering process of different materials, such as aluminum and copper soldering, and nickel plating or other special treatment is required. In the soldering process, the solder is easily left between the adjacent heat sink fins, and the positioning of each heat sink fin is based on the adjacent heat sink fins on the front side thereof, so that the latter heat sink fins are opposite to each other. There is a deviation between the actual position of the previous heat sink fin and the position at which it should be designed. In the prior art, the heat dissipating fins of the heat sink are arranged from one side to the other side, and the above-mentioned deviations are superimposed on each other, so that the rearmost heat radiating fins are compared with the most The front fins produce a large deviation, so that the shape of the fins finally arranged is different from the standard that should be achieved when designing, which affects the combination of the heat sink and other components, and therefore needs to be improved.

In view of the above, it is necessary to provide a heat sink which can reduce the dimensional deviation of the heat radiating fins from each other and the actual design, and a heat sink using the heat sink.

A heat sink includes a first fin set and a second fin set disposed side by side, the first fin set includes a plurality of first heat sinks, and the second fin set includes a plurality of second heat sinks, each A first heat sink comprises a body and a flange formed by bending an end of the body, each second heat sink comprises a body and a flange formed by bending an end of the body, and the fold on the first heat sink The side is opposite to the flange on the second heat sink, and the body of the first heat sink at the junction of the first fin group and the second fin group abuts the body of the second heat sink, and the remaining first heat dissipation The sheet and each of the second fins are respectively arranged from the joint to the sides of the heat sink.

A heat dissipating device includes a heat sink including a first fin set and a second fin set disposed side by side, the first fin set including a plurality of first fins, and the second fin set includes a plurality of a heat sink, each of the first heat sinks includes a body and a flange formed by bending an end of the body, each second heat sink comprising a body and a flange formed by bending an end of the body, the first heat sink The flange on the heat sink is opposite to the flange on the second heat sink, and the body of the first heat sink at the junction of the first fin group and the second fin group abuts the body of the second heat sink. The remaining first heat sinks and the second heat sinks are respectively connected from the joint The directions on both sides of the heat sink are arranged.

Compared with the prior art, the heat sink is arranged side by side by the first fin set and the second fin set, and is arranged in the opposite direction by the respective folded edges, so that the heat sink is arranged from the middle to the both sides, minus The effect of cumulative tolerances on the arrangement of small heat sinks is achieved to achieve the size of the heat sink required for the design.

10‧‧‧Substrate

20‧‧‧ radiator

20a‧‧‧First fin set

20b‧‧‧second fin set

30‧‧‧heat pipe

40‧‧‧Heat plate

220‧‧‧First heat sink

222‧‧‧second heat sink

2202, 2222‧‧‧ ontology

2204, 2224‧‧‧ first fold

2206, 2226‧‧‧ second fold

1 is a perspective assembled view of a first embodiment of a heat sink according to the present invention.

2 is an assembled, isometric view of a second embodiment of a heat sink according to the present invention.

Hereinafter, the heat sink of the present invention will be described in detail with reference to the accompanying drawings.

Figure 1 shows a first embodiment of the heat sink of the present invention. The heat sink includes a substrate 10 and a heat sink 20 attached to the substrate 10 .

The substrate 10 has a flat shape and is made of copper having good thermal conductivity. The upper surface of the substrate 10 is a flat bonding surface. The lower surface of the substrate 10 can be directly contacted with a heat-generating electronic component (not shown) through a heat-conducting medium and absorbed by heat and then radiated through the heat sink 20.

The heat sink 20 includes a first fin set 20a and a second fin set 20b disposed side by side, wherein the first fin set 20a includes a plurality of first heat sinks 220, and the second fin set 20b includes a plurality of second heat sinks 222 The first heat sink 220 and the second heat sink 222 are each made of a metal foil.

Each of the first fins 220 includes a rectangular body 2202 and a first flange 2204 and a second flange formed by bending from a bottom end and a top end of the body 2202 toward the same side. 2206, the first flange 2204 and the second flange 2206 are both perpendicular to the body 2202. The first flange 2204 and the second flange 2206 of each first heat sink 220 are adjacent to a first heat sink 220. The bodies 2202 are in contact with each other, and a flat surface is formed on the bottom end and the top end of the heat sink 20, respectively. The widths of the flanges 2204, 2206 of each of the first fins 220 are equal, and are combined to form an equal spacing between the bodies 2202 of the adjacent two first fins 220.

Each of the second fins 222 includes a rectangular body 2222 and a first flange 2224 and a second flange 2226 which are bent from the bottom end and the top end of the body 2222 to the same side. The first flange 2224 and The second hem 2226 is perpendicular to the body 2222, and the first hem 2224 and the second hem 2226 of each second heat sink 222 are in contact with the body 2222 of a second heat sink 222 adjacent thereto. The bottom end and the top end of the heat sink 20 respectively form a plane. The widths of the flanges 2224 and 2226 of each of the second heat sinks 222 are equal, and are combined to form an equal spacing between the bodies 2222 of the adjacent two second heat sinks 222, and the flanges of each of the second heat sinks 222 are folded. The width of 2224, 2226 is greater than the width of the flanges 2204, 2206 of each first fin 220.

The heat sink 20 is located on the upper surface of the substrate 10, wherein the body 2202 of the first heat sink 220 located at the rightmost side of the first fin set 20a and the leftmost side of the second fin set 20b The main body 2222 of the second heat sink 222 abuts against each other, and the remaining first heat sinks 220 are arranged in the left direction with the rightmost first heat sink 220 as a reference, and the remaining second heat sinks 222 are cooled by the leftmost second heat sink 222. The sheets 222 are arranged to the right in order, that is, the flanges 2204 and 2206 on the first heat sink 220 and the flanges 2224 and 2226 on the second heat sink 222 are reversed. The body 2202 of the first heat sink 220 at the junction of the first fin set 20a and the second fin set 20b abuts the body 2222 of the second heat sink 222, and the remaining first heat sinks 220 and the second heat sink The sheets 222 are respectively arranged from the joint to the sides of the heat sink 20. The fins 220 and 222 are sequentially soldered to the bonding surface of the substrate 10 at the first flanges 2204 and 2224 at the bottom end, so that the flanges 2204 and 2206 of the two sets of fins 20a and 20b are The edges 2224, 2226 are opposite in direction.

The heat sink 20 is disposed such that the first heat sink 220 and the second heat sink 222 located at the outermost side of the heat sink 20 are respectively received only by the first heat sink 220 located on the left side of the heat sink 20 and on the right side of the heat sink 20 The influence of the second heat sink 222 causes the final arrangement of the heat sinks 220 and 222 to be close to the standard that should be achieved when designing, and improves the accuracy of the heat sink 20, thereby adapting to the heat dissipation field where the required standard is more and more improved. At the same time, the width of the flanges 2224, 2226 of each of the second fins 222 is greater than the width of the flanges 2204, 2206 of each of the first fins 220, so that the distance between each adjacent first fins 220 is It is smaller than the distance between each adjacent two second heat sinks 222. When the heat sink 20 is used with a fan, it can cooperate with the fan flow field condition and the wind pressure to provide rectification efficiency. For example, the portion of the first heat sink 220 having a higher density of the heat sink 20 faces the position where the air volume at the fan air outlet is larger and the wind pressure is stronger, and the portion of the second heat sink 222 having a lower density faces the fan. At the tuyere, the air volume is small and the wind pressure is weak, so as to achieve better heat dissipation.

Figure 2 shows a second embodiment of the heat sink of the present invention. The difference between this embodiment and the previous embodiment is that the heat dissipating device does not include the substrate 10, and includes a heat absorbing plate. 40 and a heat pipe 30 connected between the heat absorbing plate 40 and the heat sink 20. In this embodiment, the heat pipe 30 is a flat heat pipe. One end of the heat pipe 30 can be adhered to the top end of the heat sink 20 by soldering, and the other end of the heat pipe 30 is in thermal contact with a heat absorbing plate 40. The board 40 is in contact with the heat-generating electronic component and absorbs heat thereof, and is then conducted to the heat sink 20 through the heat pipe 30, and is radiated outward through the first heat sink 220 and the second heat sink 222.

In summary, the present invention conforms to the requirements of the invention patent, and proposes a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be covered by the following claims.

10‧‧‧Substrate

20‧‧‧ radiator

20a‧‧‧First fin set

20b‧‧‧second fin set

220‧‧‧First heat sink

222‧‧‧second heat sink

2202, 2222‧‧‧ ontology

2204, 2224‧‧‧ first fold

2206, 2226‧‧‧ second fold

Claims (10)

A heat sink is improved in that the heat sink includes a first fin set and a second fin set disposed side by side, the first fin set includes a plurality of first heat sinks, and the second fin set includes a plurality of second fins a heat sink, each of the first heat sinks includes a body and a flange formed by bending an end portion of the body, and each of the second heat sinks includes a body and a flange formed by bending an end portion of the body, the first The flange on the heat sink is opposite to the flange on the second heat sink, and the body of the first heat sink at the junction of the first fin group and the second fin group abuts the body of the second heat sink, and the rest Each of the first heat sinks and the second heat sinks are respectively arranged from the joint to the sides of the heat sink, and the adjacent first heat sinks directly abut each other, and the adjacent second heat sinks directly abut each other. . The heat sink according to claim 1, wherein the folded edges of the first heat sink are respectively formed at the top end and the bottom end of the first heat sink, and are bent toward the same side of the body of the first heat sink. . The heat sink according to claim 1, wherein the folded edges on the second heat sink are respectively formed on the top end and the bottom end of the second heat sink, and are bent toward the same side of the body of the second heat sink. . The heat sink according to claim 1, wherein the width of the flange on the first heat sink is different from the width of the flange on the second heat sink, so that the first heat sink and the second heat sink have different arrangements. density. A heat sink comprising a heat sink, the improvement comprising: the heat sink comprising a first fin set and a second fin set arranged side by side, the first fin set comprising a plurality of first heat sinks, the second fin set includes a plurality of second heat sinks, each of the first heat sinks includes a body and a flange formed by bending an end of the body, each second heat sink comprising a body and a flange formed by bending the end portion of the body, a flange on the first heat sink and a flange on the second heat sink are oppositely disposed, and the first fin group and the second fin group are connected to each other The body of a heat sink abuts against the body of the second heat sink, and the other first heat sinks and the second heat sinks are respectively arranged from the joint to the sides of the heat sink, and the adjacent first heat sinks are directly connected to each other. Abutting, the adjacent second fins also abut each other directly. The heat dissipating device of claim 5, wherein the folded edges of the first heat sink are respectively formed at the top end and the bottom end of the first heat sink, and are bent toward the same side of the body of the first heat sink. . The heat dissipating device of claim 5, wherein the folded edges on the second heat sink are respectively formed on the top end and the bottom end of the second heat sink, and are bent toward the same side of the body of the second heat sink. . The heat dissipating device of claim 5, wherein the width of the folded edge of the first heat sink is different from the width of the folded edge of the second heat sink, so that the first heat sink and the second heat sink have different arrangements. density. The heat dissipating device of claim 5, wherein the folded edge of the first heat sink is formed at a top end and a bottom end of the first heat sink, and the folded edge of the second heat sink is formed at a second heat dissipation The heat sink further includes a substrate disposed on the bottom end of the heat sink and conforming to the folded edges of the bottom ends of all the first and second heat sinks. The heat dissipating device of claim 5, wherein the folded edge of the first heat sink is formed at a top end and a bottom end of the first heat sink, the second The heat sink is formed at the top end and the bottom end of the second heat sink, and the heat sink further includes a heat pipe, one end of the heat pipe is disposed at the top end or the bottom end of the heat sink and is adjacent to the top ends of all the first and second heat sinks Or the bottom edge of the fold fits.