M417597 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作係有關於一種導熱結構，尤指一種導熱體結構。 【先前技術】 [0002] 電腦中包含有許多晶片，這些晶片在運作時容易產生高 溫，其中最具代表的晶片以中央處理器（Central Processing Unit，CPU) 為例 ，其本身製造過程與其他晶 片大同小異，但中央處理器是一顆整合性的晶片，其裡 面含有百萬顆以上的電晶體（也就是電阻電路，可用來 進行電腦裡的内建指令），在這些電晶體裡面，事先儲 存了專有的指令集，即為命令電腦工作的基本程式，以 執行電腦所需的一般性工作。因此，中央處理器為整部 電腦中最核心、最重要的元件，其也相較電腦中其他元 件更須避免發生高溫而無法運作。 [0003] 傳統使用在中央處理器的散熱器，如第一圖所示，此散 熱器包含一散熱板10、一導熱塊20及一散熱風扇30，散 熱板10底部設有一容置凹槽101，導熱塊20固定並突出於 容置凹槽101，散熱板10上設有一體成型之複數片散熱鰭 片102，該等散熱鰭片102上方安裝有散熱風扇30 ;之後 ，將散熱板10安裝在印刷電路板40上，同時利用導熱塊 20突出散熱板10，以更壓制貼合於中央處理器50上方， 最後經由導熱塊20將中央處理器50運轉時所產生的熱量 帶至散熱板10，再藉由散熱風扇30將熱量吸或吹至外界 ，而達到散熱效果。 [0004] 然而，中央處理器50的表面設計上並非真平面，其表面 表單編號A0101 第3頁/共15頁 M417597 仍有公差存在而產生凹凸處，因此中央處理器50與導熱 塊20之間會有間隙產生，無法獲得良好之貼附性，且在 這些間隙間會存留有空氣，而造成導熱膏無法順利填補 ，進而導致導熱及散熱的效果變差。同理，上述散熱板 10所形成之容置凹槽101其尺寸必須非常平整，才能使導 熱塊20在安裝時能保持密合，但即使非常平整，因係利 用加工機具所成形之容置凹槽101，在設計上仍須有公差 存在，使散熱板10與導熱塊20之間會有間隙產生，也無 法獲得良好之貼附性，故傳統散熱器存有加工所產生的 公差問題，而無法與中央處理器緊密貼合，導致其導熱 及散熱的效果不佳。 [0005] 有鑑於此，本創作人遂針對上述現有技術，特潛心研究 並配合學理的運用，盡力解決上述之問題點，即成為本 創作人改良之目標。 【新型内容】 [0006] 本創作之一目的，在於提供一種導熱體結構，其係利用 導熱體和發熱元件之間具有良好的貼附性，以提高導熱 體的散熱效率。 [0007] 為了達成上述之目的，本創作係提供一種導熱體結構， 裝設在一發熱元件上方，該導熱體結構包括一基板，該 基板中心對應所述發熱元件中心設有一突出部，該突出 部具有一非平面並和所述發熱元件熱接觸。 [0008] 本創作還具有以下功效，當發熱元件的表面為凹陷時， 本創作和發熱元件之間具有良好之貼附性，以提高本創 作導熱體的散熱效率；當發熱元件的表面為凸出時，本 表單编號A0101 第4頁/共15頁 幻作可確K地接觸發熱S件的中心而達到本創作導熱 體具有良好的散熱效率。另外，本創作導熱體可避免和 發熱兀件之__存有空氣，*便利導熱膏的填補， 進而保持梢料純科熱及散熱效果。又本創作 可避免導熱膏溢出，以避免後續需增加清潔之步戰，導 致組裝成本之提高。再者，本創作可將《元件運轉所 產生的熱量直接傳導至散熱縛片’再藉由散熱縛片將熱 量排至外界，而讓本創作達到快速散熱之特點。 【實施方式】 有關本創作之詳細說明及技術内容，將配合圖式說明如 下，然而所附圖式僅作為說明用途，並非用於侷限本創 作。 請參考第二至四圖所示，本創作係提供一種導熱體結構 ，裝設在一發熱元件100上方，發熱元件1〇〇内部中心設 有一晶片200，且發熱元件1〇〇可為一中央處理器，但不 以此為限，此導熱體結構主要包括一基板丨，基板丨中心 對應發熱元件100中心設有一突出部11，突出部U具有一 非平面111並和發熱元件1〇〇熱接觸；其中，突出部長 寬尺寸為15xl0mra ’但實際尺寸大小以配合發熱元件1〇〇 的尺寸為主’不以此為限；另外，此非平面111為一外凸 曲面’且非平面111的最低點和最高點之縱向距離L介於 〇· 10隨至0. 15mm，此縱向距離L為配合發熱元件1〇〇的 外殼體經過加工所產生的表面公差，因此實際的縱向距 離L不以此為限。 本創作更包括一導熱膏2，基板1的突出部11對應發熱元 表單編號A0101 第5頁/共15頁 M417597 件100中心固定，使導熱膏2塗佈在突出部Η及發熱元件 100之間。 [0012]本創作導熱體結構之使用狀態，其係利用基板1的突出部 11對應發熱元件1〇〇中心固定，此時發熱元件1〇()的表面 設計上並非真平面’其表面仍有公差存在而產生凹凸處 ’因此’如第三圖所示，當發熱元件1〇〇的表面為凹陷時 ’非平面111為一外凸曲面以貼合發熱元件10〇，使發熱 元件100和突出部11之間具有良好之貼附性，以提高本創 作導熱體的散熱效率；如第四圖所示，當發熱元件100的 表面為凸出時，此非平面111為一外凸曲面，使本創作突 出部11相較習知呈平面的導熱塊更可產生較大的壓制力 ，以壓制發熱元件1〇〇申心的表面，更確實將晶片2〇〇產 生的熱量傳導至基板1，故本創作讓突出部U確實地接觸 發熱元件10 0的中心，而達到本創作導熱體具有良好的散 熱效率。 [0013]另外’發熱元件100和基板1的表面或多或少都存在有機 械加工所產生的公差，因此發熱元件1〇〇和基板i之間會 有間隙產生，這些間隙間會存留有空氣，而造成導熱膏 無法順利填補，進而導致導熱及散熱的效果變差。但本 創作非平面111為一外凸曲面時，基板1經由突出部丨！對 應發熱元件100中心開始向外擴大接觸面積，而使突出部 11及發熱元件100之間的導熱膏2逐漸由發熱元件100的 中心向外壓擠’因此帶動間隙之間的空氣也逐漸向外移 動，最後空氣會經由導熱膏2的外側排出，使本創作導熱 體可避免發熱元件100和基板1之間的間隙存有空氣，而 表單編號A0101 第6頁/共15頁 M417597 便利導熱膏2的填補，進而保持本創作導熱體的導熱及散 熱效果。 [0014]明參考第五至六圖所示，係本創作導熱體結構第二實施 例，其中以突出部11的中心為圓心設有至少一環型凹槽 12，此一或複數的環型凹槽12可容置位在突出部u及發 熱兀件100之間的導熱膏2，使突出部11對應發熱元件 100接觸之過程’導熱膏2不易溢出至發熱元件剛未與突 出部11接觸的其他地方’以避免後續需增加清潔之步雜 ，導致組裝成本之提高。 [_請參考第七至八圖所示，係本創作導熱體結構之第三至 四實施例，其中基板i朝遠離突出部u方向延伸有複數散 熱轉片13，相較習知利用散熱板1G及導熱塊20之組合， 反而讓散熱板10和導熱塊20之間存有間隙產生，而無法 與中央處理器緊密貼合，導致其導熱及散熱的效果不佳 :本創作可自S板1 一體成型有該等散熱縛片13，或自基 板1上連接有該等散熱韓片13，而非習知利用組合之方式 ，故此，本創作可將發熱元件1〇〇 (其可為中央處理器， 但不以此為限）運轉所產生的熱量直接傳導至散熱趙片 13 ’再藉由散熱錄片13將熱量排至外界，而縣創作達 到快速散熱之特點。 _6]請參考第九圖所示，係本創作導熱邀結構之第五實施例 ，其中突ώ部11可自基板…表面局部隆起，或如第二至 八圖所示，突出部11可自基板1的表面全部隆起，但不論 突出部11是自基板1的表面局部或全部隆起，其所具有的 功效皆相同如上述。 表單編號Α010Ι 第7頁/共15頁 M417597 [0017] 綜上所述，本創作之導熱體結構，確可達到預期之使用 目的，而解決習知之缺失，並具有產業利用性、新穎性 與進步性，完全符合新型專利申請要件，爰依專利法提 出申請，敬請詳查並賜准本案專利，以保障創作人之權 利。 【圖式簡單說明】 [0018] 第一圖係習知的散熱器之立體分解圖。 [0019] 第二圓係本創作導熱體結構第一實施例之組合示意圖。 [0020] 第三圖係本創作導熱體結構第一實施例之使用狀態示意 圖。 [0021] 第四圖係本創作導熱體結構第一實施例之另一使用狀態 示意圖。 [0022] 第五圖係本創作導熱體結構第二實施例之立體圖。 [0023] 第六圖係本創作導熱體結構第二實施例之使用狀態示意 圖。 [0024] 第七圖係本創作導熱體結構第三實施例之剖面示意圖。 [0025] 第八圖係本創作導熱體結構第四實施例之剖面示意圖。 [0026] 第九圖係本創作導熱體結構第五實施例之剖面示意圖。 【主要元件符號說明】 [0027] 10…散熱板 [0028] 101…容置凹槽 [0029] 102…散熱鰭片 表單编號A0101 第8頁/共15頁 M417597M417597 V. New description: [New technical field] [0001] This creation is about a heat-conducting structure, especially a heat-conducting structure. [Prior Art] [0002] Computers contain many wafers that are prone to high temperatures during operation. The most representative wafers are Central Processing Units (CPUs), which are manufactured by themselves and other wafers. The same is true, but the central processor is an integrated chip, which contains more than one million transistors (that is, resistor circuits, which can be used to carry out built-in instructions in the computer). In these transistors, they are stored in advance. A proprietary instruction set is the basic program that commands the computer to work to perform the general work required by the computer. Therefore, the central processing unit is the most important and important component of the entire computer. It is also more difficult to operate than other components in the computer. [0003] A heat sink is conventionally used in a central processing unit. As shown in the first figure, the heat sink includes a heat sink 10, a heat conducting block 20, and a heat dissipating fan 30. The bottom of the heat sink 10 is provided with a receiving recess 101. The heat-dissipating block 20 is fixed and protrudes from the accommodating recess 101. The heat-dissipating plate 10 is provided with a plurality of integrally formed heat-dissipating fins 102. The heat-dissipating fins 102 are mounted above the heat-dissipating fins 102. Thereafter, the heat-dissipating plate 10 is mounted. On the printed circuit board 40, the heat dissipating plate 10 is simultaneously protruded by the heat conducting block 20 to be pressed against the central processing unit 50, and finally the heat generated when the central processing unit 50 is operated via the heat conducting block 20 is brought to the heat dissipating plate 10. Then, the heat dissipation fan 30 sucks or blows heat to the outside to achieve a heat dissipation effect. [0004] However, the surface of the central processing unit 50 is not designed to be a true plane, and its surface form number A0101, page 3/15 pages, M417597, still has tolerances to generate irregularities, so between the central processing unit 50 and the thermal block 20. There will be gaps, and good adhesion will not be obtained, and air will remain between these gaps, and the thermal paste will not be filled smoothly, resulting in poor heat conduction and heat dissipation. Similarly, the accommodating recess 101 formed by the heat dissipating plate 10 must be very flat in size, so that the heat conducting block 20 can be kept in close contact during installation, but even if it is very flat, it is formed by the processing tool. The groove 101 is still required to have a tolerance in design, so that a gap is generated between the heat dissipation plate 10 and the heat conduction block 20, and good adhesion is not obtained, so the conventional heat sink has a tolerance problem caused by processing. Cannot be closely attached to the central processing unit, resulting in poor heat conduction and heat dissipation. [0005] In view of this, the present creator has made great efforts to solve the above problems by focusing on the above-mentioned prior art and focusing on the application of the theory, that is, the goal of the creator's improvement. [New Content] [0006] One of the aims of the present invention is to provide a heat conductor structure which utilizes good adhesion between a heat conductor and a heat generating component to improve heat dissipation efficiency of the heat conductor. [0007] In order to achieve the above object, the present invention provides a heat conductor structure, which is disposed above a heat generating component, the heat conductor structure includes a substrate, and the center of the substrate is provided with a protrusion corresponding to the center of the heat generating component. The portion has a non-planar surface and is in thermal contact with the heat generating component. [0008] The present invention also has the following effects: when the surface of the heat-generating component is recessed, the creation and the heat-generating component have good adhesion to improve the heat dissipation efficiency of the heat-conducting body; when the surface of the heat-generating component is convex When the time comes, this form number A0101 page 4 / a total of 15 pages of magic can be sure to contact the center of the hot S piece to achieve the heat dissipation efficiency of the original heat conductor. In addition, the creation of the heat conductor can avoid the heat of the 兀 __ stored air, * facilitate the filling of the thermal paste, and thus maintain the pure heat and heat dissipation effect of the tip material. In addition, this creation can avoid the overflow of the thermal paste to avoid the need to increase the cleaning step, resulting in an increase in assembly costs. Furthermore, this creation allows the heat generated by the operation of the component to be directly transmitted to the heat-dissipating tabs and then discharges the heat to the outside through the heat-dissipating tabs, thereby allowing the creation to achieve rapid heat dissipation. [Embodiment] The detailed description and technical contents of the present invention will be described below with reference to the drawings, but the drawings are for illustrative purposes only and are not intended to limit the present invention. Referring to Figures 2 to 4, the present invention provides a heat conductor structure disposed above a heat generating component 100. A heat generating component 1 is internally provided with a wafer 200, and the heat generating component 1 is a central portion. The heat conductor structure mainly includes a substrate 丨, and the center of the substrate 对应 corresponding to the heat generating component 100 is provided with a protruding portion 11 having a non-planar surface 111 and being heated by the heat generating component 1 Contact; wherein, the protruding dimension is 15x10 mma 'but the actual size is matched with the size of the heating element 1 为主 as the main 'not limited thereto; in addition, the non-planar 111 is a convex curved surface 'and non-planar 111 The longitudinal distance L between the lowest point and the highest point is between 〇·10 and 0.15 mm. This longitudinal distance L is the surface tolerance generated by the processing of the outer casing of the heating element 1〇〇, so the actual longitudinal distance L is not This is limited. The creation further includes a thermal paste 2, and the protruding portion 11 of the substrate 1 corresponds to the heat element form number A0101, page 5 / 15 pages, M417597 piece 100 center fixing, so that the thermal paste 2 is coated between the protruding portion Η and the heating element 100 . [0012] The state of use of the heat conductor structure of the present invention is fixed by the protrusion 11 of the substrate 1 corresponding to the center of the heating element 1 , and the surface of the heating element 1 is not designed to be true plane. The tolerance exists and the unevenness is generated. Therefore, as shown in the third figure, when the surface of the heat generating component 1 is recessed, the non-planar surface 111 is a convex curved surface to fit the heat generating component 10, so that the heat generating component 100 and the protruding The portion 11 has good adhesion between the portions 11 to improve the heat dissipation efficiency of the heat conductor of the present invention; as shown in the fourth figure, when the surface of the heat generating component 100 is convex, the non-planar surface 111 is a convex curved surface, so that The artificial protrusion 11 can generate a larger pressing force than the conventional planar heat conducting block, so as to suppress the surface of the heating element 1 and more reliably transfer the heat generated by the wafer 2 to the substrate 1. Therefore, the creation makes the protrusion U positively contact the center of the heating element 100, and the heat conductor of the present invention has good heat dissipation efficiency. [0013] In addition, the surface of the heating element 100 and the substrate 1 has more or less tolerances generated by machining, so that a gap is generated between the heating element 1 and the substrate i, and air remains between the gaps. However, the thermal paste cannot be filled smoothly, and the heat conduction and heat dissipation effects are deteriorated. However, when the non-planar 111 is a convex curved surface, the substrate 1 passes through the protruding portion! Corresponding to the center of the heating element 100, the contact area is enlarged outward, and the thermal paste 2 between the protrusion 11 and the heating element 100 is gradually pressed outward by the center of the heating element 100. Therefore, the air between the gaps is gradually outward. After moving, the air is finally discharged through the outside of the thermal paste 2, so that the heat conductor of the present invention can prevent air from remaining in the gap between the heat generating component 100 and the substrate 1, and the form number A0101 is 6/15 M417597 convenient thermal paste 2 The filling, in order to maintain the heat conduction and heat dissipation effect of the original heat conductor. [0014] Referring to the fifth to sixth figures, a second embodiment of the present heat-conducting body structure is provided, wherein at least one annular groove 12 is provided with the center of the protrusion 11 as a center, and the one or more annular concaves The groove 12 can accommodate the thermal conductive paste 2 located between the protruding portion u and the heat generating element 100, so that the protruding portion 11 is in contact with the heating element 100. The thermal conductive paste 2 does not easily overflow until the heating element is not in contact with the protruding portion 11. Other places' to avoid the need to increase the number of cleaning steps, resulting in increased assembly costs. [ _____________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________ The combination of 1G and the heat conducting block 20 causes a gap between the heat radiating plate 10 and the heat conducting block 20 to be generated, and cannot be closely adhered to the central processing unit, resulting in poor heat conduction and heat dissipation: the creation can be from the S board. 1 The heat-dissipating clips 13 are integrally formed, or the heat-dissipating Korean sheets 13 are connected to the substrate 1 instead of the conventional combination. Therefore, the present invention can be used to heat the components 1 (which can be centrally The processor, but not limited to this, the heat generated by the operation is directly transmitted to the heat-dissipating film 13', and the heat is discharged to the outside by the heat-dissipating recording sheet 13, and the county creation achieves the characteristics of rapid heat dissipation. _6] Please refer to the ninth figure, which is a fifth embodiment of the heat conduction invitation structure, wherein the protrusion portion 11 can be locally raised from the surface of the substrate, or as shown in the second to eighth figures, the protrusion 11 can be self-exposed The surface of the substrate 1 is entirely raised, but the protrusion 11 is partially or completely raised from the surface of the substrate 1, and the effects thereof are the same as described above. Form No. Α 010 Ι Page 7 / Total 15 pages M417597 [0017] In summary, the heat conductor structure of the creation can achieve the intended purpose of use, and solve the lack of knowledge, and has industrial utilization, novelty and progress. Sexuality, in full compliance with the requirements of the new patent application, filed in accordance with the Patent Law, please check and grant the patent in this case to protect the rights of the creator. BRIEF DESCRIPTION OF THE DRAWINGS [0018] The first figure is an exploded perspective view of a conventional heat sink. [0019] A second circular system of the present invention is a combination of the first embodiment of the heat conductor structure. [0020] The third figure is a schematic view showing the state of use of the first embodiment of the present heat conductor structure. [0021] The fourth figure is a schematic view showing another use state of the first embodiment of the present heat conductor structure. [0022] The fifth figure is a perspective view of a second embodiment of the present heat conductor structure. [0023] Fig. 6 is a schematic view showing the state of use of the second embodiment of the present heat conductor structure. [0024] The seventh figure is a schematic cross-sectional view of a third embodiment of the present heat conductor structure. [0025] The eighth figure is a schematic cross-sectional view of a fourth embodiment of the present heat conductor structure. The ninth drawing is a schematic cross-sectional view of a fifth embodiment of the present heat conductor structure. [Main Component Symbol Description] [0027] 10... Heat Dissipation Plate [0028] 101...Receiving Groove [0029] 102... Heat Sink Flaw Form No. A0101 Page 8 of 15 M417597
[0030] 20···導熱塊 / [0031] 30···散熱風扇 [0032] 40···電路板 [0033] 50…中央處理器 [0034] 100…發熱元件 [0035] 200…晶片 [0036] 1…基板 [0037] 11…突出部 [0038] 111…非平面 [0039] 12…環型凹槽 [0040] 13…散熱鰭片 [0041] 2…導熱膏 [0042] L···縱向距離[0030] 20···thermal conduction block/[0031] 30···heat dissipation fan [0032] 40···circuit board [0033] 50... central processor [0034] 100...heating element [0035] 200...wafer [ 0036] 1...substrate [0037] 11...protrusion [0038] 111...non-planar [0039] 12...ring groove [0040] 13...heat dissipation fin [0041] 2...thermal paste [0042] L··· Vertical distance
表單编號A0101 第9頁/共15頁Form No. A0101 Page 9 of 15