TW201306726A - Heat sink assembly - Google Patents

Heat sink assembly Download PDF

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Publication number
TW201306726A
TW201306726A TW100126262A TW100126262A TW201306726A TW 201306726 A TW201306726 A TW 201306726A TW 100126262 A TW100126262 A TW 100126262A TW 100126262 A TW100126262 A TW 100126262A TW 201306726 A TW201306726 A TW 201306726A
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TW
Taiwan
Prior art keywords
heat
base
heat pipe
contact surface
pipe
Prior art date
Application number
TW100126262A
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Chinese (zh)
Inventor
Guo-He Huang
Original Assignee
Hon Hai Prec Ind Co Ltd
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Publication date
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Publication of TW201306726A publication Critical patent/TW201306726A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat sink assembly includes a base contacting a heat generating element and fins assembly. The base is flat. The base includes a first contact surface and a second contact surface opposite to the first contact surface. The base defines a slot at the second contact surface. The heat sink assembly further includes a heat pipe located in the slot. The fins assembly contacts the second contact surface and the heat pipe at the same time. The heat sink assembly has good heat dissipating effect.

Description

散熱裝置Heat sink

本發明涉及一種散熱裝置，尤指一種用於接觸電子元件之散熱裝置。The invention relates to a heat dissipating device, in particular to a heat dissipating device for contacting electronic components.

習知之電子元件散熱裝置一般是於電子元器件上設置散熱器，散熱器一般包括有基座、散熱鰭片及插入該散熱鰭片並連接該基座之熱傳導管，散熱鰭片之上部或側部固設有散熱風扇。散熱器具有良好之導熱性，電子元件產生之熱量由熱傳導管傳導到散熱鰭片上。散熱風扇產生之氣流將熱量迅速由散熱鰭片上帶離，從而達到散發熱量及冷卻電子元件之目的。而習知散熱鰭片往往僅與該熱傳導管連接，熱接觸面積有限，散熱效果不理想。The conventional electronic component heat sink generally has a heat sink disposed on the electronic component. The heat sink generally includes a base, a heat sink fin, and a heat conduction tube inserted into the heat sink fin and connected to the base, and the heat sink fin is upper or side. A cooling fan is fixed to the part. The heat sink has good thermal conductivity, and the heat generated by the electronic component is conducted by the heat conducting tube to the heat sink fin. The airflow generated by the cooling fan quickly dissipates heat from the fins to dissipate heat and cool the electronic components. Conventional heat sink fins are often only connected to the heat transfer tube, and the thermal contact area is limited, and the heat dissipation effect is not satisfactory.

鑒於以上內容，有必要提供一具有較好熱接觸面積之散熱裝置。In view of the above, it is necessary to provide a heat sink having a better thermal contact area.

一種散熱裝置，包括用於接觸發熱元件之基座及散熱鰭片組，該基座為平板狀，該基座包括用於接觸該發熱元件之第一接觸面及相對該第一接觸面之第二接觸面，該基座於該第二接觸面一側開設有凹槽，該散熱裝置還包括熱管，該熱管位於該凹槽內，該散熱鰭片組同時接觸該基座之第二接觸面及該熱管。A heat dissipating device includes a base for contacting a heat generating component and a heat dissipating fin set, wherein the base is in a flat shape, the base includes a first contact surface for contacting the heat generating component and a first contact surface opposite to the first contact surface a second contact surface, the base is provided with a groove on a side of the second contact surface, the heat dissipation device further includes a heat pipe, the heat pipe is located in the groove, and the heat dissipation fin group simultaneously contacts the second contact surface of the base And the heat pipe.

相對習知技術，本發明實施方式中之散熱裝置中該散熱鰭片組同時接觸該基座之第二接觸面及該熱管，可實現較好之散熱效果。Compared with the conventional technology, in the heat dissipation device of the embodiment of the present invention, the heat dissipation fin group simultaneously contacts the second contact surface of the base and the heat pipe, so that a better heat dissipation effect can be achieved.

本發明實施方式中涉及一種散熱裝置，該散熱裝置可應用於電子裝置中，如台式電腦、伺服器等，對發熱電子元件進行散熱。該散熱裝置可與其他輔助散熱元件，如導風罩、風扇等配合使用達到更好之散熱效果。Embodiments of the present invention relate to a heat dissipating device that can be applied to an electronic device, such as a desktop computer, a server, or the like, to dissipate heat from a heat-generating electronic component. The heat sink can be used in combination with other auxiliary heat dissipating components, such as an air hood, a fan, etc., to achieve better heat dissipation.

請參閱圖1，於一實施方式中，一散熱裝置可安裝於一電腦主機板100上用於給一發熱元件110散熱。該發熱元件110可為CPU、南、北橋晶片等。該散熱裝置包括一散熱鰭片組10，一基座30及安裝於該基座30上之熱管50。Referring to FIG. 1 , in one embodiment, a heat sink can be mounted on a computer motherboard 100 for dissipating heat from a heat generating component 110 . The heat generating component 110 can be a CPU, a south, a north bridge wafer, or the like. The heat sink includes a heat sink fin set 10, a base 30 and a heat pipe 50 mounted on the base 30.

該基座30為平板狀。該基座30可為矩形。該基座30包括一用於接觸該發熱元件110之第一接觸面31及相對該第一接觸面31之第二接觸面33。該基座30包括有一用於接觸該發熱元件110之熱接觸區332，於本實施方式中，該熱接觸區332位於該基座30之中間部位。該基座30於該熱接觸區332兩側分別開設有一通透之開口35。該開口35可大致為矩形。該基座30於該第二接觸面33一側開設有用於放置該熱管50之凹槽37。該凹槽37之深度小於該基座30之厚度。The base 30 has a flat shape. The base 30 can be rectangular. The base 30 includes a first contact surface 31 for contacting the heat generating component 110 and a second contact surface 33 opposite to the first contact surface 31. The susceptor 30 includes a thermal contact region 332 for contacting the heat generating component 110. In the present embodiment, the thermal contact region 332 is located at an intermediate portion of the susceptor 30. The pedestal 30 defines a transparent opening 35 on each side of the thermal contact area 332. The opening 35 can be substantially rectangular. The base 30 defines a recess 37 for placing the heat pipe 50 on a side of the second contact surface 33. The depth of the groove 37 is smaller than the thickness of the base 30.

於本實施方式中，該熱管50包括有一大致呈Z形之第一熱管51及兩大致呈L形之第二熱管53。該第一熱管51包括一第一主熱管511及兩連接於該第一主熱管511兩端之第一延伸管513，該第一主熱管511位於該熱接觸區332，該兩第一延伸管513延伸至該熱接觸區332兩側。每一第二熱管53包括一第二主熱管531及一第二延伸管533，該第二主熱管531位於該熱接觸區332內，該第二延伸管533部分圍繞該開口35。該第一主熱管511及該兩第二主熱管531並排設置。該兩第二熱管53於該基座30上呈中心對稱放置，即其中一第二熱管53可繞一中心點旋轉180與另一第二熱管53位置重合。In the present embodiment, the heat pipe 50 includes a first heat pipe 51 having a substantially Z shape and two second heat pipes 53 having a substantially L shape. The first heat pipe 51 includes a first main heat pipe 511 and two first extension pipes 513 connected to the two ends of the first main heat pipe 511. The first main heat pipe 511 is located in the thermal contact zone 332, and the two first extension pipes 513 extends to both sides of the thermal contact zone 332. Each of the second heat pipes 53 includes a second main heat pipe 531 and a second extension pipe 533. The second main heat pipe 531 is located in the heat contact zone 332, and the second extension pipe 533 partially surrounds the opening 35. The first main heat pipe 511 and the two second main heat pipes 531 are arranged side by side. The two second heat pipes 53 are placed symmetrically on the base 30, that is, one of the second heat pipes 53 can be rotated 180 about a center point to coincide with the position of the other second heat pipe 53.

該散熱鰭片組10包括有複數平行設置之散熱鰭片。The heat dissipation fin set 10 includes a plurality of heat dissipation fins disposed in parallel.

請繼續參閱圖2，組裝時，將該熱管50放置於該基座30之凹槽37內，使該熱管50完全位於該凹槽37內，此時，該熱管50之上表面與該基座30之第二接觸面33大致齊平。將該散熱鰭片組10藉由固定件或習知之卡扣裝置安裝於該基座30之第二接觸面33上，使該散熱鰭片組10同時與該基座30及該熱管50熱接觸。該散熱鰭片組10之複數散熱鰭片垂直於基座30之第二接觸面33。Referring to FIG. 2, during assembly, the heat pipe 50 is placed in the recess 37 of the base 30, so that the heat pipe 50 is completely located in the groove 37. At this time, the upper surface of the heat pipe 50 and the base The second contact surface 33 of 30 is substantially flush. The heat dissipation fin assembly 10 is mounted on the second contact surface 33 of the base 30 by a fixing member or a conventional fastening device, so that the heat dissipation fin assembly 10 is in thermal contact with the base 30 and the heat pipe 50 at the same time. . The plurality of heat dissipation fins of the heat dissipation fin set 10 are perpendicular to the second contact surface 33 of the base 30.

請繼續參閱圖3，使用時，將組裝後之散熱裝置安裝於該電腦主機板100上使該散熱裝置基座30之熱接觸區332接觸該發熱元件110。該發熱元件110產生熱量傳遞給該基座30，該基座30一方面直接傳遞給該散熱鰭片組10，另一方面藉由該熱管50將熱量間接傳遞給該散熱鰭片組10。Referring to FIG. 3, in use, the assembled heat sink is mounted on the computer motherboard 100 such that the thermal contact region 332 of the heat sink base 30 contacts the heat generating component 110. The heat generating component 110 generates heat transfer to the susceptor 30. The susceptor 30 is directly transferred to the heat sink fin set 10 on the one hand, and heat is transferred to the heat sink fin set 10 indirectly by the heat pipe 50.

該熱管50設置一個或多個，該熱管50之橫截面可為矩形、圓形或橢圓形。該凹槽37可根據該熱管50之形狀做相應設置。The heat pipe 50 is provided with one or more, and the heat pipe 50 may have a rectangular, circular or elliptical cross section. The groove 37 can be correspondingly arranged according to the shape of the heat pipe 50.

於本實施方式中，該熱管50之該第一主熱管511及該兩第二主熱管531設置於該熱接觸區332，而該第一延伸管513及該第二延伸管533延伸至間接熱接觸區332，這樣之熱管配置可有效地將熱量均勻傳遞至該基座30及該散熱鰭片組10，達到較好之散熱效果。In the present embodiment, the first main heat pipe 511 and the two second main heat pipes 531 of the heat pipe 50 are disposed in the thermal contact zone 332, and the first extension pipe 513 and the second extension pipe 533 extend to indirect heat. The contact area 332, such that the heat pipe arrangement can effectively transfer heat to the base 30 and the heat dissipation fin set 10 to achieve better heat dissipation.

於本實施方式中，為減少材料成本，該熱管50之密度可設置成大於該基座30之密度。例如，該熱管50由銅製成，該基座30由鋁製成。於使用較小密度材料之同時，可減輕整個散熱裝置之重量。In the present embodiment, to reduce material cost, the density of the heat pipe 50 can be set to be greater than the density of the susceptor 30. For example, the heat pipe 50 is made of copper, and the base 30 is made of aluminum. The use of a smaller density material reduces the weight of the entire heat sink.

於本實施方式中，該開口35可於不影響散熱效果之同時節省該基座30之材料成本。In the embodiment, the opening 35 can save the material cost of the susceptor 30 without affecting the heat dissipation effect.

另外，於本實施方式中，該熱管50與該第二接觸面製成齊平結構不會額外影響該散熱鰭片組10之接觸結構。In addition, in the embodiment, the heat pipe 50 and the second contact surface are formed in a flush structure without additionally affecting the contact structure of the heat dissipation fin group 10.

綜上所述，本發明係合乎發明專利申請條件，爰依法提出專利申請。惟，以上所述僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士其所爰依本案之創作精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。In summary, the present invention is in accordance with the conditions of the invention patent application, and the patent application is filed according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art to the spirit of the present invention should be included in the following claims.

10．．．散熱鰭片組10. . . Heat sink fin set

30．．．基座30. . . Pedestal

31．．．第一接觸面31. . . First contact surface

33．．．第二接觸面33. . . Second contact surface

332．．．熱接觸區332. . . Thermal contact zone

35．．．開口35. . . Opening

37．．．凹槽37. . . Groove

50．．．熱管50. . . Heat pipe

51．．．第一熱管51. . . First heat pipe

511．．．第一主熱管511. . . First main heat pipe

513．．．第一延伸管513. . . First extension tube

53．．．第二熱管53. . . Second heat pipe

531．．．第二主熱管531. . . Second main heat pipe

533．．．第二延伸管533. . . Second extension tube

100．．．主機板100. . . motherboard

110．．．發熱元件110. . . Heating element

圖1為本發明實施方式中一散熱裝置及一電腦主機板之立體分解圖。FIG. 1 is an exploded perspective view of a heat sink and a computer motherboard according to an embodiment of the present invention.

圖2為圖1中散熱鰭片組、基座與熱管之部分立體組裝圖。2 is a partial assembled view of the heat sink fin set, the base and the heat pipe of FIG. 1 .

圖3為圖1之立體組裝圖。Figure 3 is a perspective assembled view of Figure 1.

10．．．散熱鰭片組10. . . Heat sink fin set

30．．．基座30. . . Pedestal

31．．．第一接觸面31. . . First contact surface

33．．．第二接觸面33. . . Second contact surface

332．．．熱接觸區332. . . Thermal contact zone

35．．．開口35. . . Opening

37．．．凹槽37. . . Groove

50．．．熱管50. . . Heat pipe

51．．．第一熱管51. . . First heat pipe

511．．．第一主熱管511. . . First main heat pipe

513．．．第一延伸管513. . . First extension tube

53．．．第二熱管53. . . Second heat pipe

531．．．第二主熱管531. . . Second main heat pipe

533．．．第二延伸管533. . . Second extension tube

100．．．主機板100. . . motherboard

110．．．發熱元件110. . . Heating element

Claims (10)

一種散熱裝置，包括用於接觸發熱元件之基座及散熱鰭片組，該基座為平板狀，該基座包括用於接觸該發熱元件之第一接觸面及相對該第一接觸面之第二接觸面，該基座於該第二接觸面一側開設有凹槽，該散熱裝置還包括熱管，該熱管位於該凹槽內，該散熱鰭片組同時接觸該基座之第二接觸面及該熱管。A heat dissipating device includes a base for contacting a heat generating component and a heat dissipating fin set, wherein the base is in a flat shape, the base includes a first contact surface for contacting the heat generating component and a first contact surface opposite to the first contact surface a second contact surface, the base is provided with a groove on a side of the second contact surface, the heat dissipation device further includes a heat pipe, the heat pipe is located in the groove, and the heat dissipation fin group simultaneously contacts the second contact surface of the base And the heat pipe. 如申請專利範圍第1項所述之散熱裝置，其中該熱管與該散熱鰭片組之接觸面大致與該第二接觸面齊平。The heat dissipating device of claim 1, wherein the contact surface of the heat pipe and the heat dissipating fin set is substantially flush with the second contact surface. 如申請專利範圍第1項所述之散熱裝置，其中該凹槽之深度小於該基座之厚度。The heat sink of claim 1, wherein the depth of the groove is less than the thickness of the base. 如申請專利範圍第1項所述之散熱裝置，其中該基座包括有一用於接觸該發熱元件之熱接觸區，該基座於該熱接觸區兩側分別開設有一開口。The heat dissipating device of claim 1, wherein the base comprises a thermal contact region for contacting the heat generating component, and the base defines an opening on each side of the thermal contact region. 如申請專利範圍第4項所述之散熱裝置，其中該熱管包括有一大致呈Z形之第一熱管及兩大致呈L形之第二熱管。The heat dissipating device of claim 4, wherein the heat pipe comprises a first heat pipe having a substantially Z shape and two second heat pipes having a substantially L shape. 如申請專利範圍第5項所述之散熱裝置，其中該第一熱管包括一第一主熱管及兩連接於該第一主熱管兩端之第一延伸管，該第一主熱管位於該熱接觸區，該兩第一延伸管延伸至該熱接觸區兩側。The heat dissipation device of claim 5, wherein the first heat pipe comprises a first main heat pipe and two first extension pipes connected to both ends of the first main heat pipe, wherein the first main heat pipe is located in the thermal contact Zones, the two first extension tubes extend to both sides of the thermal contact zone. 如申請專利範圍第5項所述之散熱裝置，其中每一第二熱管包括一第二主熱管及一第二延伸管，該第二主熱管位於該熱接觸區，該第二延伸管部分圍繞該開口。The heat dissipating device of claim 5, wherein each of the second heat pipes comprises a second main heat pipe and a second extension pipe, the second main heat pipe is located in the thermal contact zone, and the second extension pipe is partially surrounded The opening. 如申請專利範圍第5項所述之散熱裝置，其中該兩第二熱管呈中心對稱放置於該基座。The heat dissipating device of claim 5, wherein the two second heat pipes are placed symmetrically on the base. 如申請專利範圍第1項所述之散熱裝置，其中該熱管之密度大於該基座之密度。The heat sink of claim 1, wherein the heat pipe has a density greater than a density of the base. 如申請專利範圍第9項所述之散熱裝置，其中該熱管由銅製成，該基座由鋁製成。The heat sink according to claim 9, wherein the heat pipe is made of copper, and the base is made of aluminum.
TW100126262A 2011-07-20 2011-07-25 Heat sink assembly TW201306726A (en)

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