1294567 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置’特別是指一種用於電子元 件上之散熱裝置。 【先前技術】1294567 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, particularly to a heat dissipating device for an electronic component. [Prior Art]
電腦中央處理器等電子元件在運行過程中産生大量之 熱量，而該熱量若不及時被排出，將會影響電子元件之運 行穩定性。因此，爲確保電子元件之正常運行，業界通常 在電子元件上安裝一散熱器進行辅助散熱。通常情況下，Electronic components such as computer central processing units generate a large amount of heat during operation, and if the heat is not discharged in time, it will affect the operational stability of the electronic components. Therefore, in order to ensure the normal operation of electronic components, the industry usually installs a heat sink on the electronic components to assist in heat dissipation. usually,
該散熱器包括一基座及複數設置在基座上之散熱鰭片，該 基座吸收電子元件產生之熱量，並將熱量擴散至散熱鰭 片，再通過散熱鰭片將熱量散發到環境空氣中，散熱器之 頂部通常還設置一風扇來增加空氣流速。現之埶 定程度上可以用來散發電子元件産生之熱量，但空:氣流動 過程中受驗大之限制’使散熱效率相對較低。 【發明内容】 有馨於此，有必要提供一種散熱效率較高之散熱裝置。 兮美座置’包括一基座以及複數平行間隔排列於 鰭片遠離基座之邊绫^亡力第-軋^通道，該專 與所述第-氣流=1:有凹槽’各鰭片之凹槽排列形成 片到兩側之鰭片之^目^之第二氣流通道，且由中部之鰭 逐漸減小。 ° 各凹槽底部至基座底面之距離 1294567 相較于習知技術，上述散熱裝置中設置了一由 :=:且與第一氣流通道相交之第二氣“，可 【實施方式】 圖1至圖3示出了本發明_個實施例中之散熱I置 放熱f置用於散發一熱源（例如，電腦中央處理器）產i 之熱里，其主要包括-導熱基座1〇以及複數設置於基座 上之鰭片20。基座_於吸收熱源產生之熱量，並將敎量 $導至鰭片20,由鰭片2G將熱量散發出去。該散 使用過程中，-般在鰭片2G之頂部設置—風扇（未圖示）在 基座10-般採關、料導熱性能良好之材料製成， 並具有—平坦之底面，用以與熱源接觸，基座U)之底面盘 ㈣之間可設置導熱膠等導熱介質，以使其間之熱量傳導 更容易。鰭片2G平行間隔地排列在基㈣頂部，相鄰钱片 間形成第-氣流通道21，鰭片2G與基座1G在本實施例^ 一 體成型。鳍片20中兩侧部之鰭片之頂緣均間隔地開設有複 數卡槽22 ’各Μ㈣上之卡槽22制形成複數第二氣流通 C 3且在中邻鰭片至兩側鰭片之方向上，各卡槽μ底部 至基座ίο底面之距離逐漸減小。每一卡槽22均包括一底壁 221以及位於底壁221兩側之側壁223 (如圖2所示）。每一 第二氣流通道23對應之卡槽22之底壁221均朝鰭片2〇同一 侧傾斜’從而可連接形成一平面或弧面，例如，鰭片2〇之 左侧鰭片上第二氣流通道23對應之卡槽22之底壁221均朝 左側傾斜，右側鰭片上第二氣流通道23對應之底壁221均朝 7 1294567 右側傾斜。另外，各鰭片20上之卡槽22在鰭片長度方向上 之分佈位置相同，從而令第二氣流通道23與第一氣流通道 21在基座10上之投影垂直，優選地，每一第二氣流通道23 對應之卡槽22之寬度（兩側壁223之間之距離）均相等。可 以理解之是，並不局限於僅在鰭片2〇兩側部之鰭片上開有 卡槽22 ’亦可在全部鰭片2〇上均可開設卡槽22。 爲防止熱量在基座1〇上局部集中而降低散熱效率，基 座ίο之頂部分別朝兩側斜向上延伸兩導熱臂12。導熱臂12 之寬度（如圖3所示）自上往下逐漸增大，以便於將基座扨 吸收之熱量迅速向兩側傳遞，並將熱量傳遞至兩側之鰭片 2〇上第一氣/;,L通道23將氣流導向兩側（如圖3中箭頭所 不），可有效提高散熱效率。兩導熱臂12均朝内側彎曲， 形成一大體呈U形構造。導熱臂12之末端沿長度方向上開設 有凹槽121，可以用於與螺絲（未圖示）配合，將風扇（未 圖示）固定於該散熱裝置頂部；導熱臂12之外侧與鰭片2〇 垂直之方向上還設有複數橫向鰭片123。 綜上所述，本發明確已符合發明專利之要件，遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施例， 自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝 之人士援依本發明之精神所作之等效修飾或變化，皆應涵 蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1是本發明一個實施例中之散熱裝置之立體圖。 1294567 圖2是圖1中散熱裝置之縱向剖視圖。 圖3是圖1中散熱裝置之在運行過程空氣向兩側流動 時之示意圖。 【主要元件符號說明】 基座 10 導熱臂 12 凹槽 121 橫向縛片 123 鰭片 20 第一氣流通道 21 卡槽 22 第二氣流通道 23 底壁 221 側壁 223The heat sink includes a base and a plurality of heat dissipating fins disposed on the base, the base absorbs heat generated by the electronic components, diffuses heat to the heat radiating fins, and then radiates heat to the ambient air through the heat radiating fins. A fan is usually placed on the top of the radiator to increase the air flow rate. Now, it can be used to dissipate the heat generated by electronic components, but the air: the limit of the test in the gas flow process makes the heat dissipation efficiency relatively low. SUMMARY OF THE INVENTION It is necessary to provide a heat dissipating device with high heat dissipation efficiency. The 座 座 ' ' includes a pedestal and a plurality of parallel spaced apart fins away from the pedestal 绫 ^ 力 第 轧 轧 , , , , , , , , , , , , , , , , , , , , , , , , , , , The grooves are arranged to form a second airflow path of the fins on the sides to the fins, and are gradually reduced by the fins in the middle. ° The distance from the bottom of each groove to the bottom surface of the base is 1294567. Compared with the prior art, a heat dissipation device is provided with a second gas that is: =: and intersects with the first air flow passage. [Embodiment] FIG. 3 shows that the heat dissipation I in the embodiment of the present invention is used to dissipate heat generated by a heat source (for example, a computer central processing unit), which mainly includes a heat conduction base 1 and a plurality of a fin 20 disposed on the pedestal. The susceptor _ absorbs heat generated by the heat source, and guides the amount of $ to the fin 20, and the heat is radiated by the fin 2G. The top of the piece 2G is set up - a fan (not shown) is made of a material that is well-used in the base 10 and has good thermal conductivity, and has a flat bottom surface for contacting the heat source, and the bottom plate of the base U) (4) A heat transfer medium such as a thermal conductive adhesive may be disposed to facilitate heat conduction therebetween. The fins 2G are arranged in parallel at the top of the base (4), and the first air flow passage 21, the fin 2G and the base are formed between the adjacent sheets. 1G is integrally formed in this embodiment. The top edge of the fins on both sides of the fin 20 is evenly spaced. The card slot 22 on each of the plurality of card slots 22's (four) is formed to form a plurality of second airflow passages C3 and in the direction of the middle fins to the fins on both sides, the bottom of each card slot μ to the bottom surface of the base ίο The distance between the card slots 22 includes a bottom wall 221 and sidewalls 223 on both sides of the bottom wall 221 (shown in Figure 2). Each of the second airflow channels 23 corresponds to the bottom wall 221 of the card slot 22. Both are inclined toward the same side of the fins 2' so as to be connected to form a plane or a curved surface. For example, the bottom wall 221 of the card slot 22 corresponding to the second air flow passage 23 on the left fin of the fin 2 is inclined to the left side. The bottom wall 221 corresponding to the second air flow passage 23 on the right fin is inclined to the right side of the 7 1294567. In addition, the slots 22 on the fins 20 are distributed in the same direction in the fin length direction, so that the second air flow passage 23 is The projection of the first air flow passage 21 on the base 10 is vertical, and preferably, the width of each of the second air flow passages 23 corresponding to the slot 22 (the distance between the two side walls 223) is equal. It can be understood that Limited to only the fins 22' on the fins on both sides of the fin 2 A card slot 22 can be formed on all the fins 2 。. In order to prevent heat from being locally concentrated on the pedestal 1 而 to reduce heat dissipation efficiency, the top of the pedestal ίο respectively extends the two heat conducting arms 12 obliquely upward toward the two sides. The width (as shown in FIG. 3) is gradually increased from the top to the bottom, so that the heat absorbed by the base 迅速 is quickly transmitted to both sides, and the heat is transmitted to the fins 2 on both sides of the first gas/; The L channel 23 guides the airflow to both sides (not shown by the arrow in Fig. 3), which can effectively improve the heat dissipation efficiency. Both of the heat conducting arms 12 are bent inward to form a substantially U-shaped structure. The end of the heat conducting arm 12 is along the length direction. A groove 121 is formed, which can be used to cooperate with a screw (not shown) to fix a fan (not shown) on the top of the heat sink; the outer side of the heat conducting arm 12 is further provided with a plurality of directions perpendicular to the fin 2〇 Lateral fins 123. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application in this case. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the present invention are intended to be included in the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a heat sink according to an embodiment of the present invention. 1294567 Figure 2 is a longitudinal cross-sectional view of the heat sink of Figure 1. Figure 3 is a schematic view of the heat dissipating device of Figure 1 as it flows to the sides during operation. [Main component symbol description] Base 10 Thermal arm 12 Groove 121 Lateral tab 123 Fin 20 First air flow path 21 Card slot 22 Second air flow path 23 Bottom wall 221 Side wall 223