M325536 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種散熱裝置。 【先前技術】 隨著電腦技術之不斷發展，電子元件（尤 係中央處理器）運行頻率和速度不斷提升。高 ，高速使得電子元件產生之熱量隨之增多，使溫 不斷升高，影響運行時之性能。為確保電子元 ( 正常運行，必須及時排出電子元件所產生之大 数量。 通常業界係正對中央處理器安裝一方形之 熱器進行散熱。單純金屬製成之散熱器一般包 一平滑之底座，供貼設於中央處理器表面以吸 其產生之熱量，再經底座向上傳至散熱鰭片進 散熱。隨著中央處理器之體積越來越小，運行 gj度越來越快，其發熱更集中，傳統之散熱器已 能很好之滿足散熱要求。為此，業界採用熱管 導熱量之散熱裝置越來越多。通常熱管之一端 置於散熱器之底座内，另一端穿過該等散熱 片。電子元件產生之熱量傳遞到散熱器之底座 再透過熱管傳遞至其上部之散熱鰭片上，最後 過散熱鰭片將熱量散發到周圍之空氣中。並進 步於該散熱器之頂部加裝一風扇，以達到冷卻 央處理器之目的。然而，僅於正對中央處理器 其 頻 度 件 量 散 括 收 行 速 不 傳 容 鰭 透 中 之 6 M325536 一側設置散熱器、熱管及風扇仍不能很好散發中 央處理器產生之熱量。 【新型内容] 路板 子元 子元 鰭片 組之 該第 散熱 一散 產生 組散 —散 佳實 產生 奋又置 路板 圖未 基板 签於以上内容 之電子元件散熱效率之散熱裝置。 一種散熱裝置，用於散發一電路板之電 -件所產生之熱量，該散熱裝置包括一與該電 _件接觸之基板、一設置於該基板之第一散熱 、、且及至少_設置於該基板與該第一散熱鰭片 門之苐一熱管，該基板上進一步設置一鄰接 政熱鳍片組且位於該電子元件一側之第二 .曰片組’該第一熱管並延伸至該基板與該第 熱鳍片組之間。 相較習知技術，該電路板之電子元件所 =熱置不僅透過與其正對之第一散熱鰭片 :，進—步透過該第一熱管將熱傳遞至 ':片級進行散熱，提高了散熱效 【實施方式】 r 4參閱圖1及圖4，本創作散熱裝置之較 用於散發一電路板10之一電子元件所 於二=。於本實施方式中，該電子元件係一 1 〇 Μ、电路板1 〇側緣附近之中央處理器，該電 示於該中央處理器周圍設有複數固定 /政熱裝置包括一由導熱材料製成之 M325536 20、複數L型之第一熱管32、一 C型之第二熱管 34、一第一散熱鰭片組42、一第二散熱鰭片組44 及一第三散熱鰭片組4 6。該散熱裝置透過複數固 定元件5 0組設於該電路板1 0。M325536 VIII. New description: [New technical field] This creation is about a heat sink. [Prior Art] With the continuous development of computer technology, the operating frequency and speed of electronic components (especially the central processing unit) continue to increase. High and high speeds increase the amount of heat generated by electronic components, causing the temperature to rise and affect the performance during operation. In order to ensure the electronic components (normal operation, the large number of electronic components must be discharged in time. Usually, the industry is installing a square heat exchanger for the central processor to dissipate heat. The radiator made of pure metal generally includes a smooth base. It is attached to the surface of the central processor to absorb the heat generated by it, and then transferred to the heat sink fins through the base for heat dissipation. As the volume of the central processing unit becomes smaller and smaller, the gj degree is faster and faster, and the heat is more heated. Concentrated, the traditional heat sink has been able to meet the heat dissipation requirements. For this reason, there are more and more heat sinks in the heat pipe of the heat pipe. Usually one end of the heat pipe is placed in the base of the heat sink, and the other end passes through the heat sink. The heat generated by the electronic component is transferred to the base of the heat sink and transmitted to the heat dissipating fins of the upper portion through the heat pipe, and finally the heat radiating fins dissipate heat to the surrounding air, and the heat is applied to the top of the heat sink. Fan, in order to achieve the purpose of cooling the central processor. However, only in front of the central processor, its frequency component spreads the receiving speed and does not pass through the fins. 6 M325536 One side of the radiator, heat pipe and fan still can not dissipate the heat generated by the central processor. [New content] The first heat dissipation of the sub-unit fin group of the road board produces a group-distribution The heat dissipation device is used to dissipate heat generated by the electric components of a circuit board, and the heat dissipation device includes one and the electric_piece a substrate to be contacted, a first heat dissipation disposed on the substrate, and at least a heat pipe disposed on the substrate and the first heat sink fin door, wherein the substrate is further provided with an adjacent thermal fin set and located a second cymbal group 'the first heat pipe on one side of the electronic component and extending between the substrate and the first heat fin group. Compared with the prior art, the electronic components of the circuit board are not thermally permeable. The first heat sink fin is opposite to the first heat sink: the heat is transmitted to the ':chip level for heat dissipation, and the heat dissipation effect is improved. [Embodiment] r 4 Referring to FIG. 1 and FIG. 4, the heat dissipation is created. Loading The electronic component is used to dissipate an electronic component of a circuit board 10 in the second embodiment. In the embodiment, the electronic component is a central processing unit near the side edge of the circuit board 1 . A plurality of fixed/political devices are disposed around the central processing unit, including a M325536 20 made of a heat conductive material, a first heat pipe 32 of a plurality L shape, a second heat pipe 34 of a C type, and a first heat sink fin set 42. A second heat dissipating fin set 44 and a third heat dissipating fin set 46. The heat dissipating device is disposed on the circuit board 10 through a plurality of fixing elements 50.
本實施方式中，該基板2 0係一大致呈L型之 板體，包括一第一板22及一第二板24。該第一板 22大致呈方形。該第二板24大致呈長形。該第一 板2 2上形成一 C型之安裝槽2 2 2。該第一板2 2及 該第二板2 4分別設有複數開槽，該等開槽共同形 成複數L型之安裝槽26。該第一板22於四角處分 別形成一凹陷2 2 4，並於每一凹陷2 2 4内設一通孔 226。該第二板24于一角處形成一凹陷242，並於 該凹陷2 4 2内設一通孔2 4 4。 該第一散熱鰭片組4 2排列成方形。該第二散 熱鰭片組4 4排列成一較短之長條形。該第三散熱 鰭片組4 6排列成一較長之長條形。對應該第一板 22之通孔226及該第二板24之通孔244，該第一 散熱鰭片組42、該第二散熱鰭片組44及該第三散 熱鰭片組46設有複數安裝口 42 2、442及462。 每一固定組件5 0包括一螺絲5 2、一彈簧5 4、 一鎖緊墊片56及一螺母58。 參閱圖2及圖3，組裝時，將該等第一熱管 3 2及該第二熱管3 4分別對應裝設於該基板2 0之 安裝槽26及222内；該第一散熱鰭片組42透過 8 M325536 焊接結合於該第一板22及第二板24之 位於該等第/熱管3 2之一部分及該第二 之上方；該第二散熱鰭片組4 4透過焊接 第二板24上與該第一散熱鰭片組42於 並位於該等第一熱管32之其他部分之上 二散熱縛片組4 6透過焊接結合於該第二 -另側面。將該等固定組件5 0之螺絲5 2 鲁黃5 4後分別穿經該第一散熱鰭片組4 2、 鳍片組4 4及弟二政熱鰭片組4 6之安裝口 及462以及該基板20之對應通孔2 2 6及 於對應之鎖緊墊片5 6。 該散熱裝置組设於該電路板1 〇時， 被2 2之未設有熱管之一側面塗設導熱膠 -碡電路板10之電子元件表面，將該等固 之螺絲52穿過該電路板1〇之固定孔後 ^件50之對應螺母5δ螺紋連接，而 %裝置固定於該電路板10。該第一散熱」 =對該電子元件，第二散熱鰭片組42及 、片組42設置於該電子元件之側向。 該電路板10之電子元件產生之熱量 反22傳導至該等第一熱管32之一部分 f瞀34後，進一步傳遞至該第一散熱.舎 =熱；該電子元件產生之熱量進〆步經 、督32之其他部分傳至該第二板24及 一側面並 二熱管34 結合於該 同一側面 方；該第 板2 4之 套設一彈 第二散熱 ，42 2、442 2 4 4卡設 將該第一 後貼設於 定元件5 0 與該等固 將而該散 ϋ片組42 第三散熱 經該第一 及該第二 蓄片組42 該等第/ 設置於該 9 M325536 第二板24相對兩側面之第二散熱鰭片組44及第 三散熱鰭片組4 6進行散熱，提高了散熱效率。 請繼續參閱圖4，該電路板1 0進一步佈局有 其他元器件（如D I MM (雙列直插式記憶模組）及南 北橋晶片等），應用該電路板1 0之電子設備常會 配置系統風扇，以加強空氣對流。該第一散熱鰭 _片組42、第二散熱鰭片組44及第三散熱鰭片組 4 6設置不同之鰭片間距，可控制流過該散熱裝置 m 之風流流阻，以提高電子設備之散熱效率。 綜上所述，本創作符合新型專利要件，爰依 法提出專利申請。惟，以上所述者僅為本創作之 較佳實施例，舉凡熟悉本案技藝之人士，於爰依 本創作精神所作之等效修飾或變化，皆應涵蓋於 以下之申請專利範圍内。 ^【圖式簡單說明】 P 圖1係本創作散熱裝置之較佳實施方式之立體 分解圖。 圖2係本創作散熱裝置之較佳實施方式之基板 及熱管之組合圖。 圖3係本創作散熱裝置之較佳實施方式之組合 圖。 圖4係本創作散熱裝置之較佳實施方式與一電 路板之立體組合圖。 10 20M325536 【主要元件符號說明】 電路板 10 基板 第一板 22 安裝槽 凹陷 224、 242 通孔 222. 226、 26 244In this embodiment, the substrate 20 is a substantially L-shaped plate body including a first plate 22 and a second plate 24. The first panel 22 is generally square. The second plate 24 is generally elongated. A C-shaped mounting groove 2 22 is formed on the first plate 2 2 . The first plate 2 2 and the second plate 24 are respectively provided with a plurality of slots, and the slots jointly form a plurality of L-shaped mounting slots 26. The first plate 22 defines a recess 2 2 4 at four corners, and a through hole 226 is defined in each recess 2 2 4 . The second plate 24 defines a recess 242 at a corner, and a through hole 24 4 is defined in the recess 24 2 . The first fins 4 2 are arranged in a square shape. The second heat radiating fin group 4 4 is arranged in a short strip shape. The third fin group 46 is arranged in a long strip shape. The first heat dissipation fin group 42 , the second heat dissipation fin group 44 and the third heat dissipation fin group 46 are provided with a plurality of the plurality of through holes 226 of the first plate 22 and the through holes 244 of the second plate 24 . Mounting ports 42, 2, 442 and 462. Each fixing component 50 includes a screw 5 2, a spring 5 4, a locking washer 56 and a nut 58. Referring to FIG. 2 and FIG. 3 , the first heat pipe 3 2 and the second heat pipe 34 are respectively disposed in the mounting grooves 26 and 222 of the substrate 20 during assembly; the first heat dissipation fin set 42 The first plate 22 and the second plate 24 are welded to the first plate 22 and the second plate 24 through a portion of the first and second plates 24, and the second heat dissipating fins 44 are welded to the second plate 24. And the first heat-dissipating fin set 42 is located on the other portions of the first heat pipes 32, and the two heat-dissipating fin sets 46 are welded to the second-other side. The screws 5 2 of the fixing components 50 are passed through the first heat-dissipating fin group 4 2, the fin group 44, and the mounting port of the second heat-heat fin group 46 and the 462, respectively. The corresponding through holes 2 26 of the substrate 20 and the corresponding locking pads 56. When the heat dissipating device is disposed on the circuit board 1 , the surface of the electronic component of the thermal conductive adhesive-cylinder circuit board 10 is coated on one side of the heat pipe which is not provided with the heat pipe, and the solid screw 52 is passed through the circuit board. The corresponding nut 5δ of the fixing member of the fixing member is screwed, and the % device is fixed to the circuit board 10. The first heat dissipation" = the electronic component, the second heat radiation fin group 42 and the chip group 42 are disposed laterally of the electronic component. The heat generated by the electronic components of the circuit board 10 is transmitted to a portion of the first heat pipe 32, f瞀34, and further transmitted to the first heat dissipation. 舎=heat; the heat generated by the electronic component enters the step, The other part of the supervisor 32 is passed to the second board 24 and a side surface and the heat pipe 34 is coupled to the same side side; the second board of the second board is provided with a second heat sink, 42 2,442 2 4 4 The first rear post is attached to the fixed component 50 and the third heat sinks the third heat sink through the first and the second power storage group 42. The second heat sink is disposed on the second board of the 9 M325536 The heat dissipation efficiency is improved by dissipating heat from the second heat dissipation fin group 44 and the third heat dissipation fin group 44 on both sides. Please continue to refer to FIG. 4, the circuit board 10 is further arranged with other components (such as DI MM (dual in-line memory module) and north-south bridge chip), and the electronic device using the circuit board 10 will often configure the system. Fan to enhance air convection. The first heat dissipation fin group 42 , the second heat dissipation fin group 44 and the third heat dissipation fin group 46 are disposed with different fin spacings, and can control the flow resistance of the heat dissipation device m to improve the electronic device. Heat dissipation efficiency. In summary, the creation complies with the new patent requirements and submits a patent application in accordance with the law. However, the above description is only a preferred embodiment of the present invention, and those skilled in the art will be able to cover the modifications and variations of the present invention in the spirit of the present invention. ^ [Simple description of the drawings] P Fig. 1 is a perspective exploded view of a preferred embodiment of the heat sink of the present invention. Fig. 2 is a combination diagram of a substrate and a heat pipe of a preferred embodiment of the heat sink of the present invention. Figure 3 is a combination of a preferred embodiment of the heat sink of the present invention. Figure 4 is a perspective view of a preferred embodiment of the heat sink of the present invention and a circuit board. 10 20M325536 [Description of main component symbols] Board 10 Substrate First board 22 Mounting groove Recess 224, 242 Through hole 222. 226, 26 244
弟二板 第二熱管 安裝口 第三散熱 .讀片組 螺絲 鎖緊墊片 2 4 34 42 2、44462 第一熱管 第一散熱鰭 片組 第二散熱鰭 片組 46 固定組件 52 彈簧 56 螺母 32 4 2 44 50 54 58The second heat pipe installation port of the second board is the third heat dissipation. The reading group screw locking washer 2 4 34 42 2, 44462 The first heat pipe first heat sink fin group The second heat sink fin group 46 The fixing component 52 spring 56 nut 32 4 2 44 50 54 58
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