TWI397369B - Heat dissipation device - Google Patents

Description

Heat sink

The present invention relates to a heat sink, and more particularly to a heat sink for dissipating heat from an electronic component.

High-power electronic components such as computer central processing units, north bridge chips, and graphics cards generate a large amount of heat during operation. If this heat cannot be effectively dissipated, it will directly cause a sharp rise in temperature, which will seriously affect the normal operation of electronic components. . To this end, heat sinks are needed to dissipate these electronic components.

A conventional heat sink generally includes a base, a heat sink set, a heat pipe connection base and the heat sink set, and a fan fixed to one side of the heat sink set. The heat generated by the electronic component is first transferred to the base and then absorbed by the bottom of the heat pipe; the heat pipe transfers heat to its end by the phase change of the working fluid therein, and the heat of the heat pipe end is radiated to the surrounding air via the heat sink group. in. The fan increases the heat exchange rate of the heat sink, which improves heat dissipation efficiency.

In the above heat dissipating device, the airflow blown by the fan flows along the interval between the fins, and leaves the heat sink group in a very short time, and the utilization rate of the cold air is low, so that the heat dissipation efficiency is low; and the heat dissipating device Since the fixing of the fan requires complicated structural erection, the fan can be disposed only on the side of the heat sink, so that the airflow on the other side of the heat sink group is weak, and the heat dissipation efficiency of the entire heat sink is reduced.

In view of this, it is necessary to provide a windshield with a strong wind guiding capability. A heat sink with high heat dissipation efficiency.

A heat dissipating device for dissipating heat to an electronic component, comprising: a heat conducting plate attached to the electronic component, a plurality of heat dissipating fins, and a heat pipe connecting the heat conducting plate and the heat dissipating fin, wherein a plurality of air passages are formed between the heat dissipating fins, The heat dissipation device further includes an air hood, the air hood includes a top plate and two baffles connected to the top plate, the top plate is fixed on the top of the heat dissipation fin, the baffle surrounds the two ends of the heat dissipation fin, and the second fan is fixed on the The air hood is placed on both sides of the heat dissipation fin and located at the inlet and outlet of the air passage.

In the above heat dissipating device, the air guiding hood is provided with a heat dissipating fin and a double fan structure, which greatly enhances the convection intensity of the air in the air passage of the heat dissipating fin, and improves the heat dissipating efficiency of the heat dissipating device.

Referring to FIG. 1 and FIG. 2 simultaneously, the heat dissipating device of the first embodiment of the present invention is mounted on a circuit board (not shown) for emitting electronic components (not shown) on the circuit board. Heat. The heat sink includes a heat sink assembly 10, an air hood 20 assembled to the heat sink assembly 10, and two fans 30 mounted on opposite sides of the air hood 20.

As shown in FIG. 3 , the heat sink assembly 10 includes a heat conducting board 12 , a heat sink fin set 14 , three heat pipes 16 for connecting the heat conducting board 12 and the heat radiating fin group 14 in parallel, and fixing to the heat sink fins. The fixing plate 18 at the top of the sheet set 14 is: wherein the heat conducting plate 12 is substantially a rectangular plate-like body, and the bottom portion thereof is provided with three parallel spaced grooves 124. The two mounting brackets 13 are fixed to opposite ends of the bottom of the heat conducting plate 12 by screws 133. The mounting brackets 13 are convexly protruded from opposite ends 132. . The heat conducting plate 12 is connected to the circuit board by four fasteners (not shown) passing through the lugs 132 and is kept in close contact with the electronic components.

Each heat pipe 16 has a U-shaped arrangement including a level of heat absorbing portion 160 and two parallel heat releasing portions 162 extending vertically upward from both ends of the heat absorbing portion 160. The heat absorbing portion 160 is received in the recess 124 of the heat conducting plate 12, and the bottom surface thereof is coplanar with the bottom surface of the heat conducting plate 12 to form a flat bottom surface with the bottom of the heat conducting plate 12 to be attached to the top surface of the electronic component to absorb the electrons. The heat of the component. The two heat releasing portions 162 penetrate the heat dissipation fin group 14 , and the heat dissipation fin group 14 is placed on the heat radiation portion 162 of the heat pipe 16 .

The heat dissipation fin group 14 is formed by stacking a plurality of mutually parallel heat dissipation fins 140 from top to bottom. Each of the heat dissipation fins 140 has a micro wave shape and is substantially parallel to the heat conduction plate 12 as a whole. The two sides of each of the heat dissipation fins 140 are respectively provided with three parallel holes 142 for receiving the heat radiation portion 162 of the heat pipe 16 . Each of the heat dissipation fins 140 extends from the edge of the through hole 142 to form a ring wall 146 to increase the surface area of the heat dissipation fin 140 contacting the heat radiation portion 162, and to space the adjacent heat dissipation fins 140 by a certain distance to form a ventilation channel ( Figure is not marked). A rectangular through-hole 144 is disposed in the middle of each of the heat dissipation fins 140. The through holes 144 are disposed between the through holes 142. The through holes 144 of the plurality of heat dissipation fins 140 may constitute a threaded hole for the screws 19 to be screwed.

The fixing plate 18 is disposed in a rectangular plate shape, and a through hole 180 is defined in each of the four corners thereof. The through holes 180 correspond to the through holes 144 of the heat dissipation fins 140 for the screws 19 to pass through to fix the fixing plate 18 to the heat dissipation fin group 14 . top. A second screw hole 185 is defined in the middle of the fixing plate 18 to fix the air guiding cover 20.

Referring to FIG. 4, the air hood 20 has an inverted U shape, and includes a top plate 22 and two baffles 24 extending perpendicularly from opposite ends of the top plate 22. The width of the top plate 22 and the baffle 24 is equal to the width of the heat dissipation fin set 14. A second through hole 220 is defined in the middle of the top plate 22, and the two through holes 220 correspond to the screw holes 185 of the fixing plate 18. A mounting portion 26 for mounting the fan 30 is formed on each of the opposite sides of each of the baffles 24, and each mounting portion 26 is provided with a pair of mounting holes 260 for fixing the fan 30.

Each fan 30 has a substantially square shape, and includes a second flat plate 32, 34 with an opening, wherein a flat plate 32 of one fan 30 is mounted on the two mounting portions 26 on the same side of the air guiding cover 20, and the other The flat plate 34 of the fan 30 is mounted on the second mounting portion 26 on the other side of the air guiding cover 20.

When the heat dissipating device is assembled, the heat dissipating fin group 14 is firstly welded to the heat radiating portion 162 of the heat pipe 16, and the adjacent heat dissipating fins 140 form a ventilation passage. The heat conducting plate 12 is welded to the heat absorbing portion 160 of the heat pipe 16 to heat the heat pipe 16. The portion 160 is received in the recess 124 of the heat conducting plate 12; the mounting bracket 13 is fixed at both ends of the bottom of the heat conducting plate 12, and the fixing plate 18 is mounted on the top of the heat radiating fin group 14. The heat sink assembly 10 is then secured to the circuit board by the fasteners in close contact with the electronic components. Then, the air hood 20 and the fan 30 that has been mounted on both sides of the air hood 20 are mounted on the heat sink assembly 10 from top to bottom, so that the baffle 24 of the air hood 20 surrounds the heat dissipation fin group 14 At both ends, the two fans 30 are respectively placed on both sides of the heat dissipation fin group 14 and placed on the inlet and outlet of the air passage. Finally, the second-hand screw 50 is screwed through the through hole 220 of the top plate 22 of the air guiding cover 20 to the fixing plate 18, and the entire heat dissipating device is installed.

When the electronic component is in operation, the heat generated by the electronic component is transmitted to the heat dissipation fin set 14 through the heat conducting plate 12 and the heat pipe 16, and then partially heated by the heat dissipation fin group 14. The amount is radiated into the air of the air duct; since the steering of the two fans 30 is the same, the fan 30 on the side of the heat dissipation fin group 14 sucks out the hot air in the air passage of the heat dissipation fin group 14, and the fan 30 on the other side blows the cold air. Into the air passage of the fin group 14, the convection exchange of hot and cold air is increased. Since the two baffles 24 of the air hood 20 enclose the two sides of the heat dissipation fin group 14, the cold air sent by the fan does not overflow to the sides in the air passage of the heat dissipation fin group 14, thereby improving the utilization of the cold air. The dual fan 30 is used at the same time, which greatly enhances the convection intensity of the air and improves the heat dissipation efficiency. Finally, since the fan 30 can be pre-mounted on the air hood 20, it is only necessary to manually unscrew the screw 50 when disassembling. The air hood 20 is extracted together with the fan 30, and the fan 30 is not required to be disassembled, which is convenient and quick.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the present invention are intended to be included in the scope of the following claims.

10‧‧‧ radiator combination

12‧‧‧heat conducting plate

124‧‧‧ Groove

13‧‧‧ Mounting frame

132‧‧‧ lugs

133, 19‧‧‧ screws

14‧‧‧Solid fin group

140‧‧‧Heat fins

142‧‧‧through holes

144, 220, 180‧‧‧through holes

146‧‧‧Circle

16‧‧‧heat pipe

160‧‧‧heat absorption department

162‧‧‧heating department

18‧‧‧ fixed plate

185‧‧‧ screw holes

20‧‧‧wind hood

22‧‧‧ top board

24‧‧ ‧ baffle

26‧‧‧Installation Department

260‧‧‧ mounting holes

30‧‧‧Fan

32, 34‧‧‧ tablet

50‧‧‧Hand screw

1 is a combination diagram of a heat sink of the present invention.

Figure 2 is a partial combination diagram of Figure 1.

3 is an exploded view of the heat sink assembly of the heat sink of FIG. 2.

4 is an exploded view of the air hood and the fan of the heat sink of FIG. 2.

10‧‧‧ radiator combination

12‧‧‧heat conducting plate

14‧‧‧Solid fin group

16‧‧‧heat pipe

18‧‧‧ fixed plate

20‧‧‧wind hood

30‧‧‧Fan

50‧‧‧Hand screw

Claims (10)

A heat dissipating device for dissipating heat to an electronic component, comprising: a heat conducting plate attached to the electronic component, a plurality of heat dissipating fins, and a heat pipe connecting the heat conducting plate and the heat dissipating fin, wherein a plurality of air passages are formed between the heat dissipating fins, The improvement device is characterized in that: the heat dissipation device further comprises an air hood, the air hood includes a top plate and two baffles connected to the top plate, the top plate is fixed on the top of the heat dissipation fin, and the baffle surrounds the two ends of the heat dissipation fin. The two fans are fixed on the air hood and placed on both sides of the heat dissipation fins and located at the inlet and outlet of the air passage, and each of the heat dissipation fins has a micro wave shape. The heat dissipating device of claim 1, wherein a top of the heat dissipating fins is fixed to a fixing plate, and a top plate of the air guiding hood is fixed to the fixing plate. The heat dissipation device of claim 2, wherein a through hole is formed in a middle portion of each of the heat dissipation fins, and the through holes of the heat dissipation fins form a screw hole for screwing to fix the fixing plate. The heat dissipating device of claim 3, wherein the top plate of the air guiding hood is provided with two through holes, and the second used screw is screwed through the top plate and the fixing plate. The heat dissipating device of claim 1, wherein the air guiding hood is U-shaped. The heat dissipating device of claim 1, wherein a mounting portion is extended on each side of each of the baffles, and the two fans are fixed to the mounting portions. The heat sink of claim 1, wherein the fan turns the same. The heat dissipating device of claim 1, wherein the heat pipe comprises a heat absorbing portion and a heat releasing portion connected to the heat absorbing portion, and the bottom of the heat conducting plate is provided with a groove to receive the heat absorbing portion of the heat pipe. The heat dissipating device of claim 8, wherein a bottom surface of the heat absorbing portion of the heat pipe is coplanar with a bottom surface of the heat conducting plate. The heat sink of claim 9, wherein the heat pipe is U-shaped.