TWI397368B - Heat dissipation device - Google Patents

Description

Heat sink

The present invention relates to a heat sink, and more particularly to a heat sink for dissipating heat from an electronic component.

High-power electronic components such as computer central processing units, north bridge chips, and graphics cards generate a large amount of heat during operation. If this heat cannot be effectively dissipated, it will directly cause a sharp rise in temperature, which will seriously affect the normal operation of electronic components. . To this end, heat sinks are needed to dissipate these electronic components. Conventional heat sinks typically include a heat sink and a fan placed on one side of the heat sink that provides a forced air flow to enhance heat dissipation.

Currently, the method of fixing the fan to the heat sink generally adopts a fan fixing member fixed on the heat sink, and the fan is fixed to the heat sink by fixing the fan to the heat sink. However, the fan fixing member in the prior art is often combined with the heat sink by an elastic snapping method, or the combination is not strong, which affects the stability of the fan; or the bonding is too strong, which makes it difficult to remove the fixing member from the heat sink.

In view of the above, it is necessary to provide a heat dissipating device that is tightly coupled between the fan fixing member and the heat sink and is easy to disassemble.

A heat dissipating device for dissipating heat to an electronic component, comprising: a heat conducting plate attached to the electronic component, a plurality of heat radiating fins connected to the heat conducting board, a fixing frame, and a fan fixed on the fixing frame, the heat sink fin The opposite ends of the piece are provided with a slot, and the fixing frame comprises a top plate and two connecting top plates a heat dissipation fin is provided with a through hole, and a through hole corresponding to the heat dissipation fin is disposed on the top portion, and a fastening portion is formed on a side of the baffle, and the buckle portion slides along the extending direction of the slot and extends into the slot The heat sink fin is slotted to engage with the heat sink fin. The heat sink further includes a screw that passes through the through hole of the top plate and the heat sink fin and fixes the top plate on the top of the heat sink fin.

In the above heat dissipating device, the heat dissipating fin is provided with a slot for sliding the buckle portion of the fixing frame, and then the top plate is fixed on the heat dissipating fin, and the installation is simple and convenient.

Referring to FIG. 1 and FIG. 2, a heat dissipating device is mounted on a circuit board (not shown) for dissipating electronic components (not shown) on the circuit board. Heat. The heat sink includes a heat sink assembly 10, a mounting bracket 20 assembled to the heat sink assembly 10, and a fan 30 mounted to the mounting bracket 20.

As shown in FIG. 3 , the heat sink assembly 10 includes a heat conducting board 12 , two heat dissipating fin sets 14 , and three heat pipes 16 arranged in parallel to connect the heat conducting board 12 and the heat dissipating fin set 14 . The heat conducting plate 12 has a substantially rectangular plate-like body, and the bottom portion thereof is provided with three parallel spaced grooves 124. The two mounting brackets 13 are fixed to opposite ends of the bottom of the heat conducting plate 12 by screws 133. The mounting brackets 13 have protrusions 132 protruding from opposite ends. The heat conducting plate 12 is connected to the circuit board by four fasteners (not shown) passing through the lugs 132 and is kept in close contact with the electronic components.

Each heat pipe 16 has a U-shaped arrangement including a level of heat absorbing portion 160 and heat absorption from Two parallel heat radiating portions 162 extending vertically upward from both ends of the portion 160. The heat absorbing portion 160 is received in the recess 124 of the heat conducting plate 12, and the bottom surface thereof is coplanar with the bottom surface of the heat conducting plate 12 to form a flat bottom surface with the bottom of the heat conducting plate 12 to be attached to the top surface of the electronic component to absorb the electrons. The heat of the component. The three heat radiating portions 162 of the same side of the heat pipe 16 are inserted through one of the heat radiating fin groups 14 , and the three heat radiating portions 162 of the other side are inserted through the other heat radiating fin group 14 to place the heat radiating fin group 14 on the heat pipe 16 . On the heat release portion 162.

Each of the heat dissipation fins 14 is formed by stacking a plurality of mutually parallel heat dissipation fins 140 from top to bottom, and each of the heat dissipation fins 140 is parallel to the heat conduction plate 12. Each of the heat dissipation fins 140 has a longitudinally long wing shape, and both side edges are connected by different arcs. Each of the heat dissipation fins 140 is uniformly provided with three parallel through holes 142 for receiving the heat radiation portion 162 of the heat pipe 16 . Each of the heat dissipation fins 140 extends from the edge of the through hole 142 to form a ring wall 146 to increase the surface area of the heat dissipation fin 140 and the heat radiation portion 162, and to position the adjacent heat dissipation fins 140 at a certain distance to form a front and rear direction. Extended air duct (not shown). Each of the heat dissipation fins 140 is provided with a through hole 148 at each end of the heat dissipation fin 140. A slot 149 communicates with the through hole 148 to the outer edge of the heat dissipation fin 140 adjacent to the through hole 148.

Referring to FIG. 4, the mounting bracket 20 includes a top plate 22 and two baffles 28 extending vertically downward from opposite ends of the top plate 22. The top plate 22 includes two opposite fixing portions 24 and a connecting portion 26 connecting the two ends of the two fixing portions 24. Each fixing portion 24 has the same shape as each of the heat dissipation fins 14 and is provided with three through holes 242 to correspond to the through holes 142 of the heat dissipation fins 14 . Two fixing holes 248 are defined at two ends of each fixing portion 24 to correspond to the through holes 148 of the heat dissipation fins 14 . The fixing portion 24 and the connecting portion 26 are surrounded by an opening (not shown), and an arch bridge is used. The working portion 29 connects the two connecting portions 26 and is placed above the opening. The baffle 28 extends vertically downward from the connecting portion 26 of the top plate 22. Each baffle 28 is provided with a meniscus-shaped perforation 280 for transmitting light when the LED lamp is mounted on the fan blade. A bent portion 21 is formed in a middle portion of each of the two sides of each of the baffles 28, and each of the latching portions 21 extends into the slot 149 of each of the fins 140. A mounting portion 212 for mounting the fan 30 is formed on the upper and lower ends of the side of the same side of the two baffles 28, and each mounting portion 212 is provided with a pair of mounting holes 2120 for fixing the fan 30.

The fan 30 is generally rectangular in shape and includes a rear plate 32, 34 with an opening. The fan 30 is received in the space enclosed by the top plate 22 and the baffle plate 28 of the mounting frame 20, and the flat plate 32 is mounted and attached to the four mounting portions 212 of the mounting frame 20, and is locked by screws 60.

When the heat dissipating device is assembled, the heat dissipating fin group 14 is firstly welded to the heat radiating portion 162 of the heat pipe 16, the adjacent heat dissipating fins 140 form a ventilation passage, and the heat conducting plate 12 and the heat absorbing portion 160 of the heat pipe 16 are welded to the heat absorbing portion of the heat pipe 16. The heat receiving plate 12 is received in the recess 124 of the heat conducting plate 12; the mounting bracket 13 is fixed at both ends of the heat conducting plate 12, and the fixing plate 18 is mounted on the top of the heat radiating fin group 14. The heat sink assembly 10 is then secured to the circuit board by the fasteners in close contact with the electronic components. Then, the fixing frame 20 and the fan 30 that has been installed in the fixing frame 20 are mounted on the heat sink assembly 10 from top to bottom. The four fastening portions 21 of the fixing frame 20 are respectively opened along the heat dissipation fins 140. The channel formed by the slot 149 and the through hole 148 slides in from the top, so that the latching portion 21 protrudes into the slot 149 of the heat dissipation fin 140 and engages with the heat dissipation fin group 14. Finally, the fixing hole 248 of the top plate 22 of the fixing frame 20 is screwed into the through hole 148 of the heat dissipation fin 140 by the screw 40, so that the fan 30 is fixed between the two heat dissipation fin groups 140. The entire heat sink is installed.

When the electronic component is in operation, the heat generated by the heat-dissipating plate 12 and the heat pipe 16 is transmitted to the heat-dissipating fin group 14, and a part of the heat is radiated to the air of the air passage by the heat-dissipating fin group 14. The heat dissipation fins 140 are provided with through holes 148 and slots 149 for communicating the through holes 148 for the mounting bracket 20 to slide in, and then screwed directly into the through holes 148 by the screws 40, which is simple and convenient to install. Moreover, the latching portion 21 of the fixing frame 20 is simultaneously combined with the two heat dissipating fin sets 14, so that the structure of the entire heat dissipating device is more stable. In addition, the operation portion 29 at the top of the fixing frame 20 is disposed in an arch shape, so that the entire heat dissipation device is conveniently carried after installation.

In summary, the present invention conforms to the requirements of the invention patent, and proposes a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

10‧‧‧ radiator combination

12‧‧‧heat conducting plate

124‧‧‧ Groove

13‧‧‧ Mounting frame

132‧‧‧ lugs

133, 40, 60‧‧‧ screws

14‧‧‧Solid fin group

140‧‧‧Heat fins

142‧‧‧through holes

146‧‧‧Circle

148‧‧‧through hole

149‧‧‧ slotting

16‧‧‧heat pipe

160‧‧‧heat absorption department

162‧‧‧heating department

20‧‧‧ fixed frame

21‧‧‧Snap Department

212‧‧‧Installation Department

2120‧‧‧ mounting holes

22‧‧‧ top board

24‧‧‧Fixed Department

26‧‧‧Connecting Department

242‧‧‧through holes

248‧‧‧Fixed holes

28‧‧ ‧Baffle

280‧‧‧Perforation

29‧‧‧Operation Department

30‧‧‧Fan

32, 34‧‧‧ tablet

1 is a combination diagram of a heat sink of the present invention.

Figure 2 is a partial combination diagram of Figure 1.

3 is an exploded view of the heat sink assembly of the heat sink of FIG. 2.

4 is an exploded view of the fixing frame and the fan of the heat dissipating device of FIG. 2.

10‧‧‧ radiator combination

12‧‧‧heat conducting plate

14‧‧‧Solid fin group

16‧‧‧heat pipe

20‧‧‧ fixed frame

30‧‧‧Fan

40‧‧‧ screws

Claims (10)

A heat dissipating device for dissipating heat to an electronic component, comprising: a heat conducting plate attached to the electronic component, a plurality of heat radiating fins connected to the heat conducting plate, a fixing frame, and a fan fixed on the fixing frame, wherein the improvement is The heat dissipating fins are provided with slots on opposite ends thereof, and the fixing bracket comprises a top plate and two baffles for connecting the top plates, wherein the heat dissipating fins are provided with through holes, and the through holes corresponding to the heat dissipating fins on the top are fixed a hole extending from a side of the baffle, the buckle portion sliding along the extending direction of the slot and extending into the slot of the heat sink fin to engage with the heat sink fin, the heat sink further comprising a screw The through hole of the top plate and the through hole of the heat dissipation fin are fixed and the top plate is fixed on the top of the heat dissipation fin. The heat dissipation device of claim 1, wherein the slot communicates with the through hole and the edge of the heat dissipation fin. The heat dissipating device of claim 1, wherein the same side of the baffle of the fixing frame extends with a mounting portion to fix the fan. The heat dissipating device of claim 3, wherein the latching portion extends from a middle portion of the side of the baffle, and the mounting portion extends from both ends of the side of the baffle. The heat dissipating device of claim 1, wherein the top of the top plate is provided with an arched operation portion. The heat dissipation device of claim 1, wherein the heat dissipation fins form two heat dissipation fin sets, and the fan is fixed between the two heat dissipation fin sets. The heat dissipating device of claim 6, wherein the heat dissipating device further comprises a heat pipe, wherein the heat pipe comprises a heat absorbing portion connected to the heat conducting plate, and a heat radiating portion through which the heat dissipating fin group is disposed. The heat dissipating device of claim 7, wherein the baffle portion of each of the baffles of the fixing frame is provided with the buckle portion, and the buckle portion extends into the two heat dissipating fin groups. Slotting to respectively engage with the two fins. The heat dissipating device according to claim 1, wherein each of the hot fins has a longitudinal wing shape, and both side edges are connected by different arcs. The heat dissipating device of claim 9, wherein the fins of the heat dissipating fins are disposed at opposite ends of the longitudinal direction of the fins.