TWM261973U - Heat pipe assembly - Google Patents

Description

M261973 V. Creation Instructions (1) [Technical Field to which the New Type belongs] This creation is about the heat pipe heat dissipation device for loose decoration and animal components. In particular, it is related to a kind of electronic components used to cool electricity [prior art], and other electronic components will generate a lot of heat during normal operation. . For this reason, the industry: 70 pieces of surface-mounted _ heat-dissipating device i to dissipate heat and heat moss is a commonly used heat-dissipating device at present, this: heat: type And heat dissipation efficiency: high. As the basic structure of this type of heat sink in the previous technology, the basin includes two, one, 100, one!) Type heat pipes 120, and a plurality of parallel heat sinks Korean fan i2i on the side of the heat sink 121. The bottom of the heat transfer tube 120 is in sexual contact with the seat to absorb heat from the base 100. Each of the heat dissipation fins 121 is opposite to the through hole and is used for accommodating the end of the heat pipe 120. The heat generated by the electronic components is transferred to the base 100, and then absorbed by the bottom of the heat pipe 120. The heat conduction officer ljo transfers heat to its end portion through the phase change of the working fluid in it. The cooling fins ι21 dissipate heat into the surrounding air. The fan can increase the heat exchange speed of the heat dissipation fins 121, thereby improving the heat dissipation efficiency. For related technologies, please refer to Mainland Patent Publication No. 25 1 4400Y, Taiwan Patent Publication No. 471 6 57 and No. 528 1 79. In the above heat dissipation device, the airflow blown by the fan flows along the interval between the heat sinks 1 2 1 and leaves the heat sinks 2 1 in a short time.

M261973 V. Creative Instructions (2) The utilization rate is low, so that the heat dissipation efficiency is low, and the above-mentioned thermal conductivity of heat transfers heat to the heat pipe 120, and only uses Γ, heat dissipation, and heat dissipation. Poor heat dissipation and heat dissipation. [Content] The purpose of the creation of this device is to provide a heat pipe with good heat dissipation effect. Creation 2: The heat dissipation device includes a heat-generating electronic component, a base, a heat pipe, and a heat sink. And a second heat sink group and a fan, the third includes a plurality of heat sinks, the first heat sink group is in thermal contact with the base, and the second heat sink group is placed on the first heat sink group " Thermal contact with the base < evaporation part and condensing part thermally contact with the second heat sink group, the fan is installed on one side of the second heat sink group, and an air guide structure is provided on the other side of the second heat sink group The air guide structure includes a plurality of folds formed on the fins and at an angle with the direction of the fan airflow. 'Compared with the prior art, the original heat pipe cooling device is provided with a wind guide junction, which can increase wind resistance and increase Wind pressure, thereby increasing [Embodiment] The following further describes the heat pipe radiating device of the present invention with reference to the drawings. Please refer to the second to fourth figures. The heat pipe radiating device of the present invention includes a base 10, and a pair of thermal properties with the base 10. The contacting heat pipe 20, the first and second & heat sheet sets 30, 40, a fixed frame 50 and a fan 60. The bottom surface of the base 10 is closely attached to the heating electronic component for absorbing the heat of the heating electronic component. There are two grooves 12 on the top surface of the seat for installing the heat pipe 20

im Page 6 M261973 V. Creation Instructions (3). A pair of locking holes 14 for mounting the fixing frame 50 are provided on each side of the base dagger. ", The official 20 is U-shaped, and has a horizontal evaporation section 22 and two vertical condensation sections 24. The evaporation section 22 can be fixed in the slot lj of the base ^ by welding or gluing. The evaporation section 22 After absorbing the heat transferred from the electronic components to the base 10, the heat is transferred to the ° by the phase change of the working fluid in the heat pipe 20

The first heat sink group 30 is in thermal contact with the top surface of the base 10, such as welding or gluing, and includes a plurality of heat sinks (not shown in the figure) perpendicular to the base 10 and spaced a certain distance from each other. The first heat sink group 30 is provided with a space 32 through which the condensation part 24 of the heating pipe 20 is arranged on each side. The bottom of the heat sink between the two spaces 32 is in thermal contact with the evaporation portion 22 of the heat pipe 20. The second heat sink group 40 is disposed on the first heat sink group 30 and includes a plurality of heat sinks (not shown in the figure) that are parallel to the base 10 and spaced a certain distance from each other. The second heat sink group 40 has two pairs of through holes 42 for receiving the condensation end 24 of the heat pipe 20. A notch 4 3 is formed on each side of the first heat sink group 4 〇,

The notch is V-shaped, and a pair of folded edges 44 are formed by punching at the edge of the notch 43, and all the folded edges 44 are stacked to form a wind guide structure 46 having a V-shaped cross section. The air guide structure 46 is located on the air duct of the fan 60. When the cold air blown by the fan 60 flows along the heat sink, the air guide structure 46 changes direction and diffuses to both sides, thereby increasing wind resistance and increasing The fixed frame 50 has a strong U-shape and increases the utilization of cold air. The fixed frame 50 has an inverted U-shape and includes a top plate 52 and two side plates 54. The top plate 52 and the two side plates 54 surround to form a space accommodating the base 10, the heat pipe 20, and the first and second heat sink groups 30 and 40. The lower part of the two side plates 54 corresponds to the locking of the base 10

Page 7 M261973 5. Creation instructions (4) A plurality of perforations 544 are provided in the hole 14 to fix the fixing frame 50 on the base 10 using fixing elements such as screws. One end of each side plate 54 forms a mounting portion 58 for mounting the fan 60, and each mounting portion 58 is provided with a pair of mounting holes 581 for fixing the fan 60. The outer frame of the fan 60 is provided with four perforations 62 corresponding to the mounting holes 581 of the fixed frame 50. The fan 60 is fixed on the side of the second heat sink group 40 opposite to the air guiding structure 46 by the mounting portion 58. For forced convective heat exchange to improve heat dissipation efficiency. When the electronic component is operating, the heat generated by the electronic component is transferred to the base 10, and the base 10 transfers the heat to the first heat sink group 30 and the evaporation portion 22 of the heat pipe 20 to partially pass the heat through the first heat sink group 30. Dissipated into the air; Then, the heat officer 20 transfers heat to the condensing section 24 through the phase change of the internal working fluid, and then quickly dissipates the heat to the surroundings through the second heat sink group 40 and the fan 60. The fifth figure is another embodiment of the second heat sink group, and only one heat sink of the second heat sink group is shown in the figure. On each heat sink, two pairs of folded edges 442 are formed at a certain angle in the manner of the previous embodiment, that is, two V-shaped notches 432 are first formed, and the edges of each V-shaped notch 432 are punched to form a pair of folded edges 442. When the folded edges of all the fins are stacked correspondingly, a wind guide structure (not shown) with a generally W-shaped cross section can be formed. From above. According to Huiming, whether the cross section of the wind guide structure is V-shaped or boundary-shaped, it includes a plurality of folds 44, 442, and these folds are at a fixed angle with the cold air flow 2 direction. In this creation, the cold air 44, "2 will change the direction of the cold air that flows there, spread to both sides, thereby increasing wind resistance and

M261973

V. Creation Instructions (5) Utilization of cold air. In the above description, these folding steps are straight lines. Understandably, the folds can be solitary to achieve the purpose. In addition, the folded edges 44 and 442 in the foregoing embodiments are formed at the edges of the notches 43 and 432. However, these gaps 43, 432 are not necessary. Referring to FIG. 1 ', another embodiment of the first political heat sheet group is shown. This figure shows only the heat sinks of the first political heat sheet group. Each heat sink is punched to form a pair of folding edges 443 at appropriate places, and the pair of folding edges 443 form a V-shaped structure. Each fold 443 forms an angle with the flow direction of the cold air. In this way, the cold air flowing there can be redirected, increasing the wind resistance and the utilization rate of the cold air. Similarly, the folding edges 443 may be straight lines or arcs. Based on the patent requirements, a preferred embodiment of the original creation is proposed in accordance with the law, and all equivalent modifications made by the spirit of the creation are within the scope of the patent. To sum up, this creation complies with the application for innovation. However, those mentioned above are only those who are familiar with the skills of this case. The conversion or changes should be covered in the following application. M261973 Brief description of the diagram [Schematic description of the diagram] The first diagram is a schematic diagram of a prior art heat sink. The second picture is a three-dimensional exploded view of the heat pipe cooling device of this creation. The third picture is a three-dimensional combined view of the second picture, the perspective of which is opposite to the second picture. The fourth picture is a front view of the heat pipe cooling device of this creation, and the fan is not shown. A perspective view of another embodiment of a heat sink of a heat sink group. The sixth diagram is a perspective view of another embodiment of a heat sink of the second heat sink group of the heat pipe cooling device of the present invention. [Description of component symbols] Base 10 Groove 12 Lock? L 14 Heat pipe 20 Evaporation section 22 Condensing section 24 First fin group 30 Space 32 Second fin group 40 Through hole 42 Notch 43 > 432 Folding edge 44 442 443 Air guide structure 46 Fixing frame 50 Top plate 52 Side plate 54 Perforation 544 ^ 62 Mounting section 58 Mounting 孑 L 581 Fan 6 0

Page 10

Claims (1)

M261973 6. Scope of patent application 1. A heat pipe heat dissipation device, comprising: ^ a base for contacting a heating electron element and a heat officer, including an evaporation part and a condensation part; thermal combination; σ 'the evaporation part and the A radiating fin group at the base is a plurality of cooling fin groups that are parallel to the base and are thermally combined with the radiating heat radiating fins. A plurality of fan-shaped airflow sides of the fan forming a fan-side fan 'are fixed on the heat sink group to form an angle with the fan-shaped edges. 2. The heat pipe cooling device described in item 1 of the patent scope, wherein each of the folded edges of the light pipe forms at least one ν-shaped 3 · that diffuses airflow to both sides, and the heat pipe cooling device described in item 2 of the patent scope In which, each month, the heat sheet forms a V-shaped gap between the folded edges forming the V-shaped structure. 4. The heat pipe radiating device according to item 1 of the scope of patent application, wherein the fold is straight. 5. The heat pipe radiating device according to item 1 of the scope of patent application, wherein the fold is an arc. 6. The heat pipe radiating device according to item 1 of the scope of patent application, wherein the heat pipe radiating device further comprises another fin group sandwiched between the fin group and the base, and the other fin group It includes a plurality of heat sinks which are perpendicular to the base and thermally combined with the base. 7. The heat pipe cooling device as described in item β of the patent application scope, of which 5 M261973 VI. Patent Application ® 1 A heat sink group is provided with two spaces for the condensing part of the heating pipe to penetrate. δ. The heat pipe heat dissipation X device according to item 7 of the scope of the patent application, wherein the bottom of the heat sink between the two spaces is firmly combined with the heat pipe evaporation part. 9 · = The heat pipe heat dissipation device described in item i of the patent application range, wherein the heat official heat dissipation device further includes a fixing pivot, the fixing frame includes a top plate and two side plates, and a housing is formed between the top plate and the two side plates. Seat heat pipe and heat sink space. 1 (ί · A heat pipe heat dissipation device, comprising: a base, which is in thermal contact with a heating electronic component; ^ # is comprised of an evaporation part and a condensation part, the evaporation part is in thermal contact with the base;: = 热 片 组 '系Including a plurality of heat sinks which are in thermal contact with the base at a certain distance from each other; and a heat sink group 'is placed on the first heat sink group and contacts the first heat sink group Including a plurality of toilet seats parallel and spaced a certain distance from each other: a heat sink group, a total station of η shore σ ^ ^ ^ and the first one, Xilian π # is provided with a wind guide structure on the other side; Wait on the heat sink and fold at an angle with the direction of the wind machine 11 as in the direction of the i-machine. • The heat pipe heat sink device described in item 10 of the patent scope, which is stacked corresponding to the fold on the second sheet. —F The heat pipe cooling device according to item 10, wherein the folds on each of the fins collectively form a fan to diffuse the air flow to both sides Page 12