1308682 九、發明說明： 【發明所屬之技術領域】 裝置本發财及-概織£ ’尤係指__於電子耕散熱之散熱 【先前技術】 電子元件（如中央處理器）運耔主 系統溫度升冑，躺導致其運行丨τ f‘，、、量’❿使其本身及 行，通常在電子元件上安裝散能正常運 習知散熱裝置-般包括與電子开杜H、所產生之熱置。 頂部之風扇。繼包括-基座及設於該^=^設== ’將散熱11從電子元件吸收之熱量散 I金扇產乳至基座上時，氣流受到阻擔而產生反彈 ===流阻增大影響氣流與散熱片間之熱交換作用。此外，風 ffit很少—部分能吹到散熱器位於風扇储下方之部分，即 未此充》_散熱紅位於風扇輪轂下方之部分進行散熱。 【發明内容】 '' 有鐾於此，有必要提供一種改進之散熱裝置。 本發明散熱裝置包括與電子元件接觸之一導熱板、設於該導熱板 亡之-散熱器、設於散熱ϋ上之-風扇、—散熱元件及__熱管，該熱 管連接該導熱板、散熱器及散熱元件，其中該散熱器包括與該導轨板 對應、且位於風扇下方之一導熱柱及設於該導熱柱上之複數鰭片。 相較於現有技術，所述散熱裝置利用熱管連接散熱器盘散熱元 件’可有效增大散熱面積’提升散熱性能；將導熱柱設於風/扇下$， 可充分利用散熱器上風扇產生之氣流吹不到之部分進行散熱；同時， 導熱柱與導熱板對應，導熱板不會阻礙氣流之流動，故本發明散熱裝 置具有較好之散熱性能。 【實施方式】 請參閱第一至第二圖，揭示本發明一實施例之散熱裝置。該散熱 裝置包括一導熱板100、設於導熱板100上之一散熱器200、通過複數 1308682 風扇固定架310固定在散熱器200頂部之一風扇3〇〇、設於散熱器2〇〇一 側，-散熱元件4〇0及三熱管500。該三熱管5〇〇連接該導熱板1〇〇、散 熱器200及散熱το件4GG。風扇3GG包括-輪較320及自輪_0向外放 射狀延伸設置之葉片330。 導熱板100與電子元件如中央處理器等接觸並吸收其產生之埶 量。導熱板100係由導熱性能良好之材料，如金屬銅或紹等製成，$ 熱板100—側設有三相互平行之凹槽102。 請同時參閱第三®，散熱H2G0為轉型，其包括位於輪較32〇下 方、且垂直固定在導熱板100上之一導熱柱21〇。導熱柱加呈矩型， 其四角分別向外延伸而形成-延伸臂212。導熱柱21〇包括與風扇3〇〇 接觸之頂部214及與導熱板_目接之底部216，且導熱柱2職部216 面積不小於導熱板100之面積。導熱柱210底部216設有相互平行、且 與導熱板100上之凹槽102分別對應之三溝槽218，該等溝槽218與凹槽 102對應齡成可以容置熱管5(X)之三#道。餘幻崎包括設於導 熱柱210及其延伸臂212周圍之鰭片220，該等鰭片220自該導熱柱210 向外放射狀延伸設置。相鄰鰭>} 220之間設有間距，形成可供氣流通 過之氣流通道222。風扇300產生之氣流沿氣流通道222向下流動，與 散熱器200進行熱交換，從而冷卻中央處理器及設於中央處理器周圍 之其他電子元件。 ° 散熱元件400包括與導熱柱21〇平行、且呈矩型之一導熱塊41〇， 及设於導熱塊410相對兩側、且與導熱板1〇〇平行之散熱片42〇。該散 熱元件400還包括三通孔430，其中一通孔430設於導熱塊41〇上並貫穿 該導熱塊410，另二通孔430分別設於導熱塊41〇兩侧之散熱片42〇上並 貫穿該等散熱片420。散熱元件4〇〇及上述散熱器2⑻可通過鋁擠等方 法製成。 熱管500大致呈L型’每一熱管5〇〇包括容置於管道内之一蒸發段 510 ’及從蒸發段510彎折延伸而出之一冷凝段52〇。熱管5〇〇之冷凝段 520分別穿設於散熱元件4〇〇上之通孔43〇，並平行於導熱柱21〇。 本發明散熱裝置在使用時，導熱板1〇〇與中央處理器接觸並吸收 中央處理器產生之熱量，風扇300產生之氣流沿散熱器2〇〇上之氣流 通道222吹向中央處理器並可將中央處理器產生之部分熱量直接散發 。導熱板100吸收之熱量一部分傳遞給散熱器2〇〇之導熱柱21〇，再 通過其上之鰭片220將熱量散發；另一部分熱量通過熱管5〇〇快速傳1308682 IX. Description of the invention: [Technical field to which the invention belongs] The device is rich in money and is generally referred to as the heat dissipation of the electronic ploughing heat. [Prior Art] Electronic components (such as central processing unit) When the temperature rises and rises, the lie causes it to operate 丨τ f', and the quantity '❿ makes it itself and the line. Usually, the dissipating energy is installed on the electronic components, and the heat sink is normally used. Hot set. The fan at the top. Following the inclusion of the pedestal and the setting of the ^=^== 'the heat dissipated from the electronic component to dissipate the heat from the electronic component to the susceptor, the airflow is resisted and rebounds === increase in flow resistance It affects the heat exchange between the airflow and the heat sink. In addition, there is very little wind ffit—some of which can be blown to the part of the radiator that is located below the fan storage, ie, the heat sink is located below the fan hub for heat dissipation. SUMMARY OF THE INVENTION '' In view of this, it is necessary to provide an improved heat sink. The heat dissipating device of the present invention comprises a heat conducting plate in contact with the electronic component, a heat sink disposed on the heat conducting plate, a heat sink, a fan disposed on the heat sink, a heat dissipating component, and a heat pipe, wherein the heat pipe is connected to the heat conducting plate and dissipates heat And a heat dissipating component, wherein the heat sink comprises a heat conducting column corresponding to the rail plate and located under the fan and a plurality of fins disposed on the heat conducting column. Compared with the prior art, the heat dissipating device uses a heat pipe to connect the heat dissipating component of the radiator plate to effectively increase the heat dissipating area to improve the heat dissipation performance; and the heat conducting column is disposed under the wind/fan, and the fan on the radiator can be fully utilized. The portion of the airflow that is not blown to dissipate heat; at the same time, the heat conducting column corresponds to the heat conducting plate, and the heat conducting plate does not hinder the flow of the airflow, so the heat dissipating device of the present invention has better heat dissipation performance. [Embodiment] Referring to first to second figures, a heat sink according to an embodiment of the present invention is disclosed. The heat dissipating device comprises a heat conducting plate 100, a heat sink 200 disposed on the heat conducting plate 100, and a fan 3〇〇 fixed to the top of the heat sink 200 through a plurality of 1308682 fan fixing brackets 310, and disposed on the side of the heat sink 2 - a heat dissipating component 4 〇 0 and a three heat pipe 500. The three heat pipes 5 are connected to the heat conducting plate 1 散, the heat sink 200, and the heat radiating member 4GG. The fan 3GG includes a wheel set 320 and a blade 330 extending outwardly from the wheel_0. The heat conducting plate 100 is in contact with an electronic component such as a central processing unit or the like and absorbs the amount of heat generated therefrom. The heat conducting plate 100 is made of a material having good thermal conductivity, such as metal copper or the like, and the hot plate 100 is provided with three mutually parallel grooves 102. Please also refer to the third®, the heat dissipation H2G0 is a transformation, which includes a heat conducting column 21〇 which is located below the 32〇 wheel and vertically fixed on the heat conducting plate 100. The heat conducting column is formed in a rectangular shape, and the four corners thereof extend outward to form an extension arm 212. The heat conducting column 21A includes a top portion 214 that is in contact with the fan 3A and a bottom portion 216 that is in contact with the heat conducting plate, and the area of the heat conducting column 2 portion 216 is not less than the area of the heat conducting plate 100. The bottom portion 216 of the heat conducting column 210 is provided with three grooves 218 which are parallel to each other and corresponding to the grooves 102 on the heat conducting plate 100, and the grooves 218 are corresponding to the grooves 102 to accommodate the heat pipe 5 (X) three # Road. The phantom includes a fin 220 disposed around the heat-conducting column 210 and its extension arm 212, and the fins 220 extend radially outward from the heat-conducting column 210. A spacing is provided between adjacent fins >} 220 to form an airflow passage 222 through which airflow can pass. The airflow generated by the fan 300 flows down the airflow passage 222 to exchange heat with the heat sink 200, thereby cooling the central processing unit and other electronic components disposed around the central processing unit. The heat dissipating component 400 includes a heat conducting block 41〇 parallel to the heat conducting post 21〇 and having a rectangular shape, and fins 42 disposed on opposite sides of the heat conducting block 410 and parallel to the heat conducting plate 1〇〇. The heat dissipating component 400 further includes a three-way hole 430, wherein a through hole 430 is disposed on the heat conducting block 41〇 and penetrates the heat conducting block 410, and the other two through holes 430 are respectively disposed on the heat sink 42〇 on both sides of the heat conducting block 41〇. Through the fins 420. The heat dissipating member 4A and the above heat sink 2 (8) can be formed by an aluminum extrusion or the like. The heat pipe 500 is generally L-shaped. Each heat pipe 5 includes a vaporization section 510' housed in the pipe and a condensation section 52〇 extending from the evaporation section 510. The condensation section 520 of the heat pipe 5 穿 is respectively passed through the through hole 43 〇〇 on the heat dissipating member 4 〇 and parallel to the heat transfer column 21 〇. When the heat dissipating device of the present invention is in use, the heat conducting plate 1 is in contact with the central processing unit and absorbing heat generated by the central processing unit, and the air flow generated by the fan 300 is blown toward the central processing unit along the air flow passage 222 on the heat sink 2 Dissipate part of the heat generated by the central processor directly. A part of the heat absorbed by the heat conducting plate 100 is transmitted to the heat conducting column 21〇 of the heat sink 2, and then the heat is radiated through the fins 220 thereon; another part of the heat is quickly transmitted through the heat pipe 5〇〇
1308682 =散減件，進而均勻__ 上並散發到周圍環境 ^由於導熱板100之面積小於導熱柱210之面積，風扇300產生之 氣流可直接吹至中央處理器而不會受到導熱板1〇〇之阻礙，消除導熱 板100對氣流之阻礙’從而降低流阻提升熱交換效率；導熱柱210設 於風扇300之輪轂320下方並從導熱板100吸收熱量，可充分利用散 熱器200上位於輪轂32〇下方之部分進行散熱，從而提升整體之散熱 性能。 此外’中央處理器產生之部分熱量通過熱管5〇〇傳遞到位於散熱 器200 —側之散熱元件4〇〇散發，這樣可使散熱器2〇〇及散熱元件4〇〇 共同為中央處理器進行散熱，可有效增大散熱面積；尤其在受到空間 限制散熱器200不能太高時’這樣設置可充分糊散熱器2⑻空 間來進行散熱。 請參閱第四至第五圖，係本發明散熱裝置另一實施例之立體圖。 該^施例與上-實施例之主要不同之處包括：散熱元件術係由相互 平行之散熱片440依次排列組成，該散熱元件4〇〇,相對兩側分別設有一 溝道，一對風扇ϋ定架450與散熱元件4〇〇,上之溝道卡扣而將另 600固定在該散熱元件400,上。其他元件與上一實施例中相同。 在上述實施例中，需要連接固定之元件之間，如導敵觸 ,、'、器200與熱管500之間，熱管5〇〇與散熱元件4〇〇、4〇〇， 過焊接等方法連接。 通 綜上所述，本發明確已符合發明專利之要件，遂依法提出 =惟，以上所述者僅為本發明之較佳實施例，自不能以此限制 =申請專職圍。軌熟悉本案技藝之人士援鉢㈣ ^ 等效修飾或變化，皆應涵蓋於以下申請專利範圍内。 坏作之 【圖式簡單說明】 第一圖係本發明散熱裝置一實施例之之立體組裝圖。 第二圖係第一圖中部分元件之分解圖。 第三圖係第二圖中之散熱器之底面圖。 第四圖係本發明散熱裝置另一實施例之之立體圖。 第五圖係第四圖中部分元件之分解圖。 1308682 【主要元件符號說明】 導熱板 100 凹槽 102 散熱器 200 導熱柱 210 延伸臂 212 頂部 214 底部 216 溝槽 218 鰭片 220 通道 222 風扇 300、600 風扇固定架 310、450 輪毅 320 葉片 330 散熱元件 400、400， 導熱塊 410 散熱片 420、440 通孔 430 熱管 500 蒸發段 510 冷凝段 5201308682 = the diffuser, and then evenly __ and distributed to the surrounding environment ^ Since the area of the heat conducting plate 100 is smaller than the area of the heat conducting column 210, the airflow generated by the fan 300 can be directly blown to the central processing unit without being subjected to the heat conducting plate 1〇 The obstruction of the heat shield 100 eliminates the obstruction of the air flow, thereby reducing the flow resistance and improving the heat exchange efficiency; the heat conducting column 210 is disposed under the hub 320 of the fan 300 and absorbs heat from the heat conducting plate 100, and can fully utilize the heat sink 200 on the hub The lower part of the 32 进行 heats up to improve the overall heat dissipation performance. In addition, part of the heat generated by the central processing unit is transmitted to the heat dissipating component 4 at the side of the heat sink 200 through the heat pipe 5〇〇, so that the heat sink 2〇〇 and the heat dissipating component 4〇〇 can be jointly performed by the central processing unit. The heat dissipation can effectively increase the heat dissipation area; especially when the space-restricted heat sink 200 cannot be too high, the arrangement can sufficiently paste the heat sink 2 (8) space for heat dissipation. Please refer to the fourth to fifth figures, which are perspective views of another embodiment of the heat sink of the present invention. The main difference between the embodiment and the above embodiment is that the heat dissipating component is composed of heat sinks 440 which are parallel to each other, and the heat dissipating component 4 is provided with a channel and a pair of fans respectively on opposite sides. The fixing frame 450 and the heat dissipating component 4 are fixed, and the upper 600 is fastened to the heat dissipating component 400. The other elements are the same as in the previous embodiment. In the above embodiment, it is necessary to connect the fixed components, such as the enemy contact, the ', between the device 200 and the heat pipe 500, the heat pipe 5〇〇 and the heat dissipating components 4〇〇, 4〇〇, and the like. . In summary, the present invention has indeed met the requirements of the invention patent, and is proposed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to apply for a full-time division. Those who are familiar with the skills of this project (4) ^ Equivalent modifications or changes shall be covered by the following patent applications. [Simplified description of the drawings] The first figure is an assembled view of an embodiment of the heat sink of the present invention. The second figure is an exploded view of some of the elements in the first figure. The third figure is the bottom view of the heat sink in the second figure. The fourth figure is a perspective view of another embodiment of the heat sink of the present invention. The fifth figure is an exploded view of some of the elements in the fourth figure. 1308682 [Main component symbol description] Thermal plate 100 Groove 102 Heat sink 200 Thermal column 210 Extension arm 212 Top 214 Bottom 216 Groove 218 Fin 220 Channel 222 Fan 300, 600 Fan holder 310, 450 Wheel Yi 320 Blade 330 Cooling Element 400, 400, heat conducting block 410 heat sink 420, 440 through hole 430 heat pipe 500 evaporation section 510 condensation section 520
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