CN100470774C

CN100470774C - Radiating apparatus

Info

Publication number: CN100470774C
Application number: CNB200510102110XA
Authority: CN
Inventors: 陈俊吉; 周世文; 武湛
Original assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2005-12-01
Filing date: 2005-12-01
Publication date: 2009-03-18
Anticipated expiration: 2025-12-01
Also published as: CN1979823A

Abstract

The heat sink includes a bottom plate, thermal fins attached to the bottom plate, heat pipe connected to the bottom plate and top of the thermal fins, a thermoelectric cooling element attached to the top of the thermal fins, and a fin set placed on the thermoelectric cooling element. Using refrigerating effect of the thermoelectric cooling element, the heat sink absorbs quantity of heat from top of the thermal fins, quickens heat transfer between bottom and top of the thermal fins so as to raise integral heat dispersion of the heat sink.

Description

Heat abstractor

[technical field]

The present invention relates to a kind of heat abstractor, particularly a kind of heat abstractor that is applied to electronic component.

[background technology]

Produce big calorimetric during electronic component (as central processing unit) operation, and itself and system temperature are raise, cause its runnability to descend then.For guaranteeing that electronic component normally moves, heat abstractor is installed on electronic component usually, discharge the heat that it produces.

The fan that traditional heat abstractor generally comprises a base plate that contacts with electronic component, is located at the some fin on the base plate and is installed on the fin top.After the heat that electronic component operation produces is absorbed by base plate, be dispersed in the surrounding environment with cooling electronic components by fin, the fan operation produces air-flow and blows to fin scattering and disappearing with accelerated heat again.Traditional heat abstractor generally has bigger surface area to increase the heat exchange area between fin and the air-flow.For promoting heat dispersion, increase the surface area of heat abstractor by increasing heat sink sizes usually.Yet the size that increases fin will can increase fin weight on the one hand, be subject to processing the restriction of technology on the other hand.

In addition, in the traditional heat-dissipating device because the distance from top electronic component of fin is far away, the heat that electronic component produces through base plate can not be fast by the bottom biography of fin to the top, fin top utilance is low, influences the integral heat sink performance of heat abstractor.

[summary of the invention]

In view of this, be necessary to provide a kind of heat abstractor that can fast heat be reached its top by the fin bottom.

A kind of heat abstractor comprises a base plate, and the thermoelectric cooling element and that the some fin on base plate of being sticked, a heat pipe, that connects base plate and fin top are attached at the fin top is arranged at the fins group of this thermoelectric cooling element.

Compared to prior art, described heat abstractor utilizes the refrigeration of thermoelectric cooling element, absorbs fin top heat, accelerates the heat transmission between fin bottom and top, effectively promotes the integral heat sink performance of heat abstractor.

With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.

[description of drawings]

Fig. 1 is the stereogram of heat abstractor of the present invention.

Fig. 2 is the stereogram of another angle of heat abstractor among Fig. 1.

Fig. 3 is the exploded view of Fig. 2.

Fig. 4 is the exploded view of cooling body and fan housing among Fig. 3.

Fig. 5 is the end view of cooling body among Fig. 4.

[embodiment]

See also Fig. 1 to Fig. 3, this heat abstractor 1 comprises a radiator 10, a fan 20, a cooling body 30 and a fan housing 40.

This radiator 10 comprises a base plate that contacts with electronic component 12, is located at some fin 14 of base plate 12 and three heat pipes 16 of hot link base plate 12 and fin 14.Each heat pipe 16 comprises an evaporation section and is arranged at a condensation segment at fin 14 tops.Base plate 12 lower surfaces are provided with three elongate slots (figure does not show) of ccontaining heat pipe 16 evaporation sections, and fin 14 tops are provided with the groove (figure does not show) of ccontaining heat pipe 16 condensation segments.Fan 20 passes through a fan Fixture 22 screw locks in radiator 10 1 sides.

See also Fig. 4, cooling body 30 is for being arranged at a thermoelectric refrigerating unit at radiator 10 tops, its bottom and fin 14 tops and heat pipe 16 condensation segment thermo-contacts.This cooling body 30 comprises a thermoelectric cooling element 32 and vertically is attached at the fins group 34 of thermoelectric cooling element 32 upper surfaces.Groove 320, one sides that these thermoelectric cooling element 32 bottoms are provided with three ccontaining heat pipe 16 condensation segments are provided with and are used for a pair of screw 326 that cooperates with fan Fixture 22.The edge of these fins group 34 1 opposite side is respectively equipped with near its bottom and cooperates the hole of fixing 340 with fan housing 40.This thermoelectric cooling element 32 comprises the hot junction 324 that a cold junction 322 reaches with respect to cold junction 322, and this cold junction 322 directly is sticked at fin 14 tops and the upper surface of heat pipe 16 condensation segments.This thermoelectric cooling element 32 is to utilize peltier effect to transmit the system of heat: when an outside electric current passed through thermoelectric cooling element 32, cold junction 322 absorbed heats and passes to hot junction 324, produces the temperature difference at the two ends of thermoelectric cooling element 32.

This fan housing 40 is fixed on radiator 10 opposite sides with respect to fan 20, comprises that the body 42 of a strip, a pair of support portion 44 of extending along body 42 two ends reach a baffle plate 46 that extends and favour body 42 by body 42 long limits, towards base plate 12.The end of each support portion 44 is provided with the screw 440 corresponding to hole 340.Baffle plate 46 guiding blows to base plate 12 by the air-flow that fan 20 produces, and strengthens fully contacting between air-flow and the base plate 12.Screw 444, hole 340 clamping fins group 34 1 sides are passed in wherein in turn by screw 60 in support portion 44, and body 42 is resisted against the side of this fin 14 simultaneously.

During use, base plate 12 absorbs the heat that electronic component produces, and by the evaporation section of heat pipe 16 heat transferred is arrived fin 14 tops.As shown in Figure 5, cold junction 322 fast Absorption fin, 14 tops of this thermoelectric cooling element 32 and the heat of heat pipe 16 condensation segments, reaching hot junction 324 simultaneously is dispersed in the environment by the fins group on it 34, quickening base plate 12 heats are delivered to fin 14 tops through heat pipe 16 evaporation sections and are absorbed by thermoelectric cooling element 32 once more, the heat transfer efficiency that adds quick heating pipe 16 effectively improves the hot transfer efficiency at fin 14 tops.In addition, the air-flow that fan 20 produces is blown over fin 14, accelerates heat and distributes.

The cold junction 322 of thermoelectric cooling element 32 absorbs the heat at fin 14 tops and passes to hot junction 324 in the heat abstractor of the present invention, the heat at fin 14 tops shifts fast, accelerate between fin 14 bottoms and the top and the evaporation section of heat pipe 16 and the heat transfer speed between the condensation segment, improve the heat dispersion of radiator 10.

Claims

1. a heat abstractor, comprise a base plate, be sticked some fin on base plate is characterized in that: comprise that also thermoelectric cooling element and that a heat pipe, that connects base plate and fin top is attached at the fin top is arranged at the fins group of this thermoelectric cooling element.

2. heat abstractor as claimed in claim 1 is characterized in that: above-mentioned thermoelectric cooling element comprise one with the top of fin and the cold junction of heat pipe thermo-contact, this fins group is formed at the surface of the opposite side of cold junction.

3. heat abstractor as claimed in claim 2 is characterized in that: above-mentioned thermoelectric cooling element bottom is provided with the groove of a ccontaining heat pipe.

4. heat abstractor as claimed in claim 3 is characterized in that: above-mentioned fin one side is provided with a fan.

5. heat abstractor as claimed in claim 4 is characterized in that: also have a fan housing to be arranged on fin one side, said fans and this fan housing lay respectively at this fin both sides.

6. heat abstractor as claimed in claim 5 is characterized in that: above-mentioned fan housing comprises support portion and baffle plate that relative fin tilts of a pair of clamping fins group one side.

7. heat abstractor as claimed in claim 6 is characterized in that: above-mentioned fan housing comprises a strip body, and a side of above-mentioned fins group is extended and be close in above-mentioned support portion along the body two ends, and above-mentioned baffle plate extends towards the base plate lopsidedness along body.