CN101018469B

CN101018469B - Heat radiator

Info

Publication number: CN101018469B
Application number: CN200610033624A
Authority: CN
Inventors: 赖振田; 周志勇; 胡健
Original assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2006-02-11
Filing date: 2006-02-11
Publication date: 2010-05-26
Anticipated expiration: 2026-02-11
Also published as: CN101018469A

Abstract

The heat radiation device comprises: a heat radiator including a bottom plate with throughole and thermal fins on the plate, and heat pipe including a first/second heat-transfer segment contacted withthe plate/fins. Wherein, the first segment contains a surface direct contacted with electronic element and an arc top surface contacted with fins through the throughhole. This invention reduces interface thermal resistance, and ensures normal running of the CPU.

Description

Heat abstractor

[technical field]

The present invention relates to a kind of heat abstractor, particularly a kind of heat abstractor that is applied to electronic component.

[background technology]

Produce a large amount of heats during electronic component (as central processing unit) operation, and itself and system temperature are raise, cause the decline of its runnability then.For guaranteeing that electronic component can normally move, heat abstractor is installed on electronic component usually, discharge the heat that it produces.

Fig. 1 to 2 is depicted as a kind of traditional heat abstractor, and this heat abstractor comprises a radiator 100 and an opposite heat tube 200.Radiator 100 is made by the good material of thermal conductivity, comprises the space, is provided with two pedestals 102 of hole and reaches another pedestal 102 and some fin 104 parallel to each other by a pedestal 102 edges, and pedestal 102 contacts with central processing unit 300.Heat pipe 200 is " U " shape, and two ends of every heat pipe 200 insert respectively in the hole of pedestal 102.When using this heat abstractor, with the heat on the central processing unit 300 substrate contacted 102 absorption central processing units 300, the part heat is directly delivered to by pedestal 102 and forms first heat-transfer path on the fin 104, all the other heats reach on another pedestal 102 by heat pipe 200, reach top fin 104 again and form second heat-transfer path.Yet, want after pedestal 102 heat absorptions, to reach heat pipe 200 more earlier at the heat on second heat-transfer path, be that heat must could conduct to heat pipe 200 via two hot interfaces, make the heat on the central processing unit 300 can not pass to heat pipe 200 fast, the heat conductivility of failing to make full use of heat pipe 200 carries out heat transferred, and influences the heat dispersion of heat abstractor.

[summary of the invention]

In view of this, be necessary the heat abstractor that provides a kind of performance preferable.

A kind of heat abstractor, comprise a radiator and at least one heat pipe, this radiator comprises a base plate that is provided with through hole and is located at groups of fins on this base plate, this heat pipe comprises first heat transfer segment that contacts with base plate and second heat transfer segment that contacts with groups of fins, wherein this through hole runs through described base plate up and down, first heat transfer segment of this heat pipe comprises and directly contacts with electronic component and be positioned at the bottom surface on same plane and curved end face with the bottom surface of this base plate of radiator, and the end face of first heat transfer segment of heat pipe extends to this through hole, this groups of fins is provided with a projection, and the through hole that this projection penetrates on the base plate contacts with the part that is positioned at this through hole of the end face of heat pipe first heat transfer segment.

Compared to prior art, described heat abstractor utilizes first heat transfer segment of heat pipe directly to contact with central processing unit, can effectively reduce the interface resistance between the two, the heat that central processing unit is produced can be absorbed to guarantee the normal operation of central processing unit by first heat transfer segment of heat pipe as early as possible.In addition, the end face of first heat transfer segment of heat pipe is curved, can effectively increase the contact area between heat pipe and other heat dissipation element such as base plate, the groups of fins, helps heat pipe with other heat dissipation element of heat transferred that absorbs.

With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.

[description of drawings]

Fig. 1 is the schematic perspective view of traditional heat-dissipating device.

Fig. 2 is the profile along the II-II line among Fig. 1.

Fig. 3 is the stereogram of heat abstractor one embodiment of the present invention.

Partial exploded view when Fig. 4 is heat abstractor among Fig. 3 bottom-up.

Fig. 5 is the exploded view of heat abstractor among Fig. 4.

Fig. 6 is the enlarged diagram of base plate among Fig. 5.

Fig. 7 is the profile along the VII-VII line among Fig. 3.

Fig. 8 is the cross sectional representation of another embodiment of heat abstractor of the present invention.

[embodiment]

See also Fig. 3 to 5, a preferred embodiment of heat abstractor of the present invention comprises a radiator 30 and is arranged at a opposite heat tube 40 on this radiator 30.Each root heat pipe 40 is the U type substantially, comprises one first heat transfer segment 42, one second heat transfer segment 44, and one the 3rd heat transfer segment 46 that first, second

heat transfer segment

42,44 is linked into an integrated entity.

Radiator 30 comprise a base plate 32, an and top board 34 that at interval be provided with parallel substantially with base plate 32 and be located at base plate 32 and top board 34 between groups of fins 36.

And with reference to Fig. 6 and Fig. 7, base plate 32 is to be made by heat conductivility good metal material such as copper, aluminium etc., and it contacts with thermal source such as central processing unit 50 and absorbs heats from central processing unit 50, simultaneously the groups of fins 36 of the heat transferred that heat pipe 40 is absorbed on it.Base plate 32 comprises and 364 contacted tops, groups of fins 36 bottoms, and relative with the top and bottom 324 that contact with central processing unit 50.In addition, also be provided with a depressed part 326 in base plate 32 central areas.This depressed part 326 comprises a rectangular through-hole 3262 that runs through base plate 32, and respectively from a pair of connecting portion 3264 of the relative dual-side of this depressed part 326 to these rectangular through-hole 3262 opposed side edges bending extensions.Connecting portion 3264 is mainly used in and contacts with first heat transfer segment 42 of heat pipe 40 and absorb heats from first heat transfer segment 42 of heat pipe 40, and its surface is curved can be cooperated with reduction interface resistance between the two with the end face of first heat transfer segment 42 of heat pipe 40.

The bottom of top board 34 is provided with the groove 342 of pair of parallel.

Groups of fins 36 is attached on the base plate 32, and its relative top 362, bottom 364 are connected with top board 34, base plate 32 respectively.Be provided with the groove 368 of pair of parallel at the top 362 of groups of fins 36, and the groove 342 corresponding pair of channels that are combined on this groove 368 and the top board 34, with second heat transfer segment 44 of ccontaining heat pipe 40.Be provided with a projection 366 triangular in shape substantially in the bottom 364 of groups of fins 36, this projection 366 can penetrate the through hole 3262 on the base plate 32 and then contact with first heat transfer segment 42 of heat pipe 40.The both sides of this denation 366 are respectively a curved surface 3662, this curved surface 3662 can with the surface engagement of first heat transfer segment 42 of heat pipe 40 to reduce interface resistance between the two.

First heat transfer segment 42 of heat pipe 40 contacts with central processing unit 50 and absorbs the heat that central processing unit 50 produces, so be the evaporation section of heat pipe 40; Second heat transfer segment 44 of heat pipe 40 contacts with the top 362 of top board 34 and groups of fins 36 and heat transferred that first heat transfer segment 42 is absorbed is in contact with it top board 34 and groups of fins 36 are so be the condensation segment of heat pipe 40.Wherein, first heat transfer segment 42 comprises a flat bottom surface 422 and curved end face 424.As shown in Figure 7, when heat pipe 40 and radiator 30 were combined, the flat bottom surface 422 of first heat transfer segment 42 of heat pipe 40 was positioned at same plane with the bottom surface 324 of the base plate 32 of radiator 30.Simultaneously, the denation 366 of the bottom 364 of groups of fins 36 penetrates the through hole 3262 on the base plate 32 and contacts with the part arc top surface 424 of heat pipe 40 first heat transfer segment 42, and another part arc top surface 424 of heat pipe 40 first heat transfer segment 42 directly and the connecting portions 3264 on the base plate 32 contact.Like this, the arc top surface 424 of heat pipe 40 first heat transfer segment 42 contacts with the bottom 364 and the base plate 32 of groups of fins 36 simultaneously.

Heat abstractor of the present invention in use, first heat transfer segment 42 of heat pipe 40 directly contacts with central processing unit 50, and the heat absorption that central processing unit 50 is produced.The heat part that heat pipe 40 first heat transfer segment 42 absorb is directly passed to the denation 366 of the bottom 364 of the groups of fins 36 that is in contact with it, and forms first heat-transfer path; Part heat is directly passed to the connecting portion 3264 on the base plate 32 that is in contact with it, and then expands to other parts of base plate 32, is passed to groups of fins 36 again and forms second heat-transfer path; The heat of remainder conducts to second heat transfer segment 44 of heat pipe 40 along the 3rd heat transfer segment 46 of heat pipe 40, and then passes to the top 362 of top board 34 and groups of fins 36, forms the 3rd heat-transfer path.So, central processing unit 50 can distribute by the heat of above-mentioned three heat-transfer paths with its generation simultaneously, but the speed that accelerated heat is distributed, the heat dispersion of lifting heat abstractor of the present invention.

And, first heat transfer segment 42 of heat pipe 40 directly contacts with central processing unit 50, can effectively reduce the interface resistance between the two, the heat that central processing unit 50 is produced can be absorbed by first heat transfer segment 42 of heat pipe 40 as early as possible, to guarantee the normal operation of central processing unit 50.In addition, the end face 424 of first heat transfer segment 42 of heat pipe 40 is curved, can effectively increase the contact area between the bottom 364 of heat pipe 40 and other heat dissipation element such as base plate 32, groups of fins 36, helps heat pipe 40 with other heat dissipation element of heat transferred that absorbs.Moreover, first heat transfer segment 42 of heat pipe 40 contacts with base plate 32, can be with part heat transferred base plate 32, and then with heat diffusion to whole base plate 32, can make full use of that the fin away from central processing unit 50 parts dispels the heat on the base plate 32, promote whole radiating effect.

Figure 8 shows that the cross sectional representation of another embodiment of heat abstractor of the present invention.Main difference part between this embodiment and the foregoing description is: base plate 32 ' is provided with the slit of pair of parallel, the arc top surface of first heat transfer segment 42 of heat pipe 40 424 protrude this to slit after and be placed in the elongated slot 367 of pair of parallel of groups of fins 36 ' bottom.

In the above-described embodiments, need between the interconnective element, as being connected by methods such as welding between heat pipe 40 and the base plate 32,32 ', between heat pipe 40 and the groups of fins 36 and between top board 34 and the groups of fins 36.

Be appreciated that ground, second heat transfer segment 44 of heat pipe 40 also can not used top board 34 and contact with the top 362 of groups of fins 36.In addition, the quantity of heat pipe 40 can be selected according to the actual caloric value of central processing unit 50 or other heater element.

Directly contact in first heat transfer segment that satisfies heat pipe with central processing unit, under second heat transfer segment and the situation that fin away from central processing unit contacts, it is described that the shape of heat pipe is not limited to the foregoing description, as the serpentine heat pipe of one first heat transfer segment, two parallel second heat transfer segment.

Claims

1. heat abstractor, comprise a radiator and at least one heat pipe, this radiator comprises a base plate that is provided with through hole and is located at groups of fins on this base plate, this heat pipe comprises first heat transfer segment that contacts with base plate and second heat transfer segment that contacts with groups of fins, it is characterized in that: this through hole runs through described base plate up and down, first heat transfer segment of this heat pipe comprises and directly contacts with electronic component and be positioned at the bottom surface on same plane and curved end face with the bottom surface of this base plate of radiator, and the end face of first heat transfer segment of heat pipe extends to this through hole, this groups of fins is provided with a projection, and the through hole that this projection penetrates on the base plate contacts with the part that is positioned at this through hole of the end face of heat pipe first heat transfer segment.

2. heat abstractor as claimed in claim 1 is characterized in that: this heat pipe first heat transfer segment is a plane with the bottom surface that electronic component directly contacts.

3. heat abstractor as claimed in claim 1 is characterized in that: the bottom of this groups of fins and this base plate join, and the bottom of this groups of fins is provided with a slit, and the end face of first heat transfer segment of this heat pipe is placed in this slit after protruding through hole on this base plate.

4. heat abstractor as claimed in claim 1, it is characterized in that: this base plate also comprises a depressed part, this through hole is located on this depressed part, and this depressed part comprises and is positioned at this through hole one side and a junction of extending to a side of this depressed part of the side of this through hole certainly.

5. heat abstractor as claimed in claim 4 is characterized in that: this connecting portion has a curved surfaces, and this curved surfaces contacts with the part that the end face of first heat transfer segment of this heat pipe is positioned at this connecting portion place.

6. heat abstractor as claimed in claim 1 is characterized in that: this projection comprises a curved surface, and this curved surface cooperates with the part that the end face of heat pipe first heat transfer segment is positioned at this through hole.

7. heat abstractor as claimed in claim 1 is characterized in that: this radiator also comprises a top board, and this groups of fins is located between base plate and the top board.

8. heat abstractor as claimed in claim 7 is characterized in that: this top board is provided with a groove, the corresponding groove that is provided with of this groups of fins with this groove, and the corresponding passage that is combined into this groove of this groove is to accommodate second heat transfer segment of heat pipe.

9. heat abstractor as claimed in claim 1 is characterized in that: this heat pipe also comprises one the 3rd heat transfer segment, and first heat transfer segment, second heat transfer segment and the 3rd heat transfer segment constitute U type structure.