TWI422315B - Heat sink dissipation - Google Patents

Description

Heat sink

The invention relates to a heat dissipating device, in particular to a heat dissipating device with good heat dissipating effect.

With the continuous development of the electronics industry, the operating speed and overall performance of electronic components (especially the central processing unit) are constantly increasing, and the heat generation is also increasing. In order to make electronic components work properly, the industry generally uses a heat sink on the electronic components to dissipate heat. Generally, the heat sink includes a solid base attached to the heat-generating electronic component, and a plurality of heat sinks extending upward from the base, and a heat pipe connecting the base and the heat sink is further provided for heat dissipation to heat the heat-generating electronic component. Transfer to the heat sink quickly. However, since the base of the heat sink is a solid body, the heat generated by the heat-generating electronic components is easily concentrated in the center of the base, and cannot be quickly and evenly distributed on the entire base, which is not conducive to uniform heat transfer to each heat sink. In addition, under the condition that the overall volume of the heat sink is constant, the heat dissipation area provided by the heat sink of the conventional structure is greatly limited, so that the heat dissipation efficiency is low. Therefore, it is necessary to provide a heat sink having a high heat dissipation efficiency.

In view of this, it is necessary to provide a heat sink having a high heat dissipation efficiency.

A heat dissipating device for dissipating heat from two adjacent heating electronic components, including a setting a first heat sink on one of the heat-generating electronic components, a second heat sink disposed on the other heat-generating electronic component in parallel with the first heat sink, and a plurality of heat pipes connected to the first and second heat sinks, each heat pipe including the penetration An evaporation section of the first heat sink, a condensation section penetrating the top end of the second heat sink, and a connection section between the evaporation section and the condensation section, the first heat sink including a heat spreader plate attached to one of the electronic components And a first fin set closely attached to the heat equalizing plate, the first fin set has a honeycomb structure, and the evaporation section of the heat pipe is flat, is received in the first fin set and clamped to the first Between the fin group and the heat equalizing plate, the connecting portion of the heat pipe includes a horizontal portion connecting the evaporation portion and an inclined portion connecting the condensation portion, and the evaporation portion is disposed opposite to the inclined portion.

Compared with the prior art, the first fin group has a honeycomb structure in the invention, which effectively increases the heat dissipation area; the heat equalizing plate uniformly transfers the heat on the one of the heat-generating electronic components to the first fin group, and fully utilizes the first Each part of the fin set is cooled to effectively improve the heat dissipation efficiency of the heat sink.

10‧‧‧First radiator

20‧‧‧second radiator

30‧‧‧heat pipe

52, 54‧‧‧ first and second heating elements

50‧‧‧ boards

12‧‧‧Support frame

14‧‧‧Homothermal board

16‧‧‧First fin set

120‧‧‧Fixed holes

510‧‧‧Perforation

80‧‧‧ screws

122‧‧‧ gap

140‧‧‧Seal

160‧‧‧Air passage

162‧‧‧ Reception trough

22‧‧‧floor

24‧‧‧second fin set

240‧‧‧ holes

32‧‧‧Evaporation section

34‧‧‧Condensation section

36‧‧‧Connection section

360‧‧‧ horizontal department

362‧‧‧ inclined section

1 is a perspective assembled view of a heat sink of the present invention.

Figure 2 is an exploded perspective view of Figure 1.

3 is a side view of the first fin set of FIG. 1.

Referring to FIG. 1 and FIG. 2, a heat dissipating device in a preferred embodiment of the present invention is configured to dissipate heat from the first and second heating elements 52 and 54 on a circuit board 50. The heat dissipating device includes a first heat sink 10, The second heat sink 20 disposed along the first heat sink 10 and the heat pipe 30 are thermally connected to one of the first and second heat sinks 10, 20. The first and second heat sinks 10 and 20 are respectively attached to the first and second heat generating elements 52 and 54 to dissipate heat therefrom.

The first heat sink 10 includes a support frame 12 , a heat equalizing plate 14 fixed to the support frame 12 , and a first fin set 16 attached to the heat equalizing plate 14 . The heat equalizing plate 14 and the first fin group 16 are fixed by welding or pasting. The support frame 12 has a rectangular shape, and a fixing hole 120 is disposed adjacent to the four corners. The fixing hole 120 corresponds to the through hole 510 disposed on the circuit board 50, so that the screw 80 passes through the support frame 12 to fix the support frame 12 to the circuit board 50. A notch 122 is defined at an intermediate position of one side of the support frame 12. The heat equalizing plate 14 is a flat-shaped heat pipe, which is packaged with a working medium, so that it has the advantages of good thermal conductivity and small quality relative to the solid metal plate body. The heat equalizing plate 14 has a rectangular shape and is matched in shape to the support frame 12 so that the heat equalizing plate 14 is just attached to the support frame 12. One side of the heat equalizing plate 14 protrudes outwardly from the side of the support frame 12; when the heat equalizing plate 14 is attached to the support frame 12, the sealing portion 140 protrudes through the notch 122 of the support frame 12 and protrudes from the support frame 12 In addition, interference with the support frame 12 is avoided. The first fin group 16 has a rectangular shape, and the honeycomb structure is formed by stacking a plurality of metal foils. The honeycomb structure may be composed of a plurality of polygons such as a circular shape, a triangular shape, a quadrangle shape, or may be a patchwork of irregular polygon shapes. Made together. In the present embodiment, the first fin set 16 has a honeycomb structure composed of a plurality of hexagonal holes, and each hexagonal hole forms an air flow path 160 through which air flows (see FIG. 3). A receiving slot 162 is defined in the bottom of the first fin set 16 for receiving the heat pipe 30. The receiving slot 162 has a rectangular cross section.

The second heat sink 20 includes a bottom plate 22 and a second fin set 24 attached to the bottom plate 22 . The bottom plate 22 is made of a metal having good thermal conductivity, and the second fin set 24 has the same structure as the first fin set 16, that is, also has a honeycomb structure, and the lower surface of the second fin set 24 is welded or pasted. It is fixed to the upper surface of the bottom plate 22. The second fin set 24 is provided at its top with a pair of holes 240 for accommodating the heat pipes 30.

Each heat pipe 30 includes a flat evaporating section 32, a condensing section 34, and a connecting section 36 between the evaporating section 32 and the condensing section 34. The lower surface of the evaporation section 32 is flat, so that the evaporation section 32 is received in the receiving groove 162 of the first fin set 16, and the lower surface thereof is coplanar with the bottom surface of the first fin set 16 to ensure the lower surface of the evaporation section 32. It can be directly attached to the upper surface of the heat equalizing plate 14 to obtain the largest contact area. The connecting section 36 includes a horizontal portion 360 connecting the evaporation section 32 and an inclined portion 362 connecting the condensation section 34, and the horizontal portion 360 is disposed opposite to the inclined portion 362. The horizontal portions 360 are disposed parallel to each other and perpendicular to the evaporation section 32. The inclined portions 362 are disposed opposite to the evaporation section 32, so that the condensation section 34 of the heat pipe 30 is smoothly inserted into the holes 240 of the second heat sink 20.

When assembled, the screw 80 is sequentially passed through the fixing hole 120 of the support frame 12, fixed in the through hole 510 of the circuit board 50, and the first heat sink 10 is fixed on the circuit board 50 and the bottom surface of the heat equalizing plate 14 is closely attached to the first surface. The heating element 52; likewise, the screw 80 passes through the bottom plate 22 of the second heat sink 20 to fix the second heat sink 20 to the circuit board 50 while the bottom surface of the bottom plate 22 abuts against the second heat generating component 54. The evaporation section 32 of the heat pipe 30 is received in the receiving groove 162 of the first fin set 16 , and the lower surface thereof is coplanar with the bottom surface of the first fin set 16 and is clamped to the heat equalizing plate 14 and the first fin set 16 . The condensing sections 34 are disposed in the holes 240 of the second heat sink 20 at intervals. At this time, the horizontal portions 360 of the connecting sections 36 are disposed in parallel on the sides of the first and second heat sinks 10, 20.

In operation, the heat equalizing plate 14 of the first heat sink 10 absorbs the heat of the first heat generating component 52 and is rapidly and evenly distributed on the heat equalizing plate 14, a portion of the heat is directly radiated through the first fin group 16, and the other portion passes through the heat pipe 30. Passing to the second fin set 24 of the second heat sink 20 and passing it from the top of the second fin set 24 to the bottom thereof; meanwhile, the bottom plate 22 of the second heat sink 20 absorbs the heat of the second heat generating component 54 and rapidly upwards Pass, that is, by the second The bottom of the fin set 24 is quickly transferred to its top. At this point, the heat of the first and second heating elements 52, 54 is evenly distributed on the second fin set 24 of the second heat sink 20, which improves the utilization of the middle of the second fin set 24, and fully utilizes the second fin set 24 Each part enhances the heat dissipation efficiency of the heat sink.

In the present invention, the first and second fin groups 16 and 24 are all honeycomb structures, and have the advantages of light volume and large heat dissipation surface area. In addition, the bottom plate 22 of the second heat sink 20 can also be formed as a soaking plate for quickly and evenly transferring heat to the second fin set 24 of the second heat sink 20.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

10‧‧‧First radiator

20‧‧‧second radiator

30‧‧‧heat pipe

52, 54‧‧‧ first and second heating elements

50‧‧‧ boards

12‧‧‧Support frame

14‧‧‧Homothermal board

16‧‧‧First fin set

120‧‧‧Fixed holes

510‧‧‧Perforation

80‧‧‧ screws

122‧‧‧ gap

140‧‧‧Seal

162‧‧‧ Reception trough

362‧‧‧ inclined section

22‧‧‧floor

24‧‧‧second fin set

240‧‧‧ holes

32‧‧‧Evaporation section

34‧‧‧Condensation section

36‧‧‧Connection section

360‧‧‧ horizontal department

Claims (8)

A heat dissipating device is configured to dissipate heat from two adjacent heat-generating electronic components, including a first heat sink disposed on one of the heat-generating electronic components and a second heat sink disposed on the other heat-generating electronic component in parallel with the first heat sink And a plurality of heat pipes connecting the first and second radiators, each heat pipe comprising an evaporation section penetrating the first heat sink, a condensation section penetrating the top end of the second heat sink, and a connection section between the evaporation section and the condensation section The improvement is that the first heat sink comprises a heat equalizing plate attached to one of the electronic components and a first fin set closely attached to the heat equalizing plate, wherein the first fin set has a honeycomb structure. The evaporating section of the heat pipe is flat, is received in the first fin set and clamped between the first fin set and the heat equalizing plate, and the connecting section of the heat pipe includes a horizontal portion connecting the evaporation section and a connecting condensation section. The inclined portion is disposed on the opposite side of the inclined portion. The heat sink of claim 1, wherein a lower surface of the evaporation section of the heat pipe is coplanar with a bottom surface of the first fin set. The heat dissipating device of claim 2, wherein the horizontal portion of the connecting portion is disposed in parallel on the side of the first and second heat sinks. The heat sink of claim 3, wherein the horizontal portion of the connecting section is disposed perpendicular to the evaporation section. The heat sink of claim 1, wherein the first heat sink further comprises a support frame, and the heat spreader is fixed on the support frame. The heat dissipating device of claim 5, wherein a side of the heat equalizing plate extends outwardly, and the sealing portion extends through one side of the supporting frame and protrudes from one side of the first heat sink. . The heat dissipating device of claim 6, wherein a side of the support frame is provided with a notch, and the sealing portion of the heat-receiving plate is fixed to the support frame through a gap of the support frame. The heat sink of claim 1, wherein the second heat sink comprises a bottom plate attached to another heat-generating electronic component, and a second fin set mounted on the bottom plate and having a honeycomb structure. The condensation section of the heat pipe is disposed in the second fin set of the second heat sink.