TWI450680B - Heat dissipation device and heat dissipation method thereof - Google Patents

Description

Heat sink and heat dissipation method thereof

The invention relates to a heat dissipating device, in particular to a heat dissipating device for dissipating heat of an electronic component and a heat dissipating method thereof.

As the electronic information industry continues to evolve, the frequency and speed of electronic components (especially central processing units) continue to increase. Due to the high frequency and high speed, the heat generated by the electronic components will increase, which causes the temperature to rise continuously, which seriously threatens the performance of the electronic components during operation. To ensure the normal operation of the electronic components, it is necessary to discharge a large amount of heat generated by the electronic components in time. Therefore, various types of heat sinks have been continuously designed.

Conventional heat sinks generally include a heat absorbing plate, a heat pipe and a heat sink. The heat absorbing plate is attached to the upper surface of the electronic component. The heat pipe is coupled to the heat absorbing plate at one end and coupled to the heat sink at the other end to be assembled into a heat dissipating device. The heat generated by the electronic component is absorbed by the heat absorbing plate and transmitted to the heat pipe. It is further radiated through the radiator.

However, in the above heat dissipating device, the heat pipe and the electronic component are connected by the heat absorbing plate, and the heat resistance is large, and the heat conduction performance of the heat pipe cannot be fully utilized, and the heat dissipation effect is often not obtained when the heat load is large.

In view of this, it is necessary to provide a heat sink having a small heat resistance and good heat dissipation performance and a heat dissipation method thereof.

A heat dissipating device includes a substrate, at least one heat pipe and a heat dissipating fin set, the heat pipe includes an evaporation section and a condensation section, and a lower surface of the substrate is provided with a groove for receiving an evaporation section of the heat pipe, the heat dissipation fin The sheet group is combined with a condensation section of the heat pipe, the evaporation section of the heat pipe having a plane for contacting a heat-generating electronic component, the plane being provided with a solid solder paste layer, the outer surface of the solder paste layer and the substrate The lower surface is on the same plane.

A heat dissipation method includes the steps of: providing a substrate, providing a trench on a lower surface of the substrate; providing a heat dissipation fin set, the heat dissipation fin set is disposed on an upper surface of the substrate; providing at least one heat pipe, The heat pipe includes an evaporation section and a condensation section, the evaporation section of the heat pipe has a plane, the condensation section of the heat pipe is coupled to the heat dissipation fin set, and the evaporation section of the heat pipe is disposed in the groove of the substrate, and the a flat surface of the evaporation section of the heat pipe is exposed; a solid solder paste layer is disposed on the exposed surface such that the outer surface of the solder paste layer is on the same plane as the lower surface of the substrate; and the solder paste layer and the heat source A layer of thermal paste is applied between the substrates and the substrate is brought into contact with a heat source.

Compared with the prior art, the evaporation section of the heat pipe of the heat dissipating device is in conduction contact with the heat source, can absorb heat more quickly and effectively, can fully exert the rapid heat conduction performance of the heat pipe, and the evaporation section of the heat pipe has a plane in contact with the heat source. A solder paste layer is disposed on the plane to ensure the flatness between the plane of the evaporation section and the lower surface of the substrate.

10‧‧‧Substrate

12‧‧‧ upper surface

14‧‧‧ Lower surface

16, 17, 18‧ ‧ gap

20‧‧‧Fixing fin group

21‧‧‧ body

22, 23‧‧‧ boss

24, 27‧‧‧through holes

25, 28‧‧‧ grooves

26, 29‧‧‧ openings

30, 32, 34‧‧‧ heat pipes

40‧‧‧ solder paste layer

160, 162‧‧‧ trench

210, 220‧‧‧ Heat sink fins

320, 340‧‧Evaporation section

322, 342‧‧ ‧ Condensation section

324, 344‧‧‧ Connection section

326‧‧‧ arc surface

328‧‧‧ plane

1 is an exploded perspective view of a heat sink according to a preferred embodiment of the present invention.

Figure 2 is an exploded perspective view of Figure 1 inverted.

Figure 3 is an assembled, isometric view of Figure 2;

4 is a flow chart of a heat dissipation method of the heat dissipation device shown in FIG.

The present invention will be further described below in conjunction with the embodiments with reference to the accompanying drawings.

As shown in FIG. 1 and FIG. 2 , the heat dissipation device includes a substrate 10 , a heat dissipation fin set 20 , and four heat pipes 30 .

The substrate 10 has a square plate shape with a flat upper surface 12 and a lower surface 14 opposite the upper surface 12. Four lower horizontal grooves 16 are arranged side by side on the lower surface 14. The four horizontal grooves 16 have a semi-circular shape in cross section, and include two first grooves 160 in the middle of the substrate 10 and two second grooves 162 on the two sides of the two first grooves 160 respectively. . The first and second trenches 160 and 162 extend through the left and right sides of the substrate 10, and the right side of the substrate 10 defines a rectangular first notch 17 corresponding to the ends of the two first trenches 160. The width of the notch 17 is the same as the overall width of the two first grooves 160. The left side of the substrate 10 defines two rectangular second notches 18 corresponding to the ends of the two second grooves 162. The width of each of the second notches 18 is the same as the width of each of the second grooves 162.

The heat dissipation fin group 20 is attached to the upper surface 12 of the substrate 10. The heat dissipation fin assembly 20 includes a square body 21 formed by arranging a plurality of longer heat dissipation fins 210, and first and second portions respectively arranged on the left and right sides of the body 21 by a plurality of shorter heat dissipation fins 220. Two bosses 22, 23. The plurality of longer heat dissipation fins 210 and the plurality of shorter heat dissipation fins 220 are spaced apart from each other in parallel.

The top end of the heat dissipation fin group 20 is provided with two circular first through holes 24 penetrating the heat dissipation fin group 20 at positions on the left and right sides. Two first U-shaped first grooves 25 are respectively formed on the second boss 23 at positions corresponding to the two first through holes 24. The two first grooves 25 The top end of the first through hole 24 communicates with the two first through holes 24 respectively, and extends toward the bottom surface of the second boss 23 corresponding to the downward direction of the two first through holes 24 and close to each other, and is in the second Two first openings 26 are formed on the bottom surface of the boss 23. The two first openings 26 are parallel to each other and spaced apart from each other, and the overall shape and size formed on the bottom surface of the heat dissipation fin group 20 correspond to the shape and size of the first notch 17 on the substrate 10 to serve the heat dissipation fins. The first notch 17 is in communication with the first groove 25 when the chip set 20 is assembled on the substrate 10.

The heat dissipation fin group 20 is respectively provided with two circular second through holes 27 below the two first through holes 24 . Two "U" shaped second grooves 28 are respectively defined in the first boss 22 at positions corresponding to the two second through holes 27. The top ends of the two second recesses 28 are respectively communicated with the two second through holes 27, corresponding to the positions of the two second through holes 27 extending downward and in a direction close to each other to extend through the first boss 22 The bottom surface defines two second openings 29 on the bottom surface of the first boss 22. The shapes and sizes of the two second openings 29 respectively correspond to the shapes and sizes of the two second notches 18 on the substrate 10, so that the two second notches 18 are formed when the heat dissipation fin set 20 is assembled on the substrate 10. Correspondingly communicate with the two second grooves 28 respectively.

The four heat pipes 30 are all U-shaped, and the pipe body is made of a metal having good thermal conductivity such as copper. Referring to FIG. 3 , the four heat pipes 30 include two first heat pipes 32 in the middle and two second heat pipes 34 respectively disposed on two sides of the two first heat pipes 32 . Each of the first heat pipes 32 includes a first evaporation section 320 received in the first trench 160 of the substrate 10, and a first condensation section 322 disposed in the first through hole 24 of the heat dissipation fin set 20, And a first connecting portion 324 connected between the first evaporation section 320 and the first condensation section 322 and received in the first recess 25 of the second boss 23. Each of the second heat pipes 34 includes a second evaporation section 340 received in the second groove 162 of the substrate 10 and is disposed in the second heat pipe 34. a second condensation section 342 in the second through hole 27 of the heat dissipation fin group 20, and a second concave portion connected between the second evaporation section 340 and the second condensation section 342 and received in the first boss 22 A second connecting section 344 in the slot 28. The first evaporation section 320 and the second evaporation section 340 have the same shape, and each includes an arc surface 326 matching the inner surfaces of the first and second grooves 160, 162 of the substrate 10 and the arc shape Face 326 is opposite a plane 328. Each of the evaporation sections 320, 340 has a semi-circular cross section with a height slightly less than the depth of the grooves 160, 162.

The evaporation sections 320, 340 of the heat pipe 30 are received in the grooves 160, 162, and the arcuate faces 326 are respectively attached to the inner surfaces of the grooves 160, 162, and the plane 328 and the lower surface 14 of the substrate 10 are An interval of approximately 0.1 mm to 0.3 mm is formed therebetween. Then, a solder paste layer 40 is filled in the gap between the arcuate surface 326 of the heat pipe 30 and the inner surface of the corresponding trenches 160, 162 and the space between the plane 328 and the lower surface 14 of the substrate 10, respectively. The solder tube 30 is soldered to the substrate 10, and the solder paste layer 40 is solid after being connected. The solder paste layer 40 on the plane 328 is milled such that its outer surface is in the same plane as the lower surface 14 of the substrate 10. The solder paste layer 40 forms a contact with the heat source at the center of the lower surface 14 of the substrate 10. A heat absorption zone with a high heat transfer coefficient. In use, the heat-generating electronic component is attached to the heat-absorbing region, and a layer of thermal conductive paste is further coated between the surface of the heat-generating electronic component and the solder paste layer 40. The heat generated by the heat-generating electronic component is transferred to the tin through the thermal conductive paste. The paste layer 40 is further absorbed by the solder paste layer 40 to the evaporation sections 320, 340 of the heat pipe 30, and then transferred to the condensation sections 322, 342 of the heat pipe 30, and the condensation sections 322, 342 of the heat pipe 30 are further passed through the heat dissipation fin group. The heat is dissipated into the surrounding environment, and the heat generated by the heat-generating electronic component is conducted to the substrate 10 through the thermal conductive paste on the other hand, and is conducted by the substrate 10 to the heat-dissipating fin group 20, and is radiated to the surrounding environment through the heat-dissipating fin group 20. . The solder paste layer 40 is disposed to fill the flatness error between the heat pipe 30 and the substrate 10 due to processing tolerances. . In design, the height of the cross section of the evaporation sections 320, 340 of the heat pipe 30 is set to be slightly smaller than the depth of the grooves 160, 162, and the height difference between the two is filled by the solder paste layer 40, and then the solder paste is used for milling. The layer 40 is on the same plane as the lower surface 14 of the substrate 10, and the flatness between the plane 328 of the evaporation sections 320, 340 and the lower surface 14 of the substrate 10 can be more accurately ensured.

The heat pipe 30 has at least one heat pipe 30, the number of which can be increased or decreased with the heat load, and the number of the through holes 24, 27 of the grooves 160, 162 and the heat dissipation fin group 20 of the corresponding substrate 10 and the heat pipe 30 The number is the same.

In summary, the present invention conforms to the requirements of the invention patent, and proposes a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

10‧‧‧Substrate

20‧‧‧Fixing fin group

40‧‧‧ solder paste layer

328‧‧‧ plane

Claims (9)

A heat dissipating device includes a substrate, at least one heat pipe and a heat dissipating fin set, the heat pipe includes an evaporation section, a condensation section, and a connecting section connecting the evaporation section and the condensation section, wherein the lower surface of the substrate is provided with the heat dissipation device The groove of the evaporation section of the heat pipe, the heat dissipation fin group is combined with the condensation section of the heat pipe, the improvement is that the evaporation section of the heat pipe has a plane for contacting with a heat-generating electronic component, and the plane is provided with a solid state a solder paste layer, the outer surface of the solder paste layer is on the same plane as the lower surface of the substrate, and the heat dissipation fin group includes a square body formed by a plurality of long heat dissipation fins and respectively located on the left and right sides of the solder body The first and second protrusions are arranged by a plurality of short heat dissipation fins, and the top end of the heat dissipation fin group is provided with a first through hole penetrating the heat dissipation fin group on the left and right sides, and the second protrusion is on the second protrusion a first U-shaped groove is formed in a position corresponding to the first through hole, and a top end of the first groove is connected to the first through hole, and a condensation section of the heat pipe is disposed in the first through hole The connecting section is received in the first recess of the second boss In the slot. The heat dissipating device of claim 1, wherein a height of the evaporation section of the heat pipe is slightly smaller than a depth of the groove, such that a space is formed between a plane of the evaporation section of the heat pipe and a lower surface of the substrate, The solder paste layer is filled in this interval. The heat sink of claim 2, wherein the height of the space is from 0.1 mm to 0.3 mm. The heat dissipating device of claim 1, wherein the evaporation section of the heat pipe and the cross section of the groove are semicircular. The heat sink of claim 1, wherein the outer surface of the solder paste layer is milled to be in the same plane as the lower surface of the substrate. The heat dissipating device of claim 1, wherein the heat dissipating fins are disposed on the substrate. A heat dissipation method includes the steps of: providing a substrate, providing a trench on a lower surface of the substrate; providing a heat dissipation fin set, the heat dissipation fin set being disposed on an upper surface of the substrate, the heat dissipation fin set The invention includes a square body formed by a plurality of long heat dissipation fins, and first and second protrusions respectively arranged by a plurality of short heat dissipation fins on the left and right sides of the body; at least one heat pipe is provided, and the heat pipe includes An evaporation section and a condensation section and a connection section connecting the evaporation section and the condensation section, the evaporation section of the heat pipe has a plane, the condensation section of the heat pipe is coupled to the heat dissipation fin set, and the evaporation section of the heat pipe is disposed in the a groove of the substrate, and exposing a plane of the evaporation section of the heat pipe; a solid solder paste layer is disposed on the exposed surface such that an outer surface of the solder paste layer is on a same plane as a lower surface of the substrate; And coating a thermal paste between the solder paste layer and the heat source, and contacting the substrate with the heat source; the top end of the heat dissipation fin set is provided with a first through hole penetrating the heat dissipation fin group on the left and right sides, Second boss a first U-shaped first groove is formed in the first through hole, and a top end of the first groove is connected to the first through hole, and a condensation section of the heat pipe is disposed in the first through hole. The connecting section is received in the first recess of the second boss. The heat dissipation method of claim 7, wherein the evaporation section of the heat pipe and the section of the groove are semicircular. The heat dissipation method of claim 7, wherein a height of the evaporation section of the heat pipe is slightly smaller than a depth of the groove, such that a space is formed between a plane of the evaporation section of the heat pipe and a lower surface of the substrate, The solder paste layer is filled in this interval.