US20090314471A1 - Heat pipe type heat sink and method of manufacturing the same - Google Patents

Heat pipe type heat sink and method of manufacturing the same Download PDF

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Publication number
US20090314471A1
US20090314471A1 US12/442,360 US44236009A US2009314471A1 US 20090314471 A1 US20090314471 A1 US 20090314471A1 US 44236009 A US44236009 A US 44236009A US 2009314471 A1 US2009314471 A1 US 2009314471A1
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heat
absorption portion
heat absorption
base
grooves
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US12/442,360
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Jianjun Du
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/007—Auxiliary supports for elements
    • F28F9/013—Auxiliary supports for elements for tubes or tube-assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Definitions

  • the present invention relates to a heat pipe type heat sink and method of manufacturing the same, and more particularly to a heat pipe type heat sink used for heat dissipation of electronic components and method of manufacturing the same.
  • Heat pipes have some unique features such as high heat conduction, fast heat transfer, lightness in weight, and simplification in structure. Heat pipes may also conduct large volume of heat without power consumption. For these reasons, heat pipes are widely used as heat-dissipating apparatuses in various electronic products today. Therefore, heat pipe type heat sinks have become an essential subject in solving heat dissipation problems in electronic components.
  • One known type of heat sink mainly includes a plurality of fins, a plurality of heat pipes and a heat conducting block in which a plurality of parallel grooves are defined.
  • internal surfaces of the grooves are coated with solder of low melting point, then heat absorption portions of the heat pipes are placed in the grooves, respectively, and soldered to the heat conducting block by heating the solder up, thereby the heat pipes are fixed.
  • this manufacturing process is complex and cost consuming.
  • the heat-conducting block with the heat pipes fixed thereon is mounted to heat-generating surfaces of electronic components. Heat conduction rate and heat dissipation efficiency are both reduced due to added thermal resistance of the heat-conducting block.
  • the heat pipes and the base of the heat sink in prior art are connected through a complex soldering process. This is a technical drawback that needs to be overcome.
  • the present invention provides a heat sink with heat pipes pressed and fixed on a base thereof, and method of manufacturing the same. Moreover, the present invention further provides a heat pipe type heat sink with high heat conduction rate and improved heat dissipation performance.
  • a heat pipe type heat sink comprises a plurality of heat pipes each having a heat absorption portion and a heat dissipation portion in connection with the heat absorption portion, and a base supporting the heat pipes, wherein a side of the base is provided with a plurality of grooves, and the heat absorption portion is pressed and held in a respective one of the grooves.
  • the heat absorption portion has a pressed flat surface arranged flush with a bottom surface of the base and serving as a heat absorption surface.
  • the base is a plate shaped block
  • the grooves are longitudinally arranged on a side of the block, and extend transversely across the side of the block.
  • each of the grooves has an opening of gradually narrowed shape.
  • a heat-conducting medium is further arranged between the respective one of the grooves and the heat absorption portion.
  • the heat pipes are of U shape or L shape.
  • a method of manufacturing a heat pipe type heat sink comprises following steps of: a. providing a heat pipe with a heat absorption portion and a heat dissipation portion in connection with the heat absorption portion, and a base with a groove defined on a side thereof, b. pressing the heat absorption portion of the heat pipe to hold the heat absorption portion in the groove.
  • step b a part of the heat absorption portion is placed in the groove, and a protruded portion of the heat absorption portion which protrudes from the groove is pressed by a clamp so that the heat absorption portion is held in the groove.
  • step b the heat absorption portion is pressed to form a pressed flat surface serving as a heat absorption surface.
  • step b the heat absorption portion of the heat pipe is pressed to form a pressed flat surface arranged flush with a bottom surface of the base.
  • FIG. 1 is an exploded view of a heat pipe type heat sink according to an embodiment of the present invention
  • FIG. 2 is an exploded view of a heat pipe and a base of the heat pipe type heat sink shown in FIG. 1 ;
  • FIG. 3 is a schematic view showing an assembly of the heat pipe type heat sink of FIG. 1 .
  • a heat sink 1 mainly comprises a plurality of heat pipes 11 each having a heat absorption portion 111 and a heat dissipation portion 112 in connection with the heat absorption portion 111 , a base 12 supporting the heat pipes 11 and a plurality of fins 13 through which the heat pipes 11 pass.
  • the base 12 is a plate shaped block, and a plurality of grooves 121 are longitudinally arranged on a side of the base 12 and extend transversely across the side of the base 12 .
  • the heat absorption portion 111 of a respective one of the heat pipes 11 is pressed and held in a respective one of the grooves 121 .
  • Each of the grooves 121 preferably has an opening of gradually narrowed shape in order to enhance the firmness of the heat pipes 11 .
  • the fins 13 are made of aluminum, cooper or any other metals with good heat dissipation performance. Through holes are defined on the fins 13 .
  • the heat pipes 11 may be of L shape, U shape or any other bending shape. Wicking structures and working fluid are provided inside the heat pipes 11 .
  • the heat pipes 11 are each formed with a heat absorption portion 111 and a heat dissipation portion 112 .
  • the heat sink 1 may also use any other suitable structure instead of the shapes described above. Since the heat absorption portion 111 is pressed and held in a respective one of the grooves 121 , the manufacturing process of the heat sink 1 is simplified while the firmness is improved.
  • a flat surface of the heat absorption portion 111 preferably is pressed flush with a bottom surface of the base 12 .
  • the pressed flat surface of the heat absorption portion 111 is in direct contact with a heat-generating surface of the electronic component and serves as a heat absorption surface, thereby heat conduction and heat dissipation of the heat sink are enhanced.
  • a heat conduction medium may be further arranged between the heat absorption portion 111 and the respective one of the grooves 121 , so that the heat absorption portion 111 can fully contact the base 12 through the heat conduction medium, thereby the heat conduction is further enhanced.
  • a heat pipe 11 with a heat absorption portion 111 and a heat dissipation portion 112 in connection with the heat absorption portion 111 is provided, and a base 12 with a groove 121 defined on a side thereof is provided. Then a part of the heat absorption portion 111 of the heat pipe 11 is placed in the groove 121 of the base 12 , and a protruded portion of the heat absorption portion 111 which protrudes from the groove 121 is pressed against the base 12 by using a clamp. The heat absorption portion 111 is deformed due to being pressed and thereby held in the groove 121 . In the process of pressing, the heat absorption portion 111 is pressed to form a pressed flat surface flush with a bottom surface of the base 12 and serving as a heat absorption surface.

Abstract

A heat pipe type heat sink (1) and method of manufacturing the same are disclosed. The heat pipe type heat sink (1) includes a plurality of heat pipes (11) and a base (12) supporting the heat pipes. Each of the heat pipes (11) has a heat absorption portion (111) and a heat dissipation portion (112) in connection with the heat absorption portion (111). One side of the base (12) is provided with a plurality of grooves (121). The heat absorption portion (111) of the heat pipe (12) is pressed and held in a respective one of the grooves (121).

Description

    FIELD OF THE INVENTION
  • The present invention relates to a heat pipe type heat sink and method of manufacturing the same, and more particularly to a heat pipe type heat sink used for heat dissipation of electronic components and method of manufacturing the same.
    • BACKGROUND OF THE INVENTION
  • Heat pipes have some unique features such as high heat conduction, fast heat transfer, lightness in weight, and simplification in structure. Heat pipes may also conduct large volume of heat without power consumption. For these reasons, heat pipes are widely used as heat-dissipating apparatuses in various electronic products today. Therefore, heat pipe type heat sinks have become an essential subject in solving heat dissipation problems in electronic components.
  • One known type of heat sink mainly includes a plurality of fins, a plurality of heat pipes and a heat conducting block in which a plurality of parallel grooves are defined. In assembly, internal surfaces of the grooves are coated with solder of low melting point, then heat absorption portions of the heat pipes are placed in the grooves, respectively, and soldered to the heat conducting block by heating the solder up, thereby the heat pipes are fixed. However, this manufacturing process is complex and cost consuming. Moreover, in prior art, the heat-conducting block with the heat pipes fixed thereon is mounted to heat-generating surfaces of electronic components. Heat conduction rate and heat dissipation efficiency are both reduced due to added thermal resistance of the heat-conducting block. As mentioned above, the heat pipes and the base of the heat sink in prior art are connected through a complex soldering process. This is a technical drawback that needs to be overcome.
    • SUMMARY OF THE INVENTION
  • To this end, the present invention provides a heat sink with heat pipes pressed and fixed on a base thereof, and method of manufacturing the same. Moreover, the present invention further provides a heat pipe type heat sink with high heat conduction rate and improved heat dissipation performance.
  • According to the present invention, a heat pipe type heat sink is provided. The heat pipe type heat sink comprises a plurality of heat pipes each having a heat absorption portion and a heat dissipation portion in connection with the heat absorption portion, and a base supporting the heat pipes, wherein a side of the base is provided with a plurality of grooves, and the heat absorption portion is pressed and held in a respective one of the grooves.
  • According to a preferred embodiment of the present invention, the heat absorption portion has a pressed flat surface arranged flush with a bottom surface of the base and serving as a heat absorption surface.
  • According to a preferred embodiment of the present invention, the base is a plate shaped block, and the grooves are longitudinally arranged on a side of the block, and extend transversely across the side of the block.
  • According to a preferred embodiment of the present invention, each of the grooves has an opening of gradually narrowed shape.
  • According to a preferred embodiment of the present invention, a heat-conducting medium is further arranged between the respective one of the grooves and the heat absorption portion.
  • According to a preferred embodiment of the present invention, the heat pipes are of U shape or L shape.
  • According to the present invention, a method of manufacturing a heat pipe type heat sink is provided. The method comprises following steps of: a. providing a heat pipe with a heat absorption portion and a heat dissipation portion in connection with the heat absorption portion, and a base with a groove defined on a side thereof, b. pressing the heat absorption portion of the heat pipe to hold the heat absorption portion in the groove.
  • According to a preferred embodiment of the present invention, in step b, a part of the heat absorption portion is placed in the groove, and a protruded portion of the heat absorption portion which protrudes from the groove is pressed by a clamp so that the heat absorption portion is held in the groove.
  • According to a preferred embodiment of the present invention, in step b, the heat absorption portion is pressed to form a pressed flat surface serving as a heat absorption surface.
  • According to a preferred embodiment of the present invention, in step b, the heat absorption portion of the heat pipe is pressed to form a pressed flat surface arranged flush with a bottom surface of the base.
  • By pressing and fixing the heat pipes in the grooves of the base using the configuration and method described above, the manufacturing process of the heat sink is simplified, the heat dissipation efficiency is improved and the manufacturing cost is reduced.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an exploded view of a heat pipe type heat sink according to an embodiment of the present invention;
  • FIG. 2 is an exploded view of a heat pipe and a base of the heat pipe type heat sink shown in FIG. 1; and
  • FIG. 3 is a schematic view showing an assembly of the heat pipe type heat sink of FIG. 1.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • The features and technical disclosure of the present invention will be described fully hereinafter through various embodiments with reference to the accompanying drawings, wherein the drawings are provided solely for purposes of reference and illustration and not as a definition of the limits of the invention.
  • Referring to FIGS. 1-3, a heat sink 1 according to an embodiment of the present invention mainly comprises a plurality of heat pipes 11 each having a heat absorption portion 111 and a heat dissipation portion 112 in connection with the heat absorption portion 111, a base 12 supporting the heat pipes 11 and a plurality of fins 13 through which the heat pipes 11 pass. In the present embodiment, the base 12 is a plate shaped block, and a plurality of grooves 121 are longitudinally arranged on a side of the base 12 and extend transversely across the side of the base 12. The heat absorption portion 111 of a respective one of the heat pipes 11 is pressed and held in a respective one of the grooves 121. Each of the grooves 121 preferably has an opening of gradually narrowed shape in order to enhance the firmness of the heat pipes 11. The fins 13 are made of aluminum, cooper or any other metals with good heat dissipation performance. Through holes are defined on the fins 13. The heat pipes 11 may be of L shape, U shape or any other bending shape. Wicking structures and working fluid are provided inside the heat pipes 11. The heat pipes 11 are each formed with a heat absorption portion 111 and a heat dissipation portion 112. Moreover, the heat sink 1 may also use any other suitable structure instead of the shapes described above. Since the heat absorption portion 111 is pressed and held in a respective one of the grooves 121, the manufacturing process of the heat sink 1 is simplified while the firmness is improved.
  • In the process of pressing the heat absorption portion 111, a flat surface of the heat absorption portion 111 preferably is pressed flush with a bottom surface of the base 12. Thus, when the heat sink 1 is fitted against an electronic component (not shown), the pressed flat surface of the heat absorption portion 111 is in direct contact with a heat-generating surface of the electronic component and serves as a heat absorption surface, thereby heat conduction and heat dissipation of the heat sink are enhanced. Moreover, a heat conduction medium may be further arranged between the heat absorption portion 111 and the respective one of the grooves 121, so that the heat absorption portion 111 can fully contact the base 12 through the heat conduction medium, thereby the heat conduction is further enhanced.
  • A method of manufacturing the heat pipe type heat sink according to a preferred embodiment of the present invention will now be described. In the embodiment, a heat pipe 11 with a heat absorption portion 111 and a heat dissipation portion 112 in connection with the heat absorption portion 111 is provided, and a base 12 with a groove 121 defined on a side thereof is provided. Then a part of the heat absorption portion 111 of the heat pipe 11 is placed in the groove 121 of the base 12, and a protruded portion of the heat absorption portion 111 which protrudes from the groove 121 is pressed against the base 12 by using a clamp. The heat absorption portion 111 is deformed due to being pressed and thereby held in the groove 121. In the process of pressing, the heat absorption portion 111 is pressed to form a pressed flat surface flush with a bottom surface of the base 12 and serving as a heat absorption surface.
  • By pressing and fixing the heat pipe to the grooves of the base using the configuration and the method described above, the manufacturing process of the heat sink is simplified, the heat dissipation efficiency is improved and the manufacturing cost is reduced.
  • While various preferred embodiments of the present invention have been described above, those skilled in the art can make various alterations and variations to the form of the present invention without departing from the spirit and the scope of the present invention. All those alternations and variations are considered to be within the scope of the invention as define in the claims.

Claims (10)

1. A heat pipe type heat sink comprising:
a plurality of heat pipes each having a heat absorption portion and a heat dissipation portion in connection with the heat absorption portion; and
a base supporting the plurality of heat pipes,
wherein a side of the base is provided with a plurality of grooves, at least a portion of the heat absorption portion is disposed within a respective one of the plurality of grooves, and
the heat absorption portion is pressed so that the heat absorption portion is deformed and held in the respective one of the plurality of grooves.
2. The heat pipe type heat sink of claim 1, wherein the plurality of grooves are disposed on a bottom surface of the base, the heat absorption portion has a pressed flat surface arranged flush with the bottom surface of the base and serving as a heat absorption surface.
3. The heat pipe type heat sink of claim 1, wherein the base is a plate shaped block, and the plurality of grooves are longitudinally arranged on a side of the block, and extend transversely across the side of the block.
4. The heat pipe type heat sink of claim 1, wherein each of the plurality of grooves has an opening of gradually narrowed shape, and a protruded portion of the heat absorption portion which protrudes from the groove is pressed so that the heat absorption portion is deformed and held in the groove.
5. The heat pipe type heat sink of claim 1, wherein a heat-conducting medium is further arranged between the respective one of the plurality of grooves and the heat absorption portion.
6. The heat pipe type heat sink of claim 1, wherein the plurality of heat pipes are of U shape or L shape.
7. A method of manufacturing a heat pipe type heat sink, comprising:
providing a heat pipe with a heat absorption portion and a heat dissipation portion in connection with the heat absorption portion, and a base with a groove defined on a side thereof,
pressing the heat absorption portion of the heat pipe to deform and hold the heat absorption portion in the groove.
8. The method of claim 7, wherein in the step of pressing the heat absorption portion, a part of the heat absorption portion of the heat pipe is placed in the groove of the base, and a protruded portion of the heat absorption portion which protrudes from the groove is pressed so that the heat absorption portion is deformed and held in the groove.
9. The method of claim 8, wherein in the step of pressing the heat absorption portion, the heat absorption portion is pressed to form a pressed flat surface serving as a heat absorption surface.
10. The method of claim 8, wherein in the step of pressing the heat absorption portion, the heat absorption portion of the heat pipe is pressed to form a pressed flat surface arranged flush with a bottom surface of the base.
US12/442,360 2006-09-22 2006-12-27 Heat pipe type heat sink and method of manufacturing the same Abandoned US20090314471A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN200610062795.4 2006-09-22
CN200610062795.4A CN101149234B (en) 2006-09-22 2006-09-22 Heat pipe radiator production method
PCT/CN2006/003617 WO2008037134A1 (en) 2006-09-22 2006-12-27 A heat pipe radiator and manufacturing method thereof
CNPCT/CN2006/003617 2006-12-27

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US20090314471A1 true US20090314471A1 (en) 2009-12-24

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US (1) US20090314471A1 (en)
CN (1) CN101149234B (en)
DE (2) DE112006004034T5 (en)
WO (1) WO2008037134A1 (en)

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TWI414741B (en) * 2011-07-26 2013-11-11 Asia Vital Components Co Ltd Heat dissipation unit structure and manufacturing method thereof
CN112879845A (en) * 2021-01-21 2021-06-01 谢玉华 Self-heat dissipation type LED lamp

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JP2011009266A (en) * 2009-06-23 2011-01-13 Sansha Electric Mfg Co Ltd Heat sink and method for manufacturing the same
CN102049672B (en) * 2009-11-03 2014-12-17 鈤新科技股份有限公司 Manufacturing method of coplane of evaporation parts of plurality of heat pipes as well as finished product structure and tools thereof
DE102010017300B4 (en) * 2010-06-09 2013-07-04 Tsung-Hsien Huang cooler unit
CN102218487B (en) * 2011-03-04 2016-01-13 东莞汉旭五金塑胶科技有限公司 Heat-conducting seat supplies compound formulation and the structure thereof of the closely sealed arrangement of many heat pipes
TWI651509B (en) * 2011-03-11 2019-02-21 黃崇賢 Restricted assembly structure of heat pipe and heat conducting seat
CN103759561A (en) * 2014-01-21 2014-04-30 华南理工大学 Heat pipe radiator based on phase change compression, and manufacturing method of heat pipe radiator
CN104075604A (en) * 2014-07-17 2014-10-01 芜湖长启炉业有限公司 Superconductor with multiple U-shaped heat pipes in same cavity
CN107478081A (en) * 2017-08-30 2017-12-15 四川建源节能科技有限公司 It is easy to be fixed on the heat exchanger tube on water pipe
CN109084605A (en) * 2018-08-01 2018-12-25 中国科学技术大学 A kind of pulsating heat pipe of the non-elbow structure of bringing-up section

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI414741B (en) * 2011-07-26 2013-11-11 Asia Vital Components Co Ltd Heat dissipation unit structure and manufacturing method thereof
CN112879845A (en) * 2021-01-21 2021-06-01 谢玉华 Self-heat dissipation type LED lamp

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WO2008037134A1 (en) 2008-04-03
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DE202006021052U1 (en) 2012-03-14
CN101149234B (en) 2010-05-12

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