CN117062382A

CN117062382A - Heat radiation structure of electronic device and heat radiation module thereof

Info

Publication number: CN117062382A
Application number: CN202210480155.4A
Authority: CN
Inventors: 林俊宏
Original assignee: MICROLOOPS CORP; Huizhou Huiliqin Electronic Technology Co ltd
Current assignee: MICROLOOPS CORP; Huizhou Huiliqin Electronic Technology Co ltd
Priority date: 2022-05-05
Filing date: 2022-05-05
Publication date: 2023-11-14

Abstract

The invention provides a heat dissipation module, which comprises a temperature equalizing plate and at least one heat pipe. The temperature equalizing plate comprises a lower half shell and an upper half shell, the lower half shell is in butt joint with the upper half shell to be closed, a lower boss is protruded out of the outer side of the lower half shell, and an upper boss is protruded out of the outer side of the upper half shell. A part of the heat pipe is attached to the upper boss, and extends beyond the edge of the temperature equalizing plate along a plane parallel to the temperature equalizing plate, and is provided with a plurality of fins, at least a part of which are arranged adjacent to the edge of the temperature equalizing plate. The invention increases the thickness of the temperature-equalizing plate by the temperature-equalizing plate composed of the lower half shell and the upper half shell, so that the space at the periphery of the temperature-equalizing plate is increased. Therefore, the heat pipe and the fins do not need to change the configuration to avoid the electronic component surrounding the temperature equalizing plate, and the heat-dissipation section of the heat pipe can be effectively utilized. Has the advantage of high heat dissipation efficiency.

Description

Heat radiation structure of electronic device and heat radiation module thereof

Technical Field

The invention relates to the field of heat dissipation of heat pipes, in particular to a heat dissipation module with heat pipes combined with a temperature equalizing plate.

Background

Heat pipes are components commonly found in the field of electronic heat dissipation, and are mainly used for transferring heat energy. Generally, a part of the heat pipe is used for absorbing heat, and the other part is used for releasing heat, and the heat absorbing part is usually connected with a heat conductor, and the heat conductor is used for triggering a heat source to remove heat energy from the heat source and further is transmitted to the heat releasing part through the heat pipe for further discharging. The heat sink portion of the heat pipe is connected with the heat spreader and fins are arranged on other portions of the heat pipe to radiate the heat energy absorbed into the heat pipe into the air. The heat source is usually a chip such as a cpu or an image processor, and generally, the chip is disposed on a circuit board, and other electronic components for assisting the chip to work are disposed on the periphery of the chip. The bottom surface of the temperature equalizing plate is attached with a chip, and the top surface is attached with a heat pipe. However, the space between the top surface of the current thin type temperature equalizing plate and the circuit board is limited, so that there is not enough space for the fins above the electronic components, and the heat pipe cannot exert the maximum performance. The existing thin type temperature equalization plates are all made of metal plates through stamping to form concave cavities, and then the concave cavities are closed by overlapping the other metal plates. The thickness of the sheet metal is limited to about 0.3 mm, but excessive deformation will cause the sheet metal to fracture, so that the depth of the allowable punch recess is limited, and the thickness of the sheet metal made of the sheet metal is limited to a specific range.

In view of the above, the present inventors have made intensive studies and have made an effort to solve the above-described problems in combination with the application of the theory, which is an object of improvement by the present inventors.

Disclosure of Invention

The invention provides a heat dissipation structure with a heat pipe combined with a temperature equalization plate and a heat dissipation module thereof.

The invention provides a heat dissipation module, which comprises a temperature equalizing plate and at least one heat pipe. The temperature equalizing plate comprises a lower half shell and an upper half shell, wherein the lower half shell is in butt joint with the upper half shell to be closed, a lower boss is protruded out of the outer side of the lower half shell, and an upper boss is protruded out of the outer side of the upper half shell. A part of the heat pipe is attached to the upper boss, and extends out of the edge of the temperature equalizing plate along a plane parallel to the temperature equalizing plate.

The heat pipe of the heat radiation module is provided with a heat absorption section, and the heat absorption section is attached to the upper boss. One side of the heat absorption section is provided with a heat exchange plane, and the heat exchange plane is attached to the upper boss.

The heat dissipation module of the invention has a plurality of heat pipes, each heat pipe is provided with a heat absorption section, the heat absorption sections are attached to the upper boss, and the heat absorption sections are contacted with each other and are arranged side by side.

The heat radiation module of the invention has a flat tubular heat absorption section.

According to the heat radiation module, the fins are arranged at intervals, and the distance between the edge of the temperature equalizing plate and the adjacent fins is not larger than the distance between the fins.

The invention also provides a heat dissipation structure of the electronic device, which comprises a circuit board and the heat dissipation module. One side of the circuit board is provided with a chip and a plurality of electronic components arranged around the chip. The lower boss is attached to the chip, and the fins adjacent to the edge of the temperature equalizing plate are located above at least a portion of the electronic assembly.

The heat dissipation structure of the electronic device and the heat dissipation module thereof of the invention, wherein the temperature equalizing plate consists of a lower half shell and an upper half shell so as to increase the temperature equalizing plate by Wen Banhou degrees (namely the height from the upper surface of the temperature equalizing plate to the circuit board), thereby increasing the space at the periphery of the temperature equalizing plate. Therefore, the heat pipe and the fins do not need to change the configuration to avoid the electronic component surrounding the temperature equalizing plate, and the heat-dissipation section of the heat pipe can be effectively utilized.

Drawings

Fig. 1 is a schematic perspective view of a heat dissipating structure of an electronic device according to a preferred embodiment of the invention.

Fig. 2 is a cross-sectional view of a heat dissipation structure of an electronic device according to a preferred embodiment of the invention.

Fig. 3 is a partial enlarged view of the area 3 shown in fig. 2.

Fig. 4 is a schematic perspective view of a heat dissipating module according to a preferred embodiment of the invention.

Fig. 5 is a cross-sectional view of a heat dissipating module according to a preferred embodiment of the present invention.

Fig. 6 is an exploded perspective view of a heat pipe and a temperature equalizing plate in a heat dissipating module according to a preferred embodiment of the invention.

Fig. 7 is a schematic perspective view of a temperature equalizing plate and a heat pipe in a heat dissipating module according to a preferred embodiment of the invention.

Fig. 8 is a cross-sectional view of a heat spreader plate and a heat pipe in a heat dissipating module according to a preferred embodiment of the present invention.

Symbol description in the drawings:

10 circuit board, 21 chip, 22 electronic component, 30 heat dissipation module, 100 temperature equalizing plate, 110 lower half shell, 111 lower concave part, 112 lower boss, 120 upper half shell, 121 upper concave part, 122 upper boss, 130 capillary structure, 200 heat pipe, 210 heat absorption section, 211 heat exchange plane, 220 fin.

Detailed Description

Referring to fig. 1 to 3, a heat dissipation structure of an electronic device according to a preferred embodiment of the present invention includes a circuit board 10 and a heat dissipation module 30. One side of the circuit board 10 is provided with a chip 21 and a plurality of electronic components 22, and the electronic components 22 are arranged around the chip 21 and are adjacent to the chip 21.

Referring to fig. 4 to 5, the heat dissipation module 30 includes a temperature equalizing plate 100 and at least one heat pipe 200. In this embodiment, the heat dissipation module 30 preferably includes a plurality of heat pipes 200, and the embodiment uses only one heat pipe 200 as an example of the heat pipes 200, but the structure is not limited to all heat pipes 200, that is, at least one of the heat pipes 200 conforms to the structure described below.

Referring to fig. 5 and 8, in the present embodiment, the temperature uniformity plate 100 includes a lower half shell 110 and an upper half shell 120. The lower half shell 110 is made by stamping a metal sheet, the inner side of the lower half shell 110 is recessed to form a lower recess 111, and the outer side of the lower half shell 110 is protruded to form a lower boss 112. The upper half shell 120 is made by stamping a metal sheet, the inner side of the upper half shell 120 is concave to form an upper concave portion 121, and the outer side of the upper half shell 120 is convex to form an upper boss 122. The lower half shell 110 is abutted against the upper half shell 120 to close the lower recess 111 and the upper recess 121 for filling with a working fluid (not shown). And the walls of the lower recess 111 and the upper recess 121 are covered with a capillary structure 130 for adsorbing the working fluid. The lower boss 112 is attached to the chip 21, a portion of the heat pipe 200 is attached to the upper boss 122, and the heat pipe 200 extends beyond the edge of the temperature plate 100 along a plane parallel to the temperature plate 100.

Referring to fig. 2 to 3 and fig. 5 to 8, the heat pipe 200 has a heat absorbing section 211, the heat absorbing section 211 may be located at one end or a middle section of the heat pipe 200, one side of the heat absorbing section 211 has a heat exchanging plane 211, and the heat exchanging plane 211 is attached to the upper boss 122 to absorb heat energy from the temperature equalizing plate 100. In the present embodiment, the heat absorbing section 211 is preferably in a flat tube shape, but the invention is not limited thereto, and for example, the heat absorbing section 211 may be in a semicircular tube shape. In this embodiment, each heat pipe 200 has a heat absorbing section 211, the heat absorbing sections 211 are attached to the upper boss 122, and the heat absorbing sections 211 are disposed in parallel in contact with each other.

The heat pipe 200 is provided with a plurality of fins 220, and more specifically, the fins 220 can be disposed at the other sections except the heat absorbing section 211 to dissipate heat energy carried in the heat pipe 200. At least a portion of the fins 220 (i.e., one or more of the fins 220) are disposed adjacent to an edge of the isopipe 100. In this embodiment, the fins 220 are arranged at intervals, at least one fin 220 is disposed adjacent to the edge of the temperature uniformity plate 100, and the fin 220 adjacent to the edge of the temperature uniformity plate 100 is located above at least a portion of the electronic components 22 (i.e. one or more of the electronic components 22) surrounding the temperature uniformity plate 100, so that the heat dissipation section of the heat pipe 200 can be effectively utilized. Preferably, the spacing between the edge of the temperature equalizing plate 100 and the adjacent partial fin 220 is not greater than the spacing between the other partial fins 220.

In summary, the heat dissipation structure of the electronic device and the heat dissipation module 30 thereof according to the present invention, the temperature-equalizing plate 100 is composed of the lower half shell 110 and the upper half shell 120, so as to increase the thickness of the temperature-equalizing plate 100 (i.e. the height from the upper surface of the temperature-equalizing plate 100 to the circuit board 10) and increase the space at the periphery of the temperature-equalizing plate 100. Therefore, the heat pipe 200 and the fins 220 can effectively utilize the heat-dissipating section of the heat pipe 200 without changing the configuration to avoid the electronic component 22 surrounding the temperature equalizing plate 100.

The foregoing description of the preferred embodiments of the present invention is not intended to limit the scope of the invention, but rather to limit the scope of the invention to the equivalents of the claims to which the invention pertains.

Claims

1. A heat dissipating module, comprising: the temperature equalizing plate comprises a lower half shell and an upper half shell, the lower half shell is in butt joint with the upper half shell to be closed, a lower boss is protruded out of the outer side of the lower half shell, and an upper boss is protruded out of the outer side of the upper half shell;

and at least one heat pipe, a part of the heat pipe is attached to the upper boss, the heat pipe extends to the outside of the edge of the temperature equalizing plate along a plane parallel to the temperature equalizing plate, the heat pipe is provided with a plurality of fins, and at least a part of the fins are arranged adjacent to the edge of the temperature equalizing plate.

2. The heat dissipating module of claim 1, wherein the heat pipe has a heat absorbing section attached to the upper boss.

3. The heat dissipating module of claim 2, wherein one side of the heat absorbing section has a heat exchanging plane, and the heat exchanging plane is attached to the upper boss.

4. The heat dissipating module of claim 1, wherein the heat pipes are a plurality of heat pipes, each heat pipe has a heat absorbing section, the heat absorbing sections are attached to the upper boss, and the heat absorbing sections are disposed in parallel in contact with each other.

5. The heat dissipating module of claim 2, wherein the heat absorbing section is in a flattened tubular shape or a semicircular tubular shape.

6. The heat dissipating module of claim 1, wherein the fins are spaced apart and a distance between an edge of the temperature equalizing plate and an adjacent fin is no greater than a distance between the fins.

7. A heat dissipation structure of an electronic device, comprising: a circuit board, one side of which is provided with a chip and a plurality of electronic components arranged around the chip; the heat dissipating module of any one of claims 1 to 6, wherein the lower boss is attached to the chip and the fins adjacent to the edge of the temperature equalizing plate are located above at least a portion of the electronic components.